JP6282843B2 - Crystal device - Google Patents

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. A substrate, a frame provided along the outer peripheral edge of the lower surface of the substrate, a crystal element mounted on an electrode pad provided on the upper surface of the substrate, and a temperature sensitive element provided on the lower surface of the substrate. A crystal resonator has been proposed (see, for example, Patent Document 1 below).

2011-212340

  In the crystal device described above, a frame is provided on the lower surface of the substrate, and a temperature sensitive element is mounted in the frame. In addition, in order to connect to an external terminal of the substrate, wirings electrically connected to the piezoelectric element and the temperature sensitive element are formed inside and on the surface of the substrate. For this reason, it is difficult to reduce the thickness of the substrate, and it is difficult to reduce the thickness of the crystal device because the frame cannot be removed to form a space for mounting the temperature sensitive element.

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a quartz crystal device that can be made thin while mounting a temperature sensitive element.

A crystal resonator according to one aspect of the present invention includes a substrate, an electrode pad provided on the upper surface of the substrate, an external terminal provided on the lower surface of the substrate, and a through hole provided so as to penetrate in the vertical direction of the substrate. A hole, a connection pad provided on the opposite surface in the through-hole, a temperature sensing element mounted on the connection pad via a conductive bonding material, and a conductive material provided to close the upper opening of the through-hole . A protective member having a melting point higher than that of the bonding member, a crystal element mounted on the electrode pad, a sealing lid provided on the upper surface of the substrate for hermetically sealing the crystal element, and sealing the upper surface of the substrate And a joining member provided between the lower surface of the lid.

A crystal resonator according to one aspect of the present invention includes a through hole provided so as to penetrate in the vertical direction of a substrate, a connection pad provided on a face facing the inside of the through hole, and a conductive bonding material for the connection pad. and the temperature sensitive device mounted over, provided so as to close the upper opening of the through hole, and is characterized in that the melting point than the conductive joining member is provided with a high protection member. By doing so, a space for mounting the temperature sensing element would be secured in the through hole, it is possible to remove the frame compared to the conventional crystal oscillator, crystal oscillator Can be made thinner by the thickness of the frame.

It is a disassembled perspective view which shows the crystal device in this embodiment. It is sectional drawing in AA of the quartz crystal device shown by FIG. (A) It is the top view which looked at the board | substrate which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate which comprises the crystal device in this embodiment from the lower surface. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 1st modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 1st modification of this embodiment is seen from a lower surface. FIG. (A) It is a top view which shows the state which mounted the crystal element which comprises the crystal device in the 2nd modification of this embodiment, (b) The board | substrate which comprises the crystal device in the 2nd modification of this embodiment is a bottom surface It is the top view seen from. (A) It is a top view which shows the state which mounted the crystal | crystallization element which comprises the crystal device in the 3rd modification of this embodiment, (b) The bottom surface which comprises the crystal device in the 2nd modification of this embodiment It is the top view seen from. (A) It is the top view which looked at the board | substrate which comprises the crystal device in the 4th modification of this embodiment from the upper surface, (b) The board | substrate which comprises the crystal device in the 4th modification of this embodiment is seen from a lower surface. FIG. (A) It is the top view which looked at the board | substrate which comprises the quartz device in the 5th modification of this embodiment from the upper surface, (b) The board | substrate which comprises the quartz device in the 5th modification of this embodiment is seen from a lower surface. FIG.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a seal for hermetically sealing the crystal element 120. A lid 130 and a temperature sensitive element 160 mounted in the through hole H of the substrate 110 are included. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape and functions as a mounting member for mounting the temperature-sensitive element 160 inside the through-hole H using the crystal element 120 mounted on the upper surface. A first electrode pad 111 a and a second electrode pad 111 b for bonding the crystal element 120 are provided along one side of the substrate 110. A third electrode pad 111 c is provided along one side facing one side of the substrate 110. External terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the four external terminals 112 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  In the vicinity of the center of the substrate 110, a through hole H that penetrates in the vertical direction of the substrate 110 is provided. The upper opening and the lower opening of the through hole H are rectangular when viewed in plan. As shown in FIGS. 1 and 2, the through holes H are each provided with one connection pad 116 on each of the opposing surfaces in the through hole H. The connection pad 116 includes a first connection pad 116a and a second connection pad 116b. As shown in FIGS. 1 and 2, the connection pad 116 is provided so as to extend from one inner surface to the outer peripheral edge of the through hole H in the upper and lower surfaces of the substrate 110. The remaining two of the four external terminals 112 are electrically connected to the temperature sensing element 160.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. Wiring patterns 113 for electrically connecting the electrode pads 111 provided on the upper surface and the external terminals 112 on the lower surface are provided on the upper surface and the lower surface of the substrate 110, respectively. In addition, an electrode pattern 115 for electrically connecting the second electrode pad 111b and the third electrode pad 111c is provided on the upper surface of the substrate 110.

