JP2016103753A - Crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device that reduces a variation in oscillatory frequency of a crystal element.SOLUTION: A crystal device includes: a rectangular substrate 110a; a pair of rectangular electrode pads 111 that are provided on the top face of the substrate 110a; convex parts 113 that have a triangular shape in plan view and are provided on the pair of electrode pads 111; a conductive adhesive that is provided across the electrode pads 111 to the convex parts 113; a crystal element 120 that is mounted on the electrode pad 111 via the conductive adhesive; and a lid body 130 for hermetically sealing the crystal element 120. The convex parts 113 are provided along the outer periphery on the electrode pad 111 having one side directed to the center side of the substrate 110a in plan view, and are provided along the outer periphery on the electrode pad 111 having one side connected to said one side directed to the outer periphery side of the substrate 110a.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  A quartz crystal device uses a piezoelectric effect of a quartz crystal element to cause a thickness-shear vibration so that both surfaces of a quartz base plate are shifted from each other, thereby generating a specific frequency. A crystal device including a crystal element mounted on an electrode pad provided on a substrate via a conductive adhesive has been proposed (for example, see Patent Document 1 below). The crystal element has excitation electrodes on both main surfaces of the crystal base plate, one end of the crystal element is a fixed end connected to the upper surface of the substrate, and the other end is a free end spaced from the upper surface of the substrate. Cantilevered support structure.

JP 2002-111435 A

  The above-described quartz device is remarkably miniaturized, but the quartz element mounted on the substrate is also downsized. When a conductive adhesive is applied on a conventional electrode pad and the crystal element is placed on the upper surface of the conductive adhesive, the free end of the crystal element or the excitation electrode may come into contact with the substrate. When the free end of the crystal element or the excitation electrode is in contact with the substrate, the thickness-shear vibration of the crystal element is hindered and the oscillation frequency of the crystal element may fluctuate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal device capable of reducing fluctuations in the oscillation frequency of a crystal element.

  A quartz crystal device according to an aspect of the present invention includes a rectangular substrate, a pair of rectangular electrode pads provided on the upper surface of the substrate, and a triangular shape in plan view, and is formed on the pair of electrode pads. The convex part provided, the conductive adhesive provided so as to straddle the convex part from the electrode pad, the crystal element mounted on the electrode pad via the conductive adhesive, and the crystal element are hermetically sealed And a lid for stopping.

  A quartz crystal device according to an aspect of the present invention includes a rectangular substrate, a pair of rectangular electrode pads provided on the upper surface of the substrate, and a triangular shape in plan view, and is formed on the pair of electrode pads. The convex part provided, the conductive adhesive provided so as to straddle the convex part from the electrode pad, the crystal element mounted on the electrode pad via the conductive adhesive, and the crystal element are hermetically sealed A convex body, and the convex portion is provided along an outer peripheral edge on the electrode pad whose one side faces the center side of the substrate when viewed in plan, and is connected to the one side. One side is provided along the outer peripheral edge on the electrode pad facing the outer peripheral edge of the substrate. By doing so, the crystal device is pulled downward on the fixed end side of the crystal element when the conductive adhesive is cured and contracted, and the free end of the crystal element is directed upward by the principle of the insulator with the convex portion as a fulcrum. Float up. In addition, when the fixed end side of the crystal element is pulled downward during the curing shrinkage of the conductive adhesive, the projection and the lead electrode on the outer peripheral edge of the crystal element come into contact with each other, and the fixed end of the crystal element It can suppress that the free end of a crystal element contacts a cover body, suppressing that the side approaches a board | substrate side rather than a convex part. Therefore, it is possible to reduce the inhibition of the thickness-shear vibration of the crystal element, so that the oscillation frequency of the crystal element can be stably output.

It is a disassembled perspective view which shows the crystal device in this embodiment. It is sectional drawing in AA of the quartz crystal device shown by FIG. (A) It is a top view which shows the state which removed the cover of the crystal device in this embodiment, (b) It is a top view which shows the state which removed the cover and crystal element of the crystal device in this embodiment. It is sectional drawing which shows the crystal device in the 1st modification of this embodiment.

