JP2005101376A - Package for housing electronic part, and electronic apparatus - Google Patents

Package for housing electronic part, and electronic apparatus Download PDF

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Publication number
JP2005101376A
JP2005101376A JP2003334419A JP2003334419A JP2005101376A JP 2005101376 A JP2005101376 A JP 2005101376A JP 2003334419 A JP2003334419 A JP 2003334419A JP 2003334419 A JP2003334419 A JP 2003334419A JP 2005101376 A JP2005101376 A JP 2005101376A
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metal frame
electronic component
insulating substrate
package
electronic
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Japanese (ja)
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Yoshiaki Shimojo
義秋 下城
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic part which bonds rigidly a cover to a metal frame, is reduced in a profile size of an insulating substrate, and has excellent airtight sealing reliability, a small size and high reliability, and also to provide an electronic device. <P>SOLUTION: The package for housing the electronic part includes the insulating substrate 1 having a loading part 1a of the electronic part formed on an upper surface, and the metal frame 2 connected to surround the loading part 1a on an outer periphery of the upper surface of the insulating substrate 1. The metal frame 2 is formed of a collar part 2a at an upper end over the entire periphery. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子部品を搭載し収容するための電子部品収納用パッケージおよびそれを用いた電子装置に関するものである。   The present invention relates to an electronic component storage package for mounting and storing an electronic component, and an electronic apparatus using the same.

従来、圧電振動子や半導体素子等の電子部品は、これらの電子部品を気密に収容するための電子部品収納用パッケージ（以下、パッケージともいう）内に気密封止されて電子装置となり、携帯電話やコンピュータ等の各種電子機器の部品として使用される。   2. Description of the Related Art Conventionally, electronic components such as piezoelectric vibrators and semiconductor elements are hermetically sealed in an electronic component storage package (hereinafter also referred to as a package) for accommodating these electronic components in an airtight manner, thereby becoming an electronic device. Used as a part of various electronic devices such as computers.

このような電子部品を気密に収容するパッケージにおいて、最も信頼性の高いとされるものは、酸化アルミニウム質焼結体等のセラミックスから成り、上面の中央部に電子部品を収容し搭載するための凹部を有する絶縁基板と、絶縁基板の凹部内から外表面にかけて導出された複数の配線導体と、絶縁基板の上面に凹部を取り囲むように被着された枠状の封止用メタライズ層と、封止用メタライズ層にろう付けされた鉄−ニッケル−コバルト合金や鉄−ニッケル合金等から成る封止用の金属枠体と、金属枠体の上面にシーム溶接により接合される鉄−ニッケル合金や鉄−ニッケル−コバルト合金から成る蓋体とから構成されるタイプのものである。   In such a package for accommodating electronic components in an airtight manner, the most reliable one is made of ceramics such as an aluminum oxide sintered body, and is used for accommodating and mounting the electronic components in the center of the upper surface. An insulating substrate having a recess; a plurality of wiring conductors led out from the inside of the recess to the outer surface; a frame-like sealing metallization layer deposited on the upper surface of the insulating substrate so as to surround the recess; Metal frame for sealing made of iron-nickel-cobalt alloy or iron-nickel alloy brazed to the metallization layer for fastening, and iron-nickel alloy or iron joined to the upper surface of the metal frame by seam welding A type composed of a lid made of a nickel-cobalt alloy;

このタイプのパッケージの場合、絶縁基板の凹部内に電子部品を搭載し収容するとともに電子部品の電極とメタライズ配線導体とを電気的に接続した後、金属枠体に蓋体を載置し、この蓋体の外周縁にシーム溶接機の一対のローラー電極を接触させながら転動させるとともに、この一対のローラー電極間に溶接のための大電流を流し金属枠体と蓋体とを直接的にシーム溶接することによって、内部に電子部品が気密に収納された製品としての電子装置となる。この電子装置は、配線導体のうち絶縁基板の外表面に導出された部位を外部電気回路に接続することにより外部電気回路基板に実装されて使用される。
特開平７−３０００７号公報 特開平６−３１０６１４号公報 In the case of this type of package, the electronic component is mounted and accommodated in the recess of the insulating substrate, and the electrode of the electronic component and the metallized wiring conductor are electrically connected, and then the lid is placed on the metal frame. The pair of roller electrodes of the seam welding machine are rolled while being in contact with the outer peripheral edge of the lid, and a large current for welding is passed between the pair of roller electrodes to directly connect the metal frame and lid to the seam. By welding, it becomes an electronic device as a product in which electronic parts are stored in an airtight manner. This electronic device is used by being mounted on an external electric circuit board by connecting a portion of the wiring conductor led to the outer surface of the insulating substrate to the external electric circuit.
Japanese Patent Laid-Open No. 7-30007 JP-A-6-310614

