JP2015091127A - Crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal oscillator that is able to reduce a difference between a temperature obtained by conversion of a voltage output from a temperature-sensitive element and the actual ambient temperature of a crystal element.SOLUTION: A crystal oscillator comprises: a substrate 110 that is rectangular as viewed from above, and provided with a joint terminal 112 having predetermined thickness at the four corners of the underside of the terminal; a mounting frame body 160 having a joint pad 161 of predetermined thickness provided on the four corners of the upper surface, and provided on the underside of the substrate 110a by joining the joint pad 161 and joint terminal 112; crystal elements 120 mounted on the pair of electrode pads 111 on the upper surface of the substrate 110; temperature-sensitive elements 150 mounted on a pair of connection pads 115 on the underside of the substrate 110; and a lid body 130. A space part H is provided, which extends from an area surrounded by the mounting frame body 160 on the underside of the substrate 110, through the space between the joint pad 161 and joint terminal 112 joined at two adjacent points, to the external faces of the substrate 110 and mounting frame body 160.

Description

  The present invention relates to a crystal resonator used in an electronic device or the like.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a package having a substrate, a first frame provided on the upper surface of the substrate for providing the first recess, and a second frame provided on the lower surface of the substrate for providing the second recess. And a crystal resonator mounted on an electrode pad provided on the upper surface of the substrate and a temperature sensitive element provided on the lower surface of the substrate have been proposed (see, for example, Patent Document 1 below) ).

JP 2011-2111340 A

  In the above-described crystal resonator, a crystal element is mounted in the first recess, and a temperature sensitive element is mounted in the second recess. When such a crystal resonator is mounted on a mounting substrate such as an electronic device, the opening of the second recess is blocked by the mounting substrate. In this state, when other electronic components mounted on the mounting board generate heat and the heat is transferred to the second recess through the mounting board, the air in the second recess is heated by the heat. Since the heated air stays in the second recess, the temperature around the temperature sensing element may increase. As a result, the ambient temperature of the quartz element and the ambient temperature of the temperature sensitive element are different, and the temperature obtained by converting the voltage output from the temperature sensitive element and the actual ambient temperature of the quartz element There was a risk that the difference from the temperature would increase.

  The present invention has been made in view of the above problems, and it is possible to reduce the difference between the temperature obtained by converting the voltage output from the temperature-sensitive element and the temperature around the actual crystal element. It is an object to provide a simple crystal resonator.

  A crystal resonator according to one aspect of the present invention includes a substrate having a rectangular shape in plan view and provided with bonding terminals having predetermined thicknesses at the four corners of the lower surface and bonding pads having predetermined thicknesses provided at the four corners of the upper surface. A bonding frame provided on the lower surface of the substrate by bonding the bonding pad and the bonding terminal; a crystal element mounted on a pair of electrode pads provided on the upper surface of the substrate; A temperature sensitive element mounted on a pair of connection pads provided in a region surrounded by the mounting frame on the lower surface of the substrate, and a lid for hermetically sealing the crystal element, A space between the substrate pad and the outer surface of the mounting frame through the space between the bonding pads and the bonding terminals adjacent to each other in the region surrounded by the mounting frame on the lower surface It is characterized by having.

  The crystal resonator according to another aspect of the present invention is characterized in that the mounting frame is made of a glass epoxy resin.

  According to another aspect of the present invention, there is provided a crystal resonator in which the crystal element and the temperature sensitive element are mounted on the substrate, and the temperature sensitive element is provided on the crystal element in plan view. It is also characterized by being located in the plane.

  In the crystal resonator according to another aspect of the present invention, the mounting frame is provided with a connection pattern for electrically connecting the connection pad and the junction terminal, and the pair of electrode pads. Are provided in parallel on one short side of the substrate with a predetermined interval between the electrode pads, and one of the connection patterns passes between the two electrode pads in plan view. It is also characterized by being provided.