  As shown in FIGS. 1 to 3, the crystal device according to the present embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and a lid 130 bonded to the upper surface of the package 110. Is included. The package 110 has a recess K surrounded by the upper surface of the substrate 110a and the inner surface of the frame 110b. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape and functions as a mounting member for mounting the crystal element 120 mounted on the upper surface. A pair of electrode pads 111 for bonding the crystal element 120 are provided on the upper surface of the substrate 110a. The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. A wiring pattern (not shown) and via conductors (not shown) for electrically connecting the electrode pads 111 provided on the upper surface and the external terminals 112 provided on the lower surface of the substrate 110a are provided on and inside the substrate 110a. (Not shown) is provided.

  The frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the recess K on the upper surface of the substrate 110a. The frame 110b is made of a ceramic material such as alumina ceramics or glass-ceramics, and is formed integrally with the substrate 110a.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the dimension of the package 110 in the vertical direction is 0.2 to 1.5 mm. The size of K will be described. The length of the long side of the recess K is 0.7 to 2.0. mm, and the length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the recessed part K is 0.1-0.5 mm.

  In addition, external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. Two of the external terminals 112 are electrically connected to an electrode pad 111 provided on the upper surface of the substrate 110a. The external terminals 112 that are electrically connected to the electrode pads 111 are provided so as to be located diagonally on the lower surface of the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. The electrode pad 111 is electrically connected to an external terminal 112 provided on the lower surface of the substrate 110a through a wiring pattern (not shown) and a via conductor (not shown) provided on the substrate 110a.

  On the pair of electrode pads 111, a pair of convex portions 113 having a triangular shape in plan view are provided. In addition, the pair of convex portions 113 is provided along the outer peripheral edge on the electrode pad 111 whose one side faces the center side of the substrate 110a when seen in a plan view, and the other side connected to the one side. Is provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral edge of the substrate 110a.

  The convex 113 is for suppressing the vertical inclination of the short side of the crystal element 120 and suppressing the end of the long side of the crystal element 120 from coming into contact with the substrate 110 a and the lid 130. Moreover, the convex part 113 is for suppressing that the free end of the crystal | crystallization element 120 contacts the board | substrate 110a. A pair of convex part 113 is comprised by the 1st convex part 113a and the 2nd convex part 113b. The first convex portion 113a is provided on the upper surface of the first electrode pad 111a, and the second convex portion 113b is provided on the upper surface of the second electrode pad 111b. Similarly to the electrode pad 111, the convex 113 is provided by applying gold plating or nickel plating on the upper surface of a sintered body of metal powder such as tungsten, molybdenum, copper, silver, or silver palladium.

  Also, one side of the pair of convex portions 113 facing the center side of the substrate 110a is provided so as to be aligned on the same straight line as shown in FIG. In this way, when the extraction electrode 123 of the crystal element 120 is mounted on the electrode pad 111 while being in contact with the pair of convex portions 113, the crystal element 120 can be mounted in a stable state without being inclined.

  Further, the convex portion 113 is provided at a position facing the extraction electrode 123 on the outer peripheral edge of the crystal element 120. By doing so, when the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive, even if the crystal element 120 is inclined, the lead electrode 123 comes into contact with the convex portion 113. The quartz crystal element 120 can be mounted in a stable state without being inclined downward from the convex portion 113. Further, the convex portion 113 is provided at a position overlapping the extraction electrode 123 on the outer peripheral edge on the fixed end side of the crystal element plate 121 in plan view. By doing in this way, it can reduce that the fixed end of crystal element 120 contacts the upper surface of substrate 110a.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the vertical dimension of the package 110 is 0.7 to 1.5 mm as an example. The size of the pad 111 and the convex portion 113 will be described. The side length of the electrode pad 111 is 250 to 400 μm. The length of the thickness of the electrode pad 111 in the vertical direction is 10 to 50 μm. The length of the side of the triangular projection 113 formed along the outer peripheral edge of the electrode pad 111 is 200 to 400 μm. The length of the thickness of the convex portion 113 in the vertical direction is 7 to 30 μm.

