JP2010258947A - Piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device for preventing variation in oscillation frequency. <P>SOLUTION: A piezoelectric device includes a piezoelectric vibrating element, an element mounting member and a cover member. In the piezoelectric vibrating element, an exciting electrode is attached and formed on a rectangular piezoelectric blank, and a lead-out electrode is formed to be positioned diagonal to the rectangular piezoelectric blank from the exciting electrode. In the element mounting member, a pair of two mounting parts is provided at a position facing the lead-out electrode in the piezoelectric vibrating element, and a pair of two piezoelectric vibrating element mounting pads is provided in the pair of two mounting parts. The cover member air-tightly seals the piezoelectric vibrating element. In each of the piezoelectric vibrating element mounting pads, a first metal layer and a second metal layer are laminated and integrated, and a thickness of the first metal layer is 30 to 100 μm. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a piezoelectric device used in electronic equipment and the like.

FIG. 9 is an exploded perspective view showing a conventional piezoelectric device. 10 is a cross-sectional view taken along line EE in FIG. As shown in FIGS. 9 and 10, the conventional piezoelectric device 300 mainly includes an element mounting member 310 having a recessed space 311, a piezoelectric vibration element 320, an integrated circuit element 340, and a lid member 330.
The element mounting member 310 includes a substrate part 310a, a first frame part 310b, and a second frame part 310c.

The element mounting member 310 is provided in the order of the first frame portion 310b and the second frame portion 310c on one main surface of the substrate portion 310a, and a rectangular recess space 311 is formed in plan view. In the recess space 311, two pairs of mounting portions 313 are provided at a position higher than the inner bottom surface of the recess space 311.
Further, the two mounting portions 313 are provided at positions that are diagonal to the opening surface of the recessed space 311. Each mounting portion 313 is provided with a piezoelectric vibration element mounting pad 314.

The piezoelectric vibration element 320 is formed such that an excitation electrode 322 is formed on a quadrangular crystal base plate 321 and extended from the excitation electrode 322 toward both short sides so as to be diagonally positioned. An electrode 323 is formed.
The excitation electrode 322 is formed by depositing and forming metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 321.
The lead electrodes 323 are provided so as to be located diagonally so as to extend from the excitation electrodes 322 attached to both main surfaces of the crystal base plate 321 toward both short sides, respectively. .
Such a piezoelectric vibration element 320 electrically connects the extraction electrode 323 and a piezoelectric vibration element mounting pad 314 described later formed in a mounting portion 313 in a concave space 311 described later via a conductive adhesive DS. And it mounts in the recessed space 311 by connecting mechanically.

The integrated circuit element 340 is mounted on an integrated circuit element mounting pad 315 formed on the inner bottom surface of the recessed space 311 of the element mounting member 310.
The lid member 330 is placed on the recessed space 311 of the element mounting member 310, and the sealing member 331 of the lid member 330 and the sealing conductor pattern 312 of the element mounting member 310 are joined, The inside of the recessed space 311 is hermetically sealed.
Power supply voltage terminals, ground terminals, oscillation output terminals, and oscillation control terminals which are external connection electrode terminals 316 are provided at the four corners of the other main surface of the element mounting member 310.
Further, in the piezoelectric device 300, there is known a structure in which two pairs of mounting portions 313 are provided so as to be positioned diagonally at corners of the inner bottom surface of the recessed space 311 (for example, see Patent Document 1).
The piezoelectric vibration element mounting pad 314 is configured by laminating a first metal layer made of tungsten (W) or molybdenum (Mo) and a second metal layer made of gold (Au) or nickel (Ni). ing.

JP 2001-77652 A

  However, like the conventional piezoelectric device 300, when the piezoelectric vibration element 320 is mounted, the piezoelectric vibration element 320 is inclined with the position where the extraction electrode 323 of the piezoelectric vibration element 320 and the piezoelectric vibration element mounting pad 314 of the mounting portion 313 are joined as an axis. There is a case. In such a case, the corner of the part where the piezoelectric vibration element 320 is not joined contacts the bottom surface of the recess space 311 of the element mounting member 310, and the vibration of the piezoelectric vibration element 320 is inhibited. For this reason, the conventional piezoelectric device 300 has a problem that the oscillation frequency fluctuates.

