WO2022137503A1

WO2022137503A1 - Package

Info

Publication number: WO2022137503A1
Application number: PCT/JP2020/048716
Authority: WO
Inventors: 淳間瀬
Original assignee: Ｎｇｋエレクトロデバイス株式会社; 日本碍子株式会社
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2022-06-30
Also published as: JPWO2022137503A1

Abstract

A package (800) includes, in a plan layout: frame body regions (R3) that include a cavity (CV); peripheral regions (R2) that are surrounded by the frame body regions (R3); and a mounting region (R1) that is surrounded by the peripheral regions (R2). A substrate part (810) of the package (800) is made from a ceramic material, supports a frame body part (820) in the frame body regions (R3), and includes: a first surface (S1) facing the cavity (CV) in the peripheral regions (R2) and the mounting region (R1); and a second surface (S2) opposing the first surface (S1). The first surface (S1) has, with respect to a first reference plane (PL1) vertical to the thickness direction, a first recessed section (C1) in the mounting region (R1) and first protruding sections (V1) in the peripheral regions (R2). The second surface (S2) has, with respect to a second reference plane (PL2) vertical to the thickness direction, a second protruding section (V2) in the mounting region (R1) and second recessed sections (C2) in the peripheral region (R2).

Description

package

The present invention relates to a package, particularly to a package for electronic components.

For digital cameras, video cameras, and other image pickup devices, charge-coupled devices (CCDs) or solid-state image pickup devices such as complementary, metal, oxide, and semiconductor (CMOS) are widely used. In the manufacture of an image pickup device, usually, an image pickup unit having an airtightly sealed solid-state image pickup device (for example, an electronic component referred to as a “CMOS / CCD package”) is first prepared, and then the image pickup unit is mounted on the image pickup device. Will be done. The unit typically has a solid-state image sensor, a ceramic package having a cavity for accommodating the solid-state image sensor, and a lid for sealing the cavity.

Japanese Patent Application Laid-Open No. 2012-28620 (Patent Document 1) discloses a solid-state image sensor. The solid-state image sensor is mounted on a wiring board, a solid-state image sensor having an electrode portion for electrically connecting to the wiring board, and formed around a light receiving portion of the solid-state image sensor. It has a bonded portion and a translucent lid portion that faces the light receiving portion and is bonded via the bonding portion so that a gap is formed between the light receiving portion and the light receiving portion. The electrode portion is arranged outside the adhesive portion. In the solid-state image sensor, the region inside the bonded portion is curved toward the wiring board. The region where the electrode portion is formed is flat. A recess is formed on the mounting surface of the solid-state image sensor in the wiring board. The area inside the adhesive portion is curved along the concave portion. When the light receiving surface of the solid-state image sensor is viewed in a plan view, the light receiving portion is inscribed in the recess and the adhesive portion is circumscribed in the recess.

According to Patent Document 1, an adhesive portion for adhering the solid-state image sensor and the translucent lid portion is formed around the light receiving portion of the solid-state image sensor. Further, the region inside the adhesive portion of the solid-state image sensor is curved toward the wiring board, and becomes a curved portion. This makes it possible to alleviate defects (out of focus, shading, etc.) that occur at the four corners of the captured image.

International Publication No. 2016/098455 (Patent Document 2) discloses a package for mounting electronic components. The package for electronic components is provided with a substrate having one main surface and another main surface, a substrate provided on the one main surface and having an arcuate concave portion in a vertical cross-sectional view, and a curved electronic component provided in the concave portion. It has a curved electronic component mounting unit. The substrate has a notch on the other main surface so as to overlap the curved electronic component mounting portion when viewed in a plane from the side of the one main surface.