近年、上記従来の電子装置を実装する外部電気回路基板は、電子機器の小型化の要求にともない、電子装置に加えてその他の容量素子や抵抗器等のいわゆる表面実装型の電子部品を高密度で実装する必要が生じている。そのため、電子装置用のパッケージは、外部電気回路基板の実装表面に占める占有面積を小さくするために、絶縁基板の外形寸法を極力小さくすることが求められている。   In recent years, external electric circuit boards on which the above-described conventional electronic devices are mounted have a high density of so-called surface mount type electronic components such as other capacitive elements and resistors in addition to the electronic devices in response to the demand for downsizing of electronic devices. Need to be implemented. Therefore, the package for an electronic device is required to reduce the outer dimension of the insulating substrate as much as possible in order to reduce the occupied area on the mounting surface of the external electric circuit board.

しかしながら、従来のパッケージおよび電子装置においては、金属枠体と蓋体とを溶接して強固に接合するために、金属枠体と蓋体との間の接合幅を確保する必要があり、金属枠体の上面の幅をあまり狭くすることができない。そのため、金属枠体が上面に接合される絶縁基板の外形寸法を小型化することが難しいという問題があった。   However, in the conventional package and electronic device, in order to weld and firmly join the metal frame body and the lid body, it is necessary to secure a joining width between the metal frame body and the lid body. The width of the upper surface of the body cannot be made too narrow. Therefore, there is a problem that it is difficult to reduce the outer dimension of the insulating substrate to which the metal frame is bonded to the upper surface.

本発明は、かかる従来の問題点に鑑みて完成されたものであり、その目的は、金属枠体に蓋体を強固に接合することができるとともに、絶縁基板の外形寸法を小型化することが可能な、気密封止の信頼性に優れた小型で高信頼性の電子部品収納用パッケージおよび電子装置を提供することにある。   The present invention has been completed in view of such conventional problems, and an object of the present invention is to firmly bond a lid to a metal frame and to reduce the external dimensions of an insulating substrate. An object of the present invention is to provide a small and highly reliable electronic component storage package and an electronic device which are excellent in reliability of hermetic sealing.

本発明の電子部品収納用パッケージは、上面に電子部品の搭載部が形成された絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を囲繞するように接合された金属枠体とを具備しており、該金属枠体は、上端に鍔部が全周にわたって形成されていることを特徴とするものである。   An electronic component storage package according to the present invention includes an insulating substrate having an electronic component mounting portion formed on an upper surface, and a metal frame bonded to the outer peripheral portion of the upper surface of the insulating substrate so as to surround the mounting portion. The metal frame body is characterized in that a collar portion is formed at the upper end over the entire circumference.

また本発明の電子部品収納用パッケージは、好ましくは、前記金属枠体は、前記鍔部よりも下側の外面が上端から下端に向かうに伴って内側に傾斜していることを特徴とするものである。   In the electronic component storage package of the present invention, it is preferable that the metal frame body is inclined inward as the outer surface below the flange portion moves from the upper end to the lower end. It is.

また本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記搭載部に搭載された電子部品と、前記金属枠体の上面に接合されて前記電子部品を気密封止する蓋体とを具備していることを特徴とするものである。   An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component mounted on the mounting portion, and a lid that is bonded to an upper surface of the metal frame and hermetically seals the electronic component. It is characterized by comprising.

本発明の電子部品収納用パッケージによれば、絶縁基板の上面に搭載部を囲繞するようにして接合された金属枠体は、上端に鍔部が全周にわたって形成されていることから、鍔部の分だけ上端で幅が広くなるため、蓋体を強固に接合するための幅を有効に確保することができる。また、蓋体を接合するための幅を鍔部により確保することができるため、下端部分の幅を広くする必要はなく、金属枠体が接合される絶縁基板を小型化することができる。   According to the electronic component storage package of the present invention, the metal frame joined so as to surround the mounting portion on the upper surface of the insulating substrate has the collar portion formed on the entire upper end. Therefore, the width becomes wider at the upper end, so that a width for firmly joining the lid can be effectively secured. Moreover, since the width | variety for joining a cover body can be ensured with a collar part, it is not necessary to widen the width | variety of a lower end part, and the insulated substrate to which a metal frame is joined can be reduced in size.

