以下、本発明の実施形態における電子装置および電子素子収納用パッケージについて図面を参照しながら説明する。なお、以下の説明で用いられる図は模式的なものであり、図面上の寸法比率等は現実のものとは必ずしも一致していない。また、電子装置および電子素子収納用パッケージは、説明の便宜上、直交座標系ｘｙｚを定義する。
Hereinafter, an electronic device and an electronic element storage package according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones. Further, the electronic device and the electronic element storage package define an orthogonal coordinate system xyz for convenience of explanation.
また、実施形態等の説明において、既に説明した構成と同一若しくは類似する構成については、同一の符号を付して説明を省略することがある。
In the description of the embodiments and the like, components that are the same as or similar to those already described may be assigned the same reference numerals and descriptions thereof may be omitted.
（実施の形態１）
本発明の第１の実施形態（実施の形態１という）における電子装置および電子素子収納用パッケージについて、図１乃至図３を参照しながら以下に説明する。
(Embodiment 1)
An electronic device and an electronic element storage package according to a first embodiment (referred to as Embodiment 1) of the present invention will be described below with reference to FIGS.
図１乃至図３に示すように、本発明の第１の実施形態（実施の形態１という）における電子装置は、電子素子収納用パッケージ１（以下、パッケージ１ともいう）と、パッケージ１に実装された電子素子２とを含んでいる。本実施形態における電子装置は、例えば、撮像装置等である。また、電子装置は、実装基板に実装されることになる。なお、図１（ａ）において、基体11は枠状部材13を透視した状態で破線によって示されている。
As shown in FIGS. 1 to 3, an electronic device according to a first embodiment (referred to as Embodiment 1) of the present invention is mounted on an electronic element storage package 1 (hereinafter also referred to as a package 1) and the package 1. The electronic device 2 is included. The electronic device in this embodiment is, for example, an imaging device. In addition, the electronic device is mounted on a mounting board. In FIG. 1A, the base 11 is indicated by a broken line with the frame-like member 13 seen through.
パッケージ１は、基体11と、基体11の上面における周囲領域に接合された枠状部材13と、枠状部材13の上面に接合された蓋体15とを含んでいる。
The package 1 includes a base body 11, a frame-shaped member 13 bonded to a peripheral region on the upper surface of the base body 11, and a lid body 15 bonded to the upper surface of the frame-shaped member 13.
基体11は、例えば、セラミック材料等から成り、その材料例は、酸化アルミニウム（アルミナ：Ａｌ２Ｏ３）質焼結体または窒化アルミニウム（ＡｌＮ）質焼結体、あるいはガラスセラミックス質焼結体等である。
The substrate 11 is made of, for example, a ceramic material, and examples of the material include an aluminum oxide (alumina: Al 2 O 3 ) sintered body, an aluminum nitride (AlN) sintered body, a glass ceramic sintered body, and the like. It is.
基体11の熱膨張係数（以下、第１の熱膨張係数ともいう）は、基体11が、例えば、酸化アルミニウムから成る場合であれば、約7.2（×10−６／℃）である。また、基体11が、
例えば、窒化アルミニウムから成る場合であれば、基体11の熱膨張係数は約4.6（×10−
６／℃）である。
The base 11 has a thermal expansion coefficient (hereinafter also referred to as a first thermal expansion coefficient) of about 7.2 (× 10 −6 / ° C.) when the base 11 is made of, for example, aluminum oxide. In addition, the substrate 11 is
For example, in the case of aluminum nitride, the base 11 has a thermal expansion coefficient of about 4.6 (× 10 −
6 / ° C.).
また、基体11が、例えば、ガラスセラミックス質焼結体から成る場合であれば、基体11の熱膨張係数は約12（×10−６／℃）である。
Further, if the substrate 11 is made of, for example, a glass ceramic sintered body, the coefficient of thermal expansion of the substrate 11 is about 12 (× 10 −6 / ° C.).
電子装置は、実装基板の熱膨張係数に近いものを基体11として用いることによって、電子装置を実装基板に実装する場合に、電子装置と実装基板との実装の信頼性を向上させることができる。なお、実装基板は、例えば、ガラス繊維製の布を重ねたものに、エポキシ樹脂を含浸させた、いわゆるガラス−エポキシ基板が用いられる。
By using an electronic device having a thermal expansion coefficient close to that of the mounting substrate as the base 11, when the electronic device is mounted on the mounting substrate, the mounting reliability between the electronic device and the mounting substrate can be improved. As the mounting substrate, for example, a so-called glass-epoxy substrate obtained by impregnating a glass fiber cloth with an epoxy resin is used.