  This invention is made | formed in view of the said subject, and makes it a subject to provide the piezoelectric device which prevents that an oscillation frequency fluctuates.

  The piezoelectric device of the present invention is a piezoelectric device in which an excitation electrode is formed on a rectangular piezoelectric element plate, and a lead electrode is formed so as to be diagonally positioned with respect to the rectangular piezoelectric element plate from the excitation electrode. An element mounting member in which two pairs of mounting portions are provided at positions opposed to the vibration element and the extraction electrode of the piezoelectric vibration element, and two pairs of piezoelectric vibration element mounting pads are provided in the two pairs of mounting portions, respectively. And a lid member for hermetically sealing the piezoelectric vibration element, and the piezoelectric vibration element mounting pad is integrally provided by laminating the first metal layer and the second metal layer, and the first metal layer The thickness is 30 μm to 100 μm.

  Further, the element mounting member includes at least an integrated circuit element including an oscillation circuit, and the integrated circuit element and the piezoelectric vibration element are in an electrically connected state.

  According to the piezoelectric device of the present invention, the piezoelectric vibration element mounting pad provided in the mounting portion is integrally provided by stacking the first metal layer and the second metal layer. When the piezoelectric vibration element is mounted, even if the thickness is 30 μm to 100 μm, even if the piezoelectric vibration element is tilted about the position where the lead electrode of the piezoelectric vibration element and the piezoelectric vibration element mounting pad of the mounting portion are joined, the piezoelectric vibration element Since the thickness of the first metal layer of the mounting pad is secured, the corner of the portion where the piezoelectric vibration element is not joined does not contact the bottom surface in the recess space of the element mounting member. Therefore, since the vibration of the piezoelectric vibration element is not inhibited, it is possible to prevent the oscillation frequency of the piezoelectric device from fluctuating.

1 is an exploded perspective view showing an example of a piezoelectric device according to a first embodiment of the present invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is the schematic which shows the piezoelectric vibration element mounting pad of the element mounting member which comprises the piezoelectric device which concerns on the 1st Embodiment of this invention. It is a graph which shows the relationship between the thickness of the 1st metal layer of the piezoelectric vibration element mounting pad in the piezoelectric device which concerns on the 1st Embodiment of this invention, and the yield of the oscillation frequency fluctuation | variation of a piezoelectric device. It is a disassembled perspective view which shows an example of the piezoelectric device which concerns on the 2nd Embodiment of this invention. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is a disassembled perspective view which shows the conventional piezoelectric device. It is EE sectional drawing of FIG.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described. In addition, the illustrated dimensions are partially exaggerated.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric device according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a schematic view showing a piezoelectric vibration element mounting pad of an element mounting member constituting the piezoelectric device according to the first embodiment of the present invention. FIG. 5 is a graph showing the relationship between the thickness of the first metal layer of the piezoelectric vibration element mounting pad and the yield of fluctuation in the oscillation frequency of the piezoelectric device in the piezoelectric device according to the first embodiment of the present invention.

In the present embodiment, a piezoelectric vibrator will be described as an example of a piezoelectric device.
As shown in FIGS. 1 to 3, the piezoelectric vibrator 100 according to the first embodiment of the present invention mainly includes an element mounting member 110, a piezoelectric vibration element 120, and a lid member 130. The piezoelectric vibrator 100 is provided with a mounting portion 113 provided diagonally at the corner of the inner bottom surface of the recess space 111 formed in the element mounting member 110. The piezoelectric vibration element 120 is mounted on the piezoelectric vibration element mounting pad 114 provided in the mounting portion 113, and the recess space 111 is hermetically sealed by the lid member 130.

  As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency.

  The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.

  The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 121.

