JP2015109353A - Package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package capable of packaging a plurality of electronic components in a space surrounded by a first insulation substrate and a second insulation substrate by the common first and second insulation substrates even if the thickness of the plurality of electronic components to be packaged in the space is changed.SOLUTION: A package 1a includes: a first insulation substrate 2a formed from ceramic layers (insulation materials) c1-c3 and including a front face 3 and a rear face 4; a second insulation substrate 10a formed from ceramic layers c4 and c4, including a front face 11 and a rear face 12 and laminated at an upper side of the first insulation substrate 2a; a recess 5 opened on the front face 3 of the first insulation substrate 2a and forming a single cavity 5; and a gap 23 positioned between a peripheral part of the first insulation substrate 2a closer to the front face 3 and a peripheral part of the second insulation substrate 10a closer to the rear face 12 and filled with a sealant 25. In the peripheral part of the first insulation substrate 2a closer to the front face 3, a plurality of protrusions 30 are formed of which tips are brought into contact with the peripheral part of the second insulation substrate 10a closer to the rear face 12.

Description

  The present invention relates to a package comprising two upper and lower insulating bases, and a cavity in which a plurality of electronic components are mounted between them.

  For example, in order to hermetically accommodate a piezoelectric vibrator such as a crystal vibrator together with other electronic components such as a semiconductor element, a flat plate-like first insulating substrate having a semiconductor element mounted on the upper center portion; Solder which is a sealing material between rectangular frame-shaped pads formed along the peripheral part of a box-shaped second insulating base having a piezoelectric vibrator mounted on the ceiling surface of a recess opening in the lower surface There has been proposed a package for housing a piezoelectric vibrator that is electrically connected via a pin (see, for example, Patent Document 1).

  However, like the piezoelectric vibrator housing package, electronic parts having different thicknesses are mounted and housed in a space surrounded by a flat plate-like first insulating base and a box-shaped second insulating base. In this case, in order to change the height in the vertical direction in the space, it was necessary to manufacture box-shaped insulating bases having different dimensions such as the recesses and the outer shape each time. As a result, in order to construct a wide variety of packages, it is necessary to design and manufacture a plurality of ceramic laminates in order to produce different insulating substrates, for example, and the production process is complicated. There was a problem that the efficiency was lowered and the manufacturing cost was increased.

Japanese Patent Laying-Open No. 2006-41924 (pages 1 to 11, FIGS. 1 and 2)

  The present invention solves the problems described in the background art, and even if the thickness of a plurality of electronic components mounted in a space surrounded by the first insulating base and the second insulating base changes, the common first It is another object of the present invention to provide a package in which the plurality of electronic components can be reliably mounted in the space by the second insulating base.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problem, the present invention provides a height (thickness) at a peripheral portion where the first insulating base and the second insulating base having at least one of recesses serving as cavities for mounting a plurality of electronic components face each other. ) The idea is to form a plurality of convex portions for adjustment.
That is, the package of the present invention (Claim 1) is made of an insulating material, and has a first insulating base having a front surface and a back surface, and an insulating material, has a front surface and a back surface, and is located above the first insulating base. A second insulating substrate to be laminated; a recess opening at least one of the surface of the first insulating substrate or the back surface of the second insulating substrate and forming a single cavity; and the surface of the first insulating substrate. A package that is located between the peripheral portion on the side and the peripheral portion on the back surface side of the second insulating substrate, and includes a gap for filling with a sealing material, and the surface of the first insulating substrate At least one of the peripheral portion on the side and the peripheral portion on the back surface side of the second insulating base is formed with one or a plurality of convex portions whose tips are in contact with the other peripheral portion.

  According to this, two electronic components (for example, an ASIC (custom IC) and a sensor element) to be mounted in a cavity surrounded by the first insulating base and the second insulating base and including at least one of the concave portions. Even if the thickness of at least one of them is changed, it is possible to easily cope with the existing first insulating base and the second insulating base by adjusting the height of the convex portion. As a result, when the thickness of the electronic component to be mounted is changed as in the prior art, a significant design change is made on one or both of the first insulating base and the second insulating base depending on the thickness (height) of the cavity. This eliminates the need for a separate manufacturing process for each type of package. Accordingly, it is possible to increase the production efficiency of the package having the above-described form and reduce the manufacturing cost.