  The first electrode pad 111a, the second electrode pad 111b, and the third electrode pad 111c of the substrate 110 are used for mounting the crystal element 120 as shown in FIGS. Further, the third electrode pad 111c prevents the outer peripheral edge of the crystal element 120 from coming into contact with the substrate 110 when the crystal element 120 is mounted on the first electrode pad 111a and the second electrode pad 111b. It is used for. As shown in FIG. 3, the first electrode pad 111 a and the second electrode pad 111 b are provided along one side of the substrate 110, and the third electrode pad 111 c is along one side facing one side of the substrate 110. Is provided. Further, the first electrode pad 111 a and the third electrode pad 111 c are provided at diagonal positions on the upper surface of the substrate 110. The electrode pad 111 is electrically connected to the external terminal 112 via a wiring pattern 113 provided on the upper and lower surfaces of the substrate 110 and a conductor portion 114 provided on a corner of the substrate 110. The external terminals 112 are provided along the outer peripheral edge of the substrate 110 at the four corners of the lower surface of the substrate 110.

  As shown in FIG. 3, the electrode pad 111 includes a first electrode pad 111a, a second electrode pad 111b, and a third electrode pad 111c. The external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d as shown in FIG. As shown in FIG. 3, the wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b, and the conductor portion 114 is composed of a first conductor portion 114a and a second conductor portion 114b. The second electrode pad 111b and the second external terminal 112b are connected by a first wiring pattern 113a provided on the upper surface and the lower surface of the substrate 110 and a first conductor portion 114a provided on a corner portion of the substrate 110. . The third electrode pad 111 c and the fourth external terminal 112 d are connected by a second wiring pattern 113 b provided on the upper surface and the lower surface of the substrate 110 and a second conductor portion 114 b provided on a corner portion of the substrate 110. . The first electrode pad 111 a and the third electrode pad 111 c are electrically connected by an electrode pattern 115 provided on the upper surface of the substrate 110. Therefore, the first electrode pad 111a is electrically connected to the fourth external terminal 112d through the third electrode pad 111c.

  The external terminal 112 is used for mounting on a mounting board constituting an external electronic device or the like. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110. The third external terminal 112c is connected to a mounting pad connected to a ground potential that is a reference potential on an external mounting substrate.

  Further, the electrode pad 111 and the external terminal 112 have a shape provided along the substrate 110. Here, taking the case where the long side dimension of the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 111 is taken as an example. The size of the external terminal 112 will be described. The length of the long side of the first electrode pad 111a and the second electrode pad 111b is 0.20 to 0.60 mm, and the length of the short side is 0.10 to 0.50 mm. The third electrode pad 111c has a long side length of 0.60 to 1.10 mm, and a short side length of 0.10 to 0.50 mm. The long side length of the external terminal 112 is 0.30 to 0.90 mm, and the short side length is 0.20 to 0.60 mm.

  The wiring pattern 113 is provided on the upper surface and the lower surface of the substrate 110, and is drawn from the electrode pad 111 and the external terminal 112 toward the corner of the substrate 110 in the vicinity. The length of the first wiring pattern 113a and the length of the second wiring pattern 113b are substantially equal. Here, the substantially equal length means that the difference between the length of the first wiring pattern 113a provided on the upper and lower surfaces of the substrate 110 and the length of the second wiring pattern 113b provided on the upper and lower surfaces of the substrate 110 is 0 to 0. It shall include those that differ by 200 μm. As for the length of the wiring pattern 113, the length of a straight line passing through the center of each wiring pattern 113 is measured.

