JP2007180080A - Ceramic package and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic package, having inside a cavity, a pair of pads which are so connected to an electronic component that the electronic component, such as a piezoelectric vibrator to be mounted inside the cavity so as to surely demonstrate the required performance, and to provide its manufacturing method. <P>SOLUTION: The ceramic package 1 comprises the body 2 of the package which is formed of ceramic and has the cavity 6 therein, and the pair of pads 10a and 10b which are formed inside the cavity 6 away from each other. The pair of pads 10a and 10b each comprise a vertical plane 11 perpendicular to the bottom face 6a of the cavity 6, and is parallel to the vertical plane 11 of the other pad; and a curved plane 12a (or 12b), which is the upper hem of the vertical plane 11, and is extended from the vertical plane 11 in a direction of going away from the vertical plane 11. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a ceramic package for mounting electronic components such as a piezoelectric vibrator and a SAW filter in a cavity and a method for manufacturing the same.

In order to stably vibrate the piezoelectric vibrator housed inside, a rectangular parallelepiped insulating base having a rectangular parallelepiped recess and a cantilever formed on the bottom surface of the recess and electrically connecting the piezoelectric vibrator to the upper surface thereof There has been proposed a piezoelectric vibrator housing package including a pair of electrodes joined in a shape (see, for example, Patent Document 1).
The pair of electrodes are exposed on the upper surfaces of the pair of step portions provided at both inner corners of the side wall of the short side in the concave portion having a rectangular shape in plan view, and the outer periphery of the electrode at the outer peripheral portion of the bottom surface of the concave portion. The part side is formed to be thicker than the central part side of the recess. For this reason, when electrically connecting a piezoelectric vibrator to such an electrode via a conductive resin, a reservoir of conductive resin can be easily formed in the gap between the piezoelectric vibrator and each electrode. This has the advantage that the bonding can be strengthened.

Japanese Patent Laying-Open No. 2005-236892 (pages 1 to 9, FIGS. 1 to 3)

  Incidentally, in order to form a pair of electrodes in a cavity of a package made of ceramic at a position higher than the bottom surface of the cavity, for example, the following manufacturing method is used. First, a conductive paste containing W or Mo powder is printed on the surface of the green sheet to form a substantially rectangular metallized layer in plan view, and then a receiving hole for dividing the metallized layer into two from above the metallized layer is formed. Place and hold down the knockout plate you have. In this state, a punch having a shape similar to that of the receiving hole is inserted into the receiving hole, and the lower metallized layer and the green sheet are punched out.

As a result, a green sheet including a pair of steps each having a pair of pads individually obtained on the upper surface obtained by dividing the metallized layer is laminated on the upper surface of the flat green sheet, and the pair of steps is further formed. A rectangular frame-shaped green sheet having a rectangular through-hole punched in advance is laminated on the periphery of the green sheet, and the resulting box-shaped green sheet laminate is fired at a predetermined temperature range. Consists of processes.
However, when punching is performed with a punch while the metallized layer is pressed by a knockout plate, the upper surfaces of the pair of pads formed in a divided manner become flat. For this reason, the piezoelectric vibrator may be bonded to the pair of pads via an excessively large area, or the posture at the time of bonding may be inclined, which may cause a problem that the required vibration operation can be performed and cannot be mounted. was there.

  The present invention solves the problems described in the background art and provides a pair of pads to be connected to such an electronic component so that the electronic component such as a piezoelectric vibrator to be mounted in the cavity can reliably exhibit the required performance. It is an object of the present invention to provide a ceramic package having a cavity and a manufacturing method thereof.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-described problems, the present invention has been conceived with the idea that the surfaces of a pair of pads formed in a cavity have a curved shape.
That is, the ceramic package of the present invention (Claim 1) includes a package body made of ceramic and having a cavity therein, and a pair of pads formed inside the cavity so as to be spaced apart from each other. Comprises a vertical plane perpendicular to the bottom surface of the cavity and parallel to each other, and a curved surface extending in a direction away from the vertical plane on the upper side of the vertical plane.