The insulating material is, for example, a high-temperature fired ceramic such as alumina, a low-temperature fired ceramic such as glass-ceramic, or a resin such as epoxy.
In addition, when the concave portion is formed in both the first and second insulating bases, when the first and second insulating bases are laminated, a single cavity comprising two concave portions for each insulating base Is formed. On the other hand, the recess formed only in one of the first and second insulating bases alone forms a cavity. In the case of such a form, the other insulating substrate having no recess has a flat plate form.
Furthermore, the bottom surface of the concave portion formed only in one of the first and second insulating bases and the other ceiling surface that closes the opening of the concave portion, or the bottom surface and the ceiling surface of a single cavity comprising two concave portions A plurality of electronic components are individually mounted later.
Further, the surface side of the first insulating substrate refers to the entire surface opposite to the back surface of the first insulating substrate, and the back surface side of the second insulating substrate refers to the surface of the second insulating substrate. It points to the entire opposite side.
Further, the convex portion is at the same position as the gap where the sealing material is filled later, or at least in the peripheral portions of the front and back surfaces of the first and second insulating bases facing each other. Is also formed on the cavity side.
The convex portion is made of either an insulating material made of ceramic or resin, or a conductor made of metal or conductive material.
Further, the sealing material joins the peripheral portions of the front surface and the back surface facing the first and second insulating bases, so that two electronic parts of different types or the same type are located inside the peripheral portion. The mounted cavity is sealed from the outside.
In addition, for example, an epoxy resin, a prepreg, an underfill, a hot melt or other organic adhesive, or a pair of peripheral portions facing the first and second insulating bases are previously opposed to the sealing material. A soldering material such as solder (low melting point metal or alloy) filled between the pair of metal layers formed in this manner is included.

In addition, the present invention includes a package (claim 2) in which the convex portion includes a plurality of point-like bodies whose positions are separated from each other in plan view.
According to this, a protrusion having a desired height made of a plurality of dot-like bodies made of ceramic or resin is formed on one of the peripheral portion of the first surface and the peripheral portion of the back surface of the second insulating base that face each other. By projecting the portion, it is possible to easily cope with a change in the thickness of one or both of the two electronic components. In addition, by adding a small amount of insulating material, it is possible to easily form convex portions made up of a plurality of dot-like bodies, and therefore, the first insulating base and the second insulating base can be manufactured at a low cost by a simple manufacturing process. Is also possible.
Note that the plurality of dot-like bodies constituting the convex portion have a circular shape (circle, ellipse, ellipse, etc.), a cube shape, a rectangular parallelepiped shape, a polygonal column shape, or a hemisphere (dome) shape in a plan view. included.

Furthermore, the present invention includes a package (Claim 3) in which the convex portion is composed of a plurality of strips whose longitudinal direction is along the opening of the cavity in plan view.
According to this, by projecting a plurality of strips made of the same material on either one of the peripheral portion of the first surface and the peripheral portion of the back surface of the second insulating base that face each other, It is possible to easily cope with a change in the thickness of the electronic component.
Examples of the belt-like body include a long and narrow rectangle and a long and narrow oval shape in plan view.

The present invention also includes a package (Claim 4) in which the convex portion is a plurality or a single frame-like body surrounding the opening portion along the opening portion of the concave portion in plan view.
According to this, a plurality or a single frame-like body made of the same material as described above is projected from either one of the opposing peripheral portion of the first surface and the peripheral portion of the back surface of the second insulating base. Thus, it is possible to easily cope with a change in the thickness of the electronic component.
In addition, as the plurality of frame-like bodies, there is a form in which a planar view surrounding the outer peripheral side of each corner portion of the recess has an L shape, or a planar view surrounding the outer peripheral side of two adjacent corner portions has a U shape. included. In addition, the single frame-like body may have a shape surrounding the opening of the recess, for example, when the opening of the recess is rectangular (square or rectangular) or polygonal in plan view, The form which exhibits a polygonal frame shape is illustrated.

