JP2016225957A - Ceramic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic package capable of coping with compaction and low profile of the package body, and in which a crystal vibrator to be mounted later comes into contact with a pillow preferentially, without coming into contact with the package body.SOLUTION: A ceramic package 1a includes a package body 2a composed of ceramic and having a front surface 3 and a back surface 4 of rectangular outer shape in the plan view, and four side faces 5 located between the front surface 3 and back surface 4, where the thickness between the front surface 3 and back surface 4 is 0.05-0.15 mm, a plurality of back connection terminals 6 formed at positions along a pair of side faces 5, on the back surface 4 of the package body 2a, a mounting terminal 7 formed on the front surface 3 of the package body 2a, and mounting a crystal vibrator 12, and a pillow 10a formed on the front surface 3 of the package body 2a. The pillow 10a is overlapping any back connection terminals 6 in the plan view.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a ceramic package for mounting a crystal resonator in a cavity on a package body.

  For example, in order to store quartz resonator pieces having different plane sizes in the same cavity, a pair of electrode pads disposed on one end side of the bottom surface of the cavity and a pillow portion disposed on the other end side of the bottom surface correspond to each other. There has been proposed a vibrating device provided with a package that can accommodate crystal vibrating pieces having different planar sizes by providing a plurality of stepped portions and selecting each stepped portion (see, for example, Patent Document 1).

However, when a plurality of step portions are formed along the thickness direction of the pair of electrode pads and pillow portions as in the vibrating device, the thickness of the package increases, so that the need for miniaturization is met. There is a problem that it becomes difficult.
Further, when the crystal resonator to be mounted in the cavity comes into contact with the surface wiring formed on the bottom surface of the cavity prior to the pillow portion provided on the bottom surface of the cavity, the characteristics of the crystal resonator are improved. In some cases, abnormalities could occur.

JP 2012-90083 (pages 1-14, FIGS. 1-8)

  The present invention solves the problems described in the background art, can cope with downsizing and low profile of a package body made of ceramic, and a pillow portion without being brought into contact with the package body without being contacted with the package body. It is an object of the present invention to provide a ceramic package that preferentially contacts a ceramic package.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention overlaps a pillow portion provided on the front surface of the package body on which the crystal resonator is mounted with any of a plurality of back surface connection terminals provided on the back surface of the package body in plan view. Inspired by the idea.
That is, the ceramic package of the present invention (Claim 1) is made of ceramic, has a rectangular front surface and a back surface, and four side surfaces located between the front surface and the back surface, and A package body having a thickness between the front surface and the back surface of 0.05 to 0.15 mm; and a plurality of back surface connection terminals formed at positions along a pair of opposing side surfaces on the back surface of the package body. A ceramic package formed on the surface of the package body and including a mounting terminal for mounting a crystal resonator, and a pillow portion formed on the surface of the package body, the pillow portion being a flat surface It overlaps with any one of the said back surface connection terminals in view.

According to this, the pillow part formed in the surface of the said package main body comparatively thin with a thickness of 0.05-0.15 mm is several about the thickness formed in the back surface of the package main body about 10 micrometers in planar view. Therefore, the following effects (1) to (3) can be obtained.
(1) The surface side of the package body that overlaps the back surface of the package body on which the back surface connection terminals are formed in a plan view is displaced upward by an amount corresponding to the thickness of the back surface connection terminals from the central portion side of the surface. Since the pillow portion positioned on the surface side that is displaced upward is similarly displaced upward, the pillow portion mounted on the pillow body without being brought into contact with the package main body is brought into contact with the pillow body. Preferential contact can be made.
(2) Since the plurality of back surface connection terminals are not formed in the central region in plan view on the back surface of the package body, the central region is not displaced upward. Accordingly, the central region side of the front surface of the package body that overlaps the back surface of the central region in plan view is not displaced upward. Accordingly, since there is a recess at least in the central region of the package body, the crystal oscillator to be mounted later can be easily assured without vibrating the surface of the package body. be able to.
(3) Combined with the effects (1) and (2), a ceramic package for mounting a crystal resonator can be a ceramic package having a package body that can be easily reduced in height and size as a whole. Become.

