JP2008278110A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator with such a structure that the conductive fixing between an integrated circuit element and a second substrate is made satisfactory while the connection fixing posture of the integrated circuit element does not collapse even when heat transmission configurations are made non-uniform in the case of bonding by heating. <P>SOLUTION: This piezoelectric oscillator is provided with: a piezoelectric vibrator part configured of a first substrate, a piezoelectric vibration element, a second electrode terminal for substrate connection formed on the other main surface of the first substrate, a posture correction part formed inside the second electrode terminal for substrate connection, and a cover body for air-tightly sealing a first concave portion; and an integrated circuit element part configured of a second substrate, an integrated circuit element, an electrode terminal for external connection formed on the second substrate and a first electrode terminal for substrate connection. The piezoelectric vibrator part is arranged so as to be superposed on the integrated circuit element part, and the first electrode terminal for substrate connection and the second electrode terminal for substrate connection are connected and fixed, and the surface of the posture correction part is brought into contact with the main surface of the integrated circuit element or made proximate to the main surface of the integrated circuit element. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator that is one of electronic components mounted in an electronic device.

  Conventionally, in an electronic device such as a portable communication device, a piezoelectric oscillator is mounted as one of electronic components, and is used as a reference signal generation source or a timing device.

  An example of such a conventional piezoelectric oscillator is illustrated in FIG. The piezoelectric oscillator 100 is generally composed of a piezoelectric vibrator unit 110 and an integrated circuit element unit 120.

  First, the piezoelectric vibrator unit 110 will be described. The first base 111 constituting the piezoelectric vibrator unit 110 has a substrate 111a made of an insulating material such as ceramic having a substantially flat outer shape, and the same material as the substrate 111a bonded to one main surface of the substrate 111a. It is comprised by the frame 111b. By joining the substrate 111a and the frame 111b, a first recess 112 surrounded by one main surface of the substrate 111a and the inner surface of the frame 111b is formed.

  The piezoelectric vibration part 110 is a piezoelectric element that is electrically connected to the first base body 111 and the second base body connection electrode terminal 114 that is placed in the first recess 112 and formed on the other main surface of the substrate 111a. The opening of the first recess 112 is covered on the top surface of the opening of the first recess 112 of the frame 111b surrounding the vibration element 113 and the first recess 112 in which the piezoelectric vibration element 113 is placed. The lid 115 is arranged and fixed in a form and hermetically seals the inside of the first recess 112.

  Next, the integrated circuit element unit 120 will be described. The second base 121 constituting the integrated circuit element portion 120 has a substantially rectangular parallelepiped shape, and the size of the main surface is approximately the same as the size of the main surface of the substrate 111a. Further, the second base 121 is formed with a second recess 122 having an opening on one main surface of the second base 121.

  The integrated circuit element unit 120 is placed in the second recess 122, and includes at least an integrated circuit element 123 including an oscillation circuit for exciting the piezoelectric vibration element 113. The integrated circuit element 123 is electrically connected to the integrated circuit element 123. The first substrate connection electrode terminal 124 formed at the four corners on the top surface of the second recess 122 opening side of the side wall portion surrounding the second recess 122 is connected to the integrated circuit element 123. And the external connection electrode terminals 125 formed at the four corners of the other main surface of the second base 121 connected to each other. The integrated circuit element 123 includes a plurality of substrate connection electrode pads 126 provided on the main surface facing the inner bottom surface of the second recess 122 of the integrated circuit element 123, and a first electrode corresponding to each substrate connection electrode pad 126. By mechanically and electrically connecting the integrated circuit element connecting electrode pad 127 provided at a predetermined position on the inner bottom surface of the concave portion 122 with a conductive bonding material 128 such as a conductive adhesive or solder, It is placed in the second recess 122.