  The lead electrodes 123 are provided so as to be diagonally positioned so as to extend from the excitation electrodes 122 attached to both main surfaces of the crystal base plate 121 toward both short sides. .

  Such a piezoelectric vibration element 120 electrically connects the extraction electrode 123 and a piezoelectric vibration element mounting pad 114 (described later) formed on a mounting portion 113 in a recess space 111 (described later) via a conductive adhesive DS. And it mounts in the recessed space 111 by connecting mechanically.

As shown in FIGS. 1 to 3, the element mounting member 110 is mainly composed of a substrate part 110 a, a first frame part 110 b, and a second frame part 110 c.
The element mounting member 110 is provided with a first frame portion 110b and a second frame portion 110b on one main surface of the substrate portion 110a to form a rectangular recess space 111.

The element mounting member 110 is laminated, for example, in the order of a first frame portion 110b and a second frame portion 110c on a substrate portion 110a, and the second frame portion 110c is stacked on the first frame portion 110b. It is formed to be wider than the width of the opening. As a result, the first frame portion 110b and the second frame portion 110c form two pairs of mounting portions 113 positioned diagonally at the corners of the bottom surface of the recessed space 111. Therefore, the two pairs of mounting portions 113 are formed by the first recessed space inner side wall portion of the first frame portion 110b and the main surface of the second frame portion 110c.
That is, the two pairs of mounting portions 113 are provided at positions diagonal to the opening surface of the recessed space 111. Each mounting portion 113 is provided with two pairs of piezoelectric vibration element mounting pads 114.

  In addition, the board | substrate part 110a, the 1st frame part 110b, and the 2nd frame part 110c which comprise this element mounting member 110 are formed by laminating | stacking multiple ceramic materials, such as an alumina ceramic and glass-ceramic, for example. . The substrate unit 110a has a structure in which ceramic materials are stacked.

An annular sealing conductor pattern 112 is provided on the main surface of the second frame portion 110 c of the element mounting member 110.
In addition, a wiring pattern (not shown) or the like is provided in the inner layer of the substrate unit 110a.
An external connection electrode terminal 116 is provided on the other main surface of the substrate portion 110a of the element mounting member 110. The external connection electrode terminal 116 is, for example, a power supply voltage terminal, a ground terminal, an oscillation output terminal, an oscillation control terminal. Used as

  As shown in FIG. 4, the piezoelectric vibration element mounting pad 114 has a second metal layer 114b made of gold plating or the like laminated on the surface of the first metal layer 114a made of tungsten (W), molybdenum (Mo) or the like. It is formed by that.

The thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is 30 μm to 100 μm.
The thickness of the second metal layer 114b of the piezoelectric vibration element mounting pad 114 is 0.3 μm to 0.5 μm.

  Here, when the thickness of the first metal layer 114 a of the piezoelectric vibration element mounting pad 114 is less than 30 μm, the piezoelectric vibrations of the extraction electrode 123 of the piezoelectric vibration element 120 and the mounting portion 113 when mounted on the element mounting member 110. When the element mounting pad 114 is tilted around the bonding point, the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is not secured. The mounting member 110 comes into contact with the inner bottom surface of the recess space 111. Therefore, the oscillation frequency of the piezoelectric device 100 varies.

Further, when the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is greater than 100 μm, the flatness of the first metal layer 114a cannot be obtained, and thus the piezoelectric vibration element 120 is not mounted in parallel. Therefore, when the frequency is adjusted by an ion gun (not shown), the excitation electrode 122 of the piezoelectric vibration element 120 cannot be uniformly removed, so that the oscillation frequency of the piezoelectric device 100 varies.
As described above, the piezoelectric vibration element 120 may come into contact with the inner bottom surface of the recess space 111 of the element mounting member 110 by being tilted in a soft state before the conductive adhesive DS is cured. Since the thickness of the first metal layer 114a is defined, even if it is inclined, it does not contact the bottom surface in the recessed space 111 of the element mounting member 110.