In general, since the curved electronic component mounting portion is an arc-shaped recess, the behavior in thermal expansion or contraction between the curved electronic component mounting portion and the flat portion around the curved electronic component mounting portion, or The direction of stress is different. Therefore, stress is applied to the boundary between the curved electronic component mounting portion and the flat portion around the curved electronic component mounting portion, and there is a concern that the substrate may be deformed, cracked, or cracked. According to the above-mentioned claim of Patent Document 2, even when the package for mounting an electronic component undergoes thermal expansion or thermal contraction, the stress of thermal expansion or thermal contraction from the curved electronic component mounting portion due to the notch is provided. Can be relaxed and absorbed. Therefore, it is possible to reduce the stress applied to the boundary between the curved electronic component mounting portion and the flat portion around the curved electronic component mounting portion, and to reduce the deformation, cracks, or cracks of the substrate.

Japanese Unexamined Patent Publication No. 2012-28620 International Publication No. 2016/098455

However, in the package disclosed in Patent Document 2, the thickness of the substrate (base portion) may be excessively thin in the notch. Therefore, there is a concern about warpage of the substrate portion due to thermal expansion and contraction.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a package capable of suppressing the misalignment of electronic components while relaxing the internal stress of the substrate portion. be.

A package according to one aspect of the invention has a cavity that will be sealed by a lid and is surrounded by a frame area surrounding the cavity and a frame area in a planar layout perpendicular to the thickness direction. It has a peripheral area and a mounting area surrounded by the peripheral area and where at least a part of electronic components is arranged. The package has a frame body portion and a substrate portion. The frame body portion is arranged in the frame body region, surrounds the cavity, and has a mounting surface to which the lid body is mounted. The substrate portion is made of ceramics, supports the frame body portion in the frame body region, and has a first surface facing the cavity in the peripheral region and the mounting region, and a second surface opposite to the first surface. ing. The first surface has a first concave portion in the mounting region and a first convex portion in the peripheral region with respect to the first reference surface perpendicular to the thickness direction. The second surface has a second convex portion in the mounting region and a second concave portion in the peripheral region with respect to the second reference surface perpendicular to the thickness direction.

The first recess on the first surface may have a first depth dimension of 15 μm or more. The second convex portion of the second surface may have a first height dimension of 15 μm or more. The second recess on the second surface may have a second depth dimension of 15 μm or more. The first convex portion of the first surface may have a second height dimension of 15 μm or more.

In the thickness direction, at least a part of the second surface in the frame region is arranged at a position protruding to the same degree or more as compared with the position reached by the second convex portion of the second surface protruding. good.

The board portion may have a uniform thickness in the mounting area and the peripheral area.

According to one aspect of the present invention, the electronic component can be supported on the first recess on the first surface in the mounting area. Further, since the second surface has the second recess in the peripheral region, the internal stress of the substrate portion can be relaxed. Further, the second convex portion and the first convex portion cancel each of the influences of the first concave portion and the second concave portion with respect to the thickness of the substrate portion at least to some extent. This prevents the substrate portion from having a locally excessively thin portion. Therefore, the warp of the substrate portion in the excessively thin portion due to the thermal expansion and contraction is suppressed. Therefore, it is possible to suppress the misalignment of the electronic component due to the warp. From the above, it is possible to suppress the misalignment of electronic components while relaxing the internal stress of the substrate portion.

In the thickness direction, at least a part of the second surface in the frame region is arranged at a position protruding to the same degree or more as compared with the position reached by the second convex portion of the second surface protruding. good. In this case, when the package is mounted on another member, the frame region of the second surface is stably supported without being hindered by the second convex portion of the second surface.

The board portion may have a uniform thickness in the mounting area and the peripheral area. In this case, the warp of the substrate portion due to thermal expansion and contraction can be more sufficiently suppressed.

The objectives, features, embodiments, and advantages of the present invention will be made clearer by the following detailed description and accompanying drawings.

It is a schematic diagram which shows schematic structure of the electronic apparatus in one Embodiment of this invention. FIG. 3 is a cross-sectional view schematically showing the configuration of the electronic device of FIG. FIG. 3 is a cross-sectional view schematically showing the structure of a package included in the electronic device of FIG. 2. It is a top view which shows the structure of the package of FIG. 3 schematically. It is a top view which shows the structure of the substrate part which the package of FIG. 4 has.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in FIGS. 2 to 5, an XYZ Cartesian coordinate system is shown in order to make it easier to understand the relationship of directions between the drawings.