また本発明の電子部品収納用パッケージにおいて好ましくは、金属枠体は、鍔部よりも下側の外面が上端から下端に向かうに伴って内側に傾斜していることから、金属枠体の鍔部より下側の下端の外形寸法をより一層小さくすることができ、絶縁基板をより一層容易に小型化することができる。また、鍔部の下面が金属枠体の側面に対して一定の角度を成して斜めになっているので、鍔部の金属枠体に対する強度をより強くすることができ、蓋体の幅をより大きくして蓋体との接合幅をより有効に確保し、より気密封止の信頼性に優れた電子部品収納用パッケージを提供することができる。   In the electronic component storage package according to the present invention, preferably, the metal frame body is inclined inward as the outer surface on the lower side of the flange portion moves from the upper end to the lower end, so that the flange portion of the metal frame body The outer dimension of the lower end on the lower side can be further reduced, and the insulating substrate can be further reduced in size. In addition, since the lower surface of the collar portion is inclined with a certain angle with respect to the side surface of the metal frame body, the strength of the collar portion with respect to the metal frame body can be increased, and the width of the lid body can be increased. It is possible to provide an electronic component storage package that is larger in size and more effectively secures the bonding width with the lid body and is more excellent in hermetic sealing reliability.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、搭載部に搭載された電子部品と、金属枠体の上面に接合されて電子部品を気密封止する蓋体とを具備していることから、気密封止の信頼性に優れた小型で高信頼性のものとなる。   An electronic device of the present invention includes an electronic component storage package having the above-described configuration, an electronic component mounted on the mounting portion, and a lid that is bonded to the upper surface of the metal frame and hermetically seals the electronic component. Therefore, it is small and highly reliable with excellent reliability of hermetic sealing.

本発明の電子部品収納用パッケージおよび電子装置を添付の図面を基に説明する。図１は本発明のパッケージおよび電子装置９の実施の形態の一例を示す断面図である。図１において、１は絶縁基板、２は金属枠体である。これらの絶縁基板１および金属枠体２とにより主にパッケージが構成される。また、絶縁基板１の上面の搭載部１ａに電子部品３を搭載するとともに、金属枠体２の上面に蓋体４を接合して電子部品３を気密封止することにより電子装置が構成される。   An electronic component storage package and an electronic device according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a sectional view showing an example of an embodiment of a package and an electronic device 9 according to the present invention. In FIG. 1, 1 is an insulating substrate and 2 is a metal frame. These insulating substrate 1 and metal frame 2 mainly constitute a package. In addition, the electronic component 3 is mounted on the mounting portion 1a on the upper surface of the insulating substrate 1, and the electronic device 3 is hermetically sealed by bonding the lid 4 to the upper surface of the metal frame 2 and sealing the electronic component 3. .

絶縁基板１は、上面に電子部品の搭載部１ａが形成されており、酸化アルミニウム質焼結体やガラスセラミックス，窒化アルミニウム質焼結体，ムライト質焼結体等の絶縁材料により形成される。   The insulating substrate 1 has an electronic component mounting portion 1a formed on the upper surface, and is formed of an insulating material such as an aluminum oxide sintered body, glass ceramics, aluminum nitride sintered body, mullite sintered body, or the like.

なお、図１の例では絶縁基板１は平板状であるが、上面に凹部を有する直方体状等の形状で、この凹部の底面に搭載部１ａが設けられた形状のものでもよい。   In the example of FIG. 1, the insulating substrate 1 has a flat plate shape, but may have a shape such as a rectangular parallelepiped shape having a concave portion on the upper surface and a shape in which the mounting portion 1 a is provided on the bottom surface of the concave portion.

絶縁基板１は、例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー，溶剤を添加混合して泥漿状となし、これを従来周知のドクターブレード法によりシート状とすることによって絶縁基板１用のセラミックグリーンシートを得、しかる後、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに複数枚積層し、高温で焼成することによって製作される。   When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. A ceramic green sheet for the insulating substrate 1 is obtained by forming into a sheet form by a conventionally known doctor blade method, and thereafter, a suitable punching process is performed on the ceramic green sheet and a plurality of sheets are laminated and fired at a high temperature. Produced.