  That is, by setting the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 to 30 μm to 100 μm, the extraction electrode 123 of the piezoelectric vibration element 120 and the piezoelectric vibration element mounting pad 114 of the mounting portion 113 are joined. Even when tilted about the location, since the thickness of the first metal layer 114 a of the piezoelectric vibration element mounting pad 114 is secured, the piezoelectric vibration element 120 does not contact the bottom surface of the recess space 111 of the element mounting member 110. Therefore, fluctuations in the oscillation frequency of the piezoelectric device 100 can be prevented.

  The sealing conductor pattern 112 surrounds the recess space 111 in an annular shape by sequentially placing a nickel (Ni) layer and a gold (Au) layer on the surface of a base layer made of, for example, tungsten (W), molybdenum (Mo), or the like. By making it adhere in a form, it is formed to a thickness of 10 μm to 25 μm.

The lid member 130 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like. Such a lid member 130 hermetically seals the recessed space 111 with nitrogen gas or vacuum. Specifically, the lid member 130 is placed on the frame portion 110c of the element mounting member 110 in a nitrogen atmosphere or a vacuum atmosphere, and the sealing conductor pattern 112 of the frame portion 110c and the lid member 130 are sealed. The seam welding is performed by applying a predetermined current so that the member 131 is welded, so that the member 131 is joined to the frame portion 110b.
The sealing member 131 is made of, for example, silver solder (Ag—Sn) or gold tin (Au—Sn).

  The conductive adhesive DS contains a conductive powder as a conductive filler in a binder such as a silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

  When the element mounting member 110 is made of alumina ceramic, a sealing conductor pattern 112, piezoelectric vibration, and the like are formed on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder. Conventionally known is a conductor paste that becomes the element mounting pad 114, the electrode terminal 116 for external connection, and the like, and a conductor paste that becomes a via conductor in a through hole that has been punched in advance in the ceramic green sheet. It is manufactured by applying it by screen printing, laminating a plurality of these and press-molding them, followed by firing at a high temperature.

According to the piezoelectric device of the present invention, the piezoelectric vibration element mounting pad 114 provided in the mounting portion 113 is integrally provided by laminating the first metal layer 114a and the second metal layer 114b. Since the thickness of the metal layer 114a is 30 μm to 100 μm, when the piezoelectric vibration element 120 is mounted, the lead electrode 123 of the piezoelectric vibration element 120 and the piezoelectric vibration element mounting pad 114 of the mounting portion 113 are joined. Since the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is secured even when the piezoelectric vibration element 120 is inclined, the corner of the piezoelectric vibration element 120 where the piezoelectric vibration element 120 is not joined has a recess space 111 of the element mounting member 110. No contact with the inner bottom surface. Therefore, since the vibration of the piezoelectric vibration element 120 is not hindered, the oscillation frequency of the piezoelectric device 100 can be prevented from changing.
Therefore, since the vibration of the piezoelectric vibration element 120 is not hindered, the oscillation frequency of the piezoelectric device 100 can be prevented from changing.

As shown in FIG. 5, when the thickness of the first metal layer 114 a of the piezoelectric vibration element mounting pad 114 is less than 30 μm, the piezoelectric vibration element 120 comes into contact with the bottom surface of the recess space 111 of the element mounting member 110. Therefore, it can be confirmed that the yield of fluctuation in the oscillation frequency of the piezoelectric device 100 is reduced. That is, as shown in FIG. 5, it can be confirmed that the yield deteriorates when the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 becomes smaller than 30 μm.
Further, as shown in FIG. 5, when the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is larger than 100 μm, the piezoelectric vibration elements 120 are not mounted in parallel. Therefore, since the excitation electrode 122 of the piezoelectric vibration element 120 cannot be uniformly removed during frequency adjustment by an ion gun (not shown), it can be confirmed that the yield of fluctuation in the oscillation frequency of the piezoelectric device 100 is reduced. . That is, as shown in FIG. 5, it can be confirmed that the yield deteriorates when the thickness of the first metal layer 114a of the piezoelectric vibration element mounting pad 114 is larger than 100 μm.