  Further, when one side connected to one side of the convex portion 113 is not provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral edge side of the substrate 110, the electrode pad 111 extends in the direction of the outer peripheral edge of the substrate 110 a. As a result, the conductive adhesive 140 spreads. Therefore, compared with the case where the convex portion 113 is formed with the concave portion on the substrate 110a, the conductive adhesive 140 is formed on the outside of the substrate 110 while suppressing the crystal element 120 from being higher than the substrate 110a and contacting the substrate 110a. Since spreading toward the peripheral edge is suppressed, the force by which the fixed end side of the crystal element 120 is pulled toward the outer peripheral edge of the substrate 110a can be reduced. By doing in this way, it can suppress that the free end side of the crystal element 120 floats too much, and it can reduce that the free end of the crystal element 120 contacts the cover body 130, and the oscillation frequency of the crystal element 120 fluctuates. . Further, since the convex portion 113 is provided on the electrode pad 111, the conductive adhesive 140 does not flow so as to climb over the convex portion 113 toward the center side of the substrate 110a. Contact with the excitation electrode 122 of the crystal element 120 can be reduced.

  In addition, the arithmetic average surface roughness of the electrode pad 111 is 0.02 to 0.10 μm, and the arithmetic average surface roughness of the surface of the substrate 110a is 0.5 to 1.5 μm. Therefore, the conductive adhesive 140 spreads in the direction of the adjacent electrode pad 111 where the convex 113 on the electrode pad 111 is not provided. It becomes difficult to spread on the board | substrate 110a from.

  The sealing conductor pattern 114 plays a role of improving the wettability of the sealing member 131 when it is bonded to the lid 130 via the sealing member 131. The sealing conductor pattern 114 is formed to have a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten, molybdenum, or the like, in a form surrounding the upper surface of the frame 110b in an annular shape. Has been.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The conductive adhesive 140 is formed so as to spread on the electrode pad 111 so as to overlap the oblique side of the convex portion 113 in plan view, and is disposed so as to be spaced from the excitation electrode 122 of the crystal element 120. In the quartz crystal device, the conductive adhesive 140 and the excitation electrode 122 are arranged with a space therebetween, so that a short circuit caused by the conductive adhesive 140 adhering to the excitation electrode 122 can be reduced. .

  Further, by using a conductive adhesive 140 having a viscosity of 35 to 45 Pa · s, the conductive adhesive 140 does not flow from the electrode pad 111 to the upper surface of the substrate 110a when applied. Since it remains on the pad 111, the thickness of the conductive adhesive 140 in the vertical direction can also be secured. The length of the thickness of the conductive adhesive 140 in the vertical direction is 10 to 25 μm. By ensuring the thickness of the conductive adhesive 140 in this way, even if an impact applied by dropping or the like is applied to the quartz crystal element 120 in the vertical direction around the conductive adhesive 140, the impact is made conductive. The adhesive 140 can sufficiently absorb and relax the absorption.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, a predetermined portion of the conductor pattern, specifically, a pair of electrode pads 111 or external terminals 112, a portion that becomes the first convex portion 113a and the second convex portion 113b is manufactured by performing nickel plating or gold plating. The Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIGS. 2 and 3A, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2, the quartz crystal element 120 has the excitation electrode 122 and the extraction electrode 123 attached to the upper and lower surfaces of the quartz base plate 121, as shown in FIGS. 1 and 2. It has the structure made. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the crystal base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  As shown in FIG. 3A, the first lead electrode 123a of the crystal element 120 is in contact with the first convex portion 113a, and the second lead electrode 123b of the crystal element 120 is in contact with the second convex portion 113b. In contact. As described above, when the crystal element 120 is mounted on the electrode pad 111 by bringing the lead electrode 123 of the crystal element 120 into contact with the convex portion 113, the mounting position of the crystal element 120 is shifted and the mounting angle is inclined. The long-side end of the crystal element 120 is supported by being in contact with the convex 113, the inclination of the short-side of the crystal element 120 is suppressed, and the long-side end of the crystal element 120 is attached to the substrate 110 a or the lid 130. Contact can be prevented. Therefore, fluctuations in the oscillation frequency of the crystal element 120 are prevented, and productivity can be improved.