  The piezoelectric vibrator unit 110 is formed on the integrated circuit element unit 120, the second substrate connecting electrode terminal 114 formed on the first base 111 constituting the piezoelectric vibrator unit 110, and the integrated circuit element unit 120. The first base connection terminals 124 formed on the second base 121 to be configured are arranged so that the surfaces of the predetermined terminals face each other, and are formed by a conductive bonding material such as a conductive adhesive or solder. The piezoelectric oscillator 110 is formed by mechanically and electrically connecting and fixing the opposing electrode terminals facing each other. At this time, a slight gap is generated between the other main surface of the first base 1 constituting the piezoelectric vibrator unit 110 and the main surface of the integrated circuit element 123 (for example, Patent Document 1, Patent). (See Reference 2 or Patent Reference 3).

JP 2000-244244 A JP 2001-36343 A JP 2004-129090 A

  In addition, other than the prior art documents specified by the prior art document information described above, no prior art documents related to the present invention have been found by the time of filing of the present application.

  The conventional piezoelectric oscillator as described above is manufactured, for example, by the following process. A first sheet substrate having a structure in which a plurality of the piezoelectric vibrator portions are arranged and assembled in a matrix to form an integrated sheet, and the integration described above at a position corresponding to the arrangement set position of each piezoelectric vibrator portion. A second sheet substrate having a structure in which a plurality of circuit element units are arranged and arranged in a matrix to form an integral sheet, and a predetermined piezoelectric vibrator unit is arranged on a predetermined integrated circuit element unit. The first sheet substrate is stacked on the second sheet substrate. Thereafter, the first and second sheet substrates are connected and fixed at the same time by heating the conductive bonding material provided at the bonding portion between each integrated circuit element portion and the piezoelectric vibrator portion. A plurality of substrate connection electrode pads of the integrated circuit element placed in the second recess in the element portion; and a plurality of integrated circuit element connection electrode pads formed on the bottom surface in the second recess. Also, the conductive bonding material provided on each substrate connecting electrode pad and the integrated circuit element connecting electrode pad is heated and fixed.

  Thereafter, the bonded first sheet substrate and second sheet substrate are cut along the outer contour of a predetermined piezoelectric oscillator constituted by each piezoelectric vibrator portion and the integrated circuit element portion, so that a plurality of It has been carried out to obtain a number of piezoelectric oscillators simultaneously.

  In such a manufacturing process, it is necessary to increase the number of piezoelectric vibrator portions and integrated circuit element portions provided on one sheet substrate in order to further reduce the manufacturing time and the manufacturing cost. There is also a tendency for the size of to increase. However, when the second sheet substrate formed by arranging a plurality of integrated circuit element portions among the sheet substrates becomes large, the integrated circuit elements are joined in each integrated circuit element portion in the second sheet substrate. For this reason, the heat transfer form in the sheet substrate of the heat applied is not uniform.

  Therefore, between the substrate connection electrode pad of each integrated circuit element and the integrated circuit element connection electrode pad on the bottom surface in the second recess in each integrated circuit element portion, depending on the pad position in each second recess. There is a possibility that a difference occurs in the melting or solidification state of the conductive bonding material, and the posture balance of the integrated circuit element is lost. For example, when a heat-softening solder is used as the conductive bonding material, the portion corresponding to the previously softened solder in the integrated circuit element sinks toward the bottom surface in the second recess due to non-uniform heat transfer. On the contrary, the portion of the circuit element corresponding to the solder that has been delayed in softening is lifted away from the bottom surface of the second recess. For this reason, the gap between the electrode pad for connecting the substrate provided on the raised portion of the integrated circuit element and the electrode pad for connecting the integrated circuit element corresponding to the electrode pad for connecting the substrate is widened, and the conduction between the pads is incomplete. Or there is a risk of non-conduction.

  The above-mentioned problems are not only caused at the time of simultaneous heating and joining of a plurality of sheet-plate-like piezoelectric vibrator portions and integrated circuit element portions, but also are made into a single product piezoelectric vibrator portion and integrated circuit element. There is also a possibility that it may also occur during heat bonding with a part.