According to this, the pair of pads are symmetric with respect to a vertical plane perpendicular to the bottom surface of the cavity and parallel to each other, and a curved surface extending in a direction away from the vertical plane on the upper side of the vertical plane. In preparation. Therefore, for example, a pair of electrodes provided near one end of the bottom surface of the piezoelectric vibrator can be firmly bonded to the curved surfaces of the pair of pads with a relatively small area, respectively, via a conductive resin or the like. . In addition, since the pair of pads are opposed to each other on the vertical surfaces, the distance between the two can be made as short as possible to reduce the size of the package body. Therefore, it is possible to provide a ceramic package in which the electronic components such as the piezoelectric vibrator mounted in the cavity can be cantilevered and the required vibration operation can be accurately performed and the cavity can be easily sealed.
In other words, the present invention also includes a ceramic package in which a rounded corner portion is located between the upper side of the vertical surface and the curved surface of each pad. In this case, an electronic component such as a piezoelectric vibrator to be mounted can be firmly bonded to the curved surface of each pad.

The ceramic includes glass-ceramic, which is a kind of low-temperature fired ceramic, in addition to the main component of alumina or the like.
Further, the cavity includes a form that is rectangular or square (rectangular) in plan view.
Further, the metallized layer is obtained by printing and forming a conductive paste containing W or Mo powder particles on one or more layers on the surface of a green sheet to be described later.
In addition, the electronic components bonded to the pair of pads include a SAW filter in addition to the piezoelectric vibrator.

The pair of pads are located at a pair of inner corners between any side surface of the rectangular cavity and another side surface adjacent to the side surface, and are formed at a position higher than the bottom surface of the cavity. It is individually formed on the upper surface of the pair of stepped portions.
In addition, the opening of the cavity of the package body is closed by a cover plate, and the cover plate includes Fe-42 wt% Ni (so-called 42 alloy), Cu-2.3 wt% Fe-0.03 wt% P (so-called 194 alloy), or metal such as Fe-29 wt% Ni-17 wt% Co (so-called Kovar), and those made of the ceramics are also included.

  On the other hand, the first manufacturing method (claim 2) for obtaining the ceramic package according to the present invention penetrates between the step of forming a metallized layer on the surface of the green sheet and the surface and the back surface of the green sheet. A step of forming a through-hole, wherein the step of forming the through-hole forms a knockout plate on the surface of the green sheet having a concave portion that accommodates the metallized layer and a receiving hole that divides the concave portion. After the metallized layer is disposed so as to be accommodated in the recess, a punch including a cross-section similar to the cross-section of the through-hole is passed through the receiving hole.

  According to this, in the state where the metallized layer formed on the surface of the green sheet is accommodated in the recess of the knockout plate, the metallized layer is divided by the punch that penetrates the receiving hole of the knockout plate, and the above A through hole penetrating the green sheet is formed. For this reason, the metallized layer is divided into a pair of pads through a through-hole having a predetermined width, the pads face each other with the vertical surfaces facing each other, and the curved surface at the time of initial printing / formation is separated from the upper side of each vertical surface. The shape extends in the direction. Therefore, the pair of electrodes provided on the bottom surface of the electronic component such as the piezoelectric vibrator can be firmly bonded to the curved surfaces of the pair of pads with a relatively small area through the conductive resin or the like. .

  A second ceramic package manufacturing method according to the present invention (Claim 3) includes a step of forming a pair of metallized layers on the surface of the green sheet, a surface of the green sheet sandwiched between the pair of metallized layers, and A step of forming a through hole penetrating between a part of the pair of metallized layers and the back surface of the green sheet, and the step of forming the through holes includes a recess for accommodating the pair of metallized layers; A knockout plate having a receiving hole for dividing the recess is disposed so that the pair of metallized layers formed on the surface of the green sheet is accommodated in the recess, and is similar to the cross section of the through hole. The punch including the cross section is made to penetrate through the receiving hole.