  As shown in FIG. 3A, the outer peripheral edge of the quartz base plate 121 on the fixed end side is provided so as to be parallel to one side of the substrate 110 a and to overlap the convex portion 113 in plan view. ing. By doing so, the mounting position of the crystal element 120 can be made visually easier to understand, and the productivity of the crystal device can be improved. Moreover, by doing in this way, it can reduce that the frame 110b of the package 110 contacts the outer periphery of the crystal element 120, and it becomes possible to prevent the crystal element 120 from being chipped.

  In addition, since the extraction electrode 123 of the crystal element 120 comes into contact with the convex portion 113, it is possible to reduce the contact of the outer peripheral edge of the crystal element 120 on the fixed end side with the upper surface of the substrate 110a. Accordingly, the crystal element 120 can be prevented from being chipped when the outer peripheral edge of the crystal element 120 on the fixed end side contacts the substrate 110a. Further, even if the crystal element 120 is tilted during mounting, the extraction electrode 123 of the crystal element 120 comes into contact with the convex portion 113, so that the fixed end side of the crystal element 120 has a distance corresponding to the vertical thickness of the convex portion 113. Since the free end of the crystal element 120 does not float too much, the free end of the crystal element 120 can be prevented from coming into contact with the lid 130.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. Then, the quartz crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the quartz base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied so as to spread on the electrode pad 111 by, for example, a dispenser. The crystal element 120 is conveyed onto the conductive adhesive 140. Further, the crystal element 120 is placed on the conductive adhesive 140 such that the lead-out electrode 123 on the outer peripheral edge on the fixed end side of the crystal element 120 overlaps the convex portion 113 in plan view. The conductive adhesive 140 is cured and contracted by being heated and cured. In the crystal element 120, when the conductive adhesive 140 is cured and contracted, the fixed end side of the crystal element 120 is pulled downward, and the principle of the insulator using the second convex portion 113 as a fulcrum works. It joins to a pair of electrode pad 111 so that the free end side of 120 may float up. Further, when the fixed end side of the crystal element 120 is pulled downward when the conductive adhesive 140 is cured and contracted, the electrode pad 111 is in a state where the protruding portion 113 and the extraction electrode 123 on the outer peripheral edge of the crystal element 120 are in contact with each other. To be joined.

  The lid body 130 has a rectangular shape, and is for hermetically sealing the concave portion K in a vacuum state or the concave portion K filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the upper surface of the joining member 150 provided on the frame 110b in a predetermined atmosphere. When heat is applied to the bonding member 150 provided on the upper surface of the frame 110b, the bonding is performed. The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example.

  The sealing member 131 is provided at a location of the lid body 130 facing the sealing conductor pattern 114 provided on the upper surface of the frame 110 b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  For example, when the joining member 150 is gold tin, the thickness of the layer of the joining member 150 is 10 to 40 μm. For example, the component ratio is 70 to 80% for gold and 20 to 30% for tin. May be used. For example, when the joining member 150 is silver brazing, the thickness of the layer of the joining member 150 is 10 to 40 μm. For example, the component ratio is 70 to 80% for silver and 20 to 30% for copper. May be used.