  Accordingly, an object of the present invention is to provide an integrated circuit element, a second base, and an integrated circuit element that do not break the connection and fixing posture of the integrated circuit element even when the heat transfer form becomes non-uniform in the integrated circuit element unit during heat bonding. Another object of the present invention is to provide a piezoelectric oscillator having a structure in which electrical conduction between the two is good.

  The present invention has been made in order to solve the above-mentioned problems. A first base body provided with a first recess having an opening on one main surface, and placed in the first recess. A piezoelectric substrate, and a second substrate connection electrode terminal provided on the other main surface of the first substrate and partially connected to the piezoelectric transducer, and the second substrate connection electrode terminal. And a piezoelectric vibrator portion formed of a posture correcting portion that is convex toward the outside with a predetermined thickness, and a lid that hermetically seals the first recess, and one main surface A second base provided with a second recess having an opening, an integrated circuit element mounted in the second recess, an integrated circuit element provided on the other main surface of the second base, An externally connected electrode terminal electrically connected to the top surface of the side wall surrounding the second recess; And an integrated circuit element portion constituted by a first substrate connecting electrode terminal electrically connected, and a piezoelectric vibrator portion is disposed on the integrated circuit element portion so as to overlap the first substrate connecting electrode. The terminal and the second substrate connection electrode terminal are mechanically and electrically connected and fixed, and the surface of the posture correction unit facing the integrated circuit element is in contact with the main surface of the integrated circuit element or the integrated circuit The piezoelectric oscillator is characterized by being close to the main surface of the element.

  The shape of the surface of the posture correction unit facing the integrated circuit element is any of an annular shape, a belt shape, or a geometric shape, and the surface of the posture correction unit facing the integrated circuit element is opposed. The piezoelectric oscillator is located inside the outer periphery of the main surface of the integrated circuit element.

  Further, the posture correcting portion is a material having no elasticity, for example, a piezoelectric oscillator characterized in that the material is aluminum oxide.

  According to the piezoelectric oscillator of the present invention, the heat transfer form applied to the second base constituting the integrated circuit element portion during manufacture becomes uneven in each second base, and the integrated circuit element and Even if there is a difference in the melting or solidification state of the conductive bonding material provided at a plurality of locations for conducting and fixing the second substrate, the integrated circuit element portion constituted by the second substrate is placed on the integrated circuit element portion. When the piezoelectric vibrator unit is arranged in an overlapping manner, the posture correction unit provided on the other main surface of the first base constituting the piezoelectric vibrator unit contacts the main surface of the integrated circuit element in the second base. By doing so, it is possible to prevent the posture balance of the integrated circuit element from being lost due to the difference in melting or solidification form of the individual conductive bonding materials during bonding heating, and to maintain the posture of the integrated circuit element in a desired posture. , Electrode pads for substrate connection provided on integrated circuit elements , It is possible to prevent the conduction between the integrated circuit device connection electrode pads corresponding to the substrate connecting electrode pads be incomplete, or non-conductive.

  In addition, since the posture correcting portion of the piezoelectric oscillator in the present invention is formed of a material having no elasticity, the posture of the integrated circuit element can be accurately held in a desired posture. Furthermore, by using aluminum oxide as a material having no elasticity, a screen printing means that can easily and accurately form the outer shape can be used for forming the posture correction portion, compared to the case of forming the material from other materials having no elasticity. There are advantages.

  Therefore, the present invention provides an integrated circuit element and a second substrate that do not break the connection and fixing posture of the integrated circuit element even when the heat transfer form becomes nonuniform in the integrated circuit element portion during the heat bonding. There is an effect that it is possible to provide a piezoelectric oscillator having a structure in which electrical conduction between the two is good.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Note that, in each embodiment, the same components are denoted by the same reference numerals. In addition, in each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for clarity. In particular, the thickness dimension of each component is exaggerated.

(First embodiment)
FIG. 1 is an exploded perspective view of the piezoelectric oscillator according to the first embodiment of the present invention as viewed from the mounting side with the outside of the piezoelectric oscillator. FIG. 2 is a schematic cross-sectional view taken along the virtual cutting line AA ′ shown in FIG. 1 after the piezoelectric oscillator shown in FIG. 1 is assembled. A piezoelectric oscillator 10 shown in FIG. 1 is generally composed of a piezoelectric vibrator unit 11 and an integrated circuit element unit 20.