In addition, according to the present invention, a metal layer having a rectangular frame shape in plan view surrounding the cavity is formed on the peripheral portion on the front surface side of the first insulating substrate and the peripheral portion on the back surface side of the second insulating substrate. A package (claim 5) is also included.
According to this, a pair of upper and lower metal layers having a rectangular frame shape in plan view formed so as to surround the cavity in the peripheral portion on the front surface side of the first insulating substrate and the peripheral portion on the back surface side of the second insulating substrate. By arranging solder or the like between them, the two electronic components mounted in the cavity can be reliably sealed from the outside.
It is mounted on the back surface of the second insulating substrate or the ceiling surface of the recess formed in the second insulating substrate through the pair of upper and lower metal layers and the sealant solder disposed between them. It can also be used for energization of electronic components.

1 is a vertical cross-sectional view of one form of package according to the present invention. FIG. The elements on larger scale in the vertical sectional view of FIG. The perspective view which shows the 1st insulation base | substrate in the said package. The partial expanded sectional view in the vision in the said package orthogonal to FIG. The vertical sectional view showing the package which is a modification of the package. The elements on larger scale in the vertical sectional view of FIG. FIG. 5 is a vertical cross-sectional view of a different form of package according to the present invention. The elements on larger scale in the vertical sectional view of FIG. The perspective view which shows the 2nd insulation base | substrate in the said package. FIG. 8 is a partially enlarged cross-sectional view visually in the package orthogonal to FIG. 7. (A), (B) is the schematic which shows the convex part of a different form. (A), (B) is the schematic which shows the convex part of a further different form.

Hereinafter, modes for carrying out the present invention will be described.
1 is a vertical sectional view of a package 1a according to an embodiment of the present invention, FIG. 2 is a partially enlarged sectional view of FIG. 1, and FIG. 3 is a perspective view showing a first insulating base 2a included in the package 1a. FIG. 4 is a partially enlarged cross-sectional view in vision perpendicular to FIG.
As shown in FIGS. 1 to 4, the package 1 a has a rectangular (square or rectangular) shape in plan view and a box-shaped first insulating base 2 a, a rectangular shape in plan view, and a flat plate shape as a whole. The second insulating base 10a.
The first insulating base 2a is formed by laminating three ceramic layers (insulating materials) c1 to c3, and has a front surface 3 having a rectangular frame shape and a rear surface 4 having a rectangular shape in plan view. On the center side of the surface 3, a cavity (concave portion) 5 penetrating the middle and upper ceramic layers c2 and c3 is opened. The cavity 5 includes a bottom surface 6 having a rectangular shape in plan view, a lower side surface 7 erected from four sides of the bottom surface 6, a middle step 8 having a rectangular frame shape in plan view, and an upper side surface 9 erected from the four sides. A plurality of convex portions 30 that are dot-like bodies (cylindrical shapes) are provided on the middle stage 8 so as to be spaced apart from each other along the four sides.
The middle step 8 and the upper side surface 9 also correspond to the peripheral portion on the surface 3 side of the first insulating base 2a. The ceramic layers c1 to c3 and the plurality of convex portions 30 are made of, for example, the same type or different types of alumina (ceramics).

On the bottom surface 6 of the cavity 5, a pair of electrodes 14 that are electrically connected to an electronic component (for example, ASIC) 32 to be mounted later are formed. The pair of electrodes 14 can individually be electrically connected to a pair of external connection terminals 15 formed on the back surface 4 via via conductors 13 penetrating the lower ceramic c1.
Further, as shown in FIGS. 3 and 4, a pair of terminals 16 are individually formed on each pair of opposing sides in the middle stage 8, and the terminals 16 are opposed to each other on the first insulating base 2a. And a pair of external connection terminals 18 formed on the back surface 4 through a recessed conductor 17 having a semicircular horizontal cross section. The via conductor 13, the electrode 14, the terminal 16, the recessed conductor 17, and the external connection terminals 15 and 18 are made of W, Mo, Ag, Cu, or the like.