(Second Embodiment)
In the second embodiment, a piezoelectric oscillator which is an example of a piezoelectric device will be described.
FIG. 6 is an exploded perspective view showing a piezoelectric device according to the second embodiment of the present invention. 7 is a cross-sectional view taken along the line CC of FIG. 8 is a cross-sectional view taken along the line DD of FIG.
The piezoelectric device 200 according to the second embodiment of the present invention is different from the first embodiment in that it includes an integrated circuit element 240 mounted in the recessed space 215 of the element mounting member 210.

  As shown in FIG. 6, the piezoelectric oscillator 200 according to the second embodiment of the present invention mainly includes an element mounting member 210, a piezoelectric vibration element 120, a lid member 130, and an integrated circuit element 240. In this piezoelectric oscillator 200, the piezoelectric vibration element 120 and the integrated circuit element 240 are mounted in the recessed space 211 formed in the element mounting member 210, and the recessed space 211 is hermetically sealed by the lid member 130. It has a structure.

As shown in FIGS. 6 to 8, the integrated circuit element 240 is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element 120 on the circuit formation surface, and an output signal generated by the oscillation circuit. Is output to the outside of the piezoelectric oscillator 200 via the external connection electrode terminal 216 and used as a reference signal such as a clock signal, for example.
In addition, in the integrated circuit element 240, in order to compensate the fluctuation of the oscillation frequency of the oscillation circuit due to the temperature change by applying the control voltage according to the ambient temperature to the variable capacitance element, the temperature is generated by the cubic function generating circuit and the storage element unit. A compensation circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit.

This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The integrated circuit element 240 is mounted on an integrated circuit element mounting pad 215 formed on the substrate portion 210a exposed in the recessed space 211 of the element mounting member 210 via a conductive bonding material (not shown) such as solder. Yes.

As shown in FIGS. 6-8, the element mounting member 210 is mainly comprised by the board | substrate part 210a, the 1st frame part 210b, and the 2nd frame part 210c.
The element mounting member 210 is laminated, for example, in the order of a first frame portion 210b and a second frame portion 210c on a substrate portion 210a, and the second frame portion 210c is stacked on the first frame portion 210b. It is formed to be narrower than the width of the opening. As a result, the first frame portion 210b and the second frame portion 210c form a pair of mounting portions 213 positioned diagonally at the corner of the bottom surface of the recessed space 211. That is, the two pairs of mounting portions 213 are formed by the first recessed space inner side wall portion of the first frame portion 210b and the main surface of the second frame portion 210c.

That is, the two pairs of mounting portions 213 are provided at positions that are diagonal to the opening surface of the recessed space 211. The mounting portion 213 is provided with two pairs of piezoelectric vibration element mounting pads 214.
The substrate portion 210a, the first frame portion 210b, and the second frame portion 210c constituting the element mounting member 210 are formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. . The substrate portion 210a has a structure in which ceramic materials are stacked.

An annular sealing conductor pattern 212 is provided on the main surface of the second frame portion 210 c of the element mounting member 210.
An integrated circuit element mounting pad 215 is provided on one main surface of the substrate part 210a exposed in the recessed space 211.
A wiring pattern (not shown) or the like is provided on the inner layer of the substrate unit 210a.
An external connection electrode terminal 216 is provided on the other main surface of the substrate portion 210a of the element mounting member 210. The external connection electrode terminal 216 includes, for example, a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal. Used as

The piezoelectric vibration element mounting pad 214 is formed by laminating a second metal layer made of gold plating or the like on the surface of a first metal layer made of tungsten (W), molybdenum (Mo) or the like.
The thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 is 30 μm to 100 μm.
The thickness of the second metal layer of the piezoelectric vibration element mounting pad 214 is 0.3 μm to 0.5 μm.