FIG. 1 is a schematic diagram schematically showing the configuration of the electronic device 900 according to the present embodiment. The electronic device 900 (FIG. 1) includes a package 800 having a cavity CV, an electronic component 902 sealed in the cavity CV, a bonding wire 901 (connecting member), and a lid 907. As a modification, other connecting members may be used together with or in place of the bonding wire 901.

The electronic component 902 may be a solid-state image sensor. The solid-state image sensor is, for example, CMOS as shown in FIG. CMOS is generally particularly excellent as a solid-state image sensor having a large image pickup unit as required for a single-lens reflex camera, some surveillance cameras, industrial cameras, and the like.

The lid body 907 is mounted on the mounting surface SF of the frame body portion 820, whereby the cavity CV of the package 800 is sealed. This attachment may be performed using, for example, an adhesive layer 906. The adhesive layer 906 is made of, for example, a resin adhesive. When the electronic component 902 is a solid-state image sensor, at least a portion of the lid 907 is substantially transparent with respect to the light being imaged, and typically the entire lid 907 is substantially with respect to the light being imaged. Is transparent.

The package 800 has an internal terminal 831 provided inside the cavity CV, an external terminal 832 provided outside the cavity CV, and a through wiring 830 for connecting the internal terminal 831 and the external terminal 832 to each other. There is. In order to obtain the connection, the through wiring 830 penetrates the package 800 between the inside of the cavity CV and the outside of the cavity CV. The electronic component 902 has an electrode terminal 902P. The bonding wire 901 connects the internal terminal 831 of the package 800 and the electrode terminal 902P of the electronic component 902 to each other.

FIG. 2 is a cross-sectional view schematically showing the configuration of the electronic device 900 according to the present embodiment. 3 and 4 are cross-sectional views and plan views schematically showing the configuration of the package 800 included in the electronic device 900 (FIG. 2), and the cross-sectional view of FIG. 3 is along lines III-III (FIG. 4). ing. FIG. 5 is a plan view schematically showing the configuration of the substrate portion 810 included in the package 800 (FIG. 4).

Package 800 has a cavity CV that will be sealed by a lid 907. The package 800 is surrounded by a frame region R3 surrounding the cavity CV, a peripheral region R2 surrounded by the frame region R3, and a peripheral region R2 in a plane layout (XY plane layout) perpendicular to the thickness direction (Z direction). It has a mounting area R1. The package 800 has a frame body portion 820 and a substrate portion 810 made of ceramics. The frame body portion 820 may also be made of ceramics, and in that case, the boundary between the substrate portion 810 and the frame body portion 820 may be virtual. The material of the frame portion 820 is not particularly limited, and may be ceramics, resin, metal, or a composite material of two or more of these. In addition, in FIG. 2 and later, the illustration of the through wiring 830 (FIG. 1), the internal terminal 831 (FIG. 1), and the external terminal 832 (FIG. 1) is omitted. The through wiring 830 (FIG. 1) penetrates a configuration including a substrate portion 810 and a frame portion 820, and may be configured by, for example, at least one of an internal electrode layer and a via wiring.

The frame body portion 820 is arranged in the frame body region R3 and surrounds the cavity CV. The frame body portion 820 has a mounting surface SF to which the lid body 907 is mounted.

The substrate portion 810 supports the frame body portion 820 in the frame body region R3. The substrate portion 810 has a first surface S1 facing the cavity CV in the peripheral region R2 and the mounting region R1, and a second surface S2 opposite to the first surface S1.

The mounting area R1 is an area in which at least a part of the electronic component 902 is to be arranged. In the example shown in FIG. 2, the electronic component 902 is arranged over the mounting region R1 and a part of the peripheral region R2.