  The crystal oscillator of the present invention has a rectangular substrate, a frame provided on the upper surface of the substrate, and a bonding pad provided along the outer peripheral edge of the upper surface, along the outer peripheral edge of the lower surface of the substrate. A mounting frame provided on the lower surface of the substrate is provided by bonding the provided bonding terminal and the bonding pad. With such a configuration, a gap is provided between the lower surface of the substrate and the upper surface of the mounting frame. For example, the crystal unit of the present invention is mounted on a mounting substrate such as an electronic device. When mounted, even if other electronic components mounted on the mounting board generate heat and the heat is transferred to the second recess through the mounting board, the air heated by the heat Air that has been heated through the gap without being trapped in the two recesses is discharged to the outside, and outside air enters the second recess through the gap, so that the temperature sensing element mounted in the second recess The effect of heat can be mitigated. Therefore, the crystal resonator of the present invention can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensitive element and the temperature around the actual crystal element.

It is a disassembled perspective view which shows the crystal resonator which concerns on this embodiment. (A) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. (A) is a perspective plan view seen from the upper surface of the package constituting the crystal resonator according to the present embodiment, and (b) is seen from the upper surface of the substrate of the package constituting the crystal resonator according to the present embodiment. It is a perspective plan view. (A) is the plane perspective view seen from the lower surface of the package which comprises the crystal oscillator which concerns on this embodiment, (b) is the plane perspective view which looked at the crystal oscillator concerning this embodiment from the lower surface. (A) is the top view seen from the upper surface of the mounting frame which comprises the crystal resonator which concerns on this embodiment, (b) is from the lower surface of the mounting frame which comprises the crystal resonator which concerns on this embodiment. It is the seen top view. (A) is a perspective plan view seen from the upper surface of the package constituting the crystal resonator according to the first modification of the present embodiment, and (b) is the crystal resonator according to the first modification of the present embodiment. It is the see-through plan view seen from the upper surface of the board | substrate of the package which comprises. (A) is the plane perspective view seen from the lower surface of the package which comprises the crystal resonator which concerns on the 1st modification of this embodiment, (b) is the crystal resonator which concerns on the 1st modification of this embodiment. It is the plane perspective view which looked at from the lower surface. (A) is a perspective plan view seen from the upper surface of a package constituting a crystal resonator according to a second modification of the present embodiment, and (b) is a crystal resonator according to the second modification of the present embodiment. It is the see-through plan view seen from the upper surface of the board | substrate of the package which comprises. (A) is the plane perspective view seen from the lower surface of the package which comprises the crystal resonator which concerns on the 2nd modification of this embodiment, (b) is the crystal resonator which concerns on the 2nd modification of this embodiment. It is the plane perspective view which looked at from the lower surface.

  As shown in FIGS. 1 to 4, the crystal resonator according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a temperature sensitive element bonded to the lower surface of the substrate 110. 150 and a lid 130 for hermetically sealing the crystal element 120. A mounting frame 160 is provided on the lower surface of the substrate 110, and a second recess K <b> 2 surrounded by the inner surface of the mounting frame 160 is formed. Such a crystal resonator is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape in plan view, and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface and the temperature sensitive element 150 mounted on the lower surface. The substrate 110 is provided with an electrode pad 111 for mounting the crystal element 120 on the upper surface and a connection pad 115 for mounting the temperature sensitive element 150 on the lower surface. A first electrode pad 111 a and a second electrode pad 111 b for bonding the crystal element 120 are provided along one side of the substrate 110. Bonding terminals 112 are provided at the four corners of the lower surface of the substrate 110. Also, two of the four junction terminals 112 are electrically connected to the crystal element 120. Also, two of the four junction terminals 112 are electrically connected to the temperature sensing element 150. Further, the first connection terminal 112 a and the third connection terminal 112 c that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the substrate 110. Further, the second joint terminal 112b and the fourth joint terminal 112d electrically connected to the temperature sensing element 130 are provided with the first joint terminal 112a and the third joint terminal 112c connected to the crystal element 120. It is provided so as to be located at a diagonal of the substrate 110 different from the diagonal.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113 and a via conductor 114 for electrically connecting the electrode pad 111 provided on the upper surface and the bonding terminal 112 provided on the lower surface of the substrate 110 are provided on and inside the substrate 110. Yes. Further, a connection pattern 116 for electrically connecting the connection pads 115 provided on the lower surface and the bonding terminals 112 provided on the lower surface of the substrate 110 is provided on the surface of the substrate 110.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110, and are provided adjacent to each other along one side of the substrate 110. The electrode pad 111 is electrically connected to the bonding terminal 112 provided on the lower surface of the substrate 110 through the wiring pattern 113 and the via conductor 114 provided on the upper surface of the substrate 110 as shown in FIGS. It is connected to the.

