JP2015142218A - crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device capable of maintaining the airtightness of a substrate.SOLUTION: A crystal device includes: a substrate 110; an electrode pad 111 disposed on the top face of the substrate 110; an external terminal 112 disposed on the bottom face of the substrate 110; a wiring pattern 113 disposed on the top face of the substrate 110 and electrically connected to the electrode pad 111; a connection pattern 115 disposed on the bottom face of the substrate 110 and electrically connected to the external terminal 112; a via conductor 114 disposed on the substrate 110 to electrically connect the wiring pattern 113 to the connection pattern 115; a crystal element 120 mounted on the electrode pad 111; a sealing lid 130 disposed on the top face of the substrate 110 to hermetically seal the crystal element 120; and a bonding member 150 disposed between the top face of the substrate 110 and the bottom face of the sealing lid 130. The bonding member 150 is disposed at a position overlaying with the via conductor 114 in a plan view.

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  The crystal device generates a specific frequency by using the piezoelectric effect of the crystal element. For example, a crystal element mounted on a pair of electrode pads provided along one side of the upper surface of a rectangular substrate via a conductive adhesive, and bonded to the upper surface of the substrate via a bonding member, A crystal resonator provided with a metal sealing lid for hermetically sealing has been proposed (see, for example, Patent Document 1 below). Glass is used for the joining member, and the sealing lid and the upper surface of the substrate can be joined by applying heat. In addition, external terminals are provided at the four corners of the lower surface of the substrate constituting the crystal device, and are mounted on a mounting substrate such as an electronic device with solder or the like.

JP 2012-70224 A

  In the crystal device described above, electrode pads provided on the upper surface of the substrate and external terminals provided on the lower surface of the substrate are connected by via conductors provided on the substrate. When this crystal device is mounted on a mounting substrate such as an electronic device, heat is applied to the substrate, which may cause peeling at the interface between the outer peripheral edge of the via conductor and the substrate due to warpage of the substrate. There is. Therefore, there is a possibility that the airtightness of the substrate cannot be maintained because a gap is generated between the via conductor and the substrate.

  The present invention has been made in view of the above problems, and provides a quartz crystal device capable of maintaining the airtightness of a substrate.

  A quartz crystal device according to an aspect of the present invention includes a substrate, an electrode pad provided on the upper surface of the substrate, an external terminal provided on the lower surface of the substrate, and an electrical connection with the electrode pad provided on the upper surface of the substrate. A wiring pattern provided on the lower surface of the substrate and electrically connected to an external terminal; a via conductor provided on the substrate for electrically connecting the wiring pattern and the connection pattern; A quartz element mounted on the electrode pad, a sealing lid provided on the upper surface of the substrate for hermetically sealing the quartz element, and provided between the upper surface of the substrate and the lower surface of the sealing lid. A joining member, and the joining member is provided at a position overlapping the via conductor in plan view.

  A quartz crystal device according to an aspect of the present invention includes a substrate, an electrode pad provided on the upper surface of the substrate, an external terminal provided on the lower surface of the substrate, and an electrical connection with the electrode pad provided on the upper surface of the substrate. A wiring pattern provided on the lower surface of the substrate and electrically connected to an external terminal; a via conductor provided on the substrate for electrically connecting the wiring pattern and the connection pattern; A joining member provided between the upper surface of the substrate and the lower surface of the sealing lid, and the joining member is provided at a position overlapping the via conductor in plan view. By doing so, since the bonding member is provided on the upper surface of the via conductor, the via conductor is fixed to the substrate 110 by the bonding member, and the outer peripheral edge of the via conductor due to warpage of the substrate or the like. The airtightness of the substrate can be maintained while suppressing the via conductor from being peeled off from the interface between the substrate and the substrate. Further, even if the via conductor peels off from the interface between the outer peripheral edge of the via conductor and the through hole of the substrate, the upper surface of the via conductor is blocked by the bonding member, so that the airtightness of the substrate can be maintained. it can.