  Here, when the thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 is less than 30 μm, when mounting on the element mounting member 210, the extraction electrode 123 of the piezoelectric vibration element 120 and the piezoelectric vibration element of the mounting portion 213 are mounted. When the mounting pad 214 is tilted around the bonding point, the thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 is not secured, so the corner where the piezoelectric vibration element 120 is not bonded is the element mounting member. 210 comes into contact with the bottom surface in the recessed space 211 of 210. Accordingly, since the vibration of the piezoelectric vibration element 120 is hindered, the oscillation frequency of the piezoelectric device 200 varies.

  Further, when the thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 is larger than 100 μm, the flatness of the first metal layer cannot be obtained, so that the piezoelectric vibration element 120 cannot be mounted in parallel. Therefore, when the frequency is adjusted by an ion gun (not shown), the excitation electrode 122 of the piezoelectric vibration element 120 cannot be removed uniformly, and the oscillation frequency of the piezoelectric device 200 varies.

  That is, by setting the thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 to 30 μm to 100 μm, the piezoelectric electrode 120 of the piezoelectric vibration element 120 and the piezoelectric vibration of the mounting portion 213 when the piezoelectric vibration element 120 is mounted. Since the thickness of the first metal layer of the piezoelectric vibration element mounting pad 214 is secured even when the element mounting pad 214 is tilted about the joint, the corner where the piezoelectric vibration element 120 is not bonded is the element. The mounting member 210 does not come into contact with the bottom surface of the recessed space 211. Therefore, since the vibration of the piezoelectric vibration element 120 is not hindered, fluctuations in the oscillation frequency of the piezoelectric device 200 can be prevented.

  Thus, even if the piezoelectric device according to the second embodiment of the present invention is configured, the same effects as those of the first embodiment can be obtained.

  In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the piezoelectric oscillator using the crystal as the piezoelectric material constituting the piezoelectric vibration element has been described. However, the piezoelectric material may be one using lithium niobate, lithium tantalate, or piezoelectric ceramics. I do not care.

Further, the present invention is not limited to the embodiment of the present invention, and the piezoelectric oscillator is mainly composed of a first container body, a second container body, a piezoelectric vibration element, a lid member, and an integrated circuit element.
A piezoelectric vibration element is mounted in a concave space formed on one main surface of the first container body of the piezoelectric oscillator, and is integrated in a concave space formed on one main surface of the second container body. A circuit element is mounted, and a second container body connection terminal formed on the other main surface of the first container body and a first container formed on the main surface of the second container body The body connection electrode terminals may be joined.

110, 210: Element mounting member 110a, 210a ... Substrate part 110b, 110c, 210b, 210c ... Frame part 111, 211 ... Recessed space 112, 212 ... Sealing conductor pattern 113, 213 ... Mounting part 114, 214 ... Piezoelectric vibration element mounting pad 215 ... Integrated circuit element mounting pad 116,216 ... External connection electrode terminal 114a ... First metal layer 114b ... Second metal layer 120 ... piezoelectric vibration element (crystal vibration element)
DESCRIPTION OF SYMBOLS 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Lid member 131 ... Sealing member 240 ... Integrated circuit element DS ... Conductive adhesive 100, 200: Piezoelectric device

Claims (2)

A piezoelectric vibration element in which an excitation electrode is attached to a rectangular piezoelectric element plate, and an extraction electrode is formed so as to be diagonally positioned with respect to the rectangular piezoelectric element plate from the excitation electrode;
An element mounting member in which two pairs of mounting portions are provided at positions facing the extraction electrodes of the piezoelectric vibration elements, and two pairs of piezoelectric vibration element mounting pads are provided in the two pairs of mounting portions, respectively;
A lid member for hermetically sealing the piezoelectric vibration element,
The piezoelectric vibration element mounting pad is integrally formed by laminating a first metal layer and a second metal layer, and the thickness of the first metal layer is 30 μm to 100 μm. .   The piezoelectric element according to claim 1, wherein the element mounting member includes an integrated circuit element including at least an oscillation circuit, and the integrated circuit element and the piezoelectric vibration element are electrically connected to each other. device.

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