  This also makes it possible to form the pair of metallized layers on a pair of pads through through holes of a predetermined width, with the relatively small vertical surfaces of each pad facing each other, and the curved surface at the time of initial printing / formation being each vertical The shape can be extended in a direction away from the upper side of the surface. Therefore, a pair of electrodes positioned on the bottom surface of an electronic component such as a piezoelectric vibrator can be firmly bonded to the curved surfaces of the pair of pads via a conductive resin or the like with a relatively small area.

  Furthermore, a third method for manufacturing a ceramic package according to the present invention (Claim 4) includes a step of forming a pair of metallized layers on the surface of the green sheet, and a surface of the green sheet sandwiched between the pair of metallized layers. A step of forming a through-hole penetrating between the back surface, and the step of forming the through-hole includes a concave portion that accommodates the pair of metallized layers and a receiving hole that divides the concave portion. Is disposed so that the pair of metallized layers formed on the surface of the green sheet is accommodated in the recess, and then a punch including a cross section similar to the cross section of the through hole is passed through the receiving hole. It is characterized by that.

  According to this, a pair of pads sandwiching the through hole in the green sheet can be formed by the through hole penetrating between the front surface and the back surface of the green sheet between the pair of metallized layers. As a result, the short circuit between the pair of pads can be surely prevented, and the pair of electrodes positioned on the bottom surface of the electronic component such as the piezoelectric vibrator is relatively small with respect to these curved surfaces via a conductive resin. It becomes possible to join firmly by area.

In other words, the present invention may include a method for manufacturing a ceramic package, in which the through-hole penetrating the green sheet has a portion that becomes a side surface of the cavity. In this case, in the first and second manufacturing methods, the metallized layer is divided or formed into a pair of pads, and a through hole is formed between them, and at the same time, for a cavity communicating with one side of the through hole. It is possible to form a relatively large through-hole having the side surfaces in the green sheet.
Further, in the present invention, in the first to third manufacturing methods, a four-frame green sheet having a rectangular through hole is laminated on the green sheet on which the pair of pads and the through hole are formed, A step of laminating a flat green sheet below the green sheet having the pair of metallized layers and the through-holes to form a green sheet laminate having a cavity, and firing the laminate to produce a ceramic Forming a package body and firing the pair of pads. The method for manufacturing a ceramic package may be included.
In this case, the ceramic package made of ceramic can be reliably manufactured.

In the following, the best mode for carrying out the present invention will be described.
FIG. 1 is a perspective view showing a ceramic package 1 of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a vertical sectional view taken along line XX in FIG. 2, and FIG. 3 is a partially enlarged view of FIG.
As shown in FIGS. 1 to 4, the ceramic package 1 includes a box-shaped package body 2 having a rectangular parallelepiped cavity 6 that opens upward, and a pair of pads 10 a formed separately from the inside of the cavity 6. 10b.
The package body 2 is made of ceramic mainly composed of alumina and has a rectangular parallelepiped shape as a whole. The bottom plate 5 has a rectangular shape in plan view, side walls 3 and 4 having long and short sides standing upright from four sides thereof, and An enclosed cavity 6 is provided. Incidentally, the external dimensions of the package body 2 are, for example, about 3.2 × 1.5 × 0.5 mm.

  As shown in FIGS. 1 to 3, in the cavity 6, the above-mentioned ceramic is interposed between one side wall 4 and the side walls 3 and 3 adjacent to both sides thereof and the bottom surface 6 a of the cavity 6 that is the upper surface of the bottom plate 5. A pair of step portions 8a and 8b is formed, and a concave groove 7 exposing the bottom surface 6a is located between the step portions 8a and 8b. On the upper surface of the stepped portions 8a and 8b, the pair of pads 10a and 10b having a substantially rectangular shape (rectangular shape) in plan view and having a short side 13 and a long side 14 are formed substantially symmetrically with the concave groove 7 in between. Yes. As will be described later, the pair of pads 10a and 10b is obtained by firing a metallized layer containing W or Mo powder particles together with a green sheet or the like containing step portions 8a and 8b.