The electronic component 902 (FIG. 2) will be mounted on the first surface S1 (FIG. 3) of the substrate portion 810. This attachment may be performed, for example, using an adhesive layer (not shown). The adhesive layer is made of, for example, a resin adhesive. The electrode terminal 902P of the electronic component 902 (not shown in FIG. 2, see FIG. 1) and the internal terminal 831 of the package 800 (not shown in FIG. 2, see FIG. 1) are connected by a bonding wire 901 (FIG. 2). To. In the example shown in FIG. 2, the internal terminal 831 of the package 800 (not shown in FIG. 2, see FIG. 1) is arranged on the stepped portion SB provided in the frame body portion 820. The step portion SB is provided in the middle portion of the frame body portion 820 in the thickness direction (Z direction).

The planar layout (XY plane layout) of the electronic component 902 may have a size including a rectangle having a long side of 10 mm or more, for example, a size including a square having a side of 10 mm or more. .. When the electronic component 902 is a solid-state image sensor, a relatively large size is often required in terms of image pickup performance as described above. However, the size and type of the electronic component 902 are not particularly limited. Corresponding to such a typical size of the electronic component 902, it is preferable that the outer edge of the peripheral region R2 has a size including a rectangle having a long side of 10 mm or more. For example, the outer edge of the peripheral region R2 is a rectangle having a long side of 10 mm or more. The outer edge may have a size including a square having a side of 10 mm or more. A square is a kind of rectangle by definition in geometry.

With reference to FIG. 3, the first surface S1 has a first concave portion C1 in the mounting region R1 and a first convex portion V1 in the peripheral region R2 with respect to the first reference surface PL1. The second surface S2 has a second convex portion V2 in the mounting region R1 and a second concave portion C2 in the peripheral region R2 with respect to the second reference surface PL2. Each of the first reference plane PL1 and the second reference plane PL2 is substantially perpendicular to the thickness direction (Z direction). In other words, each of the first reference plane PL1 and the second reference plane PL2 is substantially parallel to the horizontal plane (XY plane). Each of the first concave portion C1 and the first convex portion V1 has one end and the other end (left end and right end in the figure) reaching the first reference plane PL1. Further, each of the second convex portion V2 and the second concave portion C2 has one end and the other end (left end and right end in the figure) reaching the second reference surface PL2. In the planar layout (XY plane layout), the first concave portion C1 at least partially overlaps with the second convex portion V2 and is preferably included. In the plane layout (XY plane layout), the second concave portion C2 at least partially overlaps with the first convex portion V1 and is preferably included.

The first reference plane PL1 is a plane parallel to the approximate plane of the first plane S1 in the mounting region R1 and the peripheral region R2. The approximate plane may be calculated by fitting the plane to the surface profile of the first surface S1 in the mounting area R1 and the peripheral area R2. Measurement of the surface profile may be made optically. The height position (position in the Z direction) of the first reference surface PL1 may be appropriately selected so that the above-mentioned first concave portion C1 and first convex portion V1 can be defined.

The second reference plane PL2 is a plane parallel to the approximate plane of the second plane S2 in the mounting region R1, the peripheral region R2, and the frame region R3. The approximate plane may be calculated by fitting the plane to the surface profile of the second surface S2 in the mounting region R1, the peripheral region R2, and the frame region R3. Measurement of the surface profile may be made optically. The height position (position in the Z direction) of the second reference surface PL2 may be appropriately selected so that the above-mentioned second concave portion C2 and second convex portion V2 can be defined.

The substrate portion 810 has a first concave portion C1, a first convex portion V1, a second convex portion V2, and a second concave portion C2 in a surface profile along at least one of the lines CS1 to CS3 (FIG. 5). .. In the example shown in FIG. 5, in the plane layout (XY plane layout), the substrate portion 810 has a rectangular shape, the line CS1 is parallel to the long side, and the line CS2 is parallel to the short side. , Line CS3 is parallel to the diagonal. It is preferable that each of the lines CS1 to CS3 passes through the center of the rectangle. Preferably, the substrate portion 810 has a first concave portion C1, a first convex portion V1, a second convex portion V2 and a second concave portion C2 in a surface profile along at least one of the line CS1 and the line CS3. There is. The configuration in which the substrate portion 810 has the first concave portion C1, the first convex portion V1, the second convex portion V2, and the second concave portion C2 in the surface profile along the line CS1 is along the long side direction. Suitable for stress relaxation. The configuration in which the substrate portion 810 has the first concave portion C1, the first convex portion V1, the second convex portion V2, and the second concave portion C2 in the surface profile along the line CS2 is such that the first concave portion C1, the first convex portion V1, and the second concave portion C2 are provided along the short side direction. Suitable for stress relaxation. The configuration in which the substrate portion 810 has the first concave portion C1, the first convex portion V1, the second convex portion V2, and the second concave portion C2 in the surface profile along the line CS3 is such that the stress is along the diagonal direction. Suitable for relaxation. When the substrate portion 810 has a square shape in the plane layout (XY plane layout), the above description is understood by replacing the long side with one side.