On the other hand, as shown in FIGS. 2 and 4, the second insulating substrate 10a is formed by laminating the same ceramic layers c4 and c5 as described above, and has a front surface 11 and a rear surface 12 which are rectangular in plan view. A pair of electrodes 19 that are electrically connected to an electronic component (for example, a sensor IC) 33 to be mounted later are formed on the center side of the back surface 12. The pair of electrodes 19 is formed on the peripheral side of the back surface 12 via a pair of inner and outer via conductors 21 that individually penetrate the ceramics c4 and c5 and a wiring layer 20 formed between the ceramics c4 and c5. The pair of terminals 22 can be individually conducted.
The electrode 19, the wiring layer 20, the via conductor 21, and the terminal 22 are also made of the same W, Mo, or the like.

  As shown in FIGS. 1, 2, and 4, the first insulating base 2 a in which the electronic component 32 is mounted on the pair of electrodes 14 on the bottom surface 6 of the cavity 5, and the pair of electrodes 19 on the back surface 12 ( When the second insulating base 10a on which the electronic component 33 is mounted on the lower side in the drawing is brought close to the middle stage 8 and the latter back surface 12 in the former cavity 5, the plurality of convex portions 30 projecting from the middle stage 8 are formed. The tip (upper end in the figure) is in contact with the back surface 12 of the second insulating substrate 10a. As a result, the recess 5 previously formed in the first insulating base 2a becomes the cavity 5 in which the height (distance) between the bottom surface 6 and the back surface 12 of the second insulating base 10a is determined. At the same time, there is a substantially L-shaped gap 23 between the middle step 8 and the upper side surface 9 of the cavity 5 in the first insulating base 2a and the peripheral portion and the outer side surface of the back surface 12 of the second insulating base 10a. Is formed.

The package 1a as described above is assembled as follows.
Prepare a plurality of green sheets containing alumina powder in advance, punch the center of any green sheet, and fill the through holes drilled in the green sheet with a conductive paste containing W powder, An insulating paste containing alumina powder or the like is screen-printed in the form of dots on the surface of the punched green sheet along the opening. Furthermore, after the same conductive paste as described above is screen-printed on the surface of any one of the green sheets, the plurality of green sheets are laminated and pressure-bonded and then fired, whereby the first insulating base 2a and the second insulating base Make 10a. Each of the above steps may be performed by taking a large number of pieces and then divided into pieces.

Next, as shown in FIG. 4, solder 24 made of, for example, Ag solder is disposed on the pair of terminals 16 located in the middle stage 8 of the cavity 5 in the first insulating base 2 a, and the solder 24 made of Ag solder is disposed on the solder 24. 2 A pair of terminals 22 on the back surface 12 of the insulating base 10a are individually placed, and the solder 24 is melted to individually connect the pair of electrodes 19 and the pair of external terminals 18 on the first insulating base 2a. Keep it conductive.
Further, the gap 23 between the first insulating base 2a and the second insulating base 10a including the pair of solders 24 is filled with a semi-liquid sealing material 25 made of epoxy resin in a rectangular frame shape in plan view. To do. As a result, it is possible to obtain a package 1a in which two types of electronic components 32 and 33 individually mounted in the cavity 5 are sealed from the outside.

FIG. 5 is a vertical sectional view of a package 1b which is a modification of the package 1a, and FIG. 6 is a partially enlarged view of FIG.
As shown in FIGS. 5 and 6, the package 1b is formed by laminating the same ceramic layers c1 to c3 as described above, and has a box-shaped first insulating base in which the same cavity 5 is opened on the surface 3. 2b and a flat plate-like second insulating substrate 10b formed by laminating ceramic layers c4 and c5 similar to those described above.
The first insulating base 2b is different from the first insulating base 2a in that the surface of the upper ceramic layer c3 is a rectangular frame instead of the terminal 16, the recessed conductor 17, and the external connection terminal 18. 3 and a side conductor 25 formed on the outer surface for individually connecting the terminal 26 and a pair of external connection terminals 27 formed on the back surface 4. Is to have. Further, a metal layer 34 having a rectangular frame shape in plan view is formed on the middle stage 8 in the cavity 5 of the first insulating base 2b. The side conductor 25, the terminal 26, the external connection terminal 27, and the metal layer 34 are also made of the same metal as described above.