As shown in FIGS. 1 to 4, the pair of pads 10 a and 10 b are flush with the side surfaces of the step portions 8 a and 8 b sandwiching the concave groove 7 and are perpendicular to the bottom surface 6 a of the cavity 6 and are parallel to each other. A vertical surface 11 and curved surfaces 12 a and 12 b extending from the upper side of the vertical surface 11 in a direction away from the vertical surface 11 and the groove 7 are provided. As shown in FIGS. 3 and 4, a rounded corner portion r is located between the upper side of each vertical surface 11 and the curved surfaces 12a and 12b of the pair of pads 10a and 10b in a sectional view. The curved surfaces 12a and 12b have a high portion near the vertical surface 11 and are gently curved so as to gradually become lower as they move away from the vertical surface 11 and the groove 7 and approach the short side 13 and the long side 14 side. .
The pair of pads 10a and 10b are individually connected with conductive wires (not shown) for penetrating the side walls 4 and establishing electrical connection with the outside.

  According to the ceramic package 1 as described above, for example, a piezoelectric vibrator (not shown) is disposed on the curved surfaces 12a and 12b of the pair of pads 10a and 10b having the above-described form via a conductive resin, for example, with a relatively small area. It becomes possible to join firmly. In addition, since the pair of pads 10a and 10b are opposed to each other on the vertical surface 11, the distance between them can be made as short as possible, so that the package body 2 can be easily reduced in size. It becomes possible. Therefore, an electronic component such as a piezoelectric vibrator mounted in the cavity 6 can be cantilevered and a required vibration operation can be exhibited accurately, and the opening of the cavity 6 can be easily sealed with a cover plate (not shown). You can also

The ceramic package 1 was manufactured by the following method for manufacturing a ceramic package according to the present invention.
A ceramic slurry was manufactured by previously mixing raw materials composed of alumina powder particles, a resin binder, a plasticizer, a solvent, and the like. The ceramic slurry was subjected to a doctor blade method to form four layers of green sheets s1 to s4. In addition, the green sheets s1 to s4 may be large plates that are used for many pieces.
Next, as shown in FIG. 5, the metallized layer 10 was formed on the surface of the green sheet s2 by printing a conductive paste containing W or Mo powder particles using a metal mask and a squeegee (not shown). The metallized layer 10 has a substantially rectangular shape with a rounded corner at each corner in plan view, and has a curved surface that is gently curved so that it is thicker at the center and thinner at the periphery.
The metallized layer 10 may be formed by laminating two or more metallized layers of a lower layer and an upper layer. Further, a pair of conductor portions (not shown) connected to the metallized layer 10 may be printed and formed on the surface of the green sheet s2.

Next, a knockout plate 15 shown in the perspective view of FIG. 6 was prepared. The knockout plate 15 is made of a steel plate, and has a rectangular parallelepiped concave portion 17 opening in the back surface 15b and a rectangular parallelepiped concave portion 17, and the concave portion 17 is divided into two near the center of the longitudinal direction of the concave portion 17 and the surface 15a. A receiving hole 16 penetrating the back surface 15b. The receiving hole 16 has an elongated rectangular shape in plan view, and both ends in the longitudinal direction are located slightly outside the long sides of the concave portion 17. The concave portion 17 has a size and volume that can accommodate the metallized layer 10. The knockout plate 15 may have a multi-cavity configuration in which a plurality of receiving holes 16 and concave portions 17 are provided.
As shown in FIG. 7, the knockout plate 15 was placed on the surface of the green sheet s <b> 2 to restrain both, and the metallized layer 10 was accommodated in the recess 17.

In this state, as shown by an arrow in FIG. 7, a punch 18 including a cross section similar to the cross section of the receiving hole 16 was inserted into the receiving hole 16. In addition, the punch 18 may have a form integrally including a parent punch 19 having a cross section similar to the cross section of the cavity 6 in plan view, as indicated by a one-dot chain line in FIG.
As shown in FIGS. 7 and 8, the punch 18 punched out the central portions of the metallized layer 10 and the green sheet s2. Next, after raising the punch 18, the knockout plate 15 was removed from the surface of the green sheet s2.