It is a disassembled perspective view which shows the crystal device in this embodiment. It is sectional drawing in AA of the quartz crystal device shown by FIG. It is a top view which shows the state which mounted the crystal element of the crystal device in this embodiment. (A) It is the top view which looked at the board | substrate which comprises the crystal device in this embodiment from the upper surface, (b) The top view which looked at the board | substrate which comprises the crystal device in this embodiment from the lower surface. (A) It is a top view which shows the state which mounted the crystal | crystallization element which comprises the crystal device in the 1st modification of this embodiment, (b) The bottom surface which comprises the crystal device in the 1st modification of this embodiment It is the top view seen from. It is a disassembled perspective view which shows the quartz crystal device in the 2nd modification of this embodiment. (A) It is a top view which shows the state which mounted the crystal | crystallization element which comprises the crystal device in the 3rd modification of this embodiment, (b) The bottom surface which comprises the crystal device in the 3rd modification of this embodiment It is the top view seen from.

  As shown in FIGS. 1 and 2, the crystal device according to the present embodiment includes a substrate 110, a crystal element 120 bonded to the upper surface of the substrate 110, and a seal for hermetically sealing the crystal element 120. A lid 130. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110 has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. A first electrode pad 111 a and a second electrode pad 111 b for bonding the crystal element 120 are provided along one side of the substrate 110. An electrode pattern 116 is provided along one side facing one side of the substrate 110. External terminals 112 are provided at the four corners of the lower surface of the substrate 110. Further, two of the four external terminals 112 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120, and the other is a reference potential on an external mounting substrate. Connected to a mounting pad connected to the ground potential.

  The substrate 110 is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110 may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern 113 electrically connected to the electrode pad 111 is provided on the upper surface of the substrate 110, and a connection pattern 115 electrically connected to the external terminal 112 is provided on the lower surface of the substrate 110. It has been. The substrate 110 is provided with a via conductor 114 for electrically connecting the wiring pattern 113 and the connection pattern 115.

  The first electrode pad 111a and the second electrode pad 111b of the substrate 110 are used for mounting the crystal element 120 as shown in FIGS. The first electrode pad 111a and the second electrode pad 111b are provided along one side of the substrate 110 as shown in FIG. The electrode pad 111 is electrically connected to the external terminal 112 via a wiring pattern 113 provided on the upper surface of the substrate 110, a via conductor 114 provided on the substrate 110, and a connection pattern 115 provided on the lower surface of the substrate 110. It is connected. The external terminals 112 are provided along the outer peripheral edge of the substrate 110 at the four corners of the lower surface of the substrate 110.

  As shown in FIG. 4A, the electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. As shown in FIG. 4B, the external terminal 112 includes a first external terminal 112a, a second external terminal 112b, a third external terminal 112c, and a fourth external terminal 112d. As shown in FIG. 4A, the wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b, and the connection pattern 115 is composed of a first connection pattern 115a and a second connection pattern 115b. Yes. The via conductor 114 includes a first via conductor 114a and a second via conductor 114b. The first electrode pad 111 a is electrically connected to one end of the first wiring pattern 113 a provided on the upper surface of the substrate 110. The other end of the first wiring pattern 113a is electrically connected to one end of the first connection pattern 115a through the first via conductor 114a. The other end of the first connection pattern 115a is electrically connected to the fourth external terminal 112d. Therefore, the first electrode pad 111a is electrically connected to the fourth external terminal 112d.

  The second electrode pad 111 b is electrically connected to one end of the second wiring pattern 113 b provided on the upper surface of the substrate 110. The other end of the second wiring pattern 113b is electrically connected to one end of the second connection pattern 115b through the second via conductor 114b. The other end of the second connection pattern 115b is electrically connected to the second external terminal 112b. Therefore, the second electrode pad 111b is electrically connected to the second external terminal 112b. Further, the first external terminal 112a and the third external terminal 112c are not connected anywhere, and are used as mounting terminals for mounting on the mounting board.