On the other hand, the second insulating substrate 10b is different from the second insulating substrate 10a in that the upper ceramic layer c5 slightly protrudes outward at a pair of sides facing the lower ceramic layer c4, and The outer end side of the wiring layer 20 formed between the ceramic layers c4 and c5 is exposed to the back surface side of the ceramic layer c5 and can be opposed to the terminal 26. In addition, a metal layer 35 having a rectangular frame shape in plan view that can be opposed to the metal layer 34 is formed on the periphery of the back surface 12 of the second insulating base 10b. The metal layer 35 is also made of the same metal as described above.
In order to assemble the package 1b as described above, as shown in FIGS. 5 and 6, the electronic component 32 is mounted on the bottom surface 6 of the cavity 5 of the first insulating base 2b in advance, as shown in FIGS. An electronic component 33 is mounted on the back surface 12 of the insulating substrate 10b.

Next, solders 36 and 28 made of Ag solder or the like are disposed and melted on the entire circumference of the metal layer 34 and the pair of terminals 26 in the first insulating base 2b. The solder 36 is a sealing material in the present invention.
In this state, the surface 3 of the first insulating base 2b is formed such that the outer end portions of the metal layer 35 and the wiring layer 20 are in close contact with each other on the solders 36 and 28, and the same gap 23 is formed. Further, the back surface 12 side of the second insulating substrate 10b is brought close to the middle stage 8. At this time, similarly to the above, the heights of the cavities 5 are determined by the upper end surfaces of the plurality of convex portions 30 in the first insulating base 2b coming into contact with the back surface 12 of the second insulating base 10b. At the same time, the cavity 5 in which the electronic components 32 and 33 are mounted is sealed from the outside. Thus, the package 1b is assembled.

According to the packages 1a and 1b as described above, two electronic components to be mounted in the cavity 5 which is surrounded by the first insulating bases 2a and 2b and the second insulating bases 10a and 10b and which is formed by the former concave portion 5. Even if the thickness of at least one of 32 and 33 is changed, the existing first insulating bases 2a and 2b and the second insulating bases 10a and 10b can be easily adjusted by adjusting the heights of the plurality of convex portions 30. It can correspond to. As a result, when the thickness of the electronic component to be mounted is changed as in the prior art, depending on the thickness (height) of the cavity, the design of the first insulating base and the second insulating base is significantly changed, The need to perform a similar manufacturing process separately for each type of package is eliminated.
Moreover, by adding a small amount of ceramic (insulating material), it is possible to easily form the convex portions 30 made up of a plurality of dot-like bodies, so that the first insulating bases 2a, 2b and the second insulating bases 10a, 10b can be made simple. In the manufacturing process, it can be manufactured at low cost.
Accordingly, it is possible to increase the production efficiency of the packages 1a and 1b having the first insulating bases 2a and 2b and the second insulating bases 10a and 10b, and to reduce the manufacturing cost thereof.

7 is a vertical sectional view showing a package 1c having a different form from the above, FIG. 8 is a partially enlarged view of FIG. 7, and FIG. 9 is a perspective view showing a second insulating substrate 10c used in the package 1c. 10 is a partially enlarged view in vision perpendicular to FIG.
As shown in FIG. 7, the package 1c has a rectangular shape in plan view and the same first insulating base 2b having a deep box shape as a whole, and a first box shape in a box shape that has a rectangular shape in plan view and a shallow shape. And 2 insulating bases 10c. The present package 1c is different from the packages 1a and 1b in that, as shown in FIGS. 7 to 10, the middle stage 8 of the first insulating base 2b does not have the plurality of convex portions 30, and the second insulating base. A concave portion 37 is formed on the center side of the back surface 12 of 10c. The concave portion 37 is formed of a ceiling surface 38 that is rectangular in bottom view and a side surface 39 that hangs from the four sides thereof. In other words, the plurality of convex portions 31 are provided so as to be spaced apart from each other.
The middle stage 8 and the upper side surface 9 erected from the four sides also correspond to the peripheral part on the surface 3 side of the first insulating base 2b.