As a result, as shown in FIG. 9, the metallized layer 10 was divided into a pair of pads 10a and 10b, and a rectangular through hole 7a was formed in the center of the green sheet s2 in cross-sectional view. The pair of pads 10a and 10b includes a vertical surface 11 which is a shearing surface by the punch 18, a round corner portion r formed along the upper side, the curved surfaces 12a and 12b, and the short side 13 And a long side 14.
When the parent punch 19 is integrated with the punch 18, as shown by broken lines in FIGS. 8 and 9, the through-hole 6b that is rectangular in a plan view forming each side surface of the cavity 6 has a green sheet s2. Formed through. The through hole 6b communicated with one end of the through hole 7a near the center of the short side. Further, the through hole 6 b may be formed by punching using a parent punch 19 separate from the punch 18.

FIG. 10 shows a pair of pads 10a and 10b formed by the knockout plate 15 and the punch 18, a through hole 7a sandwiched between them, and a through hole 6b communicating with one end of the through hole 7a. The green sheet s2 is shown. The pair of pads 10a and 10b are individually formed on the upper surfaces of the step portions 8a and 8b, and the side surfaces of the step portions 8a and 8b across the through hole 7a are flush with the vertical surfaces 11 of the pads 10a and 10b. It was.
Further, as shown in FIG. 11, through holes 6c and 6d which are the side surfaces of the cavity 6 are formed in the green sheets s3 and s4 by punching using punches having the same cross section as the parent punch 19. .

Next, as shown by the arrows in FIG. 11, the green sheets s3 and s4 in which the through holes 6c and 6d are formed and the green sheet s2 in which the pads 10a and 10b and the through holes 6b are formed are flattened. A green sheet laminated body (not shown) was formed by laminating on the green sheet s1 having a smooth surface 6a and serving as the bottom plate 5.
And the said green sheet laminated body was inserted in the baking furnace which is not illustrated, and it heated and baked in the predetermined | prescribed temperature range. As a result, it was possible to manufacture the ceramic package 1 shown in FIGS. 1 to 4 and having the through-hole 7a formed as the concave groove 7 including the bottom surface 6a.

  According to the first method for manufacturing a ceramic package as described above, the green sheet s2 and the metallized layer 10 are formed in a state where the metallized layer 10 formed on the surface of the green sheet s2 is accommodated in the recess 17 of the knockout plate 15. By punching at the same time, a through hole 7a penetrating the green sheet s2 was formed. For this reason, the metallized layer 10 is divided into a pair of pads 10a and 10b through a through-hole 7a having a predetermined width. The pads 10a and 10b are opposed to each other with the vertical surfaces 11 and are initially printed and formed. The curved surfaces 12a and 12b at the time had a shape extending in a direction away from the corner portion r located on the upper side of each vertical surface 11. Therefore, for example, the piezoelectric vibrator can be firmly bonded to the curved surfaces 12a and 12b of the pair of pads 10a and 10b through a conductive resin or the like with a relatively small area.

Next, the manufacturing method of the 2nd ceramic package in this invention is demonstrated.
As shown in FIG. 12, using a metal mask and a squeegee (not shown) on the surface of the green sheet s5 prepared in the same manner as described above, conductive paste printing containing W or Mo powder particles is performed to form a pair of metallized layers 20. They were formed apart from each other. The pair of metallized layers 20 had a substantially square shape with a rounded corner at each corner in plan view, and curved gently so that the central part was thicker and the peripheral part was thinner.
The pair of metallized layers 20 may also be formed by laminating two or more upper and lower metallized layers. Also, the green sheet s5 may be a large plate for taking a large number of pieces.
Next, as shown in FIG. 13, the same knockout plate 15 as described above was placed on the surface of the green sheet s <b> 5 to restrain both, and the pair of metallized layers 20 were accommodated in the recesses 17.