The ceramic is made of a high-temperature fired ceramic such as alumina, or a low-temperature fired ceramic such as glass-ceramic. In the former case, the conductor such as the back connection terminal is made of, for example, W or Mo, and an alloy based on one of them, and in the latter case, for example, Ag or Cu, or any one of these is used as the base. Made of an alloy or the like.
The package body includes a form composed of only a plate-shaped ceramic layer and a form in which a lower-layer plate-shaped ceramic layer and an upper-layer frame-shaped ceramic layer are laminated. However, in the case of the latter form, the thickness of the package body refers only to the plate-shaped ceramic layer on the lower layer side.
Furthermore, the thickness of the package main body is set to 0.05 to 0.15 mm because when it exceeds 0.15 mm, it becomes difficult to form dents described later on the front surface and the back surface. This is because it is difficult to manufacture and the strength tends to be insufficient.
The plurality of back surface connection terminals are formed on the peripheral side along each side surface of the back surface of the package body, and are not formed at least on the center side of the back surface.
Furthermore, the pillow part is made of any one of the metals such as W, Mo, Cu, and Ag, ceramics such as alumina or glass-ceramic, glass, or resin.
The ratio between the thickness of the metallized layer and the thickness of the package body is approximately in the range of 1: 5 to 1:15.
Further, the pillow section is exemplified by a single form having a rectangular shape, an oval shape, or an elliptical shape in a plan view, or a pair of forms having a square shape, a rectangular shape, or an oval shape in a plan view. Is done. In the former case, the middle along the long side direction is preferably located in the recess of the surface of the package body, and in the latter case, it is desirable that none of them is located in the recess.
In addition, one end side of the crystal resonator is bonded to the mounting terminal via a conductive adhesive, and, for example, bonding by brazing is performed.

The present invention also includes a ceramic package (Claim 2) in which a part of the pillow portion overlaps any one of the back surface connection terminals in a plan view.
According to this, the surface side of the package body that overlaps the back surface of the package body on which any one of the back surface connection terminals is formed is displaced upward by an amount corresponding to the thickness of the back surface connection terminal. The pillow (1) positioned on the surface side is also at the same level in the thickness direction, so that the effect (1) can be achieved.
The “any of the back surface connection terminals” refers to the whole of one back surface connection terminal, or a part of the back surface connection terminals, and a plurality of back surface connection terminals that are adjacent to each other. The form which is a part of each is also included.

Further, according to the present invention, the pillow portion and the mounting terminal form a metal frame having a rectangular frame shape in plan view formed along the periphery of the surface of the package body, or at least the uppermost layer of the package body. A ceramic package (Claim 3) formed on the bottom surface of the cavity surrounded by a rectangular frame-shaped ceramic layer in plan view is also included.
According to this, after mounting the crystal resonator on the mounting terminal, the metal lid is directly seam welded to the upper surface of the metal frame, or the brazing material layer is formed on the upper surface of the frame-shaped ceramic layer. By bonding the metal lid through the above, the crystal resonator can be reliably sealed from the outside, so that the operation of the crystal resonator can be guaranteed (effect (4)).
The bottom surface of the cavity is the surface of the package body in a form in which the cavity is surrounded by the metal frame, and the cavity is surrounded by an upper ceramic layer having a rectangular frame shape in plan view. In the embodiment, it is the surface of the lower ceramic layer constituting the package body.

In other words, in the present invention, a part of the recess located in at least the central region on the surface of the package body is provided between the back surface connection terminals adjacent to each other in the side view on the four side surfaces of the package body. An extended ceramic package may also be included.
In this case, for example, a back connection terminal is formed near each of the four corners on the back surface of the package body, and a pair of the four corners on the surface of the package body that overlaps with these back connection terminals in plan view. By forming the mounting terminal and the pair of pillow parts, or the single pillow part straddling the vicinity of the pair of mounting terminals and two adjacent corners, the effects (1) and (2) are achieved. Is possible.
The recess of the front surface of the package body is at a position where at least the back surface connection terminal formed on the back surface of the package body is not formed in a plan view, and a central region is rectangular in a plan view, and An extending portion extending from each of the four sides toward each side surface of the package body is provided.

In addition, according to the present invention, a process for preparing a green sheet having a front surface and a back surface, and a plurality of conductive pastes are provided along a pair of opposite sides on the back surface of the green sheet. Forming a plurality of unfired backside connection terminals formed at locations (for example, near the corners), and forming an unfired mounting terminal by forming a conductive paste on the surface of the green sheet; A step of forming a pillow portion that overlaps at least a part of the back surface connection terminal in a plan view on the surface of the green sheet; and the green sheet having the back surface connection terminal is formed on the front surface and the back surface. And a method of manufacturing the ceramic package, including a step of pressing along the thickness direction.
In this case, the package can be reliably manufactured.
In addition, when the said pillow part consists of metals, you may form this pillow part by screen printing simultaneously with the process of forming the said unbaking mounting terminal.

