JP6282800B2 - Crystal oscillator - Google Patents

Description

  The present invention relates to a crystal resonator used in an electronic device or the like.

  The crystal resonator generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a package having a substrate, a first frame provided on the upper surface of the substrate for providing the first recess, and a second frame provided on the lower surface of the substrate for providing the second recess. And a crystal element mounted on an electrode pad provided on the upper surface of the substrate and a thermistor element provided on the lower surface of the substrate have been proposed (see, for example, Patent Document 1 below). .

JP 2011-2111340 A

  As the above-described quartz resonator is downsized, the temperature sensing element is also miniaturized. Therefore, if a force is applied to the temperature sensing element when mounting the temperature sensing element, the temperature sensing element will be misaligned. There is a possibility that the productivity of the crystal unit may be reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal resonator capable of suppressing the positional deviation of the temperature sensitive element and improving the productivity of the crystal resonator.

A crystal resonator according to one aspect of the present invention includes a substrate, a first frame provided on the upper surface of the substrate, a second frame provided on the lower surface of the substrate, and a second frame on the lower surface of the second frame. A third frame provided to expose the inner edge of the second frame along the outer edge of the frame, a bonding pad provided on the exposed lower surface of the second frame, and a lower surface of the third frame A pair of crystal element external terminals and a pair of temperature sensitive element external terminals provided on the substrate, and a crystal element mounted on a pair of electrode pads provided on the upper surface of the substrate, surrounded by the first frame body A temperature sensing element provided with a connection terminal electrically connected to the bonding pad and accommodated in a region surrounded by the second frame, and provided with a connection terminal for connecting to the bonding pad; A lid provided on the body for hermetically sealing the quartz element, and a pair of electrode pads and a pair of quartz elements Terminal is electrically connected to the bonding pads and the external terminals for a pair of temperature sensing elements are electrically connected, joined to the surface facing the open side of the connecting terminals provided at both ends of the temperature-sensitive element a surface facing the open side of the pad lies in the same plane height, as to extend from the surface facing the open side of the interface pad toward a surface facing the open side of the connection terminals provided on the thermosensitive element And a conductive bonding material.

  A crystal resonator according to one aspect of the present invention includes a bonding pad provided on the exposed lower surface of the second frame, and a temperature sensing element provided so as to be accommodated in a region surrounded by the second frame. With this, even when a force is applied when mounting the temperature sensitive element, it is possible to reduce the occurrence of the positional deviation of the temperature sensitive element outside the second frame. Therefore, the productivity of the crystal unit can be improved.

It is a disassembled perspective view which shows the crystal resonator which concerns on this embodiment. It is AA sectional drawing of FIG. It is the top view which looked at the crystal oscillator concerning this embodiment from the lower surface side. (A) is a perspective plan view seen from the upper surface of the package constituting the crystal resonator according to the present embodiment, and (b) is seen from the upper surface of the substrate of the package constituting the crystal resonator according to the present embodiment. It is a perspective plan view. (A) is a perspective plan view seen from the lower surface of the substrate of the package constituting the crystal resonator according to the present embodiment, and (b) is seen from the lower surface of the package constituting the crystal resonator according to the present embodiment. It is a perspective plan view. It is the top view seen from the lower surface of the package which comprises the crystal oscillator concerning this embodiment. (A) is the elements on larger scale showing the state where the thermistor element which is the temperature sensing element which constitutes the crystal oscillator concerning this embodiment was mounted, and (b) is the crystal oscillator concerning this embodiment. It is the elements on larger scale which show the state which mounted the diode which is a temperature sensitive element to perform. It is a disassembled perspective view which shows the crystal resonator which concerns on the 1st modification of this embodiment.

  As shown in FIGS. 1 to 3, the crystal resonator according to the present embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and a temperature sensitive element bonded to the lower surface of the package 110. 130. The package 110 has an accommodation space K surrounded by the upper surface of the substrate 110a and the inner surface of the first frame 110b. The package 110 is surrounded by a first recess 118 surrounded by the lower surface of the second frame 110c and the inner surface of the third frame 110d, a first surface surrounded by the inner surface of the lower surface of the substrate 110a and the second frame 110c. Two recesses 119 are formed. Such a crystal resonator is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. The substrate 110a is provided with an electrode pad 111 for bonding the crystal element 120 on the upper surface.