The first recess C1 of the first surface S1 has a first depth dimension of 15 μm or more. The second convex portion V2 of the second surface S2 has a first height dimension of 15 μm or more. The second recess C2 of the second surface S2 has a second depth dimension of 15 μm or more. The first convex portion V1 of the first surface S1 has a second height dimension of 15 μm or more. The first recess C1 of the first surface S1 preferably has a first depth dimension of 80 μm or less. The second convex portion V2 of the second surface S2 preferably has a first height dimension of 80 μm or less. The second recess C2 of the second surface S2 preferably has a second depth dimension of 80 μm or less. The first convex portion V1 of the first surface S1 preferably has a second height dimension of 80 μm or less.

In the thickness direction (Z direction), at least a part of the second surface S2 in the frame region R3 is equal to or more than the position reached by the second convex portion V2 of the second surface S2 protruding. It is preferably arranged in a protruding position. In other words, in the Z direction (vertical direction in FIG. 3), the second surface is compared to the position reached by the second convex portion V2 of the second surface S2 protruding in the −Z direction (downward in FIG. 3). It is preferable that at least a part of S2 in the frame region R3 is arranged at a position protruding to the same extent or more.

In particular, in the configuration exemplified in FIG. 3, in the thickness direction (Z direction), the second surface S2 is in the frame region R3 with reference to the position reached by the second convex portion V2 of the second surface S2 protruding. , It has a portion arranged at a position protruding to the same extent, and does not have a portion arranged at a more protruding position. Specifically, the second surface S2 is composed of a surface arranged at a position that protrudes to the same extent in the frame body region R3, based on the position reached by the second convex portion V2 of the second surface S2 protruding. , This surface may be a horizontal plane.

As a modification of the configuration of FIG. 3, in the thickness direction (Z direction), the frame region of the second surface S2 is compared with the position reached by the second convex portion V2 of the second surface S2 protruding. At least a part of R3 may be arranged in a more protruding position. In other words, in the Z direction (vertical direction in FIG. 3), the second surface is compared to the position reached by the second convex portion V2 of the second surface S2 protruding in the −Z direction (downward in FIG. 3). At least a part of S2 in the frame region R3 may be arranged at a more protruding position.

The thickness of the substrate portion 810 is, for example, about 1 mm. The substrate portion 810 has a uniform thickness in the mounting region R1 and the peripheral region R2 at the cross-sectional position where the first concave portion C1, the first convex portion V1, the second convex portion V2, and the second concave portion C2 can be seen as described above. You can do it. In this case, the first reference plane PL1 and the second reference plane PL2 so that the distance between the first reference plane PL1 and the second reference plane PL2 in the thickness direction (Z direction) is the same as the above uniform thickness. And can be defined. Under this definition, in the plane layout (XY plane layout), it is preferable that the first recess C1 and the second recess C2 are arranged so as not to overlap each other. In addition, in this specification, the wording of "uniform thickness" is defined as allowing a thickness distribution of ± 5% in consideration of usual variations in the manufacture of ceramic parts. The thickness of the substrate portion 810 may be measured using a micrometer.