Further, in addition, in the present invention, after the step of pressing the green sheet, the step of firing the green sheet having the back surface connection terminal, the mounting terminal, and the pillow portion, and the step after the firing step, The method for producing the ceramic package may further include an electrolytic metal plating step of covering the surfaces of the back surface connection terminals and the metal pillow part element mounting terminals with metal (Ni and Au) plating films.
In this case, the package can be more reliably manufactured.

The top view which shows the ceramic package of 1 form by this invention. The bottom view of the said ceramic package. The perspective view by the vision from the diagonal upper direction of the package main body contained in the said ceramic package. The side (front) figure of the said ceramic package. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. FIG. 2 is a vertical sectional view taken along the line YY in FIG. 1. (A)-(F) are schematic which shows the manufacturing process of the said ceramic package. The side (front) figure which shows the ceramic package of a different form. (A) is a top view of the different form of the said package, (B) is the bottom view. (A) is a top view of the further different form of the said package, (B) is the bottom view. (A) is a top view of the different form of the said package, (B) is the bottom view.

Hereinafter, modes for carrying out the present invention will be described.
1 is a plan view showing a ceramic package 1a according to an embodiment of the present invention, FIG. 2 is a bottom view thereof, and FIG. 3 is a perspective view of a package main body 2a used in the package 1a as viewed from an oblique upper side. Is a side view of the package 1a, FIG. 5 is a vertical sectional view taken along the line XX in FIG. 1, and FIG. 6 is a vertical view taken along the line YY in FIG. It is sectional drawing.
As shown in the figure, the ceramic package 1a has a front surface 3 and a back surface 4 whose outer shape in a plan view is rectangular (rectangular), and four side surfaces 5 positioned between the front surface 3 and the back surface 4. 2a and the back surface 4 of the package body 2a, four (plural) back surface connection terminals 6 are formed along the opposing long and short sides and at positions near the corners on both ends of each side. A pair of mounting terminals 7 that are formed on one short side (left side in the drawing) side of the surface 3 of the package body 2a and for mounting a crystal resonator later, and the other of the surface 3 of the package body 2a. And a pillow portion 10a formed on the short side (right side in the figure).
The package body 2a has a thickness of 0.05 to 0.15 mm, and the back connection terminal 6 has a thickness of about 10 μm.
Further, in the package body 2a, a curved surface 5r having an arc shape in plan view is located between the adjacent side surfaces 5 and 5. However, the curved surface 5r may be omitted.

  The package body 2a is made of, for example, a high-temperature fired ceramic such as alumina. As shown in FIG. 3, the package body 2a has a substantially cross shape in plan view through a loose inclined surface 3b between the surfaces 3 positioned on the corner sides. A recess 3a having a shape is formed, and an upward shallow recess 4a having a rectangular shape in a bottom view is formed on the back surface 4 in the vicinity of each corner so as to sandwich a gentle inclined surface 4b. As will be described later, the recesses 3a and 4a are formed in the thickness direction after forming the unfired back surface connection terminals 6 near the respective corners on the back surface of the green sheet that will be the package body 2a later in manufacturing. This is because the upward displacement corresponding to the thickness of the four back surface connection terminals 6 occurs in the vicinity of the corners on the front surface and the back surface of the green sheet. Therefore, the depth of the recess 3a is equivalent to the thickness of the back surface connection terminal 6 at the deepest portion. Further, the recess 3a is gently depressed from the vicinity of the corner of the package body 2a toward the central region.

As shown in FIG. 1, the pair of mounting terminals 7 having a square (rectangular) shape in plan view are individually formed for each surface 3 slightly higher than the recess 3a. In other words, the mounting terminal 7 is not formed in the region where the recess 3a is formed.
Further, the pillow portion 10a having a rectangular (rectangular) shape in plan view is made of the same ceramic as alumina as described above, and only the vicinity of the center of the long side is formed in the region of the recess 3a, and both ends of the pillow portion 10a are formed. The side is individually formed for each surface 3 on the corner side. As shown in FIGS. 1 and 2, the pillow portion 10 a overlaps the two back surface connection terminals 6 individually at both ends in plan view. The overlapping ratio is about 40 to 70% in plan view area ratio. However, the area ratio is not applied when it is only necessary to be able to contact only near both ends of the side of the tip side of the crystal resonator to be mounted later.