  As shown in FIG. 3, the electrode pad 111 is composed of a first electrode pad 111a and a second electrode pad 111b. Further, as shown in FIG. 4B, the junction terminal 112 includes a first junction terminal 112a, a second junction terminal 112b, a third junction terminal 112c, and a fourth junction terminal 112d. The via conductor 114 includes a first via conductor 114a and a second via conductor 114b. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b. The first electrode pad 111 a is electrically connected to one end of the first wiring pattern 113 a provided on the substrate 110. The other end of the first wiring pattern is electrically connected to the first joint terminal 112a via the first via conductor 114a. Therefore, the first electrode pad 111a is electrically connected to the first joint terminal 112a. The second electrode pad 111 b is electrically connected to one end of the second wiring pattern 113 b provided on the substrate 110. The other end of the second wiring pattern 113b is electrically connected to the third junction terminal 112c through the second via conductor 114b.

  The joint terminal 112 is used for electrical joining with the joint pad 161 of the mounting frame 160. The junction terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the bonding terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. In addition, the junction terminal 112 that is electrically connected to the electrode pad 111 is provided so as to be located diagonally on the lower surface of the substrate 110. The second joint terminal 112 c is electrically connected to the sealing conductor pattern 118 via the ground via conductor 117.

  The wiring pattern 113 is provided on the upper surface of the substrate 110 and is drawn from the electrode pad 111 toward the via conductor 114 of the nearby substrate 110. Moreover, the wiring pattern 113 is comprised by the 1st wiring pattern 113a and the 2nd wiring pattern 113b, as shown in FIG.

  The via conductor 114 is provided inside the substrate 110, and both ends thereof are electrically connected to the wiring pattern 113 and the connection pattern 115. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110.

  The connection pad 115 is used for mounting the temperature sensitive element 150. Further, as shown in FIG. 4, the connection pad 115 includes a first connection pad 115a and a second connection pad 115b. The first connection pad 115a and the second bonding terminal 112b are connected by a first connection pattern 116a provided on the lower surface of the substrate 110, and the second connection pad 115b and the fourth bonding terminal 112d are connected to the substrate 110. They are connected by a second connection pattern 116b provided on the lower surface.

  The connection pattern 116 is provided on the lower surface of the substrate 110, and is drawn from the connection pad 116 toward the nearby bonding terminal 112. Further, as shown in FIG. 4, the connection pattern 116 includes a first connection pattern 116a and a second connection pattern 116b. The length of the first connection pattern 116a and the length of the second connection pattern 116b are substantially equal. Here, the substantially equal length means that the difference between the length of the first connection pattern 116 a provided on the lower surface of the substrate 110 and the length of the second connection pattern 116 b provided on the lower surface of the substrate 110 is different by 0 to 200 μm. Shall be included. The length of the connection pattern 116 is obtained by measuring the length of a straight line passing through the center of each connection pattern 116. That is, when the wiring length of the first connection pattern 116a and the wiring length of the second connection pattern 116b are substantially equal, the generated resistance values are equal, and the load resistance applied to the temperature sensing element 150 is also uniform. Therefore, it becomes possible to output a voltage stably.

  The second connection pattern 116b is provided so as to pass between the pair of electrode pads 111 in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second connection pad 115b via the substrate 110 located immediately below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

  The sealing conductor pattern 118 plays a role of improving the wettability of the sealing member 131 when it is joined to the lid 130 via the sealing member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern 118 is electrically connected to the second junction terminal 112 b through the ground via conductor 117. The sealing conductor pattern 118 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of, for example, tungsten or molybdenum so as to surround the upper surface of the substrate 110 in an annular shape. ing.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, predetermined portions of the conductor pattern, specifically, the electrode pad 111, the bonding terminal 112, the wiring pattern 113, the via conductor 114, the connection pad 115, the connection pattern 116, the ground via conductor 117, and the sealing conductor pattern 118. This is produced by applying nickel plating, gold plating, silver palladium, or the like to the part to be. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  The mounting frame 160 is bonded to the lower surface of the substrate 110 and is used to form the second recess K2 on the lower surface of the substrate 110. The mounting frame 160 is made of an insulating substrate such as glass epoxy resin, and is bonded to the lower surface of the substrate 110 via a conductive bonding material 170. Inside the mounting frame 160, a conductor portion 163 for electrically connecting a bonding pad 161 provided on the upper surface and an external terminal 162 provided on the lower surface of the mounting frame 160 is provided. Bonding pads 161 are provided at the four corners of the upper surface of the mounting frame 160, and external terminals 162 are provided at the four corners of the lower surface. Two of the four external terminals 162 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120. Also, two of the four external terminals 162 are electrically connected to the temperature sensing element 150. Further, the first external terminal 162 a and the third external terminal 162 c that are electrically connected to the crystal element 120 are provided so as to be located diagonally on the lower surface of the mounting frame 160. The second external terminal 162b and the fourth external terminal 162d that are electrically connected to the temperature sensing element 150 are provided with the first external terminal 162a and the third external terminal 162c that are connected to the crystal element 120. It is provided so that it may be located in the diagonal of the mounting frame 160 different from the diagonal which is.