  The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using one insulating layer or may be a laminate of a plurality of insulating layers. A crystal element wiring pattern for electrically connecting the electrode pad 111 provided on the upper surface and the crystal element external terminal G1 provided on the lower surface of the third frame 110d on the surface and inside of the substrate 110a. 113 and a quartz element via conductor 114 are provided. Further, as shown in FIG. 5, the substrate 110a electrically connects the bonding pad 115 provided on the lower surface of the second frame 110c and the external terminal G2 for the temperature sensing element provided on the lower surface of the third frame 110d. A temperature sensing element wiring pattern 116 and a temperature sensing element via conductor 117 are provided on the surface and inside of the second frame 110c and the third frame 110d.

  The first frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the accommodation space K on the upper surface of the substrate 110a. The second frame 110c is disposed on the lower surface of the substrate 110a, and is for forming the second recess 119 on the lower surface of the substrate 110a. The third frame 110d is provided on the lower surface of the second frame 110b along the outer edge of the second frame 110b, and is provided so as to expose the inner edge of the second frame 110c. The 3rd frame 110d is for forming the 1st recessed part 118 in the lower surface of the 2nd frame 110b. The first frame 110b, the second frame 110c, and the third frame 110d are made of a ceramic material such as alumina ceramics or glass-ceramics, and are formed integrally with the substrate 110a.

  When viewed in a plan view, the opening area of the second recess 119 is provided to be smaller than the opening area of the first recess 118. The opening of the second recess 119 is provided so as to be located in the opening of the first recess 118. Here, the case where the dimension of one side when the package 110 is viewed in plan is 1.0 to 3.0 mm and the dimension in the thickness direction of the package is 0.7 to 1.5 mm is taken as an example. The sizes of the recess 118 and the second recess 119 will be described. The length of the long side of the opening of the first recess 118 is 0.8 to 1.1 mm, and the length of the short side is 0.7 to 0.9 mm. The length of the first recess 118 in the depth direction is 0.1 to 0.35 mm. Moreover, the length of the long side of the 2nd recessed part 119 is 0.45-0.70 mm, and the length of a short side is 0.25-0.40 mm. The length of the second recess 119 in the depth direction is 0.10 to 0.35 mm.

  Also, as shown in FIG. 6, a pair of crystal element external terminals G1 and a pair of temperature sensitive element external terminals G2 are provided at the four corners of the lower surface of the third frame 110d. The pair of crystal element external terminals G1 are provided so as to be located diagonally on the lower surface of the third frame 110d. Further, the temperature sensitive element external terminal G2 is provided so as to be located at a diagonal of the third frame 110d different from the diagonal at which the crystal element external terminal G1 is provided. The crystal element external terminal G1 is electrically connected to an electrode pad 111 provided on the upper surface of the substrate 110a. Further, the temperature sensing element external terminal G2 is electrically connected to the bonding pad 115 provided on the lower surface of the second frame 110c. The crystal element external terminal G1 and the temperature sensitive element external terminal G2 are not electrically connected but are provided separately.

  The crystal element external terminal G1 and the temperature sensitive element external terminal G2 have a shape provided along the third frame 110d. Here, in the case where the package 110 has a one-side dimension of 1.0 to 3.0 mm when viewed in plan, and the package has a thickness-direction dimension of 0.7 to 1.5 mm. The sizes of the external terminal G1 and the temperature sensing element external terminal G2 will be described. The long side length of the crystal element external terminal G1 and the temperature sensitive element external terminal G2 is 0.3 to 0.65 mm, and the short side length is 0.25 to 0.6 mm. .

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. As shown in FIG. 4A, the electrode pad 111 is connected to the third frame body via the quartz element wiring pattern 113 and the quartz element via conductor 114 provided on the substrate 110a and the second frame 110c. The crystal element external terminal G1 provided on the lower surface of 110d is electrically connected.