図１（ｂ）に示すように、基体11は、底基体部11ａと枠基体部11bとを含んでおり、基
体11がセラミック材料から成る場合、底基体部11ａおよび枠基体部11bは、例えば、焼成
によって一体的に形成されるものである。また、基体11のキャビティ部11ｅは、底基体部11ａおよび枠基体部11bによって規定される空間のことである。
As shown in FIG. 1B, the base 11 includes a bottom base 11a and a frame base 11b. When the base 11 is made of a ceramic material, the bottom base 11a and the frame base 11b are, for example, These are integrally formed by firing. The cavity portion 11e of the base 11 is a space defined by the bottom base portion 11a and the frame base portion 11b.
底基体部11ａは、平面視において矩形状を有する平板状の部分である。底基体部11ａは、上面が電子素子２の搭載領域11cを有しており、この搭載領域11cは、例えば、底基体部11ａの上面の中央領域に位置している。また、底基体部11aには、電子素子２に電気的に
接続される端子あるいは実装基板に電気的に接続される配線導体層等が設けられている。
The bottom base portion 11a is a flat plate-like portion having a rectangular shape in plan view. The bottom base portion 11a has a mounting area 11c for the electronic element 2 on the top surface, and this mounting area 11c is located, for example, in a central region on the top surface of the bottom base portion 11a. Further, the bottom base portion 11a is provided with a terminal electrically connected to the electronic element 2 or a wiring conductor layer electrically connected to the mounting substrate.
枠基体部11bは、例えば、底基体部11ａの平面形状に対応した形状および寸法を有して
おり、底基体部11ａの搭載領域11cに対応した開口部を有している。枠基体部11bは、枠状部材13との位置決め用の複数の凹部11dを有しており、この複数の凹部11dは、平面的に配置されている。
The frame base portion 11b has, for example, a shape and dimensions corresponding to the planar shape of the bottom base portion 11a, and has an opening corresponding to the mounting region 11c of the bottom base portion 11a. The frame base portion 11b has a plurality of concave portions 11d for positioning with the frame-like member 13, and the plurality of concave portions 11d are arranged in a plane.
ここで、“平面的に配置”とは、図２（ａ）に示すように、少なくとも３つ以上の凹部11dが仮想のｘｙ平面方向に二次元に配置されていることをいう。例示的には、複数の凹
部11dは、基体11のキャビティ部11ｅを囲むように配置されている。図２（ａ）に示す例
においては、複数の凹部11dは、枠基体部11bの中心部を基準に、仮想のｘ軸方向に２個および仮想のｙ軸方向に２個の合計４個設けられている。
Here, “planarly arranged” means that at least three or more concave portions 11d are two-dimensionally arranged in the virtual xy plane direction as shown in FIG. Illustratively, the plurality of recesses 11d are arranged so as to surround the cavity 11e of the base 11. In the example shown in FIG. 2A, a plurality of recesses 11d are provided in total, two in the virtual x-axis direction and two in the virtual y-axis direction, with the central portion of the frame base portion 11b as a reference. It has been.
複数の凹部11dのそれぞれは、枠基体部11bの中心部を基準とする放射状の直線に沿って延びる形状を有している。また、複数の凹部11dのそれぞれは、例えば、図示するように
直線形状を有している。
Each of the plurality of recesses 11d has a shape extending along a radial straight line with the center portion of the frame base portion 11b as a reference. Further, each of the plurality of recesses 11d has, for example, a linear shape as illustrated.
なお、図２（ａ）において、凹部11dは、キャビティ部11ｅの内側から基体11の外側に
向かって延びる形状として示しているが、凹部11dは、基体11の外縁側から内側に向かっ
て形成されていてもよい。また、“凹部”とは、枠基体部11bの上面から下面へ向かって
凹んでいる部分であり、図示しているように平面視において枠基体部11bの下面の縁に接
するように内壁が部分的に存在しないものに加えて、縁から離れて配置されており全周にわたって内壁が存在するものも含まれる。
In FIG. 2A, the recess 11d is shown as a shape extending from the inside of the cavity portion 11e toward the outside of the base 11, but the recess 11d is formed from the outer edge side of the base 11 toward the inside. It may be. In addition, the “concave portion” is a portion that is recessed from the upper surface to the lower surface of the frame base portion 11b, and as shown in the drawing, the inner wall is a part that touches the edge of the lower surface of the frame base portion 11b. In addition to those that do not exist, those that are arranged away from the edge and have an inner wall around the entire circumference are also included.
