JP6483369B2 - Crystal device - Google Patents

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a crystal element mounted on a pair of electrode pads provided along one side of the upper surface of a rectangular substrate via a conductive adhesive, and bonded to the upper surface of the substrate via a bonding member, A crystal resonator provided with a metal sealing lid for hermetically sealing has been proposed (see, for example, Patent Document 1 below). Glass is used for the joining member, and the sealing lid and the upper surface of the substrate can be joined by applying heat. In addition, external terminals are provided at the four corners of the lower surface of the substrate constituting the crystal device, and are mounted on a mounting substrate such as an electronic device with solder or the like.

JP 2009-141234 A

  In the above-described crystal device, when mounting a mounting pad on a mounting substrate of an electronic device or the like and an external terminal of the substrate constituting the crystal device with solder, the solder used during mounting is provided from the external terminal to the side surface of the substrate. Since the metal cover body and the solder come into contact with each other, the metal cover body and the solder may be short-circuited.

  The present invention has been made in view of the above problems, and it is possible to reduce a short circuit with a metal lid even when solder is used during mounting, and to stably output an oscillation frequency. It is to provide.

A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, an electrode pad provided on the upper surface of the substrate, an external terminal provided on the lower surface of the substrate, and an electrode pad provided on the upper and lower surfaces of the substrate. And a wiring pattern electrically connected to the external terminal, a conductor provided on the side surface of the substrate and electrically connected to the wiring pattern, a crystal element mounted on the electrode pad of the substrate, and an upper surface of the substrate And a glass bonding member provided between the upper surface of the substrate and the lower surface of the sealing lid, and the conductor portion includes a silver-palladium alloy having glass. The thickness of the conductor part at the boundary line between the outer peripheral edge of the upper surface of the substrate and the conductor part is smaller than the thickness of the other conductor part, and the glass bonding member is provided at the upper end of the conductor part. On the part where the thickness of the It has been kicked.

A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, an electrode pad provided on the upper surface of the substrate, an external terminal provided on the lower surface of the substrate, and an electrode pad provided on the upper and lower surfaces of the substrate. And a wiring pattern electrically connected to the external terminal, a conductor provided on the side surface of the substrate and electrically connected to the wiring pattern, a crystal element mounted on the electrode pad of the substrate, and an upper surface of the substrate And a glass bonding member provided between the upper surface of the substrate and the lower surface of the sealing lid, and the conductor portion includes a silver-palladium alloy having glass. The thickness of the conductor part at the boundary line between the outer peripheral edge of the upper surface of the substrate and the conductor part is smaller than the thickness of the other conductor part, and the glass bonding member is provided at the upper end of the conductor part. On the part where the thickness of the It has been kicked. In this way, when mounting the mounting pad of the mounting board of the electronic device or the like and the external terminal of the board with the solder, the solder used for mounting has a wettability due to the conductor portion containing the glass component. Since it repels badly, it can only crawl up to about half of the thickness in the vertical direction of the conductor provided on the side surface of the substrate from the external terminal. Therefore, since it can suppress that a metal lid and a solder contact, it can reduce that a metal lid and solder short-circuit.