  The electrode pad 111 and the crystal element external terminal G1 are for the crystal element wiring pattern 113 formed on the upper surface of the substrate 110a, and for the crystal element provided on the substrate 110a, the second frame 110c, and the third frame 110d. The via conductor 114 is connected. As shown in FIG. 4, one electrode pad 111a is connected to one end of the first crystal element wiring pattern 113a. Further, the other end of the first crystal element wiring pattern 113a is connected to one crystal element external terminal G1a through a first crystal element via conductor 114a, as shown in FIGS. . Therefore, one electrode pad 111a is electrically connected to one crystal element external terminal G1a. The other electrode pad 111b is connected to one end of the second crystal element wiring pattern 113b as shown in FIG. The other end of the other crystal element wiring pattern 113b is connected to the other crystal element external terminal G1b via the second crystal element via conductor 114b, as shown in FIGS. Therefore, the other electrode pad 111b is electrically connected to the other crystal element external terminal G1b.

  The bonding pad 115 is for mounting the temperature sensitive element 130. A pair of bonding pads 115 are provided on the exposed lower surface of the second frame 110 c and are provided along the opening edge of the second recess 119. As shown in FIGS. 5B and 6, the bonding pad 115 includes the temperature sensing element wiring pattern 116 provided on the lower surface of the second frame 110 c, the second frame 110 c, and the third frame. The temperature sensing element external terminal G2 provided on the lower surface of the third frame 110d is electrically connected via a temperature sensing element via conductor 117 provided inside the body 110d. Further, the bonding pad 115 is provided so as to be flush with the lower surface of the connection terminal 131 of the temperature sensing element 130. By doing so, the conductive bonding material 160 can be provided uniformly so as to straddle the lower surface of the connection terminal 131 from the bonding pad 115, so that the overflow of the conductive bonding material 160 can be reduced. it can.

  Further, the bonding pad 115 and the temperature sensing element external terminal G <b> 2 are connected by a temperature sensing element wiring pattern 116 having a portion formed in the second frame 110 c in the first recess 118 of the package 110. One bonding pad 115a is connected to one end of one temperature sensing element wiring pattern 116a as shown in FIG. Further, the other end of one temperature sensing element wiring pattern 116a is connected to one temperature sensing element external terminal G2a via one temperature sensing element via conductor 117a as shown in FIG. 5B and FIG. It is connected. Accordingly, one bonding pad 115a is electrically connected to one temperature sensing element external terminal G2a. The other bonding pad 115b is connected to one end of the other temperature sensing element wiring pattern 116b as shown in FIG. 5B. Further, the other end of the other temperature sensing element wiring pattern 116b is connected to the other temperature sensing element external terminal G2b via the other temperature sensing element via conductor 117b as shown in FIG. 5B and FIG. It is connected. Therefore, the other bonding pad 115b is electrically connected to the other temperature sensing element external terminal G2b.

  Further, the length of one temperature sensing element wiring pattern 116a provided on the lower surface of the first recess 118 is substantially equal to the length of the other temperature sensing element wiring pattern 116b. That is, the pair of temperature sensing element wiring patterns 116 have substantially the same length. The length of the pair of temperature sensitive element wiring patterns 116 exposed on the inner bottom surface of the first recess 118 is about 200 to 250 μm. Here, the substantially equal length includes one in which the difference between the wiring length of one temperature sensing element wiring pattern 116a and the wiring length of the other temperature sensing element wiring pattern 116b is 0 to 50 μm. Further, the wiring length is obtained by measuring the length of a straight line passing through the center of each wiring. That is, when the wiring length of one temperature sensing element wiring pattern 116a is substantially equal to the wiring length of the other temperature sensing element wiring pattern 116b, the generated resistance values become equal, and the temperature sensing element 130 is equalized. Since the load resistance applied to is also uniform, the voltage can be output stably.

  The sealing conductor pattern 112 is for improving the wettability of the sealing member 141 when bonded via the lid 140 and the sealing member 141. As shown in FIG. 2, FIG. 5B and FIG. 6, the sealing conductor pattern 112 is electrically connected to one temperature sensing element external terminal G2a via one temperature sensing element via conductor 117a. It is connected. One temperature sensing element external terminal G2a plays the role of a ground terminal by being connected to a mounting pad connected to a ground which is a reference potential on an external mounting substrate. The lid 140 joined to the sealing conductor pattern 112 is connected to one temperature-sensing element external terminal G2a having a ground potential. Therefore, the shielding property in the accommodation space K by the lid 140 is improved. The sealing conductor pattern 112 is, for example, 10 to 25 μm in thickness by applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten or molybdenum, for example, so as to surround the upper surface of the first frame 110b in an annular shape. Is formed.