基体11が、例えば、酸化アルミニウム質焼結体から成る場合であれば、まず、アルミナ（Ａｌ２Ｏ３）、シリカ（ＳｉＯ２）、カルシア（ＣａＯ）、マグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤、溶媒を添加混合して泥漿状とし、これを周知のドクターブレード法またはカレンダーロール法等を用いてシート状に成形してセラミックグリーンシート（以下、グリーンシートともいう）を得る。その後、グリーンシートを所定形状に打ち抜き加工するとともに必要に応じて複数枚積層し、これを約1,600（℃）の温度で焼成す
ることにより基体11が製作される。基体11が酸化アルミニウム質焼結体からなる場合は、機械強度が高いために基体11に反りが発生しにくく、また、適度な熱伝導率を持っているので、撮像素子から発生する熱を外部に放散しやすいものとなり、機械強度と熱伝導率またコストも手ごろなものとなり好ましい。また、グリーンシートの表面には、スクリーン印刷法を用いて端子または配線導体層となるメタライズペーストが所定の箇所に塗布される。ビア導体等を形成する場合には、グリーンシートの所定箇所にスルーホールを形成して、そのスルーホール内部にメタライズペーストを充填して形成する。
If the substrate 11 is made of, for example, an aluminum oxide sintered body, first, it is suitable for a raw material powder such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), etc. An organic solvent and a solvent are added and mixed to form a slurry, which is formed into a sheet using a well-known doctor blade method or calender roll method to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape and a plurality of sheets are laminated as necessary, and the base sheet 11 is manufactured by firing at a temperature of about 1,600 (° C.). When the base 11 is made of an aluminum oxide sintered body, since the mechanical strength is high, the base 11 is unlikely to warp and has an appropriate thermal conductivity. It is easy to disperse, and mechanical strength, thermal conductivity, and cost are reasonable, which is preferable. Further, a metallized paste to be a terminal or a wiring conductor layer is applied to a predetermined portion on the surface of the green sheet using a screen printing method. When forming a via conductor or the like, a through hole is formed at a predetermined position of the green sheet, and the metallized paste is filled in the through hole.
基体11が、例えば、ＳｉＯ２およびＡｌ２Ｏ３を主体とするガラスセラミックス質焼結体からなる場合は、シリカ（ＳｉＯ２）、アルミナ（Ａｌ２Ｏ３）、酸化硼素（Ｂ２Ｏ５）、(酸化バリウム（ＢａＯ）等の各原料粉末を用いて、溶媒としてトルエンおよびＩＰ
Ａ、バインダーとしてアクリル樹脂、可塑剤としてフタル酸ジブチルを用いてドクターブレード法によりシート状に成形してグリーンシート（以下、グリーンシートともいう）を得る。このグリーンシートの表面には、スクリーン印刷法を用いて端子または配線導体層となるＣｕメタライズペーストが所定の箇所に塗布される。
When the substrate 11 is made of, for example, a glass ceramic sintered body mainly composed of SiO 2 and Al 2 O 3 , silica (SiO 2 ), alumina (Al 2 O 3 ), boron oxide (B 2 O 5 ). , (Using raw material powders such as barium oxide (BaO), toluene and IP as solvents
A. A green sheet (hereinafter also referred to as a green sheet) is obtained by molding into a sheet by a doctor blade method using acrylic resin as a binder and dibutyl phthalate as a plasticizer. On the surface of the green sheet, a Cu metallized paste to be a terminal or a wiring conductor layer is applied to a predetermined portion by screen printing.
また、ビア導体等を形成する場合には、グリーンシートの所定箇所にスルーホールを形成して、そのスルーホール内部にＣｕメタライズペーストを充填して形成する。そして、メタライズペーストが塗布されたグリーンシートを積層し圧着する。この積層体を約1,000（℃）の温度で焼成することにより基体11が製作される。
Further, when forming a via conductor or the like, a through hole is formed in a predetermined portion of the green sheet, and a Cu metallized paste is filled in the through hole. Then, the green sheets coated with the metallized paste are stacked and pressure-bonded. The laminated body is fired at a temperature of about 1,000 (° C.), whereby the substrate 11 is manufactured.