  The quartz crystal device according to the present embodiment includes a rectangular substrate 110a, a pair of rectangular electrode pads 111 provided on the upper surface of the substrate 110a, and a triangular shape in plan view, and is formed on the pair of electrode pads 111. , A conductive adhesive 140 provided so as to straddle the convex 113 from above the electrode pad 111, and a crystal element mounted on the electrode pad 111 via the conductive adhesive 140 120 and a lid 130 for hermetically sealing the quartz crystal element 120, and the convex portion is along the outer peripheral edge on the electrode pad 111 with one side thereof facing the center side of the substrate 110a when viewed in plan. One side connected to the one side is provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral side of the substrate 110a. By doing so, the crystal device is freed of the crystal element 120 by the principle of the lever with the convex portion 113 as a fulcrum, while the fixed end side of the crystal element 120 is pulled downward when the conductive adhesive 140 is cured and contracted. The edge rises upward. Further, when the fixed end side of the crystal element 120 is pulled downward during the curing shrinkage of the conductive adhesive 140, the convex portion 113 and the extraction electrode 123 on the outer peripheral edge of the crystal element 120 come into contact with each other. It is possible to suppress the free end of the crystal element 120 from coming into contact with the lid 130 while suppressing the fixed end side of the crystal element 120 from approaching the substrate 110a side relative to the convex portion 113. Therefore, it is possible to reduce the inhibition of the thickness-shear vibration of the crystal element 120, so that the oscillation frequency of the crystal element 120 can be output stably.

  Further, when the fixed end side of the crystal element 120 is pulled downward when the conductive adhesive 140 is cured and contracted, the projection 113 and the extraction electrode 123 on the outer peripheral edge of the crystal element 120 come into contact with each other. In addition, it is possible to suppress the free end of the crystal element 120 from coming into contact with the lid 130 while suppressing the fixed end side of the crystal element 120 from being closer to the substrate 110a side than the convex portion 113. Therefore, the quartz crystal device can reduce the contact of the free end of the quartz crystal element 120 to the lid 130 while reducing the free end of the quartz crystal element 120 and the excitation electrode 122 from contacting the substrate 110a. By doing so, the quartz crystal device can stably output the oscillation frequency because the thickness shear vibration of the quartz crystal element 120 is not inhibited.

  In the crystal device according to the present embodiment, the conductive adhesive 140 is provided so as to straddle the oblique side of the convex portion 113 from the electrode pad 111. By doing so, the conductive adhesive 140 between the excitation electrode 122 of the crystal element 120 and the convex 113 is less than half, so that when the conductive adhesive 140 is cured and contracted, the free end of the crystal element 120 Since the pulling force toward the direction becomes weak, the principle of the insulator by the convex portion 113 works, and the free end side of the crystal element 120 can be prevented from contacting the substrate 110a. Therefore, fluctuations in the oscillation frequency of the crystal element 120 caused by the crystal element 120 coming into contact with the substrate 110a can be reduced, and a stable oscillation frequency can be output. Further, the conductive adhesive 40 between the excitation electrode 122 and the projection 113 of the crystal element 120 is less than half, but a necessary amount of conductivity is provided between the crystal element 120 and the electrode pad 111. Since the adhesive 140 is applied, the strength necessary for mechanical connection of the crystal element 120 can be maintained.

  Further, the quartz crystal device in the present embodiment is provided such that one side of the pair of convex portions 113 facing the center side of the substrate 110a is aligned on the same straight line. In this way, when the extraction electrode 123 of the crystal element 120 is mounted on the electrode pad 111 while being in contact with the pair of convex portions 113, the crystal element 120 can be mounted in a stable state without being inclined.

(First modification)
Hereinafter, the crystal device according to the first modification of the present embodiment will be described. Note that, in the quartz crystal device according to the first modification of the present embodiment, the same portions as those of the quartz crystal device described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. In the quartz crystal device according to the first modification of the present embodiment, as shown in FIG. 4, the vertical thickness of the convex portion 213 decreases from the center side of the substrate 210a toward the short side of the substrate 210a. This is different from the present embodiment.

  In the quartz crystal device according to the first modification of the present embodiment, the thickness of the convex portion 213 in the vertical direction is thinner from the center side of the substrate 210a toward the short side of the substrate 210a. Here, the size of the convex portion 213 will be described by taking as an example a case where the dimension of one side when the package 210 is viewed in plan is 1.0 to 2.5 mm. The length of the thickness in the up-down direction at the portion corresponding to one side of the convex portion 213 facing the center side of the substrate 210 is 7 to 30 μm. The length of the thickness in the vertical direction of the convex portion 213 at a portion from one side facing the center side of the substrate 210 toward the outer peripheral edge of the substrate 210a is 5 to 20 μm.