It is a disassembled perspective view which shows the crystal device in this embodiment. It is sectional drawing in AA of the quartz crystal device shown by FIG. It is a top view which shows the state which mounted the crystal element of the crystal device in this embodiment. It is sectional drawing in BB of the quartz crystal device shown by FIG. (A) It is the top view which looked at the board | substrate which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate which comprises the crystal device in this embodiment from the lower surface. It is a graph which shows the yield in the conduction | electrical_connection defect for every weight ratio of the glass contained in the conductor part of the board | substrate which comprises the crystal device in this embodiment. It is a graph which shows the yield in the joint strength with the mounting board | substrate of the crystal device in this embodiment. It is sectional drawing which shows the crystal device in the 1st modification of this embodiment. (A) It is a top view which shows the state which mounted the crystal element which comprises the crystal device in the 2nd modification of this embodiment, (b) The board | substrate which comprises the crystal device in the 2nd modification of this embodiment is a bottom surface It is the top view seen from. It is a disassembled perspective view which shows the quartz crystal device in the 3rd modification of this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 4th modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 4th modification of this embodiment is seen from a lower surface. FIG.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a seal for hermetically sealing the crystal element 120. A lid 130. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. A first electrode pad 111 a and a second electrode pad 111 b for bonding the crystal element 120 are provided along one side of the substrate 110. A third electrode pad 111 c is provided along one side facing one side of the substrate 110. External terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the four external terminals 112 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. Wiring patterns 113 for electrically connecting the electrode pads 111 provided on the upper surface and the external terminals 112 on the lower surface are provided on the upper surface and the lower surface of the substrate 110, respectively. In addition, an electrode pattern 115 for electrically connecting the first electrode pad 111a and the third electrode pad 111c is provided on the upper surface of the substrate 110.

  The first electrode pad 111a, the second electrode pad 111b, and the third electrode pad 111c of the substrate 110 are used for mounting the crystal element 120 as shown in FIGS. Further, the third electrode pad 111c prevents the outer peripheral edge of the crystal element 120 from coming into contact with the substrate 110 when the crystal element 120 is mounted on the first electrode pad 111a and the second electrode pad 111b. It is used for. As shown in FIG. 1, the first electrode pad 111 a and the second electrode pad 111 b are provided along one side of the substrate 110, and the third electrode pad 111 c is along one side facing one side of the substrate 110. Is provided. The second electrode pad 111b and the third electrode pad 111c are provided at diagonal positions on the upper surface of the substrate 110 as shown in FIG. In addition, the electrode pad 111 is provided at a position overlapping the electrode pad 111 in plan view via a wiring pattern 113 provided on the upper and lower surfaces of the substrate 110 and a conductive portion 114 provided on a corner portion of the substrate 110. The external terminal 112 is electrically connected. The external terminals 112 are provided along the outer peripheral edge of the substrate 110 at the four corners of the lower surface of the substrate 110.

  As shown in FIG. 5A, the electrode pad 111 includes a first electrode pad 111a, a second electrode pad 111b, and a third electrode pad 111c. The external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d as shown in FIG. 5B. As shown in FIG. 1, the wiring pattern 113 includes a first wiring pattern 113a, a second wiring pattern 113b, and a third wiring pattern 113c. The conductive portion 114 includes a first conductive portion 114a, a second conductive portion 114b, and The third conductive portion 114c is configured. The second electrode pad 111b and the second external terminal 112b are connected by a first wiring pattern 113a provided on the upper surface and the lower surface of the substrate 110 and a first conductive portion 114a provided on a corner portion of the substrate 110. The third electrode pad 111c and the fourth external terminal 112d are connected by the second wiring pattern 113b provided on the upper surface and the lower surface of the substrate 110 and the second conductive portion 114b provided on the corner portion of the substrate 110. Yes. The first electrode pad 111 a and the third electrode pad 111 c are electrically connected by an electrode pattern 115 provided on the upper surface of the substrate 110. Therefore, the first electrode pad 111a is electrically connected to the fourth external terminal 112d through the third electrode pad 111c. Further, the first external terminal 112a and the third external terminal 112c are not connected anywhere, and are used as mounting terminals for mounting on the mounting board.

  The external terminal 112 is used for mounting on a mounting board constituting an external electronic device or the like. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110.

  Further, the electrode pad 111 and the external terminal 112 have a shape provided along the substrate 110. Here, taking the case where the long side dimension of the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 111 is taken as an example. The size of the external terminal 112 will be described. The length of the long side of the first electrode pad 111a and the second electrode pad 111b is 0.20 to 0.60 mm, and the length of the short side is 0.10 to 0.50 mm. The third electrode pad 111c has a long side length of 0.60 to 1.10 mm, and a short side length of 0.10 to 0.50 mm. The long side length of the external terminal 112 is 0.30 to 0.90 mm, and the short side length is 0.20 to 0.60 mm.