また、絶縁基板１は、上面の搭載部１ａまたはその周辺から側面や下面等の外表面にかけて複数の配線導体５が導出されている。   Further, in the insulating substrate 1, a plurality of wiring conductors 5 are led out from the mounting portion 1a on the upper surface or the periphery thereof to the outer surface such as the side surface and the lower surface.

搭載部１ａに搭載される電子部品３は、その電極が、配線導体５のうち搭載部１ａやその周辺に露出した部位にボンディングワイヤや半田等を介して電気的に接続される。   The electrode of the electronic component 3 mounted on the mounting portion 1a is electrically connected to the portion of the wiring conductor 5 exposed to the mounting portion 1a and its periphery via a bonding wire, solder, or the like.

配線導体５は、タングステン，モリブデン，マンガン，銅，銀，金等の金属材料からなり、例えばタングステンから成る場合、タングステン粉末に適当な有機バインダー，溶剤を添加混合して得たタングステンペーストを、絶縁基板１となるセラミックグリーンシートに従来周知のスクリーン印刷法により所定パターンに印刷塗布し、これを絶縁基板１となるセラミックグリーンシートとともに焼成することによって、所定のパターンに被着形成される。   The wiring conductor 5 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, or gold. For example, when it is made of tungsten, the tungsten paste obtained by adding and mixing an appropriate organic binder and solvent to tungsten powder is insulated. The ceramic green sheet to be the substrate 1 is printed and applied in a predetermined pattern by a conventionally well-known screen printing method, and is fired together with the ceramic green sheet to be the insulating substrate 1 to be deposited on the predetermined pattern.

また、絶縁基板１は、上面の外周部に搭載部１ａを囲繞するようにして金属枠体２が接合されている。金属枠体２は、電子部品３の搭載部１ａを気密封止するためのものであり、金属枠体２の上面に蓋体４を接合することにより、搭載部１ａに搭載された電子部品３が絶縁基板１と金属枠体２と蓋体４とから成る容器の内部に気密封止される。金属枠体２の形状は四角枠状である。これにより、半導体集積回路素子や圧電振動子等の一般に四角形状である電子部品３を無駄なスペースを取ることなく効率よく取り囲むものとなっている。この場合、金属枠体２は、各角部が円弧状に面取りされて角部で欠け等が生じることを防止することが好ましい。   The insulating substrate 1 has a metal frame 2 bonded to the outer peripheral portion of the upper surface so as to surround the mounting portion 1a. The metal frame 2 is for hermetically sealing the mounting portion 1 a of the electronic component 3. The electronic component 3 mounted on the mounting portion 1 a is bonded to the upper surface of the metal frame 2. Is hermetically sealed inside a container composed of the insulating substrate 1, the metal frame 2, and the lid 4. The shape of the metal frame 2 is a square frame shape. As a result, the electronic component 3 that is generally rectangular, such as a semiconductor integrated circuit element or a piezoelectric vibrator, is efficiently surrounded without taking up a useless space. In this case, it is preferable that the metal frame 2 prevent each corner from being chamfered in an arc shape to cause chipping or the like at the corner.

金属枠体２は、鉄−ニッケル−コバルト合金や鉄−ニッケル合金等の金属材料からなり、例えば鉄−ニッケル−コバルト合金からなる場合、鉄−ニッケル−コバルト合金の板材に適当な圧延加工や打抜き加工、エッチング加工等の加工を施すことにより形成される。   The metal frame 2 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, when the metal frame 2 is made of an iron-nickel-cobalt alloy, the metal frame 2 is rolled or punched appropriately for the plate material of the iron-nickel-cobalt alloy. It is formed by processing such as processing and etching processing.

また、金属枠体２の絶縁基板１に対する接合は、例えば、絶縁基板１の上面の外周部に搭載部１ａを囲繞するようにして枠状のメタライズ層を形成しておき、この枠状のメタライズ層に金属枠体２の下端面を銀ろう等のろう材を介して接合すること等により行なうことができる。   The metal frame 2 is bonded to the insulating substrate 1 by, for example, forming a frame-shaped metallization layer so as to surround the mounting portion 1a on the outer peripheral portion of the upper surface of the insulating substrate 1, and this frame-shaped metallization. It can be performed by joining the lower end surface of the metal frame 2 to the layer through a brazing material such as silver brazing.