  The external terminal 112 is used for mounting on a mounting board constituting an external electronic device or the like. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110. Two of the external terminals 112 are electrically connected to a pair of electrode pads 111 provided on the upper surface of the substrate 110, respectively. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110.

  Further, the electrode pad 111 and the external terminal 112 have a shape provided along the substrate 110. Here, taking the case where the long side dimension of the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 111 is taken as an example. The size of the external terminal 112 will be described. The length of the long side of the first electrode pad 111a and the second electrode pad 111b is 0.20 to 0.60 mm, and the length of the short side is 0.10 to 0.50 mm. The long side length of the external terminal 112 is 0.30 to 0.90 mm, and the short side length is 0.20 to 0.60 mm.

  The wiring pattern 113 is provided on the upper surface of the substrate 110 and is drawn from the electrode pad 111 toward the corner of the substrate 110 in the vicinity. The connection pattern 115 is provided on the lower surface of the substrate 110 and is drawn from the external terminal 112 toward the corner of the substrate 110 in the vicinity. The length of the first connection pattern 115a and the length of the second connection pattern 115b are substantially equal. Here, the substantially equal length includes a difference between the length of the first connection pattern 115a and the length of the second connection pattern 115b by 0 to 200 μm. The length of the connection pattern 115 is obtained by measuring the length of a straight line passing through the center of each connection pattern 115.

  The via conductor 114 is provided inside the substrate 110, and both ends thereof are electrically connected to the wiring pattern 113 and the connection pattern 115. The via conductor 114 is provided by filling a conductor in a through hole provided in the substrate 110. A bonding member 150 is provided on the upper surface of the via conductor 114, and the outer peripheral edge of the upper surface of the via conductor 114 is fixed to the substrate 110 by the bonding member 150. The airtightness of the substrate 110 can be maintained while suppressing the via conductor 114 from peeling off from the interface between the outer peripheral edge and the substrate 110. Even if the via conductor 114 is peeled off from the interface between the outer peripheral edge of the via conductor 114 and the through hole of the substrate 110 due to the warpage of the substrate 110, the upper surface of the via conductor 114 is blocked by the bonding member 150. The airtightness of the substrate 110 can be maintained.

  The electrode pattern 116 is used to prevent the outer peripheral edge of the crystal element 120 from coming into contact with the substrate 110 when the crystal element 120 is mounted on the first electrode pad 111a and the second electrode pad 111b. ing. The electrode pattern 116 has a rectangular shape, and is provided along one side opposite to the one side on which the electrode pads are provided. Here, taking the case where the long side dimension of the substrate 110 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pattern 116 is taken as an example. Explain the size of. The length of the long side of the electrode pattern 116 is 0.20 to 0.60 mm, and the length of the short side is 0.10 to 0.50 mm. The thickness of the electrode pattern 116 in the vertical direction is 0.01 to 0.05 mm.

  Here, a method for manufacturing the substrate 110 is described. When the substrate 110 is made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating, gold plating, silver palladium, or the like is applied to a predetermined portion of the conductor pattern, specifically, the electrode pad 111, the external terminal 112, the wiring pattern 113, the via conductor 114, the connection pattern 115, and the electrode pattern 116. It is produced by giving. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 1 to 3, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  Further, as shown in FIGS. 1 to 3, the crystal element 120 has a structure in which the excitation electrode 122 and the extraction electrode 123 are attached to the upper surface and the lower surface of the crystal base plate 121, respectively. . The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. The crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110 will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by a dispenser, for example. The crystal element 120 is transported onto the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 120 is bonded to the electrode pad 111. That is, the first extraction electrode 123a of the crystal element 120 is bonded to the second electrode pad 111b, and the second extraction electrode 123b is bonded to the first electrode pad 111a. As a result, the second external terminal 112b and the fourth external terminal 112d are electrically connected to the crystal element 120.