The second insulating base 10c is provided with a through hole having a rectangular shape in plan view that passes through the center side of the lower ceramic layer c4, thereby opening the recess 37 on the center side of the back surface 12. In addition, a plurality of convex portions 31 made of the same ceramic as described above protrude from the peripheral portion on the back surface 12 side along the opening of the concave portion 37 so as to be spaced apart from each other. Furthermore, as shown in FIGS. 9 and 10, in the second insulating base 10c, the upper ceramic layer c5 protrudes slightly outside the lower ceramic layer c4 at a pair of opposing sides, and the ceiling of the recess 37 The pair of left and right electrodes 40 formed on the surface 38 are individually connected to a pair of wiring layers 42 formed between the ceramic layers c4 and c5 and along the back surface of the ceramic layer c5 up to the outer surface.
In addition, a metal layer 35 similar to the above is formed in the peripheral portion of the back surface 12 having a rectangular frame shape when viewed from the bottom, and the metal layer 35 is a peripheral portion on the surface 3 side of the first insulating base 2b. It faces the same metal layer 34 formed in the middle stage 8 in the vertical direction.
Further, the concave portion 5 and the concave portion 37 form a single cavity 5c when the second insulating base 10c is laminated on the first insulating base 2b as described below.

The package 1c is assembled as follows.
The first insulating base 2b and the second insulating base 10c are produced in advance by a plurality of processes similar to those described above.
Next, as shown in FIGS. 7, 8, and 10, the electronic component 32 is mounted in the recess 5 of the first insulating base 2b, and the electronic component 33 is mounted in the recess 37 of the second insulating base 10c. . Next, the same solder (sealing material) 36 is disposed on the metal layer 34 of the first insulating base 2 b, and the solder 28 is disposed on the pair of terminals 26.
Further, after laminating the second insulating base 10c above the middle stage 8 and the surface 3 of the first insulating base 2b, the solder 28 and 36 are melted. At this time, the lower ends (tips) of the plurality of convex portions 31 on the second insulating base 10c side come into contact with the middle stage 8 of the first insulating base 2b, so that the concave portion 5 and the concave portion 37 are formed. The cavity 5c having a height (thickness) between the ceiling surface 38 and the ceiling surface 38 is determined. At the same time, a gap 23 is formed between the middle stage 8 of the first insulating base 2b and the back surface 12 of the second insulating base 10c, and the solder 36 is sandwiched between the upper and lower metal layers 34 and 35. The cavity 5c is sealed from the outside. Thereby, a package 1c as shown in FIG. 7 is obtained.
Even with the package 1c as described above, the same effects as those of the packages 1a and 1b can be obtained.

FIG. 11A is a schematic (plan) view showing a plurality of convex portions 44 and 45 having a different form from the above formed on the middle stage 8 surrounding the cavity 5 in the first insulating base 2a of the package 1a. It is. The convex portions 44 and 45 are made of the same ceramic as described above, and as shown in the drawing, the longitudinal directions are strips having different lengths along the opening of the cavity 5 and are separated from each other. Similarly to the convex portions 30 and 31, the convex portions 44 and 45 are obtained by screen-printing an insulating paste containing alumina powder or the like on the surface of the green sheet serving as the ceramic layer c2, and then firing.
FIG. 11B shows an L-shape in plan view on the middle stage 8 surrounding the cavity 5 of the first insulating base 2a so as to surround each corner of the cavity 5 and are symmetrical to each other. A plurality of (four) convex portions 46, which are strip-shaped bodies, are shown. The convex portion 46 is also made of the same ceramic as described above.