  The bonding pad 161 is for electrically bonding to the bonding terminal 112 of the substrate 110 via the conductive bonding material 170. As shown in FIG. 5, the bonding pad 161 includes a first bonding pad 161a, a second bonding pad 161b, a third bonding pad 161c, and a fourth bonding pad 161d. As shown in FIG. 5, the external terminal 162 includes a first external terminal 162a, a second external terminal 162b, a third external terminal 162c, and a fourth external terminal 162d. The conductor part 163 includes a first conductor part 163a, a second conductor part 163b, a third conductor part 163c, and a fourth conductor part 163d. The first bonding pad 161a is electrically connected to the first external terminal 162a via the first conductor portion 163a, and the second bonding pad 161b is connected to the second external terminal 162b via the second conductor portion 163b. Electrically connected. The third bonding pad 161c is electrically connected to the third external terminal 162c via the third conductor portion 163c, and the fourth bonding pad 161d is connected to the fourth external terminal 162d via the fourth conductor portion 163d. Electrically connected.

  The external terminal 162 is for mounting on a mounting board such as an electronic device. The external terminals 162 are provided at the four corners of the lower surface of the mounting frame 160. Two of the external terminals 162 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. The remaining two terminals of the external terminals 162 are electrically connected to a pair of connection pads 115 provided on the lower surface of the substrate 110. The second external terminal 162b is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting board of an electronic device or the like. As a result, the lid 130 bonded to the sealing conductor pattern 118 is connected to the second external terminal 162b having the ground potential.

  The conductor portion 163 is for electrically connecting the bonding pad 161 on the upper surface of the substrate 110 and the external terminal 162 on the lower surface. The conductor portion 163 is formed by providing through holes at the four corners of the mounting frame 160, forming a conductive member on the inner wall surface of the through hole, closing the upper surface with the bonding pad 161, and closing the lower surface with the external terminals 162. ing.

  The shape of the opening of the second recess K2 is a rectangular shape in plan view. Here, taking the case where the long side dimension when viewing the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the second concave portion is taken as an example. The size of the opening of K2 will be described. The length of the long side of the second recess K2 is 0.6 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm.

  A method for bonding the mounting frame 160 to the substrate 110 will be described. First, the conductive bonding material 170 is applied onto the first bonding pad 161a, the second bonding pad 161b, the third bonding pad 161c, and the fourth bonding pad 161d by, for example, a dispenser and screen printing. The substrate 110 is transported so that the bonding terminals of the substrate 110 are positioned on the conductive bonding material 170 and placed on the conductive bonding material 170. The conductive bonding material 170 is cured and contracted by being heated and cured. As a result, the bonding terminal 112 of the substrate 110 is bonded to the bonding pad 161. That is, the first bonding terminal 112a of the substrate 110 is bonded to the first bonding pad 161a, and the second bonding terminal 112b of the substrate 110 is bonded to the second bonding pad 161b. Further, the third bonding terminal 112c of the substrate 110 is bonded to the third bonding pad 161c, and the fourth bonding terminal 112d of the substrate 110 is bonded to the fourth bonding pad 161d.