  The crystal element 120 is mounted such that the electrode pattern 116 is disposed at a position facing the free end of the crystal element 120. By doing so, the free end of the crystal element 120 comes into contact with the electrode pattern 116 even if the crystal element 220 is tilted about the location where the extraction electrode 123 of the crystal element 220 and the electrode pad 111 are joined, so that the substrate 110 It is possible to prevent the free end of the quartz crystal element 120 from coming into contact with the upper surface of the substrate. If the drop test is performed with the free end of the crystal element 120 in contact with the substrate 110, the free end of the crystal element 120 may be lost. By doing in this way, it can reduce that the oscillation frequency of the crystal element 120 fluctuates, suppressing that the free end side of the crystal element 120 is missing.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The sealing lid 130 includes a rectangular sealing base portion 130a and a sealing frame portion 130b provided along the outer peripheral edge of the lower surface of the sealing base portion 130a, and the lower surface of the sealing base portion 130a. A storage space K is formed by the inner side surface of the sealing frame portion 130b. The sealing frame part 130b is for forming the accommodation space K on the lower surface of the sealing base part 130a. The sealing frame part 130b is provided along the outer edge of the lower surface of the sealing base part 130a.

  The sealing base portion 130a and the sealing frame portion 130b are made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and are integrally formed. Such a sealing lid 130 is for hermetically sealing the housing space K in a vacuum state or the housing space K filled with nitrogen gas or the like. Specifically, the sealing lid 130 is placed on the upper surface of the substrate 110 in a predetermined atmosphere, and the bonding member 150 provided between the upper surface of the substrate 110 and the lower surface of the sealing frame portion 130b is heated. Is applied to melt-bond.

  The bonding member 150 is used to bond the lower surface of the sealing lid 130 and the outer peripheral edge of the upper surface of the substrate 110. As shown in FIG. 2, the bonding member 150 is provided from the lower surface of the sealing frame portion 130 b to the outer peripheral edge on the substrate 110. The joining member 150 is provided at a position overlapping the via conductor 114 in plan view. By doing so, since the bonding member 150 is provided on the upper surface of the via conductor 114, the outer peripheral edge of the via conductor and the substrate 110 are fixed by the bonding member 150. The airtightness of the substrate 110 can be maintained while suppressing the via conductor 114 from being peeled off from the interface between the outer peripheral edge of the via conductor 114 and the substrate 110 due to warpage or the like. Even if the via conductor 114 is peeled off from the interface between the outer peripheral edge of the via conductor 114 and the through hole of the substrate 110, the upper surface of the via conductor 114 is blocked by the bonding member 150. Thus, the airtightness of the substrate 110 can be improved.

  The joining member 150 is made of, for example, low melting glass or lead oxide glass containing vanadium which is a glass that melts at 300 ° C. to 400 ° C. Glass is pasty with a binder and a solvent added, and is melted and then solidified to adhere to other members. The joining member 150 is provided by, for example, applying glass frit paste in an annular shape along the lower surface of the sealing frame portion 130b by screen printing and drying. The composition of the lead oxide glass is composed of lead oxide, lead fluoride, titanium dioxide, niobium oxide, bismuth oxide, boron oxide, zinc oxide, ferric oxide, copper oxide and calcium oxide.

  The crystal device according to the present embodiment is provided at a position where the bonding member 150 overlaps with the via conductor 114 in plan view. By doing so, since the bonding member 150 is provided on the upper surface of the via conductor 114, the via conductor 114 is fixed to the substrate 110 by the bonding member 150, and the substrate 110 is warped. The airtightness of the substrate 110 can be maintained while preventing the via conductor 114 from being peeled off from the interface between the outer peripheral edge of the via conductor 114 and the substrate 110. Even if the via conductor 114 is peeled off from the interface between the outer peripheral edge of the via conductor 114 and the through hole of the substrate 110, the upper surface of the via conductor 114 is blocked by the bonding member 150. Therefore, the airtightness of the substrate 110 can be improved.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In the crystal device according to the first modification of the present embodiment, as shown in FIG. 5, the electrode pad 211 includes a first electrode pad 211a, a second electrode pad 211b, and a third electrode pad 211c. This embodiment is different from the present embodiment in that the first electrode pad 211a is electrically connected to the third electrode pad 211c.