  The piezoelectric vibrator 11 will be described below. As shown in FIGS. 1 and 2, the first base 12 constituting the piezoelectric vibrator unit 11 is bonded to a substrate 12a whose outer shape is a flat plate shape having a rectangular shape in plan view, and one main surface of the substrate 12a. Frame body 12b. By joining the substrate 12a and the frame 12b, a first recess 13 (see FIG. 2) surrounded by one main surface of the substrate 12a and the inner surface of the frame 12b is formed. The substrate 12a and the frame body 12b constituting the first base 12 are configured by firing a ceramic material such as glass-ceramic or alumina ceramic.

  As shown in FIG. 2, a pair of piezoelectric vibration element connecting electrode pads 14 is provided in the vicinity of one short side of the inner bottom surface of the first recess 13 along the short side. On the electrode pad 14 for connecting the piezoelectric vibration element, the piezoelectric vibration element 15 is disposed, and an electrode film (not shown) provided on the surface of the piezoelectric vibration element 15 and the electrode pad 14 for connecting the piezoelectric vibration element are electrically conductive. The piezoelectric vibration element 15 is placed in the first recess 13 by being conductively fixed by the adhesive 16. The piezoelectric vibration element connecting electrode pad 14 is electrically connected to a predetermined terminal of the second base connecting electrode terminals 17 formed on the other main surface of the substrate 12a.

  The piezoelectric vibration element 15 placed in the first recess 13 is configured based on a piezoelectric material. For example, when quartz is used as the piezoelectric material, a vibrating electrode film is formed at the center of both main surfaces of a quartz base plate that is cut out from an artificial crystalline lens at a predetermined cut angle and processed into a rectangular plate shape in plan view. Then, the substrate connecting electrode film electrically connected from the vibrating electrode film through the lead electrode film is deposited to form a crystal vibrating element. In this crystal resonator element, when a varying voltage from the outside is applied to the crystal element plate via the vibration electrodes on both main surfaces, the crystal element plate vibrates at a frequency of a predetermined vibration mode. Examples of piezoelectric materials other than quartz include lithium tantalate, lithium niobate, and piezoelectric ceramics.

  In addition, as shown in FIG. 2, a posture correcting portion 18 a is provided inside the second base connection electrode terminal 17 on the other main surface of the substrate 12 a constituting the first base 12. . This posture correction unit 18a is a posture correction that faces the integrated circuit element 23 placed in the integrated circuit element unit 20 when the piezoelectric vibrator unit 11 is placed on the integrated circuit element unit 20 described later. The surface of the portion 18 a has a thickness that contacts the main surface of the integrated circuit element 23. Further, the main surface plan view shape of the posture correction unit 18a is a ring shape in which the contour shape of the outer periphery and the inner periphery is a quadrangle and has a predetermined width dimension between the outer periphery and the inner periphery, and this posture correction unit 18a. The outer peripheral size of the opposing surface of the integrated circuit element is equal to the outer peripheral size of the main surface 23 of the opposing integrated circuit element. Further, the material of the posture correcting portion 18a is aluminum oxide, and therefore the posture correcting portion 18a has a structure having no elasticity.

  Further, the first recess 13 in which the piezoelectric vibration element 15 is placed is provided on the top surface of the frame body 12 b surrounding the first recess 13 on the opening side of the first recess 13. It is hermetically sealed by a lid 19 that is arranged and fixed in a form that covers the opening. The lid 19 is made of a metal such as 42 alloy, Kovar or phosphor bronze. As described above, the piezoelectric vibrator portion 11 is constituted by the above-described components.