  In the quartz crystal device according to the first modification of the present embodiment, the thickness of the convex portion 213 in the vertical direction is reduced from the center side of the substrate 210a toward the short side of the substrate 210a. When the crystal element 120 is hardened and contracted, the fixed end side of the crystal element 120 is pulled downward, and the principle of the insulator using the convex portion 213 as a fulcrum further works, so that the free end of the crystal element 120 can be further floated. Therefore, the quartz crystal device reduces the contact between the free end of the quartz crystal element 120 and the excitation electrode 122 with the substrate 210a, and the thickness shear vibration of the quartz crystal element 120 is not hindered. Can be output.

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described. However, after the crystal element is mounted on the substrate, the lid having the sealing frame provided on the lower surface of the sealing base is provided. The quartz element may be hermetically sealed. The lid is composed of a rectangular sealing base and a sealing frame portion provided along the outer peripheral edge of the lower surface of the sealing base. The lower surface of the sealing base and the inner side of the sealing frame portion An accommodation space is formed with the side surface. The sealing frame portion is for forming an accommodation space on the lower surface of the sealing base. The sealing frame part is provided along the outer edge of the lower surface of the sealing base.

  In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described. However, after mounting the crystal element on the substrate, the crystal element is mounted using the lid having the wall portion provided on the lower surface. The structure may be hermetically sealed.

  In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used. The crystal element includes a crystal piece, an excitation electrode provided on the surface of the crystal piece, an extraction electrode, and a metal film for frequency adjustment. The crystal piece includes a crystal base portion and a crystal vibration portion, and the crystal vibration portion includes a first crystal vibration portion and a second crystal vibration portion. The crystal base has an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis as the crystal axis direction, within a range of −5 ° to + 5 ° around the X axis. This is a flat plate having a substantially rectangular shape in a plan view in which the direction of the rotated Z ′ axis is the thickness direction. The first crystal vibrating part and the second crystal vibrating part are extended in parallel with the Y′-axis direction from one side of the crystal base part. Such a crystal piece has a tuning fork shape in which a crystal base and each crystal vibration part are integrated, and is manufactured by a photolithography technique and a chemical etching technique.

  A bevel processing method for the crystal element 120 will be described. A polishing material provided with media and abrasive grains having a predetermined particle size and a quartz base plate 121 having a predetermined size are prepared. The abrasive prepared in the cylindrical body and the quartz base plate 121 are placed, and the open end of the cylindrical body is closed with a cover. The quartz base plate 121 that rotates the cylindrical body containing the abrasive and the quartz base plate 121 with the central axis of the cylindrical body as the rotation axis is polished with the abrasive and beveled.

110, 210: Package 110a, 210a ... Substrate 110b, 210b ... Frame body 111, 211 ... Electrode pad 112, 212 ... External terminal 113, 213 ... Projection 120 ... Crystal element 121... Crystal element plate 122... Excitation electrode 123... Extraction electrode 130 .. Lid 140 .. Conductive adhesive 150.

Claims (4)

A rectangular substrate;
A pair of electrode pads provided on the upper surface of the substrate and having a rectangular shape;
A convex shape provided on the pair of electrode pads, which is triangular in plan view,
A conductive adhesive provided so as to straddle the convex portion from the electrode pad;
A crystal element mounted on the electrode pad via the conductive adhesive;
A lid for hermetically sealing the crystal element,
The convex portion is provided along an outer peripheral edge on the electrode pad whose one side faces the center side of the substrate when viewed in plan.
One side connected with the said one side is provided along the outer periphery on the said electrode pad which faces the outer periphery side of the said board | substrate, The crystal device characterized by the above-mentioned. The crystal device according to claim 1,
The crystal device, wherein the conductive adhesive is provided so as to straddle the oblique side of the convex portion from the electrode pad. The crystal device according to claim 2,
A quartz crystal device, wherein one side of the pair of convex portions facing the center side of the substrate is arranged on the same straight line. The crystal device according to claim 1,
A quartz crystal device, wherein a thickness in a vertical direction of the convex portion is reduced from a center side of the substrate toward a short side of the substrate.

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