  The substrate 210 has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. A first electrode pad 211 a and a second electrode pad 211 b for bonding the crystal element 120 are provided along one side of the substrate 210. A third electrode pad 211c is provided along one side opposite to one side of the substrate 210. External terminals 212 are provided at the four corners of the lower surface of the substrate 210. Two of the four external terminals 212 are electrically connected to the crystal element 120 and used as input / output terminals of the crystal element 120.

  A wiring pattern 213 that is electrically connected to the electrode pad 211 is provided on the upper surface of the substrate 210, and a connection pattern 215 that is electrically connected to the external terminal 212 is provided on the lower surface of the substrate 210. It has been. The substrate 210 is provided with a via conductor 214 for electrically connecting the wiring pattern 213 and the connection pattern 215.

  As shown in FIG. 5A, the electrode pad 211 includes a first electrode pad 211a, a second electrode pad 211b, and a third electrode pad 211c. The external terminal 212 includes a first external terminal 212a, a second external terminal 212b, a third external terminal 212c, and a fourth external terminal 212d as shown in FIG. 5B. As shown in FIG. 5A, the wiring pattern 213 includes a first wiring pattern 213a, a second wiring pattern 213b, and a third wiring pattern 213c, and the connection pattern 215 includes the first connection pattern 215a and the second connection pattern 215a. The pattern 215b is used. The via conductor 214 includes a first via conductor 214a and a second via conductor 214b. The first electrode pad 211 a is electrically connected to one end of the first wiring pattern 213 a provided on the upper surface of the substrate 210. The other end of the first wiring pattern 213a is electrically connected to the third electrode pad 211c. The third electrode pad 211c is electrically connected to one end of a third wiring pattern 213c provided on the upper surface of the substrate 210. The other end of the third wiring pattern 213c is electrically connected to one end of the first connection pattern 215a through the first via conductor 214a. The other end of the first connection pattern 215a is electrically connected to the fourth external terminal 212d. Therefore, the first electrode pad 211a and the third electrode pad 211c are electrically connected to the fourth external terminal 212d.

  The second electrode pad 211b is electrically connected to one end of the second wiring pattern 213b provided on the upper surface of the substrate 210. The other end of the second wiring pattern 213b is electrically connected to one end of the second connection pattern 215b through the second via conductor 214b. The other end of the second connection pattern 215b is electrically connected to the second external terminal 212b. Therefore, the second electrode pad 211b is electrically connected to the second external terminal 212b. The first external terminal 212a and the third external terminal 212c are not connected anywhere and are used as mounting terminals for mounting on a mounting board.

  In the quartz crystal device according to the first modification of the present embodiment, the electrode pad 211 includes a first electrode pad 211a, a second electrode pad 211b, and a third electrode pad 211c, and the first electrode pad 211a is a third electrode. It is electrically connected to the pad 211c. By doing so, the crystal element 120 can be mounted on the first electrode pad 211a, the second electrode pad 211b, and the third electrode pad 211c. There is no need to redesign the substrate 210 on which the electrode pads 211 are formed. Therefore, the productivity of the crystal device can be improved.

  Further, the quartz crystal device according to the first modification of the present embodiment is mounted such that the third electrode pad 212c is disposed at a position facing the free end of the quartz crystal element 120. Therefore, even if the portion where the lead electrode 123 of the crystal element 120 and the electrode pad 211 are joined is inclined, the free end of the crystal element 120 contacts the third electrode pad 211c, so that the upper surface of the substrate 210 is It is possible to suppress contact of the free end of the crystal element 120. If a drop test or the like is performed with the free end of the crystal element 120 in contact with the substrate 210, the free end of the crystal element 120 may be lost. Also by doing this, it is possible to suppress the free end side of the crystal element 120 from being lost, and to reduce the fluctuation of the oscillation frequency of the crystal element 120.