  The wiring pattern 113 is provided on the upper surface and the lower surface of the substrate 110, and is drawn from the electrode pad 111 and the external terminal 112 toward the corner of the substrate 110 in the vicinity. The length of the first wiring pattern 113a and the length of the second wiring pattern 113b are substantially equal. Here, the substantially equal length means that the difference between the length of the first wiring pattern 113a provided on the upper and lower surfaces of the substrate 110 and the length of the second wiring pattern 113b provided on the upper and lower surfaces of the substrate 110 is 0 to 0. It shall include those that differ by 200 μm. As for the length of the wiring pattern 113, the length of a straight line passing through the center of each wiring pattern 113 is measured.

  As shown in FIGS. 3 and 4, the conductor portion 114 is provided inside a notch provided in a corner portion of the substrate 110. Both ends of the conductor portion 114 are connected to the wiring pattern 113. By doing so, the electrode pad 111 is electrically connected to the external terminal 112 via the wiring pattern 113 and the conductor portion 114. Further, since the conductor portion 114 is provided so as to print the conductor paste in the cut, the thickness of the conductor portion 114 at the boundary line between the outer peripheral edge of the upper surface of the substrate 110 and the conductor portion 114 is reduced. Yes. Such a conductor portion 114 is formed of a silver-palladium alloy and contains glass components such as vanadium-based low-melting glass, phosphoric acid-based low-melting glass, or lead oxide-based glass in order to suppress solder erosion. . The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide. It is provided so that the weight ratio of the glass is 0.3 to 5.0% by weight with respect to the total amount of the silver palladium alloy and the glass constituting the conductor portion 114. Solder is used to join a mounting pad (not shown) of the mounting board and the external terminal 112 of the board 110. Such solder is composed of, for example, tin, silver, and copper, and 95 to 98% tin, 2 to 4% silver, and 0 to 1.0% copper are used. As described above, since 0.3 to 5.0% by weight of glass is contained, the wettability with the solder is poor, so that the solder is repelled to about half the thickness of the conductor portion 114 in the vertical direction while repelling the solder. It will crawl up. Therefore, since a fillet is formed between the conductor portion 114 and the conductor portion 114 so that the thickness gradually increases from the mounting substrate side toward the conductor portion 114, the bonding strength between the mounting substrate and the crystal device can be maintained. it can. Further, since the solder does not crawl up to the upper end of the conductor part 114, solder erosion of the conductor part 114 can be reduced. Such solder erosion means that the material of the wiring pattern 113 or the conductor portion 114 diffuses into the solder, and the wiring pattern 113 or the conductor portion 114 disappears.

  As shown in FIG. 6, when the weight ratio of the glass contained in the conductor part 114 is less than 0.3% by weight, it can be confirmed that the yield due to poor conduction decreases. This is because when the weight ratio of the glass contained in the conductor portion 114 is less than 0.3% by weight, the solder from the external terminal to the upper end of the conductor portion 114 when the crystal device is mounted on the mounting substrate. As a result, the upper end portion of the conductor portion 114 is eroded by solder and the electrode pad 111 and the external terminal 112 are disconnected from each other, so that a conduction failure occurs and the yield decreases.

  Further, as shown in FIG. 7, when the weight ratio of the glass contained in the conductor portion 114 is larger than 5.0% by weight, it can be confirmed that the yield of peeling of the crystal device at the time of mounting is lowered. This is because when the weight ratio of the glass contained in the conductor part 114 is larger than 5.0% by weight, solder does not crawl up on the conductor part 114 when the crystal device is mounted on the mounting substrate. Therefore, a fillet that gradually increases in thickness from the mounting substrate side toward the conductor portion 114 is not formed, the bonding strength between the mounting substrate 10 and the crystal device is reduced, and the yield at the time of mounting is reduced. Become.