  As shown in FIG. 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 150. The crystal element 120 is for oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2, the crystal element 120 has a structure in which the excitation electrode 122, the connection electrode 123, and the extraction electrode 124 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The extraction electrode 124 extends from the excitation electrode 122 toward the short side of the crystal base plate 121. The connection electrode 123 is connected to the lead electrode 124 and is provided in a shape along the long side or the short side of the crystal base plate 121.

  In the present embodiment, a one-side holding structure in which one end of the crystal element 120 connected to the electrode pad 111 is a fixed end connected to the upper surface of the substrate 110a and the other end is a free end spaced from the upper surface of the substrate 110a. The quartz crystal element 120 is fixed on the substrate 110. The outer peripheral edge on the fixed end side of the quartz base plate 121 is provided so as to be parallel to one side of the substrate 110a and approach the inner peripheral edge of the first frame 110b in plan view. By doing so, the mounting position of the crystal element 120 can be made visually easier to understand, and the productivity of the crystal unit can be improved.

  Here, the operation of the crystal element 120 will be described. When an alternating voltage from the outside is applied to the crystal element plate 121 from the connection electrode 123 via the extraction electrode 124 and the excitation electrode 122, the crystal element 120 is excited in a predetermined vibration mode and frequency. Is supposed to wake up.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. Then, the quartz crystal element 120 has the excitation electrode 122, the connection electrode 123, and the extraction electrode 124 formed by depositing a metal film on both main surfaces of the quartz base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. It is produced by forming.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 150 is applied onto the electrode pad 111 by, for example, a dispenser. The crystal element 120 is transported onto the conductive adhesive 150 and placed on the conductive adhesive 150. The conductive adhesive 150 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the pair of electrode pads 111.

  The conductive adhesive 150 contains conductive powder as a conductive filler in a binder such as a silicone resin. Examples of the conductive powder include aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing nickel or iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  As the temperature sensing element 130, a thermistor, a platinum resistance thermometer, a diode, or the like is used. In the case of the thermistor element, the temperature sensing element 130 has a rectangular parallelepiped shape, and connection terminals 131 are provided at both ends. The temperature sensing element 130 shows a remarkable change in electrical resistance due to a change in temperature. Since the voltage changes due to the change in resistance value, the output depends on the relationship between the resistance value and the voltage and the relationship between the voltage and the temperature. Temperature information can be obtained from the applied voltage. The temperature sensing element 130 outputs the voltage between the temperature sensing element external terminals G2 to the outside of the crystal resonator via the temperature sensing element external terminal G2, for example, a main IC (see FIG. Temperature information can be obtained by converting the voltage output at (not shown) into temperature. Such a temperature sensitive element 130 is arranged near the crystal resonator, and the voltage for driving the crystal resonator is controlled by the IC in accordance with the temperature information of the crystal resonator obtained thereby, so-called temperature compensation is performed. can do.

  When a platinum resistance thermometer is used, the temperature sensing element 130 is provided with a platinum electrode by depositing platinum at the center of a rectangular parallelepiped ceramic plate. Connection terminals 131 are provided at both ends of the ceramic plate. The platinum electrode and the connection terminal 131 are connected by a lead electrode provided on the upper surface of the ceramic plate. An insulating resin is provided so as to cover the upper surface of the platinum electrode.

When a diode is used, the temperature sensing element 130 has a structure in which a semiconductor element is mounted on an upper surface of a semiconductor element substrate, and the upper surface of the semiconductor element and the semiconductor element substrate is covered with an insulating resin. . Connection terminals serving as an anode terminal and a cathode terminal are provided from the lower surface to the side surface of the semiconductor element substrate. The temperature sensing element has a forward characteristic in which current flows from the anode terminal to the cathode terminal, but hardly current flows from the cathode terminal to the anode terminal.
The forward characteristics of the temperature sensitive element vary greatly depending on the temperature. Voltage information can be obtained by passing a constant current through the temperature sensing element and measuring the forward voltage. By converting from the voltage information, temperature information of the crystal element can be obtained. In the diode, the relationship between voltage and temperature shows a straight line. The voltage between the temperature sensing element external terminals is output to the outside of the crystal resonator via the temperature sensing element external terminal.