(Second modification)
Hereinafter, the quartz crystal device according to the second modification of the present embodiment will be described. Of the quartz crystal device according to the second modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals and description thereof is omitted as appropriate. As shown in FIG. 6, the crystal device according to the second modification example of the present embodiment is different from the first modification example of the present embodiment in that the crystal element 220 has a dual-support structure.

  As shown in FIG. 6, the crystal element 220 has a structure in which the excitation electrode 222 and the extraction electrode 223 are attached to the upper surface and the lower surface of the crystal base plate 221, respectively. The excitation electrode 222 is formed by depositing and forming a metal in a predetermined pattern on the upper and lower surfaces of the quartz base plate 221. The excitation electrode 222 includes a first excitation electrode 222a on the upper surface and a second excitation electrode 222b on the lower surface. The extraction electrode 223 extends from the excitation electrode 222 toward the opposite sides of the crystal base plate 221. The extraction electrode 223 includes a first extraction electrode 223a on the upper surface and a second extraction electrode 223b on the lower surface. The first extraction electrode 223 a is extracted from the first excitation electrode 222 a and is provided so as to extend toward one side of the crystal base plate 221. The second extraction electrode 223 b is extracted from the second excitation electrode 222 b and is provided so as to extend toward the other side of the crystal base plate 221. In addition, such a crystal element 220 is fixed on the substrate 210 by a both-end support structure that is supported at a position located diagonally of the crystal base plate 221. In this case, the first electrode pad 211 a is used for reducing the contact between the outer peripheral edge of the crystal element 220 and the substrate 210.

  A method for bonding the crystal element 220 to the substrate 210 will be described. First, the conductive adhesive 140 is applied onto the second electrode pad 211b and the third electrode pad 211c by, for example, a dispenser. The crystal element 220 is transported on the conductive adhesive 140 and placed on the conductive adhesive 140. The conductive adhesive 140 is cured and contracted by being heated and cured. The crystal element 220 is bonded to the electrode pad 211. That is, the first lead electrode 223a of the crystal element 220 is joined to the second electrode pad 211b, and the second lead electrode 223b is joined to the third electrode pad 211c. As a result, the second external terminal 212b and the fourth external terminal 212d are electrically connected to the crystal element 220.

  In the crystal device according to the second modification of the present embodiment, the crystal element 220 includes a rectangular crystal element plate 221, excitation electrodes 222 provided on the upper and lower surfaces of the crystal element plate 221, and excitation electrodes 222. A pair of lead electrodes 223 provided so as to extend toward opposite sides of the quartz base plate 221, and one of the pair of lead electrodes 223 and the second electrode pad 211b are electrically connected to each other. The other of the pair of lead electrodes 223 and the third electrode pad 211c are electrically connected. By doing so, even if the first lead electrode 223a and the second lead electrode 223b of the crystal element 220 are tilted around the place where the second electrode pad 211b and the third electrode pad 211c are joined, the crystal One corner where the element 220 is not bonded is in contact with the first electrode pad 211a and the other corner is separated from the substrate 210, so that the corner where the crystal element 220 is not bonded is in contact with the upper surface of the substrate 210. Can be suppressed. If a drop test or the like is performed in a state where the unjoined corner of the crystal element 220 is in contact with the substrate 210, the unjoined corner of the crystal element 220 may be lost. By doing so, it is possible to reduce the fluctuation of the oscillation frequency of the crystal element 220 while suppressing the corner of the crystal element 220 from being lost.

(Third modification)
Hereinafter, the quartz crystal device according to the third modification of the present embodiment will be described. Note that, in the quartz crystal device according to the third modification of the present embodiment, the same parts as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In the crystal device according to the third modification of the present embodiment, as illustrated in FIG. 7, the electrode pad 311 has a rectangular shape, and the electrode pad 311 is provided with a chamfered portion 317 in plan view. However, this embodiment is different from the present embodiment.