According to the present embodiment, the electronic component 902 can be supported on the first recess C1 of the first surface S1 in the mounting region R1 with reference to FIG. Further, since the second surface S2 has the second recess C2 in the peripheral region R2, the internal stress of the substrate portion 810 can be relaxed. Further, the second convex portion V2 and the first convex portion V1 cancel each of the influences of the first concave portion C1 and the second concave portion C2 with respect to the thickness of the substrate portion 810 at least to some extent. This prevents the substrate portion 810 from having a locally excessively thin portion. Therefore, the warp of the substrate portion 810 in the excessively thin portion due to the thermal expansion and contraction is suppressed. Therefore, it is possible to suppress the misalignment of the electronic component 902 due to the warp. From the above, it is possible to suppress the misalignment of the electronic component 902 while relaxing the internal stress of the substrate portion 810. In particular, when the electronic component 902 is a solid-state image sensor, such misalignment is optically unfavorable.

In the thickness direction (Z direction), at least a part of the second surface S2 in the frame region R3 is equal to or more than the position reached by the second convex portion V2 of the second surface S2 protruding. It may be arranged in a protruding position. In this case, when the package 800 is mounted on another member, the frame body region R3 of the second surface S2 is stably supported without being hindered by the second convex portion V2 of the second surface S2. ..

The substrate portion 810 may have a uniform thickness in the mounting region R1 and the peripheral region R2. In this case, the warp of the substrate portion 810 due to thermal expansion and contraction can be more sufficiently suppressed. In addition, the process of forming the substrate portion 810 is simplified.

In the above embodiment, the package 800 (FIG. 3) having both the substrate portion 810 and the frame portion 820 has been described in detail, but as a modification, a ceramic substrate for electronic components is used without the frame portion 820. The substrate portion 810 may be configured. In this case, since the frame body portion 820 is not provided in the frame body region R3, the frame body region is understood as a surrounding region surrounding the peripheral region. The ceramic substrate can also suppress the misalignment of electronic components while relaxing the internal stress for the reason described in the above embodiment.

The above-described embodiments and modifications may be freely combined with each other. Although the present invention has been described in detail, the above description is exemplary in all embodiments and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention.

800: Package 810: Board part 820: Frame body part 830: Through wiring 831: Internal terminal 832: External terminal 900: Electronic device 901: Bonding wire 902: Electronic component 902P: Electrode terminal 906: Adhesive layer 907: Lid body C1: 1st recess C2: 2nd recess CV: Cavity PL1: 1st reference surface PL2: 2nd reference surface R1: Mounting area R2: Peripheral area R3: Frame area S1: 1st surface S2: 2nd surface SB: Step SF: Mounting surface V1: First convex part V2: Second convex part

Claims

In a planar layout having a cavity to be sealed by a lid and perpendicular to the thickness direction, a frame area surrounding the cavity, a peripheral area surrounded by the frame area, and a peripheral area surrounded by the peripheral area. A package with a mounting area on which at least a portion of an electronic component will be located.
A frame portion that is disposed in the frame area, surrounds the cavity, and has a mounting surface on which the lid is to be mounted.
A substrate made of ceramics, supporting the frame body portion in the frame body region, and having a first surface facing the cavity in the peripheral region and the mounting region, and a second surface opposite to the first surface. Department and
Equipped with
The first surface has a first concave portion in the mounting region and a first convex portion in the peripheral region with respect to the first reference surface perpendicular to the thickness direction.
The second surface is a package having a second convex portion in the mounting region and a second concave portion in the peripheral region with respect to a second reference surface perpendicular to the thickness direction.
The package according to claim 1, wherein the first recess on the first surface has a first depth dimension of 15 μm or more.
The package according to claim 1 or 2, wherein the second convex portion of the second surface has a first height dimension of 15 μm or more.
The package according to any one of claims 1 to 3, wherein the second recess on the second surface has a second depth dimension of 15 μm or more.
The package according to any one of claims 1 to 4, wherein the first convex portion of the first surface has a second height dimension of 15 μm or more.
In the thickness direction, at least a part of the second surface in the frame region protrudes to the same extent or more as compared with the position reached by the second convex portion of the second surface protruding. The package according to any one of claims 1 to 5, which is arranged in.
The package according to any one of claims 1 to 6, wherein the substrate portion has a uniform thickness in the mounting area and the peripheral area.