Furthermore, FIG. 12A shows a U-shape in plan view on the middle step 8 surrounding the cavity 5 of the first insulating base 2a so as to surround the left and right sides facing each other in the cavity 5. A pair (plurality) of convex portions 47, which are frame-like bodies formed symmetrically to each other, are shown. The convex portion 47 is also made of the same ceramic as described above, and has a pair of short sides 49 connected at right angles to both ends of the long side 48 in plan view.
In addition, FIG. 12B shows a square (rectangular) shape in plan view so as to surround the opening of the cavity 5 on the middle stage 8 surrounding the cavity 5 of the first insulating base 2a. The convex part 50 which is a frame-shaped body is shown. The convex portion 50 is also made of the same ceramic as described above.
Even when the convex portions 44 to 47 and 50 are replaced with the convex portions 30 and 31, the packages 1a to 1c can achieve the same effects as described above.
Note that the heights of the uppermost portions (tips) of the convex portions 44 to 47, 50 as described above are aligned in advance so as to be substantially the same.
Furthermore, the convex portions 44 to 47, 50 can be formed so as to hang from the peripheral portion of the back surface 12 of the second insulating base 10c.

The present invention is not limited to the embodiments described above.
For example, an epoxy resin, for example, may be applied to the insulating material constituting the first insulating base and the second insulating base. In this case, Cu, Ag, or the like is applied to the conductors such as the electrode 14 and the wiring layer 20, and the first and second insulating bases are produced by, for example, a photolithography technique.
Further, it is also possible to form a part of the plurality of convex portions 30, 31, 44, 45 on the first insulating base and to form the rest on the second insulating base.
Furthermore, it is also possible to arrange the convex portions 30 and 31 between the convex portions 44 to 47.
Further, the packages 1a to 1c including the convex portions 30, 31, 44 to 47, 50 may be in a multi-piece form having a plurality of these.
Furthermore, a plurality of electronic components may be mounted on the concave portion of the first insulating base and the back surface or concave portion of the second insulating base forming the cavity.
In addition, the plurality of electronic components mounted in the cavity may be the same type as well as different types.

  According to the present invention, even if the thickness of the plurality of electronic components mounted in the space surrounded by the first insulating base and the second insulating base changes, the plurality of the electronic parts are shared by the common first and second insulating bases. It is possible to reliably provide a package that can securely mount the electronic component in the space.

1a to 1c ………………………… Package 2a, 2b ………………………… First insulating substrate 3,11 ……………………… Surface 4,12… ………………………… Back 5 …………………………………… Recess / Cavity 5c …………………………………… Cavities 10a-10c ……… …………… Second insulating substrate 23 ………………………………… Gap 25, 36 ………………………… Sealing material 30, 31, 44 to 47, 50… Convex part 37 …………………………………… Concave part c1 to c5 ………………………… Ceramic layer (insulating material)

Claims (5)

A first insulating substrate made of an insulating material and having a front surface and a back surface;
A second insulating substrate made of an insulating material, having a front surface and a back surface, and laminated on the first insulating substrate;
A recess opening in at least one of the front surface of the first insulating base or the back surface of the second insulating base and forming a single cavity;
A package that is located between a peripheral portion on the front surface side of the first insulating substrate and a peripheral portion on the back surface side of the second insulating substrate and includes a gap for filling with a sealing material,
At least one of the peripheral portion on the front surface side of the first insulating substrate and the peripheral portion on the back surface side of the second insulating substrate is formed with one or a plurality of convex portions whose tips contact the other peripheral portion.
Package characterized by that. The convex portion is composed of a plurality of point-like bodies whose positions are separated from each other in plan view.
The package according to claim 1. The convex portion is composed of a plurality of strips whose longitudinal direction is along the opening of the cavity in plan view.
The package according to claim 1. The convex portion is a plurality or a single frame-like body surrounding the opening portion along the opening portion of the concave portion in plan view.
The package according to claim 1. In the peripheral portion on the front surface side of the first insulating substrate and the peripheral portion on the back surface side of the second insulating substrate, a metal layer having a rectangular frame shape in plan view surrounding the cavity is formed.
The package according to any one of claims 1 to 4, characterized in that:

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