また、金属枠体２に対する蓋体４の接合は、金属枠体２の上面に蓋体４の下面の外周部を位置合わせして載せ、蓋体４の外周部に沿ってシーム溶接や電子ビーム溶接等の加熱溶接を施すこと等により行なうことができる。   The lid 4 is bonded to the metal frame 2 by placing the outer peripheral portion of the lower surface of the lid 4 on the upper surface of the metal frame 2 and placing seam welding or electron beam along the outer peripheral portion of the lid 4. It can be performed by performing heat welding such as welding.

そして、パッケージの搭載部１ａに電子部品３を搭載するとともにその電極を配線導体５に電気的に接続し、その後、金属枠体２の上面に蓋体４を接合して電子部品３を気密封止することにより、電子装置９が構成される。   Then, the electronic component 3 is mounted on the mounting portion 1a of the package and its electrode is electrically connected to the wiring conductor 5, and then the lid 4 is joined to the upper surface of the metal frame 2 to hermetically seal the electronic component 3. The electronic device 9 is configured by stopping.

本発明のパッケージおよび電子装置９において、金属枠体２は上端に鍔部２ａが全周にわたって形成されている。これにより、鍔部２ａの分だけ金属枠体２の幅が上端で広くなるため、蓋体４を強固に接合するための幅を有効に確保することができる。また、蓋体４を接合するための幅を鍔部２ａにより確保することができるため、金属枠体２の下端部の幅を広くする必要はなく、金属枠体２が接合される絶縁基板１を容易に小型化することができる。   In the package and the electronic device 9 of the present invention, the metal frame 2 has a flange portion 2a formed at the upper end over the entire circumference. Thereby, since the width | variety of the metal frame 2 becomes large by the part corresponding to the collar part 2a, the width | variety for joining the cover body 4 firmly can be ensured effectively. Moreover, since the width | variety for joining the cover body 4 can be ensured by the collar part 2a, it is not necessary to make the width | variety of the lower end part of the metal frame 2 wide, and the insulated substrate 1 to which the metal frame 2 is joined. Can be easily reduced in size.

鍔部２ａの幅は０．５〜３ｍｍが好ましい。０．５ｍｍ未満では、蓋体４の接合を有効に強くすることが難しくなる傾向にあり、３ｍｍを超えると、パッケージが必要以上に大きくなり、また鍔部２ａの良好な平坦度が得られず、かえって蓋体４の接合が難しくなって気密封止の信頼性が低下するおそれがある。また、外部電気回路基板のうち鍔部２ａの下方に位置する部位に表面実装型の電子部品を実装する際の位置決め等が鍔部２ａに遮られて難しくなるおそれもある。   The width of the flange 2a is preferably 0.5 to 3 mm. If it is less than 0.5 mm, it tends to be difficult to effectively strengthen the bonding of the lid body 4, and if it exceeds 3 mm, the package becomes larger than necessary, and good flatness of the flange portion 2 a cannot be obtained. On the contrary, it is difficult to join the lid 4 and the reliability of hermetic sealing may be lowered. In addition, positioning or the like when mounting a surface mount type electronic component on a portion of the external electric circuit board located below the flange 2a may be blocked by the flange 2a and may become difficult.

また、鍔部２ａの幅は全周で同じ幅でよいが、金属枠体２の形状等に応じてより蓋体４の接合を強くすることができるように鍔部２ａの幅を部分的に変えてもよい。例えば、金属枠体２が長方形状である場合、蓋体４の接合強度が低下しやすい長辺側の中央部付近の幅を他の部分の幅よりも広くしてもよい。また、応力等の歪が集中しやすい角部分で幅を広くしてもよい。   Further, the width of the flange portion 2a may be the same in the entire circumference, but the width of the flange portion 2a is partially set so that the bonding of the lid body 4 can be strengthened according to the shape of the metal frame 2 and the like. You may change it. For example, when the metal frame 2 has a rectangular shape, the width in the vicinity of the central portion on the long side where the bonding strength of the lid 4 is likely to be reduced may be made wider than the width of other portions. Further, the width may be widened at corners where strains such as stress tend to concentrate.