In this state, as indicated by an arrow in FIG. 13, a punch 18 including a cross section similar to the cross section of the receiving hole 16 is caused to enter the receiving hole 16. Note that the punch 18 may be integrated with a parent punch 19 having a cross section similar to the cross section of the cavity 6 in plan view, as indicated by a dashed line in FIG.
As shown in FIGS. 13 and 14, the punch 18 punched out a green sheet s 5 including a part of the metallized layers 20, 20 near the opposite sides and the surface f sandwiched between them. Next, after pulling up the punch 18, the knockout plate 15 was removed from the surface of the green sheet s5.

As a result, as shown in FIG. 15, the pair of metallized layers 20 becomes a pair of pads 20a and 20b whose opposite sides are sheared, and at the central part of the green sheet s5, a rectangular shape in a sectional view. Through-holes 27 were formed. The pair of pads 20a and 20b are formed of a vertical surface 21 which is a sheared surface by the punch 18, a round corner portion r formed along the upper side thereof, and a similar curved surface similar to the metallized layer 20 22, and a short side 23 and a long side 24.
When the parent punch 19 is integrated with the punch 18, as shown by broken lines in FIG. 14 and FIG. 15, the rectangular through hole 6b forming each side surface of the cavity 6 has the green sheet s5. Formed through. The through hole 6 b communicated with one end of the through hole 27 in the vicinity of the center of the short side. The through-hole 6b may be formed by punching using a parent punch 19 that is separate from the punch 18.

In FIG. 16, a pair of pads 20a and 20b formed by the knockout plate 15 and the punch 18, a through hole 27 sandwiched between them, and a through hole 6b communicating with one end of the through hole 27 are formed. A green sheet s5 is shown. The pair of pads 20a and 20b are individually formed on the upper surfaces of the step portions 8a and 8b, and the side surfaces of the step portions 8a and 8b sandwiching the through hole 27 are flush with the vertical surfaces 21 of the pads 20a and 20b. It was.
Next, a green sheet s5 in which pads 20a, 20b, through-holes 6b and the like are formed is laminated on the green sheet s1 having a flat surface 6a in the same manner as described above, and each of the cavities 6 is further formed thereon. The green sheets s3 and s4 having the through holes 6c and 6d serving as side surfaces were laminated to form a green sheet laminate.

Then, the green sheet laminate was inserted into a firing furnace (not shown), and heated and fired at a predetermined temperature range. As a result, the through-hole 27 becomes a concave groove surrounded by the step portions 8a and 8b and the bottom surface 6a, and has a vertical surface 21, a corner portion r, a curved surface 22 and the like on the upper surface of the step portions 8a and 8b in the cavity 6. A ceramic package similar to the ceramic package 1 on which the pads 20a and 20b were formed was manufactured.
According to the second ceramic package manufacturing method as described above, a part of the pair of metallized layers 20 in a state where the pair of metallized layers 20 formed on the surface of the green sheet s5 is accommodated in the recesses 17 of the knockout plate 15. By punching out the green sheet s5, the through hole 27 was formed in the green sheet s5. Therefore, the metallized layer 20 becomes a pair of pads 20a and 20b through a through-hole 27 having a predetermined width. The pads 20a and 20b have relatively small vertical surfaces 21 facing each other, and the initial printing / forming. The curved surface 22 at the time has a shape extending in a direction away from the corner portion r located on the upper side of each vertical surface 21. Therefore, for example, a ceramic package capable of firmly bonding a piezoelectric vibrator on each curved surface 22 of the pair of pads 20a and 20b with a relatively small area can be provided.

Next, a third method for manufacturing a ceramic package according to the present invention will be described.
As shown in FIG. 17, using a metal mask and a squeegee (not shown) on the surface of the green sheet s6 produced in the same manner as described above, a conductive paste containing W or Mo powder particles is printed to form a pair of metallized layers 30. They were formed apart from each other. The pair of metallized layers 30 have a substantially square shape with rounded corners in plan view, and have a gently curved curved surface 32 that is thicker at the center and thinner at the periphery.
The metallized layers 30 and 30 may also be formed by laminating two or more upper and lower metallized layers. The green sheet s6 may also be a large version for taking a large number of pieces.
Next, as shown in FIG. 18, the same knockout plate 15 as described above was placed on the surface of the green sheet s 6 to restrain both, and the metallized layers 30 and 30 were accommodated in the recess 17.