  Further, the bonding terminal 112 of the substrate 110 and the bonding pad 161 of the mounting frame body 160 are bonded through the conductive bonding material 170, so that the substrate 110 and the mounting frame body 160 are shown in FIG. A gap H corresponding to the sum of the thickness of the conductive bonding material 170 and the thickness of the bonding terminal 112 and the bonding pad 161 is provided. Thereby, for example, when the crystal resonator of the present embodiment is mounted on a mounting substrate such as an electronic device, other electronic components such as power amplifiers mounted on the mounting substrate generate heat, and the heat Even if the air is transmitted into the second recess K2 via the mounting substrate, the air heated by the heat is not trapped in the second recess K2, and the heated air is discharged to the outside through the gap H. Since the air enters the second recess K2 through the gap H, the influence of heat on the temperature sensitive element 150 can be reduced in the second recess K2. Therefore, such a crystal resonator can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  Here, a method for manufacturing the mounting frame 160 will be described. When the mounting frame 160 is made of glass epoxy resin, it is manufactured by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature. In addition, a predetermined portion of the conductor pattern, specifically, the bonding pad 161 and the external terminal 162, for example, transfer a copper foil processed into a predetermined shape onto a resin sheet made of glass epoxy resin, and the copper foil is transferred. The formed resin sheets are laminated and bonded with an adhesive. The conductor portion 163 is formed by being deposited on the inner surface of the through hole formed in the resin sheet by printing or plating a conductor paste, or by filling the through hole. Such a conductor part 163 is formed by, for example, integrating a metal foil or a metal column by resin molding, or depositing it using a sputtering method, a vapor deposition method, or the like.

  As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 and 2, the crystal element 120 has a structure in which an excitation electrode 122 and an extraction electrode 123 are attached to an upper surface and a lower surface of a crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the first joint terminal 112a and the third joint terminal 112c are electrically connected to the crystal element 120. The first bonding terminal 112a and the third bonding terminal 112c are bonded to the first bonding pad 161a and the third bonding pad 161c via the conductive bonding material 170, so that the first external terminal 162a and the third external terminal It is electrically connected to the terminal 162c. That is, the first external terminal 162a and the third external terminal 162c are electrically connected to the crystal element 120.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 150, a thermistor, a platinum resistance thermometer, a diode, or the like is used. In the case of the thermistor element, the temperature-sensitive element 150 has a rectangular parallelepiped shape and is provided with connection terminals 161 at both ends. The temperature sensing element 150 shows a remarkable change in electrical resistance due to a change in temperature. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and voltage and the relationship between voltage and temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 150 outputs a voltage between connection terminals 151, which will be described later, to the outside of the crystal resonator via the second external terminal 162b and the fourth external terminal 162d. Temperature information can be obtained by converting the voltage output at (not shown) into temperature. Such a temperature sensitive element 150 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the main IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation. Can do.

  In the case where a platinum resistance thermometer is used, the temperature sensing element 150 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 151 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

  When a diode is used, the temperature sensing element 150 has a structure in which a semiconductor element is mounted on an upper surface of a semiconductor element substrate and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals 151 serving as an anode terminal and a cathode terminal are provided from the bottom surface to the side surface of the semiconductor element substrate. The temperature sensing element 150 has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly flows current from the cathode terminal to the anode terminal. The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, temperature information of the crystal element can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. The voltage between the cathode terminal and the anode terminal of the connection terminal 151 is output to the outside of the crystal resonator via the second external terminal 162b and the fourth external terminal 162d.

  As shown in FIG. 2, the temperature sensitive element 150 is mounted on a connection pad 115 provided on the lower surface of the substrate 110 via a conductive bonding material 170 such as solder. The first connection terminal 151a of the temperature sensitive element 150 is connected to the first connection pad 115a, and the second connection terminal 151b is connected to the second connection pad 115b. The first connection pads 115a are connected to the second bonding terminals 112b via the first connection patterns 116a provided on the lower surface of the substrate 110. The second bonding terminal 112b is electrically connected to the second bonding pad 161b through the conductive bonding material 170. The second bonding pad 161b is electrically connected to the second external terminal 162b through the second conductor portion 163b. Therefore, the first connection pad 115a is electrically connected to the second external terminal 162b through the second bonding terminal 112b. The second external terminal 162b serves as a ground terminal by being connected to a mounting pad that is connected to a ground that is a reference potential on a mounting board of an electronic device or the like. Therefore, the first connection terminal 151a of the temperature sensitive element 150 is connected to the ground that is the reference potential.