  As shown in FIG. 3, the conductor portion 114 is provided inside a notch provided in a corner portion of the substrate 110. Both ends of the conductor portion 114 are connected to the wiring pattern 113. By doing so, the electrode pad 111 is electrically connected to the external terminal 112 via the wiring pattern 113 and the conductor portion 114. Further, since the conductor portion 114 is provided so as to print the conductor paste in the cut, the thickness of the conductor portion 114 at the boundary line between the outer peripheral edge of the upper surface of the substrate 110 and the conductor portion 114 is reduced. Yes. Such a conductor part 114 is formed of a silver-palladium alloy and also contains a glass component.

  The electrode pattern 115 is provided on the upper surface of the substrate 110, one end of which is connected to the first electrode pad 111a, and the other end is electrically connected to the third electrode pad 111c. By doing in this way, the 1st electrode pad 111a will be electrically connected with the 4th external terminal 112d via the 3rd electrode pad 111c.

  The connection pad 116 is used for mounting the temperature sensitive element 160. Further, as shown in FIG. 3, the connection pad 116 includes a first connection pad 116a and a second connection pad 116b. The first connection pad 116 a and the first external terminal 112 a are connected by a first connection pattern 117 a provided on the lower surface of the substrate 110, and the second connection pad 116 b and the third external terminal 112 c are connected to the substrate 110. They are connected by a second connection pattern 117b provided on the lower surface.

  The connection pattern 117 is provided on the lower surface of the substrate 110, and is drawn from the connection pad 116 toward the nearby external terminal 112. As shown in FIG. 3, the connection pattern 117 includes a first connection pattern 117a and a second connection pattern 117b. The length of the first connection pattern 117a and the length of the second connection pattern 117b are substantially equal. Here, the substantially equal length means that the difference between the length of the first connection pattern 117a provided on the upper and lower surfaces of the substrate 110 and the length of the second connection pattern 117b provided on the upper and lower surfaces of the substrate 110 is 0 to 0. It shall include those that differ by 200 μm. As for the length of the connection pattern 117, it is assumed that the length of a straight line passing through the center of each connection pattern 117 is measured.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating or gold plating is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the conductor portion 114, the electrode pattern 115, the connection pad 116, and the connection pattern 117. It is produced by applying silver palladium or the like. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 3, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the second external terminal 112b and the fourth external terminal 112d are electrically connected to the crystal element 120.

  The crystal element 120 is mounted such that the third electrode pad 111c is disposed at a position facing the free end of the crystal element 120. By doing so, the free end of the crystal element 120 is in contact with the third electrode pad 111c even if it is tilted around the location where the extraction electrode 123 of the crystal element 120 and the electrode pad 111 are joined. It is possible to prevent the free end of the crystal element 120 from coming into contact with the upper surface of the substrate 110. If the drop test is performed with the free end of the crystal element 120 in contact with the substrate 110, the free end of the crystal element 120 may be lost. By doing in this way, it can reduce that the oscillation frequency of the crystal element 120 fluctuates, suppressing that the free end side of the crystal element 120 is missing.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 160, a thermistor, a platinum resistance temperature detector, a diode, or the like is used. In the case of the thermistor element, the temperature-sensitive element 160 has a rectangular parallelepiped shape and is provided with connection terminals 161 at both ends. The temperature sensing element 160 shows a remarkable change in electrical resistance due to a temperature change. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and the voltage and the relationship between the voltage and the temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 160 outputs a voltage between the first external terminal 112a and the third external terminal 112c to the outside of the crystal resonator via the first external terminal 112a and the third external terminal 112c, for example, Temperature information can be obtained by converting a voltage output from a main IC (not shown) such as an electronic device into a temperature. Such a temperature sensitive element 160 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the main IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation. Can do.

  When a platinum resistance thermometer is used, the temperature sensing element 160 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 161 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

  When a diode is used, the temperature sensing element 160 has a structure in which a semiconductor element is mounted on the upper surface of a semiconductor element substrate and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals 161 serving as an anode terminal and a cathode terminal are provided from the lower surface to the side surface of the semiconductor element substrate. The temperature sensing element 160 has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly flows current from the cathode terminal to the anode terminal. The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, temperature information of the crystal element can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. The voltage between the first external terminal 112a and the third external terminal 112c is output to the outside of the crystal resonator via the first external terminal 112a and the third external terminal 112c.