  Next, the integrated circuit element unit 20 will be described below. As shown in FIGS. 1 and 2, the second base 21 constituting the integrated circuit element portion 20 has a substantially rectangular parallelepiped shape, and the size of the main surface thereof is the first base of the piezoelectric vibrator portion 11. 12 is approximately the same as the size of the main surface of the substrate 12a. The second base 21 is provided with a second recess 22 (see FIG. 2) having an opening on one main surface of the second base 21. The second base 21 is made of a material such as a ceramic material such as glass-ceramic or alumina ceramic, or a resin-based material such as glass cloth base epoxy resin, polycarbonate, epoxy resin, or polyimide resin.

  The integrated circuit element unit 20 includes an integrated circuit element 23 placed in the second recess 22 and a second side wall portion that is electrically connected to the integrated circuit element 23 and surrounds the second recess 22. The first base connection electrode terminal 24 formed at the four corners of the top surface of the concave portion 22 opening side, and the other main surface of the second base 21 that is also electrically connected to the integrated circuit element 23 The external connection electrode terminals 25 are formed at the four corners.

  The integrated circuit element 23 is based on, for example, a temperature sensitive element such as a thermistor for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 15, and the temperature compensation data in the memory. In addition, a temperature compensation circuit for correcting the vibration characteristics of the piezoelectric vibration element 5 according to a temperature change is built in, and a predetermined oscillation is received by receiving a compensation signal from the previous temperature compensation circuit and an output signal from the piezoelectric vibration element 15. An oscillation circuit for generating an output is provided. The oscillation output generated by the oscillation circuit is output from the external connection electrode terminal 25 to the outside of the piezoelectric oscillator 10 and then, for example, an electronic device on which the piezoelectric oscillator 10 is mounted. Used as a reference signal such as a device clock signal.

  The external connection electrode terminals 25 are a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal, respectively, and function as terminals for connecting the piezoelectric oscillator 10 to a mounting circuit board such as a motherboard. Yes, when the piezoelectric oscillator 10 is mounted on the mounting circuit board, the piezoelectric oscillator 10 is electrically connected to the circuit wiring of the mounting circuit board via a conductive bonding material such as solder.

  Further, the integrated circuit element 23 includes a plurality of substrate connection electrode pads 26 provided on the main surface facing the inner bottom surface of the second recess 22 of the integrated circuit element 23, and a second electrode corresponding to each substrate connection electrode pad 26. By mechanically and electrically connecting the integrated circuit element connecting electrode pad 27 provided at a predetermined position on the inner bottom surface of the recess 22 with a conductive bonding material 28 such as a conductive adhesive or solder, It is placed in the second recess 22. As described above, the integrated circuit element section 20 is constituted by the above-described components.

  The piezoelectric oscillator 10 according to the first embodiment of the present invention includes an integrated circuit element unit 20 and a second substrate connection electrode terminal 17 formed on the first substrate 12 constituting the piezoelectric vibrator unit 11. The piezoelectric vibrator portion 11 is placed on the integrated circuit element portion 20 so that the surface of the predetermined base faces the first base connection terminal 24 formed on the second base 21 to be formed. The respective electrode terminals facing each other are mechanically and electrically connected and fixed by a conductive bonding material (not shown) such as a conductive adhesive or solder, and the piezoelectric vibration element 15 and the integrated circuit element 23 The piezoelectric vibrator unit 11 and the integrated circuit unit 20 are integrated while electrically connecting an electronic circuit network including the oscillation circuit.

  The piezoelectric oscillator 10 according to the first embodiment of the present invention configured as described above is arranged when the piezoelectric vibrator unit 11 is arranged on the integrated circuit element unit 20 as shown in FIGS. 1 and 2. Further, the annular flat surface facing the integrated circuit element 23 of the posture correcting unit 18a provided on the other main surface of the substrate 12a constituting the piezoelectric vibrator unit 11 is in contact with the main surface of the integrated circuit element 23, or the integrated circuit element. The structure is as close as possible to the main surface of 23. This posture correcting unit 18a is provided to prevent the occurrence of problems such as non-conduction due to poor bonding of the integrated circuit element 23, and the posture of the integrated circuit element 23 becomes oblique in the heat bonding process. It is possible to prevent part of the circuit element 23 from lifting in the direction of the piezoelectric vibrating portion 11. This minimizes unnecessary movement of the integrated circuit element 23 at the time of bonding.