  Further, since the temperature sensing element 150 is positioned in the plane of the excitation electrode 122 provided on the crystal element 120 in a plan view, the temperature sensing element 150 is made electronic by the shielding effect of the metal film of the excitation electrode 122. It protects against noise from other semiconductor parts and electronic parts such as power amplifiers that make up the equipment. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  A method for bonding the temperature sensitive element 150 to the substrate 110 will be described. First, the conductive bonding material 170 is applied to the connection pad 115 by a dispenser, for example. The temperature sensitive element 150 is placed on the conductive bonding material 170. The conductive bonding material 170 is melt bonded by heating. Therefore, the temperature sensitive element 150 is bonded to the pair of connection pads 115.

  When the temperature sensitive element 150 is a thermistor element, as shown in FIGS. 1 and 2, one connection terminal 151 is provided at each end of the rectangular parallelepiped shape. The first connection terminal 151 a is provided on the right side surface and the top and bottom surfaces of the temperature sensing element 150. The second connection terminals 151b are provided on the left side surface and the top and bottom surfaces of the temperature sensitive element 150. The length of the long side of the temperature sensitive element 150 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 170 is made of, for example, silver paste or lead-free solder. The conductive bonding material contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example. The outer shape of the lid 130 is a shape in which the box-shaped member having the first recess K1 is turned upside down, and the contact portion with the sealing conductor pattern 118 formed on the substrate 110 is an L-shaped flange. Yes. The lid 130 has a flange portion in contact with a band-shaped region of the sealing conductor pattern 118 formed on the inner periphery of the substrate 110, and the quartz crystal element 120 is accommodated in the first recess K <b> 1. It is mounted on the upper surface. Such a lid 130 is for hermetically sealing the first recess K1 in a vacuum state or the first recess K1 filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and the sealing conductor pattern 118 of the substrate 110 and the sealing member 131 provided on the flange portion of the lid 130 are welded. As described above, by applying a predetermined current to perform seam welding, the frame body 110b is joined. The lid 130 is electrically connected to the second bonding terminal 112 b on the lower surface of the substrate 110 via the sealing conductor pattern 118 and the ground via conductor 117. The second bonding terminal 112b is electrically connected to the second bonding pad 161b through the conductive bonding material 180. The second bonding pad 161b is electrically connected to the second external terminal 162b through the second conductor portion 163b. Therefore, the lid body 130 is electrically connected to the second external terminal 162b of the mounting frame body 160.

  The sealing member 131 is provided at a position of the lid 130 facing the sealing conductor pattern 118 provided on the upper surface of the substrate 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  The crystal device according to the embodiment of the present invention includes a substrate 110 having a rectangular shape in plan view and a bonding pad 161 provided along the outer peripheral edge of the upper surface of the mounting frame 160, and along the outer peripheral edge of the lower surface of the substrate 110. A bonding frame 112 provided on the lower surface of the substrate 110a is provided by bonding the provided bonding terminal 112 and the bonding pad 161 to each other. By doing so, the gap H is provided between the lower surface of the substrate 110 and the upper surface of the mounting frame 160. For example, the crystal resonator of the present invention is mounted on a mounting substrate such as an electronic device. Even if the other electronic components mounted on the mounting board generate heat and the heat is transferred to the second recess K2 through the mounting board, the air heated by the heat is mounted. Is not trapped in the second recess K2, but the air heated through the gap H is discharged to the outside, and the outside air enters the second recess K2 through the gap H, so that it is mounted in the second recess K2. The influence of heat on the temperature sensitive element 150 can be reduced. Therefore, such a crystal resonator can reduce the difference between the temperature obtained by converting the voltage output from the temperature sensing element 150 and the temperature around the actual crystal element 120.

  In the crystal device according to the embodiment of the present invention, the crystal element 120 and the temperature sensitive element 150 are mounted on the substrate 110, and the temperature is within the plane of the excitation electrode 122 provided on the crystal element 120 in plan view. By positioning the element 150, the temperature-sensitive element 150 is protected from noise from other semiconductor components such as a power amplifier constituting the electronic apparatus and electronic components by the shielding effect by the metal film of the excitation electrode 122. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 150 and to output an accurate voltage of the temperature sensing element 150. In addition, since an accurate voltage value can be output from the temperature sensing element 150, temperature information obtained by converting the voltage output from the temperature sensing element 150 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  The crystal device according to the embodiment of the present invention includes a connection pattern 116 for electrically connecting the connection pad 115 and the bonding terminal 112, and a pair of electrode pads 111 provided on the upper surface of the substrate 100 is provided. One of the connection patterns 116 is provided so as to be positioned between the pair of electrode pads 111 in plan view. By doing so, the heat transferred from the crystal element 120 is transferred from the second connection pattern 116b to the second bonding pad 115b via the substrate 110 immediately below the electrode pad 111. Therefore, since such a crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensing element 150 are approximated and output from the temperature sensing element 150. It becomes possible to further reduce the difference between the temperature obtained by converting the voltage and the actual temperature around the quartz crystal element 120.