  The chamfered portion 317 is linearly provided at a corner facing the excitation electrode 122 side so as to cross from one side of the electrode pad 311 to one side adjacent to the one side. In this way, even if the electrode pad 311 is enlarged, a sufficient distance can be secured between the excitation electrode 122 and the electrode pad 311, so that the contact between the excitation electrode 122 and the electrode pad 311 is prevented. Can be reduced.

  The electrode pad 311 has a shape provided along the substrate 310. Here, taking the case where the long side dimension of the substrate 310 in plan view is 1.2 to 2.5 mm and the short side dimension is 1.0 to 2.0 mm, the electrode pad 311 is taken as an example. Explain the size of. The long side length of the electrode pad 311 is 0.40 to 0.90 mm, and the short side length is 0.30 to 0.60 mm. The chamfered portion 317 is obtained by removing the corners of the rectangular electrode pad 311 in a triangular shape, and the dimension parallel to the vertical dimension when the electrode pad 311 is viewed in plan is 0.05 to 0.15 mm. Yes, and the horizontal dimension when viewed in plan is 0.05 to 0.15 mm. Further, the electrode pad 311 provided with the chamfered portion 317 is formed to have an area of 97 to 99% as compared with the rectangular electrode pad 311.

  In the quartz crystal device according to the third modification of the present embodiment, the first electrode pad 311a and the second electrode pad 311b are rectangular, and the first electrode pad 311a, the second electrode pad 311b, and the third electrode are viewed in plan view. A chamfered portion 317 is provided at a corner of the electrode pad 311c. By doing so, a sufficient distance can be secured between the excitation electrode 122 and the first electrode pad 311a and the second electrode pad 311b, so that the excitation electrode 122, the first electrode pad 311a, and Contact with the second electrode pad 311b can be reduced.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

  Although the case where the crystal element for AT is used has been described as the crystal element, a tuning fork type bending crystal element having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base may be used. I do not care.

  In the above embodiment, the case where the bonding member 150 is provided on the lower surface of the sealing frame portion 130b of the sealing lid 130 has been described. However, the bonding member 150 is provided annularly on the outer peripheral edge of the upper surface of the substrate 110. It doesn't matter. Such a joining member 150 is provided, for example, by applying a glass frit paste along the outer peripheral edge of the substrate 110 by a screen printing method and drying it.

110, 210, 310 ... Substrate 111, 211, 311 ... Electrode pad 112, 212, 312 ... External terminal 113, 213, 313 ... Wiring pattern 114, 214, 314 ... Via conductor 115 215, 315 ... connection pattern 116 ... electrode pattern 216 ... chamfered portion 120 ... crystal element 121 ... crystal base plate 122 ... excitation electrode 123 ... extraction electrode 130 ... -Sealing lid 131 ... Sealing base part 132 ... Sealing frame part 140 ... Conductive adhesive 150 ... Joining member K ... Storage space

Claims (4)

A substrate,
An electrode pad provided on the upper surface of the substrate;
An external terminal provided on the lower surface of the substrate;
A wiring pattern provided on the upper surface of the substrate and electrically connected to the electrode pad;
A connection pattern provided on the lower surface of the substrate and electrically connected to the external terminal;
A via conductor provided on the substrate for electrically connecting the wiring pattern and the connection pattern;
A crystal element mounted on the electrode pad;
In order to hermetically seal the crystal element, a sealing lid provided on the upper surface of the substrate;
A bonding member provided between the upper surface of the substrate and the lower surface of the sealing lid,
The bonding device is provided in a position overlapping the via conductor in plan view. The crystal device according to claim 1,
A crystal device comprising: an electrode pattern provided on an upper surface of the substrate and provided at a position overlapping the crystal element in plan view. The crystal device according to claim 1,
The electrode pad is composed of a first electrode pad, a second electrode pad and a third electrode pad,
The crystal device, wherein the first electrode pad is electrically connected to the third electrode pad. The quartz crystal device according to claim 1, wherein
The electrode pad has a rectangular shape,
A crystal device, wherein a chamfered portion is provided at a corner of the electrode pad in plan view.

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