  2 and 3, the temperature sensitive element 160 is mounted on a connection pad 116 provided in the through hole H via a conductive bonding material 180 such as solder. Further, the second connection terminal 161b of the temperature sensitive element 160 is connected to the second connection pad 116b. The second connection pad 116b is electrically connected to the third external terminal 112c through a second connection pattern 117b provided on the lower surface of the substrate 110. The third external terminal 112c serves as a ground terminal by being connected to a mounting pad connected to the ground which is a reference potential on the external mounting substrate. Therefore, the second connection terminal 161b of the temperature sensitive element 160 is connected to the ground that is the reference potential.

  Further, since the temperature sensing element 160 is positioned in the plane of the excitation electrode 122 provided on the crystal element 120 in a plan view, the temperature sensing element 160 is made electronic by the shielding effect of the metal film of the excitation electrode 122. It protects against noise from other semiconductor parts and electronic parts such as power amplifiers that make up the equipment. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 160 and to output an accurate voltage of the temperature sensing element 160. Further, since an accurate voltage value can be output from the temperature sensing element 160, temperature information obtained by converting the voltage output from the temperature sensing element 160 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  A method for bonding the temperature sensing element 160 to the substrate 110 will be described. First, the temperature sensitive element 160 is placed so as to be accommodated in the through hole H. The conductive bonding material 180 is applied so as to straddle the connection terminal 161 of the temperature-sensitive element 160 from the connection pad 116 provided on the inner wall of the through hole H by a dispenser, for example. The conductive bonding material 180 is melt-bonded by heating. Therefore, the temperature sensitive element 160 is bonded to the pair of connection pads 116 provided in the through hole H of the substrate 110.

  Further, when the temperature sensitive element 160 is a thermistor element, as shown in FIGS. 1 and 3, one connection terminal 161 is provided at each of both ends of the rectangular parallelepiped shape. One connection terminal 161 a is provided on the left side surface and the top and bottom surfaces of the temperature sensing element 160. The other connection terminal 161 b is provided on the right side surface and the upper and lower surfaces of the temperature sensing element 160. The length of the long side of the temperature sensing element 160 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 160 in the thickness direction is 0.1 to 0.3 mm. The distance between the side surfaces of the connection terminals 161a and 161b of the temperature sensitive element 160 and the inner surface of the through hole H is set to be 0.05 to 0.1 mm. By doing in this way, even when a force is applied when mounting the temperature sensing element 160, the temperature sensing element 160 is pressed by the inner wall surface in the through hole H. It is possible to reduce the occurrence of displacement of the temperature sensitive element 160.

  The protection member 170 is provided on the upper surface of the substrate 110 so as to close the opening on the upper surface of the through hole H. By doing so, the inside of the accommodation space K is hermetically sealed, and gas generated from the conductive bonding material 180 when the temperature-sensitive element 160 is mounted on the connection pad 116 is suppressed from adhering to the crystal element 120. be able to. As the protective member 170, a member having a melting point of 500 to 800 ° C. higher than that of the bonding member 150 is used. The protective member 170 is provided by, for example, applying and drying glass frit paste so as to close the opening on the upper surface of the through hole provided in the substrate 110 by screen printing. Moreover, the thickness of the up-down direction of the protection member 170 is 0.01-0.03 mm.

  The conductive bonding material 180 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 180 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 98% for tin, 2 to 4% for silver, and 0 to 1.0% for copper.

  The sealing lid 130 includes a rectangular sealing base portion 130a and a sealing frame portion 130b provided along the outer peripheral edge of the lower surface of the sealing base portion 130a, and the lower surface of the sealing base portion 130a. A storage space K is formed by the inner side surface of the sealing frame portion 130b. The sealing frame part 130b is for forming the accommodation space K on the lower surface of the sealing base part 130a. The sealing frame part 130b is provided along the outer edge of the lower surface of the sealing base part 130a.

  The sealing base portion 130a and the sealing frame portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid 130 is for hermetically sealing the housing space K in a vacuum state or the housing space K filled with nitrogen gas or the like. Specifically, the sealing lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and the bonding member 150 provided between the upper surface of the substrate 110 and the lower surface of the sealing frame portion 130b is heated. Is applied to melt-bond.

  The bonding member 150 is used to bond the lower surface of the sealing lid 130 and the outer peripheral edge of the upper surface of the substrate 110. As shown in FIG. 2, the bonding member 150 is provided from the lower surface of the sealing frame portion 130 b to the outer peripheral edge on the substrate 110.