  For example, even when a plurality of integrated circuit element portions are assembled and arranged and one integrated circuit element portion in a single sheet-like second sheet substrate (not shown) is the integrated circuit element portion 20, the integrated circuit When the integrated circuit element 23 disposed in the element unit 20 is heated and bonded, the integrated circuit element 23 is softened due to a difference in the timing of melting or solidification of the conductive bonding material 28 due to an uneven heating state. The attitude correction unit 18a prevents the integrated circuit element 23 from sinking to the material 28 side and causing the attitude of the integrated circuit element 23 to become oblique, thereby preventing problems such as incomplete conduction or non-conduction.

  Here, aluminum oxide is used as a material for forming the posture correcting portion 18a. The historic site correction portion 18a made of aluminum oxide is formed by screen printing on the other main surface of the substrate 12a after the ceramic material of the first base 12 is laminated and fired. The thickness ratio of aluminum oxide is preferably 60% or more of the dimension between the other main surface of the substrate and the main surface of the integrated circuit element. For example, in the piezoelectric oscillator 10 according to the first embodiment of the present invention, the dimension between the other principal surface of the substrate 12a and the principal surface of the integrated circuit element 23 is 50 μm, and the thickness dimension of the posture correction unit 16 is. Is suitably 30 to 50 μm.

(Second Embodiment)
FIG. 3 is a plan view showing the other main surface of the substrate 12a constituting the first base of the piezoelectric vibrator unit 11 in the piezoelectric oscillator according to the second embodiment of the present invention. In the piezoelectric oscillator according to the second embodiment of the present invention, the posture correction unit 18a of the piezoelectric oscillator 10 according to the first embodiment is configured by four blocks, and the planar shape is an L-shaped belt-like plane. The second embodiment is different from the first embodiment in that the posture correcting unit 18b is provided. Each of the posture correction portions 18b has an outer corner portion of the bent portion of the posture correction portion 18b and a corner portion of the outer periphery of the region facing the main surface of the integrated circuit element on the other main surface of the substrate 12a. The correction portion 18b is disposed so that the plane of the correction portion 18b is in contact with or close to the main surface of the integrated circuit element. The posture correction unit 18b having such a configuration also has the same operational effects as the posture correction unit 18a shown in the first embodiment.

(Third embodiment)
FIG. 4 is a plan view showing the other main surface of the substrate 12a constituting the first base of the piezoelectric vibrator unit 11 in the piezoelectric oscillator according to the third embodiment of the present invention. In the piezoelectric oscillator according to the third embodiment of the present invention, the posture correction unit 18a of the piezoelectric oscillator 10 according to the first embodiment is configured by two blocks, and has a single-character belt-like plane. This is different from the first embodiment in that the posture correcting unit 18c is configured. The dimension in the length direction of the posture correcting portion 18c is substantially the same as the dimension in the length direction of the main surface of the integrated circuit element. Each of the posture correction portions 18c is along two sides in the length direction of the outer periphery of the region facing the main surface of the integrated circuit element on the other main surface of the substrate 12a, and the plane of each posture correction portion 43 is the integrated circuit element. It is arranged so as to be in contact with or close to the main surface of the integrated circuit element. The posture correcting unit 18c having such a configuration also has the same function and effect as the posture correcting unit 18a shown in the first embodiment.

(Fourth embodiment)
FIG. 5 is a plan view showing the other main surface of the substrate 12a constituting the first base of the piezoelectric vibrator unit 11 in the piezoelectric oscillator according to the fourth embodiment of the present invention. In the piezoelectric oscillator according to the fourth embodiment of the present invention, the posture correcting portion 18a of the piezoelectric oscillator 10 according to the first embodiment has a plane having a geometric shape with an X-shaped plan view. The second embodiment is different from the first embodiment in that each of the two crossing planes is configured by the posture correcting unit 18d having a length dimension substantially equal to the diagonal dimension of the main surface of the integrated circuit element. In the posture correction unit 18d, the crossing center point of the posture correction unit 18d is aligned with the center point of the region facing the main surface of the integrated circuit element on the other main surface of the substrate 12a, and the plane of each posture correction unit 18d is It is provided on the other main surface of the substrate 12a so as to be in contact with or close to the main surface of the integrated circuit element. The posture correcting unit 18d having such a configuration also achieves the same operational effects as the posture correcting unit 18a shown in the first embodiment.