  The electrode pattern 115 is provided on the upper surface of the substrate 110, one end of which is connected to the second electrode pad 111b, and the other end is electrically connected to the third electrode pad 111c. By doing in this way, the 2nd electrode pad 111b is electrically connected with the 3rd external terminal 112c via the 3rd electrode pad 111c.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating, gold plating, silver palladium, or the like is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the conductor portion 114, and the electrode pattern 115. Produced. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 1 to 4, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 to 4, the crystal element 120 has a structure in which the excitation electrode 122 and the extraction electrode 123 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the second external terminal 112b and the fourth external terminal 112d are electrically connected to the crystal element 120.

  The crystal element 120 is mounted such that the third electrode pad 112 is disposed at a position facing the free end of the crystal element 120. By doing so, the free end of the crystal element 120 is in contact with the third electrode pad 111c even if it is tilted around the location where the extraction electrode 123 of the crystal element 120 and the electrode pad 111 are joined. It is possible to prevent the free end of the crystal element 120 from coming into contact with the upper surface of the substrate 110. If the drop test is performed with the free end of the crystal element 120 in contact with the substrate 110, the free end of the crystal element 120 may be lost. By doing in this way, it can reduce that the oscillation frequency of the crystal element 120 fluctuates, suppressing that the free end side of the crystal element 120 is missing.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The sealing lid 130 includes a rectangular sealing base portion 130a and a sealing frame portion 130b provided along the outer peripheral edge of the lower surface of the sealing base portion 130a, and the lower surface of the sealing base portion 130a. A storage space K is formed by the inner side surface of the sealing frame portion 130b. The sealing frame part 130b is for forming the accommodation space K on the lower surface of the sealing base part 130a. The sealing frame part 130b is provided along the outer edge of the lower surface of the sealing base part 130a.

  The sealing base portion 130a and the sealing frame portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid 130 is for hermetically sealing the housing space K in a vacuum state or the housing space K filled with nitrogen gas or the like. Specifically, the sealing lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and the bonding member 150 provided between the upper surface of the substrate 110 and the lower surface of the sealing frame portion 130b is heated. Is applied to melt-bond.

  The glass bonding member 150 is used for bonding the lower surface of the sealing lid 130 and the outer peripheral edge of the upper surface of the substrate 110. As shown in FIG. 2, the glass bonding member 150 is provided from the lower surface of the sealing frame portion 130 b to the outer peripheral edge on the substrate 110.

  The glass bonding member 150 is made of, for example, low melting glass or lead oxide glass containing vanadium that is a glass that melts at 300 ° C. to 400 ° C. Glass is pasty with a binder and a solvent added, and is melted and then solidified to adhere to other members. The glass bonding member 150 is provided, for example, by applying glass frit paste in an annular shape along the lower surface of the sealing frame portion 130b by screen printing and drying. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide.

  The crystal device according to the present embodiment includes a conductor 114 provided on the side surface of the substrate 110 and electrically connected to the wiring pattern 113, a crystal element 120 mounted on the electrode pad 110 of the substrate 110, and the crystal element 120. In order to hermetically seal, a sealing lid 130 provided on the upper surface of the substrate 110, and a glass bonding member 140 provided between the upper surface of the substrate 110 and the lower surface of the sealing lid 130, The conductor part 110 contains the silver palladium alloy which has glass. By doing in this way, when mounting the mounting pad (not shown) of the mounting board of the electronic device or the like and the external terminal 112 of the board 110 with the solder, the solder used for mounting contains a glass component. Since the wettability is repelled by the conductive portion 114, the conductive portion 114 can only crawl up to about half of the vertical thickness of the conductive portion 114 provided on the side surface of the substrate 110 from the external terminal 112. Therefore, since it can suppress that the metal cover body 130 and a solder contact, it can reduce that the metal cover body 130 and solder short-circuit.