  The joining member 150 is made of, for example, low melting glass or lead oxide glass containing vanadium which is a glass that melts at 300 ° C. to 400 ° C. Glass is pasty with a binder and a solvent added, and is melted and then solidified to adhere to other members. The joining member 150 is provided by, for example, applying glass frit paste in an annular shape along the lower surface of the sealing frame portion 130b by screen printing and drying. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide.

  In the quartz crystal device according to the present embodiment, the through hole H provided so as to penetrate the substrate 110 in the vertical direction, the connection pad 116 provided on the facing surface in the through hole H, and the feeling mounted on the connection pad 116. A temperature element 160 and a protective member 170 provided so as to close the upper surface of the through hole H are provided. By doing so, a space for mounting the temperature sensing element 160 is secured in the through hole, and the frame 110b can be eliminated as compared with the conventional crystal device. Can be reduced in thickness by the thickness of the frame 110b.

  Further, in the quartz crystal device according to the present embodiment, the protective member 170 is provided on the upper surface of the substrate 110 so as to close the opening on the upper surface of the through hole H. By doing so, the inside of the accommodation space K can be hermetically sealed, and gas generated from the conductive bonding material 180 adheres to the crystal element 120 when the temperature-sensitive element 160 is mounted on the connection pad 116. Can be suppressed.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. The quartz crystal device according to the first modification of the present embodiment is different from the present embodiment in that the protective member 270 is provided so as to block the lower opening of the through hole H as shown in FIG.

  As shown in FIG. 4, the protection member 270 is provided on the upper surface and the lower surface of the substrate 110 so as to close the upper opening and the lower opening of the through hole H. By doing so, the inside of the accommodation space K is hermetically sealed, and further, the gas generated from the conductive bonding material 180 when the temperature sensitive element 160 is mounted on the connection pad 116 is further adhered to the crystal element 120. Can be suppressed. Further, the protective member 270 is provided so as to close the lower opening of the through hole H, so that the solder attached to the external terminal 112 adheres to the temperature sensitive element 160 in the through hole H when the crystal device is mounted. Thus, it is possible to reduce the short circuit. The protective member 270 is provided by, for example, applying and drying glass frit paste so as to close the upper opening and the lower opening of the through hole H provided in the substrate 110 by a screen printing method.

  The quartz crystal device according to the first modification of the present embodiment is provided with a protective member 270 so as to cover the lower surface of the through hole H. By covering the lower surface of the opening of the through hole H with the protective member 270 in this way, when the crystal device is mounted, the solder attached to the external terminal 112 adheres to the temperature sensitive element 160 in the through hole H and is short-circuited. Can be reduced.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. As shown in FIG. 5, the crystal device according to the second modification of the present embodiment is provided on the lower surface of the substrate 110 and is electrically connected to the two of the external terminals 112 and the connection pads 116. And a connection pattern 117, and is different from the present embodiment in that the protection member 370 is provided so as to cover the connection pattern 117.

  As shown in FIG. 5, the protection member 370 is provided so as to cover the upper surface of the through hole H and the connection pattern 117. Further, the protective member 370 provided so as to cover the connection pattern 117 is provided so as to be parallel to the outer peripheral edge of the short side of the substrate 110. As described above, the protective member 370 provided on the connection pattern 117 can reduce the flow of the conductive bonding material 180 along the connection pattern 117 after the conductive bonding material 180 is applied to the connection pad 116. It is possible to maintain the conductive bonding material 180 sufficient to maintain the bonding strength of 160. Therefore, it is possible to reduce the temperature sensitive element 160 from being detached from the connection pad 116.

  The quartz crystal device according to the second modified example of the present embodiment includes a connection pattern 117 provided on the lower surface of the substrate 110 and electrically connected to two of the external terminals 112 and the connection pad 116, and a protection member 370 is provided. It is provided so as to cover the connection pattern. Thus, by covering the upper surface of the connection pattern 117 with the protective member 370, it is possible to reduce the flow of the conductive bonding material 180 along the connection pattern 117 after applying the conductive bonding material 180 to the connection pad 116. The conductive bonding material 180 sufficient to maintain the bonding strength of the temperature element 160 can be maintained. Therefore, it is possible to reduce the temperature sensitive element 160 from being detached from the connection pad 116.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the third modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 6, the quartz crystal device according to the third modification of the present embodiment is provided on the upper and lower surfaces of the substrate 110 and is electrically connected to the electrode pads 111 and the external terminals 112. 113 and a conductive portion 114 that is provided on the side surface of the substrate and electrically connected to the wiring pattern 113, and the protection member 470 is provided so as to cover the wiring pattern 113. Different from the embodiment.