  As shown in FIGS. 2 and 3, the temperature sensing element 130 includes a conductive bonding material 160 such as solder on a bonding pad 115 provided on the lower surface of the second frame portion 110 c exposed in the first recess 118 of the package 110. Has been implemented through. In addition, the connection terminal 131a of the temperature sensitive element 130 is connected to the bonding pad 115a. The bonding pad 115a is sensed through the temperature sensing element wiring pattern 116a of the second frame 110c and one temperature sensing element via conductor 117a provided inside the second frame 110c and the third frame 110d. It is electrically connected to the temperature element external terminal G2a. The temperature-sensing element external terminal G2a serves as a ground terminal by being connected to a mounting pad connected to a ground which is a reference potential on an external mounting substrate. Therefore, the connection terminal 131a of the temperature sensing element 130 is connected to the ground that is the reference potential.

  The other temperature sensing element wiring pattern 116 b is provided so as to pass through a part between the pair of electrode pads 111 and overlap with the one electrode pad 111 in a plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred from the other temperature sensing element wiring pattern 116b to the other bonding pad 115b through the substrate 110a immediately below the electrode pad 111. . Therefore, since the crystal resonator can further shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the temperature sensitive element 130 are approximated, and the voltage output from the temperature sensitive element 130 is converted. It is possible to further reduce the difference between the temperature obtained by doing this and the temperature around the actual quartz crystal element 120.

  Further, since the temperature sensing element 130 is positioned in the plane of the excitation electrode 122 provided on the crystal element 120 in a plan view, the temperature sensing element 130 is made electronic by the shielding effect of the metal film of the excitation electrode 122. It protects against noise from other semiconductor parts and electronic parts such as power amplifiers that make up the equipment. Therefore, due to the shielding effect of the excitation electrode 122, it is possible to reduce the superimposition of noise on the temperature sensing element 130 and to output an accurate voltage of the temperature sensing element 130. In addition, since an accurate voltage value can be output from the temperature sensing element 130, temperature information obtained by converting the voltage output from the temperature sensing element 130 and temperature information around the actual crystal element 120 are obtained. It is possible to further reduce the difference.

  A method for joining the temperature sensing element 130 to the package 110 will be described. First, the temperature sensing element 130 is placed so as to be accommodated in the second recess 119. The conductive bonding material 160 is applied by, for example, a dispenser so as to straddle the connection pad 131 provided on the second frame 110c and the connection terminal 131 of the temperature sensitive element 130. The conductive bonding material 160 is melt bonded by heating. Therefore, the temperature sensitive element 130 is bonded to the pair of bonding pads 115.

  When the temperature sensitive element 130 is a thermistor element, as shown in FIG. 7A, one connection terminal 131 is provided at each end of the rectangular parallelepiped shape. One connection terminal 131 a is provided on the left side surface and the top and bottom surfaces of the temperature sensing element 130. The other connection terminal 131 b is provided on the right side surface and the upper and lower surfaces of the temperature sensing element 130. The length of the long side of the thermosensitive element 130 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 130 in the thickness direction is 0.1 to 0.3 mm. The distance between the side surfaces of the connection terminals 131a and 131b of the temperature sensing element 130 and the inner surface of the second frame 110c is set to 0.05 to 0.1 mm. By doing in this way, even when a force is applied when mounting the temperature sensing element 130, the temperature sensing element 130 is pressed by the inner wall surface of the second frame portion 110c. Further, it is possible to reduce the occurrence of positional deviation of the temperature sensing element 130.