(First modification)
Hereinafter, the crystal resonator according to the first modification of the present embodiment will be described. Note that, in the crystal resonator according to the first modification of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 6 and 7, the crystal resonator according to the first modification of the present embodiment includes a wiring pattern 213 for electrically connecting the electrode pad 211 and the connection terminal 212. One of the wiring patterns 213 is provided on the same plane as the connection pads 215 and is provided at a position overlapping the mounting frame 160.

  As shown in FIG. 6, the electrode pad 211 is composed of a first electrode pad 211a and a second electrode pad 211b. Further, as shown in FIG. 7, the joining terminal 212 includes a first joining terminal 212a, a second joining terminal 212b, a third joining terminal 212c, and a fourth joining terminal 212d. The via conductor 214 includes a first via conductor 214a and a second via conductor 214b. The wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, and a third wiring pattern 213c. The first electrode pad 211a is electrically connected to one end of the first wiring pattern 213a provided on the substrate 210a. The other end of the first wiring pattern 213a is electrically connected to one end of the third wiring pattern 213c via the first via conductor 214a. The other end of the third wiring pattern 213c is electrically connected to the first joint terminal 212a. Therefore, the first electrode pad 211a is electrically connected to the first bonding terminal 212a. The second electrode pad 211b is electrically connected to one end of the second wiring pattern 213b provided on the substrate 110. The other end of the second wiring pattern 213b is electrically connected to the third junction terminal 212c through the second via conductor 214b.

  Further, as shown in FIGS. 6 and 7, the wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, and a third wiring pattern 213c. The first wiring pattern 213 a and the second wiring pattern 213 b are provided on the upper surface of the substrate 210, and are drawn from the electrode pad 211 toward the via conductor 214 of the nearby substrate 210. The third wiring pattern 213 c is provided on the lower surface of the substrate 210 so as to be close to the connection pad 215 of the substrate 210. That is, the distance between the third wiring pattern 213c and the connection pad 215b is 50 to 100 μm. By doing so, heat transferred from the crystal element 120 is transferred from the electrode pad 211 to the third wiring pattern 213c via the first wiring pattern 213a and the first via conductor 214a. Next, the heat transmitted from the crystal element 120 is transmitted from the third wiring pattern 213 c to the connection pad 215 via the lower surface of the substrate 210. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the actual temperature around the quartz crystal element 120 can be reduced.

  Further, the third wiring pattern 213 c is provided at a position overlapping the mounting frame body 160. In this way, when the crystal resonator according to the first modification of the present embodiment is mounted on a mounting board such as an electronic device, the wiring conductor provided on the mounting board and the third wiring pattern 213c. The stray capacitance generated between the two can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

  The crystal resonator in the first modification of the present embodiment includes a wiring pattern 213 for electrically connecting the electrode pad 211 and the connection terminal 212, and the third wiring pattern 213 c is flush with the connection pad 215. It is provided on a position that overlaps with the mounting frame 160. By doing so, heat transferred from the crystal element 120 is transferred from the electrode pad 211 to the third wiring pattern 213c via the first wiring pattern 213a and the first via conductor 214a. Next, the heat transmitted from the crystal element 120 is transmitted from the third wiring pattern 213 c to the connection pad 215 via the lower surface of the substrate 210. Therefore, since the crystal resonator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 150 are approximated, and the voltage output from the temperature sensitive element 150 is converted. Thus, the difference between the obtained temperature and the actual temperature around the quartz crystal element 120 can be reduced.

  Further, in the crystal resonator according to the first modification of the present embodiment, the third wiring pattern 213 c is provided at a position where it overlaps the mounting frame 160. By doing so, when the crystal resonator of the present embodiment is mounted on a mounting board such as an electronic device, it is generated between the wiring conductor provided on the mounting board and the third wiring pattern 213c. The stray capacitance to be reduced can be reduced. Therefore, fluctuation of the oscillation frequency of the crystal element 120 can be reduced while suppressing the stray capacitance from being added to the crystal element 120.