  The protective member 470 is used to reduce a short circuit caused by the wiring pattern 113 coming into contact with the metal sealing lid 130. Further, as shown in FIG. 6, the protection member 470 is provided so as to cover the wiring pattern 113 provided on the upper surface of the substrate 110. The protection member 470 is provided, for example, by applying a glass frit paste on the upper surface of the wiring pattern 113 provided on the substrate 110 by a screen printing method and drying it. Moreover, the thickness of the up-down direction of the protection member 470 is 0.01-0.03 mm.

  Further, the protection member 470 is provided on the wiring pattern 113 located at the corner of the substrate 110. By doing in this way, it becomes possible to suppress that the metal sealing lid body 130 contacts the wiring pattern 113. Further, the protection member 470 is provided at the corner of the substrate 110 so as to have an arc shape in plan view, and the protection member 470 is not provided in the notch in which the conductor portion 114 is provided. . In this way, when the substrate 110 is mounted on a mounting substrate constituting an electronic device or the like, the solder attached to the external terminal 112 is formed so as to crawl up to the conductor portion 114. A fillet is formed. In addition, since the solder does not crawl on the wiring pattern 113 of the substrate 110 covered with the protective member 470, a short circuit between the solder and the metal sealing lid 130 can be reduced.

  The quartz crystal device according to the third modification of the present embodiment is provided with a protection member 470 so as to cover the wiring pattern 113. By covering the upper surface of the wiring pattern 113 with the protective member 470 in this way, when the metal sealing lid 130 is bonded to the upper surface of the substrate 110, the metal sealing lid 130 and the upper surface of the substrate 110 are placed on the upper surface of the substrate 110. Short circuit with the wiring pattern 113 provided can be reduced.

(Fourth modification)
Hereinafter, the quartz crystal device according to the fourth modification of the present embodiment will be described. Of the quartz crystal device according to the fourth modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. As shown in FIG. 7, in the crystal device according to the fourth modification example of the present embodiment, the electrode pad 211 has a rectangular shape, and the electrode pad 211 is provided with a chamfered portion 218 in plan view. However, this embodiment is different from the present embodiment.

  The chamfered portion 218 is provided in a straight line at the corner facing the excitation electrode 122 side so as to cross from one side of the electrode pad 211 to one side adjacent to the one side. In this way, even if the electrode pad 211 is enlarged, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 211, so that the contact between the excitation electrode 122 and the electrode pad 211 is prevented. Can be reduced.

  The electrode pad 211 has a shape provided along the substrate 210. Here, taking the case where the long side dimension of the substrate 210 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 211 is taken as an example. Explain the size of. The long side length of the electrode pad 211 is 0.40 to 0.90 mm, and the short side length is 0.30 to 0.60 mm. The chamfered portion 218 is obtained by removing the corners of the rectangular electrode pad 211 in a triangular shape, and the dimension parallel to the vertical dimension when the electrode pad 211 is viewed in plan is 0.05 to 0.15 mm. Yes, and the horizontal dimension when viewed in plan is 0.05 to 0.15 mm. Further, the electrode pad 211 provided with the chamfered portion 218 is formed so that the area thereof is 97 to 99% as compared with the rectangular electrode pad 211.

  In the quartz crystal device according to the fourth modification of the present embodiment, the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c are rectangular, and the first electrode pad 211a and the second electrode are in a plan view. A chamfered portion 218 is provided at the corners of the electrode pad 211b and the third electrode pad 211c. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c. Contact with the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c can be reduced.

(Fifth modification)
Hereinafter, a quartz crystal device according to a fifth modification of the present embodiment will be described. Note that, in the quartz device according to the fifth modification of the present embodiment, the same parts as those of the quartz device described above are denoted by the same reference numerals, and the description thereof is omitted as appropriate. As shown in FIG. 8, the quartz crystal device according to the fifth modified example of the present embodiment is arranged in the through hole H so that the long side of the temperature sensitive element 260 is parallel to the short side of the substrate 310. This is different from the present embodiment.