  When the temperature sensing element 230 is a diode, as shown in FIG. 7B, one connection terminal 231 is provided at each end of the rectangular parallelepiped lower surface. One connection terminal 231 a is provided on the lower left surface of the temperature sensing element 230. The other connection terminal 231 b is provided on the lower right surface of the temperature sensing element 230. The length of the long side of the temperature sensing element 230 is 0.4 to 0.6 mm, and the length of the short side is 0.2 to 0.3 mm. The length of the thermosensitive element 230 in the thickness direction is 0.1 to 0.3 mm. The distance between the side surface of the temperature sensing element 230 and the inner surface of the second frame 110c is set to be 0.05 to 0.1 mm. By doing in this way, even when a force is applied when mounting the temperature sensing element 230, the temperature sensing element 230 is pressed by the inner wall surface of the second frame portion 110c. It is possible to reduce the occurrence of positional deviation of the temperature sensitive element 230 outside.

  When the temperature sensing element 130 is a thermistor element, as shown in FIG. 7A, the second recess 119 is arranged so that the longitudinal direction of the temperature sensing element 130 and the bottom surface of the second recess 119 are parallel to each other. The surface of the connection terminal 131 facing the opening side when accommodated in the housing is defined as the lower surface of the connection terminal 131. In the case where the temperature sensing element 230 is a diode as shown in FIG. 7B, the upper surface on which the insulating resin provided in the temperature sensing element 130 is formed is the bottom surface of the second recess 119. The surface of the connection terminal 231 that is brought into contact with and faces the opening side is defined as the lower surface of the connection terminal 231. The lower surfaces of the connection terminals 131, 231 of the temperature sensitive elements 130, 230 are at the same level as the lower surface of the bonding pad 115, and the conductive bonding is carried out so as to straddle the lower surface of the bonding pad 115 from the lower surface of the connection terminals 131, 231. A material 160 is provided. Here, the same plane height position includes a position in which the vertical displacement between the lower surfaces of the connection terminals 131 and 231 of the temperature sensitive elements 130 and 230 and the lower surface of the bonding pad 115 is 0.05 mm or less. By doing so, the conductive bonding material 160 can be provided uniformly, so that overflow can be reduced. Therefore, in order to prevent the conductive bonding material 160 from overflowing and spreading, a short circuit between the connection terminals 131 and 231 of the temperature sensitive elements 130 and 230 can be reduced. In addition, since the amount of the conductive bonding material 160 can be confirmed in appearance even after the connection terminals 131 and 231 of the temperature sensitive elements 130 and 230 and the bonding pad 115 are bonded, the productivity of the crystal resonator is improved. Can be made.

  The conductive bonding material 160 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 160 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 98% for tin, 2 to 4% for silver, and 0 to 1.0% for copper.

  The lid 140 is made of, for example, an alloy containing at least one of iron, nickel, and cobalt. Such a lid 140 is for hermetically sealing the accommodation space K in a vacuum state or the accommodation space K filled with nitrogen gas or the like. Specifically, the lid 140 is placed on the first frame 110b of the package 110 in a predetermined atmosphere. Then, by applying seam welding by applying a predetermined current to the lid 140 so that the sealing conductor pattern 112 of the first frame 110b and the sealing member 141 of the lid 140 are welded, the first frame Join the body 110b.

  The sealing member 141 is provided at a position of the lid 140 facing the sealing conductor pattern 112 provided on the upper surface of the first frame 110 b of the package 110. The sealing member 141 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  The crystal resonator according to the present embodiment includes a temperature sensing element 130 that is bonded to the bottom surface of the second frame 110c and is accommodated in a region surrounded by the second frame 110c. By doing so, since the temperature sensing element 130 is accommodated in the second recess 119, even when a force is applied when the temperature sensing element 130 is mounted, the inner wall surface of the second frame portion 110c. Since the temperature sensing element 130 is pressed at the position, it is possible to reduce the occurrence of the positional deviation of the temperature sensing element 130 outside the second recess 119. Therefore, the productivity of the crystal unit can be improved.

  Further, in the crystal resonator according to the present embodiment, the conductive bonding material 160 is provided so as to extend from the connection terminal 131 of the temperature-sensitive element 130 to the bonding pad 115, thereby providing the conductive bonding material 160 uniformly. Therefore, overflowing can be reduced. Therefore, since the conductive bonding material 160 is prevented from overflowing and spreading, a short circuit between the connection terminals 131 of the temperature sensitive element 130 can be reduced. In addition, since the amount of the conductive bonding material 160 can be confirmed in appearance even after the connection terminal 131 of the temperature sensitive element 130 and the bonding pad 115 are bonded, the productivity of the crystal resonator can be improved. .