また、鍔部２ａの厚みは全周で同じでよいが、外周側から中心側に向かうにつれて厚くなるようにしてもよい。この場合、鍔部２ａの上面に蓋体４を接合する際に、鍔部２ａが変形しにくくなるので、気密封止の信頼性がよりいっそう優れたものとなる。   Moreover, although the thickness of the collar part 2a may be the same all around, you may make it thicken as it goes to the center side from an outer peripheral side. In this case, when the lid body 4 is joined to the upper surface of the flange portion 2a, the flange portion 2a is hardly deformed, so that the reliability of hermetic sealing is further improved.

また、鍔部２ａは、金属枠体２と一体成形されたものであることが好ましい。鍔部２ａを金属枠体２と一体成形されたものとしておくと、鍔部２ａが金属枠体２の上端に強固に設けられたものとなり、金属枠体２の鍔部２ａの上面に蓋体４を溶接する際、鍔部２ａが欠けたり、亀裂を生じたりすることが効果的に防止され、より一層気密封止の信頼性に優れたパッケージおよび電子装置９を提供することができる。   Moreover, it is preferable that the collar part 2a is integrally molded with the metal frame 2. If the flange 2a is formed integrally with the metal frame 2, the flange 2a is firmly provided at the upper end of the metal frame 2, and the lid is placed on the upper surface of the flange 2a of the metal frame 2. When welding 4, it is possible to effectively prevent the flange portion 2 a from being chipped or cracked, and to provide a package and an electronic device 9 that are more excellent in hermetic sealing reliability.

鍔部２ａが一体成形された金属枠体２は、例えば、圧延加工や打抜き加工、エッチング加工等の加工を施すことにより形成する際、金属枠体２の上端に鍔部２ａが形成されるように打抜き金型やエッチング加工用のマスク材を作製しておくことにより形成することができる。   When the metal frame 2 in which the flange 2a is integrally formed is formed, for example, by performing processing such as rolling, punching, or etching, the flange 2a is formed at the upper end of the metal frame 2. It can be formed by preparing a punching die and a mask material for etching.

この金属枠体２は、鍔部２ａよりも下側の外面が上端から下端に向かうに伴って内側に傾斜していることが好ましい。これにより、金属枠体２の下端の外形寸法をより一層小さくすることができ、絶縁基板１をより一層容易に小型化することができる。また、鍔部２ａの下面が金属枠体２の側面と一定の角度を成して斜めに交わることになるので、鍔部２ａの金属枠体２に対する強度をより強くすることができ、蓋体４の幅をより大きくして蓋体４との接合幅をより有効に確保し、より気密封止の信頼性に優れたパッケージおよび電子装置９を提供することができる。   It is preferable that this metal frame 2 is inclined inward as the outer surface below the flange portion 2a moves from the upper end to the lower end. Thereby, the external dimension of the lower end of the metal frame 2 can be further reduced, and the insulating substrate 1 can be further reduced in size. In addition, since the lower surface of the flange portion 2a obliquely intersects the side surface of the metal frame body 2 at a certain angle, the strength of the flange portion 2a with respect to the metal frame body 2 can be increased, and the lid body Thus, the width of 4 can be made larger, and the bonding width with the lid 4 can be ensured more effectively, and the package and the electronic device 9 with more excellent hermetic sealing reliability can be provided.

金属枠体２が鍔部２ａよりも下側の外面が上端から下端に向かうに伴って内側に傾斜している場合の傾斜角度は、厚さが０．５〜２ｍｍ程度の金属枠体２の場合、金属枠体２の側面と下端面とのなす角度が４５〜８５度であることが好ましい。この角度が４５度未満では、鍔部２ａの強度を向上させることが難しくなる傾向があり、４５度を超えて大きく傾かせると、金属枠体２の下端の幅が小さくなり絶縁基板１に対する接合強度が低くなるおそれがある。   The inclination angle when the metal frame 2 is inclined inwardly with the outer surface below the flange 2a from the upper end toward the lower end is the thickness of the metal frame 2 having a thickness of about 0.5 to 2 mm. In this case, the angle formed between the side surface of the metal frame 2 and the lower end surface is preferably 45 to 85 degrees. If this angle is less than 45 degrees, it tends to be difficult to improve the strength of the flange 2a. If the angle exceeds 45 degrees, the width of the lower end of the metal frame 2 will be reduced, and bonding to the insulating substrate 1 will occur. There is a risk that the strength is lowered.