  In the vicinity of the center of the substrate 310, a through-hole H penetrating in the vertical direction of the substrate 310 is provided. The opening of the through hole H has a rectangular shape in plan view, and is provided so that the long side of the through hole H and the short side of the substrate 310 are parallel to each other. Connection pads 316 are respectively provided on the opposing surfaces in the short side direction of the through holes H. The connection pad 316 includes a first connection pad 316a and a second connection pad 316b. The connection pad 316 is provided so as to extend from one inner surface to the outer peripheral edge of the through hole H in the upper and lower surfaces of the substrate 310. The remaining two of the four external terminals 312 are electrically connected to the temperature sensing element 260.

  The temperature sensing element 260 is disposed in the through hole H so that the long side of the temperature sensing element 260 and the short side of the substrate 310 are parallel to each other. By doing so, the distance between the external terminal 312 electrically connected to the crystal element 120 and the connection pad 316 can be increased, so that the conductive bonding material for bonding the temperature-sensitive element 260 is used. Even if 180 overflows, it is possible to prevent the conductive bonding material 180 from adhering. Therefore, a short circuit between the temperature sensing element 260 and the external terminal 312 electrically connected to the crystal element 120 can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the crystal element for AT is used as the crystal element has been described. A crystal element may be used. In the above-described embodiment, the case where the crystal element is fixed on the substrate 110 with the cantilever support structure has been described. However, the crystal element may have a both-end support structure.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the bonding member 150 is provided on the lower surface of the sealing frame portion 130b of the sealing lid 130 has been described. However, the bonding member 150 is provided annularly on the outer peripheral edge of the upper surface of the substrate 110. It doesn't matter. Such a joining member 150 is provided, for example, by applying a glass frit paste along the outer peripheral edge of the substrate 110 by a screen printing method and drying it.

110, 210, 310 ... Substrate 111, 211, 311 ... Electrode pad 112, 212, 312 ... External terminal 113, 213, 313 ... Wiring pattern 114, 214, 314 ... Conductor part 115 215, 315 ... Electrode pattern 116, 216, 316 ... Connection pad 117, 217, 317 ... Connection pattern 218 ... Chamfered portion 120 ... Crystal element 121 ... Crystal base plate 122 ··· Excitation electrode 123 ··· Extraction electrode 130 ··· Sealing lid 131 ··· Sealing base portion 132 ··· Sealing frame portion 140 ··· Conductive adhesive 150 ··· Joining member 160 · ·・ ・ Temperature sensing element 170 ・ ・ ・ Protective member 180 ・ ・ ・ Conductive bonding material K ・ ・ ・ Storage space H ・ ・ ・ Through hole

Claims (5)

A substrate,
An electrode pad provided on the upper surface of the substrate;
An external terminal provided on the lower surface of the substrate;
A through hole provided so as to penetrate in the vertical direction of the substrate;
A connection pad provided on the facing surface in the through hole;
A temperature sensitive element mounted on the connection pad via a conductive bonding material ;
A protective member provided so as to close the upper opening of the through hole, and having a melting point higher than that of the conductive bonding member ;
A crystal element mounted on the electrode pad;
In order to hermetically seal the crystal element, a sealing lid provided on the upper surface of the substrate;
A crystal resonator comprising: a bonding member provided between an upper surface of the substrate and a lower surface of the sealing lid. The crystal resonator according to claim 1,
The quartz resonator, wherein the protective member is provided so as to close a lower opening of the through hole. The crystal resonator according to claim 1,
A connection pattern provided on the lower surface of the substrate and electrically connected to two of the external terminals and the connection pad ;
A crystal resonator, wherein the protective member is provided so as to cover the connection pattern. The crystal resonator according to claim 1, wherein:
A wiring pattern provided on the upper and lower surfaces of the substrate, and electrically connected to the electrode pads and the external terminals;
Provided on a side surface of the substrate, and a conductor portion electrically connected to the wiring pattern,
The quartz resonator , wherein the protective member is provided so as to cover the wiring pattern. The crystal resonator according to any one of claims 1 to 4,
The electrode pad has a rectangular shape, a crystal oscillator in plan view, wherein the chamfered portion is provided at the corner of the electrode pads.

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