(First modification)
Hereinafter, the crystal resonator according to the first modification of the present embodiment will be described. Note that, in the crystal resonator according to the first modification of the present embodiment, the same portions as those of the above-described crystal resonator are denoted by the same reference numerals, and description thereof will be omitted as appropriate. As shown in FIG. 8, the crystal resonator according to the first modification of the present embodiment is provided with an insulating resin 170 so as to cover the temperature-sensitive element 130 and the conductive bonding material 160. Different from this embodiment.

  The insulating resin 170 is provided so as to cover the temperature sensitive element 130 and the conductive bonding material 160. Insulating resin 170 is often made of epoxy, polyimide, or the like, and is added with a curing agent, a curing accelerator, and other inorganic fillers as necessary to a thermoplastic resin that has the property of flowing when softened or melted by heating.・ Mixed. Thus, since the periphery of the temperature sensing element 130 is covered and protected by the insulating resin 170, foreign matter does not come into contact with each other, and it is possible to prevent a short circuit between the connection terminals 131 of the temperature sensing element 130. it can.

  The quartz resonator according to the first modification of the present embodiment protects the periphery of the temperature sensitive element 130 by providing the insulating resin 170 so as to cover the temperature sensitive element 130 and the conductive bonding material 160. be able to. Such a crystal resonator can prevent a short circuit between the connection terminals 131 of the temperature sensing element 130 due to the contact of foreign matter.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  In the above embodiment, the case where the first frame body 110b is integrally formed of a ceramic material in the same manner as the substrate 110a has been described. However, the first frame body 110b may be made of metal. In this case, the frame is joined to the conductor film of the substrate via a brazing material such as silver-copper.

DESCRIPTION OF SYMBOLS 110 ... Package 110a ... Board | substrate 110b ... 1st frame 110c ... 2nd frame 110d ... 3rd frame 111 ... Electrode pad 112 ... Conductive pattern 113 for sealing ... Wiring pattern for crystal element 114 ... Via conductor for crystal element 115 ... Junction pad 116 ... Wiring pattern for temperature sensing element 117 ... Via conductor for temperature sensing element 118 ... First recess 119 ... Second recess 120 ... Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Extraction electrode 124 ... Connection electrode 130 ... Temperature sensing element 131 ... Connection terminal 140: Lid 141: Sealing member 150: Conductive adhesive 160 ... Conductive bonding material 170 ... Insulating resin G1 ... External terminal for crystal element G2 ..Temperature sensitive element External terminal

Claims (2)

A substrate,
A first frame provided on the upper surface of the substrate;
A second frame provided on the lower surface of the substrate;
A third frame provided on the lower surface of the second frame along the outer edge of the second frame so as to expose the inner edge of the second frame;
A bonding pad provided on the exposed lower surface of the second frame;
A pair of crystal element external terminals and a pair of temperature sensitive element external terminals provided on the lower surface of the third frame;
A crystal element mounted on a pair of electrode pads provided on an upper surface of the substrate in a region surrounded by the first frame;
A temperature-sensitive element that is electrically bonded to the bonding pad and is provided so as to be housed in a region surrounded by the second frame, and provided with a connection terminal for connection to the bonding pad ;
A lid that is provided on the first frame and hermetically seals the crystal element,
The pair of electrode pads and the pair of crystal element external terminals are electrically connected, and the bonding pad and the pair of temperature sensitive element external terminals are electrically connected,
The surface facing the opening side of the connection terminal provided at both ends of the temperature sensing element and the surface facing the opening side of the bonding pad are at the same plane height position and facing the opening side of the bonding pad. crystal oscillator, characterized in that the conductive bonding material so as to extend toward the surface facing the open side of the connecting terminals provided on the temperature sensitive device is provided from which a surface. The crystal resonator according to claim 1 ,
An insulating resin is provided so as to cover the temperature sensitive element.

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