(Second modification)
Hereinafter, the crystal resonator according to the second modification of the present embodiment will be described. Note that, in the crystal resonator in the second modification of the present embodiment, the same portions as those of the crystal resonator described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIGS. 8 and 9, the crystal resonator according to the second modification of the present embodiment is formed on the substrate 310 so that the long side of the temperature sensing element 150 is parallel to the short side of the substrate 310. It differs from the present embodiment in that it is mounted on the connection pad 315.

  The connection pad 315 has a rectangular shape and is provided near the center of the lower surface of the substrate 310. As shown in FIG. 9, the connection pads 315 are provided adjacent to each other so that the long sides of the connection pads 315 and the long sides of the substrate 310 are parallel to each other. The connection pad 315 includes a first connection pad 315a and a second connection pad 315b. The connection pattern 316 is provided on the lower surface of the substrate 310, and is drawn from the connection pad 315 toward the nearby bonding terminal 312.

  The temperature sensing element 150 is mounted on the lower surface of the substrate 310 so that the long side of the temperature sensing element 150 and the short side of the substrate 310 are parallel to each other. By doing in this way, the 1st junction terminal 312a electrically connected with the crystal element 120 can lengthen the space | interval with the 1st connection pad 315a, and is electrically connected with the crystal element 120. Since the third joint terminal 312c can have a longer distance from the second connection pad 315b, even if the conductive joint material 170 joining the temperature sensitive element 150 overflows, the conductive joint material 170 Can be suppressed. Therefore, a short circuit between the temperature sensitive element 150 and the junction terminal 312 electrically connected to the crystal element 120 can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the crystal element for AT is used as the crystal element has been described. An element may be used.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  Moreover, although the case where the conductor part 163 was provided in the board | substrate was demonstrated in the said embodiment, you may provide in the inside of the notch provided in the corner | angular part of the mounting frame 160. FIG. At this time, the conductive portion is provided so as to print the conductor paste in the cut.

110, 210, 310 ... substrate 111, 211, 311 ... electrode pad 112, 212, 312 ... junction terminal 113, 213, 313 ... wiring pattern 114, 214, 314 ... via conductor 115 215, 315 ... connection pads 116, 216, 316 ... connection patterns 117, 217, 317 ... ground via conductors 118, 218, 318 ... sealing conductor patterns 120 ... crystal elements 121 ... crystal base plate 122 ... excitation electrode 123 ... extraction electrode 130 ... lid body 131 ... sealing member 140 ... conductive adhesive 150 ... temperature sensing element 151. ..Connection terminal 160 ... Mounting frame 161 ... Junction pad 162 ... External terminal 163 ... Conductor part K1 ... First recess K2 ... Second Part H ··· gap

Claims (4)

A substrate having a rectangular shape in plan view and provided with joining terminals having predetermined thicknesses at four corners of the lower surface;
A bonding frame having a predetermined thickness provided at the four corners of the upper surface, and a mounting frame provided on the lower surface of the substrate by bonding the bonding pad and the bonding terminal;
A crystal element mounted on a pair of electrode pads provided on the upper surface of the substrate;
A temperature sensitive element mounted on a pair of connection pads provided in a region surrounded by the mounting frame on the lower surface of the substrate;
A lid for hermetically sealing the crystal element;
With
From the area surrounded by the mounting frame on the lower surface of the substrate, between the two adjacent bonding pads and the bonding terminals, on the outer surface of the substrate and the mounting frame A crystal unit characterized in that it has a gap part that extends. The crystal resonator according to claim 1,
The mounting frame is made of glass epoxy resin. The crystal resonator according to claim 1 or 2,
The quartz crystal device, wherein the quartz crystal element and the thermosensitive element are mounted on the substrate, and the thermosensitive element is located in a plane of an excitation electrode provided on the quartz crystal element in a plan view. Vibrator. The crystal resonator according to claim 1 to claim 3, wherein
The mounting frame body is provided with a connection pattern for electrically connecting the connection pad and the joining terminal,
The pair of electrode pads are provided in parallel with a predetermined interval between the electrode pads on one short side of the substrate,
One of the connection patterns is provided so as to pass between the two electrode pads in plan view.

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