As shown in FIGS. 1, 4, and 5, a metallized layer 11 having a rectangular frame shape in plan view is formed on the surface 3 of the package body 2 a along each side, and above the metallized layer 11. A metal frame 9 having a rectangular frame shape in plan view is joined through a brazing material layer 8 made of Ag brazing. The metal frame 9 is made of, for example, Kovar, and a cavity 3c having a bottom surface of the surface 3 including the recess 3a is formed inside thereof.
As shown in FIG. 4, the metallized layer 11 is also displaced downward in the vicinity of the center of each side along the recess 3a located on the surface 3 of the package body 2a. A relatively thick brazing material layer 8a having a thickness of about 20 to 25 μm is disposed above.
The back connection terminal 6, the mounting terminal 7, and the metallized layer 11 are made of, for example, W or Mo, or an alloy based on one of them.
Furthermore, the ratio between the thickness of the metallized layer 11 and the thickness of the package body 2a is approximately in the range of 1: 5 to 1:15.
In addition, the metal frame 9 may be made of 42 alloy, 194 alloy, or stainless steel.

Further, as shown in FIGS. 5 and 6, the crystal resonator 12 to be mounted is joined by joining the base end side to a pair of mounting terminals 7 formed on the surface 3 in the cavity 3 c. The tip side is approaching the pillow part 10a with a slight gap therebetween. Moreover, the crystal resonator 12 has an intermediate portion in the long side direction located above (directly above) the recess 3a slightly lower than the region of the surface 3 where the mounting terminals 7 are formed. Therefore, even if the thickness of the package body 2a is relatively thin, 0.05 to 0.15 mm, the required operation can be easily and reliably performed.
In addition, in order to seal the inside of the cavity 3c from the outside, a metal lid described later is joined to the upper surface of the metal frame 9 by seam welding.
According to the ceramic package 1a as described above, the effects (1) to (4) can be achieved.

Hereinafter, a method of manufacturing the package 1a will be described with reference to FIG.
A ceramic slurry is prepared in advance by mixing required amounts of alumina powder, a predetermined binder resin, a plasticizer, and a solvent, and the slurry is formed into a sheet by a doctor blade method, as shown in FIG. 7A. Thus, a single ceramic green sheet (hereinafter simply referred to as a green sheet) g having a front surface 3, a back surface 4, and a side surface 5 was prepared. In this case, two green sheets g may be prepared.
Next, through the one or two green sheets g, through holes having small diameters are provided at a plurality of locations, and a conductive paste containing W powder or Mo powder is sucked and filled in each through hole, so that a plurality of uncoated holes are obtained. A fired via conductor (not shown) was formed.

Next, as shown in FIG. 7B, a conductive paste similar to the above is screen-printed on the surface 3 of the green sheet g1, and a pair of mounting terminals 7 that are not fired and a plan view are shown. A rectangular frame-shaped metallization layer 11 was formed. Subsequently, screen printing similar to the above was performed on the vicinity of each corner on the back surface 4 of the green sheet g1 to form four unfired back surface connection terminals 6. The composition of the conductive base to be the back connection terminal 6 is slightly adjusted.
When the two green sheets g are prepared, an unfired internal wiring layer (not shown) is further formed on one of the front surface 3 and the back surface 4 and then laminated. And it crimped | bonded and it was set as the single green sheet laminated body.

Furthermore, as indicated by the white arrow in FIG. 7B, the green sheet g or the green sheet laminate is restrained on a surface plate and is perpendicular to the entire surface 3 from above through a rubber sheet or the like. Pressing (compression processing) was performed along the (thickness) direction.
As a result, as shown in FIG. 7C, a recess 3a having a substantially cross shape in a plan view is formed on the front surface 3 of the green sheet g. A recess 4 a having a rectangular shape in bottom view was formed so as to surround 6. The inclined surface 3b on the front surface 3 side is located closer to the center side of the green sheet g than the inclined surface 4b on the back surface 4 side in plan view.
Next, as shown in FIG. 7 (D), on the surface 3 of the green sheet g, on the short side away from the mounting terminal 7, the dent 3a located near the center in the front-rear direction in the figure is straddled. The same ceramic slurry as described above was screen-printed to form an unfired pillow portion 10a. In addition, you may form this pillow part 10a by using the ceramic paste containing an alumina powder using a squeegee.