基体11は、ＳｉＯ２およびＡｌ２Ｏ３を主体とするガラスセラミックス質焼結体からなる場合は、ガラス相組成またはクリストバライト結晶およびムライト結晶相の析出量を制御することにより、熱膨張係数を制御しやすくなる。そのために、基体11は、実装基板のガラス−エポキシ基板との熱膨張係数を合わせることで電子装置と実装基板との実装の信頼性を向上させることができる。なお、ガラスセラミックス質焼結体は上記の組成に限られない。例えば、ガラス相と、40（℃）〜400（℃）の温度範囲における熱膨張係数が６
（×１０−６／℃）以上の金属酸化物からなる結晶相とからなるガラスセラミックス質焼結体であっても、ガラス相組成を制御することで熱膨張係数を制御することができる。
When the base 11 is made of a glass ceramic sintered body mainly composed of SiO 2 and Al 2 O 3 , the thermal expansion coefficient is controlled by controlling the glass phase composition or the amount of cristobalite crystals and mullite crystals deposited. It becomes easy to do. Therefore, the base body 11 can improve the mounting reliability between the electronic device and the mounting substrate by matching the thermal expansion coefficients of the mounting substrate and the glass-epoxy substrate. The glass ceramic sintered body is not limited to the above composition. For example, the thermal expansion coefficient in the temperature range of 40 (° C.) to 400 (° C.) is 6 with the glass phase.
Even in the case of a glass ceramic sintered body composed of a crystal phase composed of a metal oxide of (× 10 −6 / ° C.) or more, the thermal expansion coefficient can be controlled by controlling the glass phase composition.
また、ガラスセラミックス質焼結体は、酸化アルミニウム質焼結体よりも誘電率が低いので信号が高速化した場合に信号の損失が小さくなる。基体11にガラスセラミックス質焼結体を用いることによって、電子装置は信号の損失を小さくすることができる。
Further, since the glass ceramic sintered body has a dielectric constant lower than that of the aluminum oxide sintered body, the signal loss is reduced when the signal speed is increased. By using a glass ceramic sintered body for the substrate 11, the electronic device can reduce signal loss.
また、ガラスセラミックス質焼結体は、焼成温度を低くできるため配線導体層として電気抵抗の低い銅を用いることができるので、基体11にガラスセラミックス質焼結体を用いることによって、酸化アルミニウム質焼結体を基体11に用いる場合に比べて、電子装置は、電子素子２が低電圧化しても配線での電圧降下が小さくなる。ガラスセラミックス質焼結体の基体11は、電子装置を電子素子２の低電圧化に対して好ましいものとすることができる。
In addition, since the glass ceramic sintered body can lower the firing temperature, copper having a low electrical resistance can be used as the wiring conductor layer. Therefore, by using the glass ceramic sintered body for the substrate 11, the aluminum oxide sintered body can be used. Compared with the case where the bonded body is used for the substrate 11, the electronic device has a smaller voltage drop in the wiring even when the voltage of the electronic element 2 is lowered. The substrate 11 made of a glass ceramic sintered body can make the electronic device preferable for reducing the voltage of the electronic element 2.
電子装置が撮像装置の場合には、用途によって電子素子２(撮像素子)は様々な寸法のものが使用され、例えば、コンパクトデジタルカメラでは、電子素子２は、1/2.3インチの6.2（ｍｍ）×4.6（ｍｍ）の寸法から、フルサイズの36（ｍｍ）×24（ｍｍ）の寸法まで
のものが主に使用される。
When the electronic device is an imaging device, electronic devices 2 (imaging devices) having various sizes are used depending on the application. For example, in a compact digital camera, the electronic device 2 is 1 / 2.3 inches of 6.2 (mm). A size from a size of x 4.6 (mm) to a full size of 36 (mm) x 24 (mm) is mainly used.