In this state, as indicated by an arrow in FIG. 18, the punch 18 including a cross section similar to the cross section of the receiving hole 16 is caused to enter the receiving hole 16. Note that the punch 18 may be integrated with a parent punch 19 having a cross section similar to the cross section of the cavity 6 in plan view, as indicated by a one-dot chain line in FIG.
As shown in FIGS. 18 and 19, the punch 18 punches the green sheet s 6 from the surface f sandwiched between the metallized layers 30 and 30. Next, after raising the punch 18, the knockout plate 15 was removed from the surface of the green sheet s6.

As a result, as shown in FIG. 20, the pair of metallized layers 30 becomes a pair of pads 30a and 30b having the same curved surface 32 as the metallized layer 30, and the green sheet s6 sandwiched between them has a central portion. A rectangular through-hole 37 was formed in a sectional view.
When the parent punch 19 is integrated with the punch 18, as shown by broken lines in FIG. 19 and FIG. 20, the rectangular through hole 6b forming each side surface of the cavity 6 has the green sheet s6. Formed through. The through hole 6 b communicated with one end of the through hole 37 in the vicinity of the center of the short side. The through-hole 6b may be formed by punching using a parent punch 19 that is separate from the punch 18.

FIG. 21 shows a green sheet s6 in which a pair of pads 30a and 30b, a through hole 37 sandwiched between them, and a through hole 6b communicating with one end of the through hole 37 are formed. The pair of pads 30a and 30b were surrounded by a pair of side 33 and side 34 and formed individually on the upper surfaces of the stepped portions 8a and 8b.
Next, the green sheet s6 in which the pads 30a, 30b, the through holes 37, and the like are formed is laminated on the green sheet s1 having the flat surface 6a, and each of the cavities 6 is further formed thereon. The green sheets s3 and s4 having the through holes 6c and 6d serving as side surfaces were laminated to form a green sheet laminate.

And the said green sheet laminated body was inserted in the baking furnace which is not shown in figure, and it heated and baked at the predetermined temperature range. As a result, the same ceramic package as described above in which the through hole 37 becomes a concave groove surrounded by the step portions 8a and 8b and the bottom surface 6a and the pads 30a and 30b are formed on the upper surfaces of the step portions 8a and 8b in the cavity 6 is obtained. I was able to manufacture it.
According to the third method for manufacturing a ceramic package as described above, the pair of metallized layers 30 formed on the surface of the green sheet s6 is sandwiched between the pair of metallized layers 30 while being accommodated in the recesses 17 of the knockout plate 15. A through-hole 37 was formed by punching out the green sheet s6 from the surface f. For this reason, the pair of pads 30a and 30b which are the pair of metallized layers 30 have the curved surface 32 at the time of initial printing and formation. Therefore, for example, a ceramic package that can firmly bond a piezoelectric vibrator on each curved surface 32 of the pair of pads 30a and 30b with a relatively small area can be provided.

The present invention is not limited to the embodiments described above.
The ceramic forming the cover body that closes the package body of the ceramic package or the opening of the cavity may be a glass-ceramic that is a kind of low-temperature fired ceramic.
The pair of pads can be individually formed on each upper surface of a pair of step portions provided at an intermediate position in a longitudinal direction in a cavity having a rectangular shape in plan view.
Further, the pair of pads may be formed near the bottom surface of the cavity.
The first manufacturing method includes a step of forming a lower metallized layer on the surface of the green sheet, and a through hole that divides the lower metallized layer and penetrates between the front and back surfaces of the green sheet. And a step of forming an upper metallized layer on each of the pair of lower metallized layers obtained by the division.