Next, the green sheet g or green sheet laminate having the back surface connection terminal 6, the mounting terminal 7, the metallized layer 11, and the pillow portion 10a was simultaneously fired.
Further, the package body 2a having a thickness of 0.15 mm obtained by firing is immersed in an electrolytic Ni plating bath and an electrolytic Au plating bath in order, and the fired back surface connection terminal 6 and mounting terminal 7 exposed to the outside. The metallized layer 11 was coated with a metal plating layer (not shown) consisting of two layers, a Ni plating film and an Au plating film.
Then, as shown in FIG. 7E, a metal frame 9 is brazed (bonded) via a brazing material layer 8 above the metallized layer 11 on the surface 3 of the package body 2a to have a cavity 3c. The ceramic package 1a was obtained.

Subsequently, as shown in FIG. 7F, the base end side of the crystal resonator 12 is joined to the pair of mounting terminals 7, and then a metal lid 13 having a rectangular shape in plan view is placed on the upper surface of the metal frame 9. Then, the metal lid 13 was seam welded (joined) by individually rolling a pair of electrode rollers (not shown) along a pair of opposing sides on the four sides. As a result, a crystal resonator device (electronic component device) in which the crystal resonator 12 was sealed in the cavity 3c was obtained.
According to the manufacturing method as described above, the ceramic package 1a and the crystal resonator device can be reliably manufactured.
The pillow portion 10a may be made of the same metal as the mounting terminal 7 and the metallized layer 11, and in this case, it can be formed in the same process by screen printing simultaneously with the mounting terminal 7 and the like. .
Moreover, when the said pillow part 10a consists of glass, for example, a required glass paste is arrange | positioned in the said position after the said baking process.
Further, each of the steps can be performed in a multi-cavity form. In this case, in a large green sheet for taking a large number of pieces, a through hole is formed at the intersection of a pair of vertical and horizontal cutting lines adjacent to each other and the four product regions that will be the package body 2a later, The curved surface 5r and the curved conductor along the inner wall surface may be formed by applying a conductive paste to the inner wall surface of the through hole.

FIG. 8 is a vertical sectional view similar to the above showing a ceramic package 1b of a different form.
As shown in FIG. 8, the ceramic package 1b includes a ceramic layer c1 on the lower layer side same as the package body 2a, and an upper layer side having a rectangular frame shape in plan view laminated around the surface 3 of the ceramic layer c1. A package body 2b composed of the ceramic layer c2, four back surface connection terminals 6 formed for each recess 4a of the back surface 4 of the package body 2b, and the same mounting formed on the surface 3 of the package body 2b. The terminal 7 for pillows and the pillow part 10a are included. A metallized layer 15 having a rectangular frame shape in plan view is formed on almost the entire upper surface (uppermost surface) 14 of the upper ceramic layer c2. In the present embodiment, the thickness of the lower ceramic layer c1 is in the range of 0.05 to 0.15 mm.

Further, as shown in FIG. 8, when the base end side of the crystal resonator 12 is joined to the mounting terminal 7 later, the same as the above, on the upper surface of the metallized layer 15 through the same brazing material layer. The metal lid (13) is brazed (joined). In this case, the same recesses are located on the center side of each side of the upper surface 14 of the upper ceramic layer c2, but the brazing material layer is disposed slightly thicker above these recesses. The
The effects (1) to (4) can also be achieved by the ceramic package 1b as described above.

FIGS. 9A and 9B are a plan view and a bottom view showing a state in which a pillow 10b having a different form is applied to the package body 2b of the package 1b. In addition, you may apply this pillow part 10b to the package main body 2a of the said package 1a.
As shown in FIG. 9 (A), the pillow portion 10b has a pair of forms individually formed on the front surface 3 of each corner vicinity excluding the dent 3a in the package main body 2b. Are individually overlapped with the back surface connection terminals 6 of the above. The overlapping ratio is about 95 to 100% in plan view area ratio.
The effects (1) to (4) can also be achieved by the ceramic package 1b (1a) including the pillow portion 10b.