  Moreover, the quartz crystal device in the present embodiment is provided such that the weight ratio of the glass is 0.3 to 5.0% by weight with respect to the total amount of the silver palladium alloy and the glass constituting the conductor 114. Yes. By doing so, the glass is contained, so that the solder is repelled, and the solder can only crawl up to about half of the thickness of the conductor portion 114 in the vertical direction. Further, since a solder fillet is formed between the conductor portion 114 and the conductor portion 114 so that the thickness gradually increases from the mounting substrate side toward the conductor portion 114, the bonding strength between the mounting substrate 10 and the crystal device is maintained. be able to. Further, since the solder does not crawl up to the upper end of the conductor part 114, solder erosion of the conductor part 114 can be reduced.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 8, the crystal device in the first modification example of the present embodiment is provided such that the glass bonding member 250 is placed on the upper end of the conductor portion 114 provided on the side surface of the substrate 110. This is different from the present embodiment.

  As shown in FIG. 8, the glass bonding member 250 is provided so as to cover the upper end of the conductor portion 114 provided on the side surface of the substrate 110. By doing in this way, when the crystal device is mounted on the mounting substrate via the solder of an electronic device or the like, the conductor portion 114 at the boundary between the substrate 110 and the conductor portion 114 is not in contact with the solder. Solder erosion caused by the diffusion of the material of the conductor portion 114 into the solder can be reduced. Accordingly, poor conduction between the electrode pad 111 and the external terminal 112 caused by solder erosion can be reduced.

  A glass bonding member 250 provided between the upper surface of the substrate 110 and the lower surface of the sealing lid 130 is provided so as to cover the upper end of the conductor portion 114. Since the glass bonding member 250 is provided on the upper end of the conductor portion 114 in this manner, the crystal device is attached to the external terminal 112 when the crystal device is mounted on the mounting substrate constituting the electronic device or the like via solder. Even if the solder crawls up to the upper end of the conductor portion 114, the upper end portion of the conductor portion 114 can be prevented from coming into contact with the solder by being stopped by the glass bonding member 250. Therefore, such a crystal device can further reduce the conduction failure between the electrode pad 111 and the external terminal 112 while further suppressing the occurrence of solder erosion caused by the material of the conductor portion 114 diffusing into the solder. it can.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. As shown in FIG. 9, the quartz crystal device according to the second modification example of the present embodiment is provided on the upper surface and the lower surface of the substrate 110 and is electrically connected to the electrode pad 111 and the external terminal 112. 113 and a conductor part 114 provided on the side surface of the substrate 110 and electrically connected to the wiring pattern 113, and a glass protective member 160 provided so as to cover the wiring pattern 113. This is different from the present embodiment.

  The glass protective member 160 is used to reduce the short circuit caused by the wiring pattern 113 coming into contact with the metal sealing lid 130. Further, as shown in FIG. 9, the glass protection member 160 is provided so as to cover the wiring pattern 113 provided on the upper surface of the substrate 110. As the glass protective member 160, a member having a melting point of 500 to 800 ° C. higher than that of the glass bonding member 150 is used. Thereby, when joining with the glass joining member 150, the glass protective member 160 is not melted and the shape at the time of formation can be maintained. Therefore, even if a pressure is applied to the metal sealing lid 130 or the substrate 110 and the metal sealing lid 130 or the substrate 110 is pressed, a short circuit due to the contact between the metal sealing lid 130 and the wiring pattern 113 of the substrate 110 can be reduced. . The glass protective member 160 is provided by, for example, applying a glass frit paste on the upper surface of the wiring pattern 113 provided on the substrate 110 by a screen printing method and drying it. Moreover, the thickness of the glass protective member 160 in the vertical direction is 0.01 to 0.03 mm.