Further, in the second and third manufacturing methods, a step of forming a pair of lower metallized layers on the surface of the green sheet apart from each other, and a surface and a rear surface of the green sheet between the pair of lower metallized layers. It is good also as a thing including the process of forming the through-hole which penetrates between, and the process of forming an upper metallization layer on every pair of said lower metallization layer.
In addition, the first to third manufacturing methods further include a step of closing the opening of the cavity with a cover plate after mounting a piezoelectric vibrator or the like on a pair of pads located in the cavity. You can also

The perspective view which shows the ceramic package of this invention. The top view of the said ceramic package. FIG. 3 is a vertical sectional view taken along line XX in FIG. 2. FIG. 4 is a partially enlarged view in FIG. 3. Schematic which shows 1 process in the 1st manufacturing method by this invention. The perspective view which shows the outline of the knockout board used for the process following FIG. Schematic which shows the process following FIG. Schematic which shows the process following FIG. Sectional drawing which shows the green sheet obtained by said each process. The perspective view which shows the said green sheet. Schematic which shows the process following FIG. 8, FIG. Schematic which shows 1 process in the 2nd manufacturing method by this invention. Schematic which shows the process of following FIG. Schematic which shows the process following FIG. Sectional drawing which shows the green sheet obtained by said each process. The perspective view which shows the said green sheet. Schematic which shows 1 process in the 3rd manufacturing method by this invention. FIG. 18 is a schematic diagram illustrating a process following FIG. 17. Schematic which shows the process of following FIG. Sectional drawing which shows the green sheet obtained by said each process. The perspective view which shows the said green sheet.

Explanation of symbols

1 …………………………………………………… Ceramic package 2 ………………………………………………………… Package body 6… …………………………………………………… Cavity 6a …………………………………………………… Bottom 7a, 27, 37 …… ……………………………… Through hole 10, 20, 30 ……………………………… Metalized layer 10a, 10b, 20a, 20b, 30a, 30b ... Pad 11, 21 ……………………………………………… Vertical surfaces 12a, 12b, 22, 32 ………………………… Curved surface 15 ……………………………… …………………… Knockout board 16 …………………………………………………… Reception hole 17 ………………………………………… ………… Recess 18 …………………………… ……………………… Punch s2, s5, s6 …………………………………… Green Sheet f ……………………………………………… ………surface

Claims (4)

A package body made of ceramic and having an internal cavity;
A pair of pads formed inside the cavity and spaced apart from each other,
Each of the pair of pads includes a vertical surface perpendicular to the bottom surface of the cavity and parallel to each other, and a curved surface extending in a direction away from the vertical surface on an upper side of the vertical surface.
A ceramic package characterized by that. Forming a metallized layer on the surface of the green sheet;
Forming a through-hole penetrating between the front surface and the back surface of the green sheet,
In the step of forming the through hole, a knockout plate having a concave portion for accommodating the metallized layer and a receiving hole for dividing the concave portion, the metallized layer formed on the surface of the green sheet is accommodated in the concave portion. After placing the punch, including a cross-section similar to the cross-section of the through-hole through the receiving hole,
A method of manufacturing a ceramic package characterized by the above. Forming a pair of metallized layers on the surface of the green sheet;
Forming a through-hole penetrating between the front surface of the green sheet sandwiched between the pair of metallized layers and a part of the pair of metallized layers and the back surface of the green sheet,
The step of forming the through-hole includes a knockout plate having a recess for accommodating the pair of metallized layers and a receiving hole for dividing the recess, and the pair of metallized layers formed on the surface of the green sheet After placing so as to be accommodated in the recess, a punch including a cross section similar to the cross section of the through hole is made to penetrate the receiving hole.
A method of manufacturing a ceramic package characterized by the above. Forming a pair of metallized layers on the surface of the green sheet;
Forming a through-hole penetrating between the front and back surfaces of the green sheet sandwiched between the pair of metallized layers,
The step of forming the through-hole includes a knockout plate having a recess for accommodating the pair of metallized layers and a receiving hole for dividing the recess, and the pair of metallized layers formed on the surface of the green sheet After placing so as to be accommodated in the recess, a punch including a cross section similar to the cross section of the through hole is made to penetrate the receiving hole.
A method of manufacturing a ceramic package characterized by the above.

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