10A and 10B are a plan view and a bottom view showing the dent 3a and the back surface connection terminal 6a in different forms with respect to the package body 2b of the package 1b. The recess 3a and the back surface connection terminal 6a may also be applied to the package body 2a of the package 1a.
As shown in FIG. 10B, a single back connection terminal 6a having a rectangular bottom view is formed along the right short side of the back surface 4 of the package body 2b, and along the left short side. Thus, a pair of back surface connection terminals 6 similar to those described above are formed. Therefore, as shown in FIG. 10A, the surface 3 of the package body 2b is formed with a substantially T-shaped recess 3a in plan view, and the three surfaces 3 excluding the recess 3a are A pair of mounting terminals 7 and a single pillow portion 10a are individually formed. And the pillow part 10a has the outer side part of the long side direction overlapped with the back surface connection terminal 6a by planar view. The back surface 4 of the package body 2b has a substantially T shape when viewed from the bottom.
The effects (1) to (4) can also be achieved by the ceramic package 1b (1a) including the substantially T-shaped recess 3a and the back surface connection terminal 6a.

FIGS. 11A and 11B are a plan view and a bottom view showing the dent 3a and the back surface connection terminal 6b in a different form with respect to the package body 2b of the package 1b. The recess 3a and the back surface connection terminal 6b may also be applied to the package body 2a of the package 1a.
As shown in FIG. 11B, on the back surface 4 of the package body 2b, a plurality (three or four) of back surface connection terminals 6 and 6b are formed along the opposing long and short sides. That is, the back surface connection terminals 6 are arranged in the vicinity of each corner of the back surface 4, and one or two back surface connection terminals 6b are disposed between them, so that the back surface 4 is only on the center side. A dent 4a that is located and has a rectangular frame shape in the bottom view surrounds it. As a result, as shown in FIG. 11A, the surface 3 of the package body 2b is provided with a recess 3a having a rectangular shape in plan view only in the central region. Therefore, the pair of mounting terminals 7 and the pillow portion 10c made of W or Mo and having an oval shape in plan view are all formed on a single surface 3 at a position slightly higher than the recess 3a. . Moreover, the pillow portion 10c overlaps with the three (plural) back surface connection terminals 6 and 6b in plan view.
The effects (1) to (4) can also be achieved by the ceramic package 1b (1a) including the recess 3a and the back surface connection terminals 6 and 6b in the above form.

The present invention is not limited to the embodiments described above.
For example, the substrate bodies 2a and 2b may be made of a high-temperature fired ceramic such as mullite or aluminum nitride, or may be made of a low-temperature fired ceramic such as glass-ceramic. In the latter case, the back surface connection terminal 6, the mounting terminal 7, the metallized layer 11, and the metal pillow portion are made of, for example, Ag or Cu, or an alloy based on one of them.
The outer shapes of the front surface 3 and the back surface 4 of the substrate bodies 2a and 2b may be substantially square (rectangular) in plan view.
Furthermore, when surface wiring is formed on the surface 3 of the substrate bodies 2a and 2b, it is desirable to set the wiring position of the surface wiring as much as possible on the recess 3a.
The pillow portions 10a and 10b may also be made of metal.
In addition, the pillow part may be formed of three or more unit parts.

  ADVANTAGE OF THE INVENTION According to this invention, the ceramic package which can respond to size reduction and low distribution of the package body which consists of ceramics, and the crystal oscillator mounted later always contacts a pillow part preferentially can be provided easily. It becomes.

1a, 1b .... Ceramic package 2a, 2b ......... Package body 3 ........... Front side 3c .......... Cavity 4 ........... Back side 5 ............ Side surface 6, 6a, 6b ... Back connection terminal 7 ............... Mounting terminal 9 ............... Metal frame 10a-10c Pillow 12 ......... Quartz crystal c2 ......... ……… Ceramic layer

Claims (3)

It is made of ceramic and has a front and back surfaces having a rectangular outer shape in plan view, and four side surfaces located between the front and back surfaces, and a thickness between the front and back surfaces of 0.05 to A package body that is 0.15 mm;
A plurality of back surface connection terminals formed at positions along a pair of opposing side surfaces on the back surface of the package body;
A mounting terminal for mounting a crystal resonator formed on the surface of the package body;
A ceramic package including a pillow portion formed on the surface of the package body,
The pillow portion overlaps with any one of the back surface connection terminals in plan view,
A ceramic package characterized by that. A part of the pillow portion overlaps with any of the back surface connection terminals in plan view,
The ceramic package according to claim 1. The pillow part and the mounting terminal are a metal frame having a rectangular frame shape in plan view formed along the periphery of the surface of the package body, or a rectangular frame shape in plan view forming at least the uppermost layer of the package body. Formed on the bottom of the cavity surrounded by ceramic layers,
The ceramic package according to claim 1 or 2, wherein

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