  The glass protection member 160 is provided on the wiring pattern 113 located at the corner of the substrate 110. By doing in this way, it becomes possible to suppress that the metal sealing lid body 130 contacts the wiring pattern 113. Further, the glass protection member 160 is provided at the corner of the substrate 110 so as to have an arc shape in plan view, and the glass protection member 160 is provided in the notch in which the conductor portion 115 is provided. Not. In this way, when the substrate 110 is mounted on a mounting substrate constituting an electronic device or the like, the solder attached to the external terminal 112 is formed so as to crawl up to the conductor portion 114. A solder fillet having a thickness gradually formed from the substrate side toward the conductor portion 114 is formed. Further, since the solder does not crawl up on the wiring pattern 113 of the substrate 110 covered with the glass protective member 160, the short circuit between the solder and the metal sealing lid 130 is reduced. Can do.

  The crystal device in the second modification of the present embodiment is provided with a glass protective member 160 so as to cover the wiring pattern 113. By covering the upper surface of the wiring pattern 113 with the glass protective member 160 in this way, a short circuit between the metal sealing lid 130 and the wiring pattern 113 provided on the upper surface of the substrate 110 can be reduced.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 10, the crystal device in the third modification example of the present embodiment is different from the present embodiment in that the crystal element 220 has a dual-support structure.

  As shown in FIG. 10, the crystal element 220 has a structure in which the excitation electrode 222 and the extraction electrode 223 are attached to the upper surface and the lower surface of the crystal base plate 221, respectively. The excitation electrode 222 is formed by depositing and forming a metal in a predetermined pattern on the upper and lower surfaces of the quartz base plate 221. The excitation electrode 222 includes a first excitation electrode 222a on the upper surface and a second excitation electrode on the lower surface. The extraction electrode 223 extends from the excitation electrode 222 toward the opposite sides of the crystal base plate 221. The first extraction electrode 223 a is extracted from the first excitation electrode 222 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 223 b is extracted from the second excitation electrode and is provided so as to extend toward the other side of the crystal base plate 221. In addition, such a crystal element 220 is fixed on the substrate 110 with a double-sided support structure that is supported at a location located diagonally of the crystal base plate 221. At this time, the first electrode pad 111 a is used for reducing the contact between the outer peripheral edge of the crystal element 220 and the substrate 110.

  A method for bonding the crystal element 220 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the third electrode pad 111c by, for example, a dispenser. The crystal element 220 is transported on the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 220 is bonded to the electrode pad 111. That is, the first extraction electrode 223a of the crystal element 220 is bonded to the second electrode pad 111b, and the second extraction electrode 223b is bonded to the third electrode pad 111c. As a result, the second external terminal 112b and the fourth external terminal 112d are electrically connected to the crystal element 220.

  In the crystal device according to the third modification of the present embodiment, the crystal element 220 includes a rectangular crystal element plate 221, excitation electrodes 222 provided on the upper and lower surfaces of the crystal element plate 221, and the excitation electrode 222. A pair of lead electrodes 223 provided so as to extend toward both opposite sides of the quartz base plate 221, and one of the pair of lead electrodes 223 and the second electrode pad 111b are electrically connected to each other. The other of the pair of lead electrodes 223 and the third electrode pad 111c are electrically connected. By doing so, even if the first lead electrode 223a and the second lead electrode 223b of the crystal element 220 are tilted around the place where the second electrode pad 111b and the third electrode pad 111c are joined, the crystal One corner where the element 220 is not bonded contacts the first electrode pad 111a, and the other corner is separated from the substrate 110, so that the corner where the crystal element 220 is not bonded contacts the upper surface of the substrate 110. Can be suppressed. If a drop test or the like is performed in a state in which the corner where the crystal element 220 is not bonded is in contact with the substrate 110, the corner where the crystal element 220 is not bonded may be lost. By doing so, it is possible to reduce the fluctuation of the oscillation frequency of the crystal element 220 while suppressing the corner of the crystal element 220 from being lost.

(Fourth modification)
Hereinafter, the quartz crystal device according to the fourth modification of the present embodiment will be described. Of the quartz crystal device according to the fourth modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. In the quartz crystal device according to the fourth modification of the present embodiment, as shown in FIG. 11, the electrode pad 211 is rectangular, and the electrode pad 211 is provided with a chamfered portion 216 in plan view. However, this embodiment is different from the present embodiment.