  The present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, in each of the above-described embodiments, the form using aluminum oxide as the material of the posture correction unit is shown. However, the substrate does not have elasticity when formed as the posture correction unit and forms the first base. As long as it can be formed in a desired form on the other main surface, a posture correcting portion made of another material may be used.

It is the disassembled perspective view which looked at the piezoelectric oscillator which concerns on the 1st Embodiment of this invention from the mounting side with the piezoelectric oscillator exterior. FIG. 2 is a schematic cross-sectional view taken along a virtual cutting line AA ′ shown in FIG. 1 after assembling the piezoelectric oscillator shown in FIG. 1. It is the top view which showed the other main surface of the board | substrate which comprises the 1st base | substrate in the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention. It is the top view which showed the other main surface of the board | substrate which comprises the 1st base | substrate in the piezoelectric oscillator which concerns on the 3rd Embodiment of this invention. It is the top view which showed the other main surface of the board | substrate which comprises the 1st base | substrate in the piezoelectric oscillator which concerns on the 4th Embodiment of this invention. It is the schematic sectional drawing which showed one Embodiment of the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Piezoelectric oscillator 11 ... Piezoelectric vibrator part 12 ... 1st base | substrate 12a ... Board | substrate 12b ... Frame body 13 ... 1st recessed part 14 ... Piezoelectric vibration element connection Electrode pad 15 ... Piezoelectric vibration element 16, 28 ... Conductive bonding material 17 ... Second substrate connection electrode terminal 18a, 18b, 18c, 18d ... Posture correction part 19 ... Lid DESCRIPTION OF SYMBOLS 20 ... Integrated circuit element part 21 ... 2nd base | substrate 22 ... 2nd recessed part 23 ... Integrated circuit element 24 ... 1st base | substrate connection electrode terminal 25 ... For external connection Electrode terminal 26 ... Substrate connection electrode pad 27 ... Integrated circuit element connection pad

Claims (4)

A first base having a first recess having an opening on one main surface, a piezoelectric vibration element mounted in the first recess, and the other main surface of the first base A second base connection electrode terminal that is partly electrically connected to the piezoelectric vibration element, and is convex toward the outside with a predetermined thickness inside the second base connection electrode terminal. A piezoelectric vibrator portion configured by a posture correcting portion provided on the lid and a lid that hermetically seals the first recess,
A second base provided with a second recess having an opening on one main surface; an integrated circuit element mounted in the second recess; provided on the other main surface of the second base And an external connection electrode terminal electrically connected to the integrated circuit element, and a first base body connection provided on the top surface of the side wall surrounding the second recess and electrically connected to the integrated circuit element And an integrated circuit element portion constituted by electrode terminals for
The piezoelectric vibrator unit is disposed on the integrated circuit element unit, and the first substrate connecting electrode terminal and the second substrate connecting electrode terminal are mechanically and electrically connected and fixed. And a surface of the posture correcting unit facing the integrated circuit element is in contact with or close to the main surface of the integrated circuit element.   The shape of the surface facing the integrated circuit element of the posture correction unit is any of an annular shape, a band shape, or a geometric shape, and the surface of the posture correction unit facing the integrated circuit element is facing the integrated circuit The piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is located inside the outer periphery of the main surface of the circuit element.   The piezoelectric oscillator according to claim 1 or 2, wherein a material of the posture correcting unit is a material having no elasticity.   The piezoelectric oscillator according to claim 3, wherein the posture correcting portion is made of aluminum oxide.

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