また、この傾斜の角度は、金属枠体２の全周にわたって同じ角度とする必要はなく、蓋体４の接合をより効果的に補強するために鍔部２ａの幅を大きく確保したい部位（熱応力が大きく作用する角部分や、長方形の金属枠体の場合の長辺側の中央部分等）で傾斜を大きくするようにしてもよい。   Further, the angle of the inclination does not need to be the same angle over the entire circumference of the metal frame body 2, and a portion (heat) where it is desired to secure a large width of the flange portion 2 a to reinforce the joint of the lid body 4 more effectively. The inclination may be increased at a corner portion where stress acts greatly, a central portion on the long side in the case of a rectangular metal frame, or the like.

また、蓋体４と金属枠体２との接合性を高めるうえで、鍔部２ａは上面が平坦面であることが好ましい。   Moreover, when improving the joining property of the cover body 4 and the metal frame 2, it is preferable that the upper surface of the collar part 2a is a flat surface.

なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更が可能である。   Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

本発明の電子部品収納用パッケージを用いた電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic device using the package for electronic component accommodation of this invention.

符号の説明Explanation of symbols

１・・・絶縁基板
１ａ・・・搭載部
２・・・金属枠体
２ａ・・・鍔部
３・・・電子部品
４・・・蓋体
５・・・配線導体
９・・・電子装置 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Mounting part 2 ... Metal frame 2a ... Eaves part 3 ... Electronic component 4 ... Lid body 5 ... Wiring conductor 9 ... Electronic device

Claims (3)

上面に電子部品の搭載部が形成された絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を囲繞するように接合された金属枠体とを具備しており、該金属枠体は、上端に鍔部が全周にわたって形成されていることを特徴とする電子部品収納用パッケージ。 An insulating substrate having an electronic component mounting portion formed on an upper surface thereof, and a metal frame joined to the outer peripheral portion of the upper surface of the insulating substrate so as to surround the mounting portion. An electronic component storage package, wherein a flange is formed on the upper end over the entire circumference. 前記金属枠体は、前記鍔部よりも下側の外面が上端から下端に向かうに伴って内側に傾斜していることを特徴とする請求項１記載の電子部品収納用パッケージ。 2. The electronic component storage package according to claim 1, wherein the metal frame body is inclined inwardly with an outer surface lower than the flange portion from the upper end toward the lower end. 請求項１または請求項２記載の電子部品収納用パッケージと、前記搭載部に搭載された電子部品と、前記金属枠体の上面に接合されて前記電子部品を気密封止する蓋体とを具備していることを特徴とする電子装置。 The electronic component storage package according to claim 1, an electronic component mounted on the mounting portion, and a lid that is bonded to an upper surface of the metal frame and hermetically seals the electronic component. An electronic device characterized by that.
JP2003334419A 2003-09-25 2003-09-25 Package for housing electronic part, and electronic apparatus Pending JP2005101376A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266171A (en) * 2006-03-28 2007-10-11 Kyocera Corp Ceramic container
CN104766830A (en) * 2015-04-02 2015-07-08 南昌欧菲生物识别技术有限公司 Fingerprint sensor packaging structure, packaging method and electronic equipment
JP2015173234A (en) * 2014-03-12 2015-10-01 株式会社東芝 Package for high-frequency semiconductor device, manufacturing method thereof and high-frequency semiconductor device
US10535972B2 (en) 2017-08-09 2020-01-14 Shinko Electric Industries Co., Ltd. Electronic component package and electronic component device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266171A (en) * 2006-03-28 2007-10-11 Kyocera Corp Ceramic container
JP2015173234A (en) * 2014-03-12 2015-10-01 株式会社東芝 Package for high-frequency semiconductor device, manufacturing method thereof and high-frequency semiconductor device
CN104766830A (en) * 2015-04-02 2015-07-08 南昌欧菲生物识别技术有限公司 Fingerprint sensor packaging structure, packaging method and electronic equipment
CN104766830B (en) * 2015-04-02 2018-07-06 南昌欧菲生物识别技术有限公司 A kind of fingerprint sensor package structure, packaging method and electronic equipment
US10535972B2 (en) 2017-08-09 2020-01-14 Shinko Electric Industries Co., Ltd. Electronic component package and electronic component device

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