  The chamfered portion 216 is provided in a straight line at a corner facing the excitation electrode 122 side so as to cross from one side of the electrode pad 211 to one side adjacent to the one side. In this way, even if the electrode pad 211 is enlarged, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 211, so that the contact between the excitation electrode 122 and the electrode pad 211 is prevented. Can be reduced.

  The electrode pad 211 has a shape provided along the substrate 210. Here, taking the case where the long side dimension of the substrate 210 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 211 is taken as an example. Explain the size of. The long side length of the electrode pad 211 is 0.40 to 0.90 mm, and the short side length is 0.30 to 0.60 mm. The chamfered portion 216 is obtained by removing the corners of the rectangular electrode pad 211 in a triangular shape, and the dimension parallel to the vertical dimension when the electrode pad 211 is viewed in plan is 0.05 to 0.15 mm. Yes, and the horizontal dimension when viewed in plan is 0.05 to 0.15 mm. Further, the electrode pad 211 provided with the chamfered portion 216 is formed so that the area thereof is 97 to 99% as compared with the rectangular electrode pad 211.

  In the quartz crystal device according to the fourth modification of the present embodiment, the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c are rectangular, and the first electrode pad 211a and the second electrode are in a plan view. A chamfered portion 216 is provided at the corners of the electrode pad 211b and the third electrode pad 211c. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c. Contact with the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bending having a base and two flat-plate-shaped vibrating arms extending in the same direction from the side surface of the base is described. A crystal element may be used.

  In addition, the crystal element 120 may be beveled so that the thickness of the outer periphery of the crystal element plate 121 is thin and the central part of the crystal element plate 121 is thicker than the outer periphery of the crystal element plate 121. . A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The beveling is performed by polishing the quartz body 121, which rotates the cylindrical body containing the abrasive and the quartz body 121 with the central axis of the cylinder as the rotation axis, with the abrasive.

  In the above embodiment, the case where the glass bonding member 150 is provided on the lower surface of the sealing frame portion 130b of the sealing lid 130 has been described. However, the glass bonding member 150 is provided annularly on the outer peripheral edge of the upper surface of the substrate 110. It doesn't matter if you do. Such a glass bonding member 150 is provided, for example, by applying a glass frit paste along the outer peripheral edge of the substrate 110 by a screen printing method and drying it.

110, 210 ... Substrate 111, 211 ... Electrode pad 112, 212 ... External terminal 113, 213 ... Wiring pattern 114, 214 ... Conductor part 115, 215 ... Electrode pattern 216 ... -Chamfered portion 120 ... Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Sealing lid 131 ... Sealing base 132 ... Sealing Frame portion 140 ... conductive adhesive 150 ... glass bonding member K ... accommodating space

Claims (3)

A rectangular substrate;
An electrode pad provided on the upper surface of the substrate;
An external terminal provided on the lower surface of the substrate;
A wiring pattern provided on the upper and lower surfaces of the substrate, and electrically connected to the electrode pads and the external terminals;
A conductor provided on a side surface of the substrate and electrically connected to the wiring pattern;
A crystal element mounted on an electrode pad of the substrate;
A metal sealing lid provided on the upper surface of the substrate;
A glass bonding member provided between the upper surface of the substrate and the lower surface of the sealing lid,
The conductor portion includes a silver-palladium alloy having glass, and the thickness of the conductor portion at the boundary line portion between the outer peripheral edge of the upper surface of the substrate and the conductor portion is larger than the thickness of the other conductor portion. It is provided to be thin,
A quartz crystal device in which the glass bonding member is provided so as to be applied to a portion where the thickness of the upper end of the conductor portion is reduced . The crystal device according to claim 1,
For the total amount of the silver-palladium alloy and the glass,
The quartz crystal device is provided so that a weight ratio of the glass is 0.3 to 5.0% by weight. The quartz crystal device according to claim 1 or 2,
A crystal device comprising a glass protective member provided so as to cover the wiring pattern.

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