一方、基体11は、使用する電子素子２を内部に収納できるように設計されるため、電子素子２よりも一回り大きな寸法となり、例えば、フルサイズの電子素子２を使用する場合には、50（ｍｍ）×38（ｍｍ）程度の大きな寸法となる。したがって、ガラス−エポキシ基板は、40（℃）〜400（℃）の温度範囲における熱膨張係数が12（×１０−６／℃）〜16（×１０−６／℃）であり、電子装置と実装基板との実装の信頼性を考慮すると、基体11は、40（℃）〜400（℃）の温度範囲における熱膨張係数が８（×１０−６／℃）〜18（×１０−６／℃）の高熱膨張係数を有するガラスセラミックス質焼結体を用いることが好ましい。
On the other hand, the base 11 is designed so that the electronic element 2 to be used can be accommodated therein, and thus has a size that is slightly larger than the electronic element 2. For example, when the full-size electronic element 2 is used, the base 11 is 50. It is a large dimension of about (mm) × 38 (mm). Therefore, the glass-epoxy substrate has a thermal expansion coefficient of 12 (× 10 −6 / ° C.) to 16 (× 10 −6 / ° C.) in a temperature range of 40 (° C.) to 400 (° C.), Considering the mounting reliability with the mounting substrate, the base 11 has a thermal expansion coefficient in the temperature range of 40 (° C.) to 400 (° C.) of 8 (× 10 −6 / ° C.) to 18 (× 10 −6 / It is preferable to use a glass-ceramic sintered body having a high thermal expansion coefficient (° C.).
枠状部材13は、四角形状を有しており、第１の接合部材12によって基体11の上面に接合されている。第１の接合部材12は、例えば、樹脂接着剤またはろう材等である。枠状部材13は、基体11の上面のうちキャビティ部11ｅを囲む周囲領域において基体11に接合されている。枠状部材13は、例えば、金属材料から成り、基体11のキャビティ部11ｅに対応した開口部を有している。第１の接合部材12が樹脂接着剤である場合には、接合時に加わる熱を150（℃）程度以下に抑えることができるため、より高温での接合となる接合部材を用
いる場合と比較して、基体11と枠状部材13との熱膨張係数の違いによって生じる基体11の反り変形が小さくなり、例えば、電子装置は電子素子２が撮像素子である場合に画像の質の向上が得られる。枠状部材13は、開口部がキャビティ部11eに対応して設けられていれ
ばよく、枠状部材13の外形の形状は、四角形状に限定されるものではない。
The frame-shaped member 13 has a quadrangular shape and is bonded to the upper surface of the base 11 by the first bonding member 12. The first joining member 12 is, for example, a resin adhesive or a brazing material. The frame-like member 13 is joined to the base body 11 in a peripheral region surrounding the cavity portion 11e on the upper surface of the base body 11. The frame-like member 13 is made of, for example, a metal material and has an opening corresponding to the cavity 11e of the base 11. When the first bonding member 12 is a resin adhesive, the heat applied at the time of bonding can be suppressed to about 150 (° C.) or less, so compared to the case where a bonding member that is bonded at a higher temperature is used. The warp deformation of the base body 11 caused by the difference in thermal expansion coefficient between the base body 11 and the frame-like member 13 is reduced. For example, the electronic device can improve the image quality when the electronic element 2 is an image sensor. The frame-shaped member 13 only needs to have an opening corresponding to the cavity portion 11e, and the outer shape of the frame-shaped member 13 is not limited to a square shape.
枠状部材13が金属材料から成る場合、その材料例は、ＳＵＳ410または50アロイ等であ
る。枠状部材13の熱膨張係数（以下、第２の熱膨張係数ともいう）は、枠状部材13がＳＵＳ410から成る場合、約11（×10−６／℃）である。また、枠状部材13が50アロイから成
る場合は、枠状部材13の熱膨張係数は、約9.8（×10−６／℃）である。
When the frame member 13 is made of a metal material, an example of the material is SUS410 or 50 alloy. The thermal expansion coefficient (hereinafter also referred to as the second thermal expansion coefficient) of the frame-shaped member 13 is approximately 11 (× 10 −6 / ° C.) when the frame-shaped member 13 is made of SUS410. When the frame member 13 is made of 50 alloy, the thermal expansion coefficient of the frame member 13 is about 9.8 (× 10 −6 / ° C.).
また、基体11は、ガラスセラミックス質焼結体を用いて、その熱膨張係数をガラス相組成またはクリストバライト結晶およびムライト結晶相の析出量を制御することで、40(℃)〜400（℃）の温度範囲における熱膨張係数を約12×10-6／℃に調整することができる。
例えば、枠状部材13がＳＵＳ410（熱膨張係数：約11（×10-6／℃））であり、蓋体15が
水晶（熱膨張係数：約11（×10-6／℃））であり、さらに、基体11がガラスセラミックス質焼結体である場合には、各部材の熱膨張係数の差が小さくなるので、それぞれの熱膨張係数の違いによって生じる応力を小さくすることができる。
The substrate 11 is made of a glass-ceramic sintered body, and its thermal expansion coefficient is controlled from 40 (° C.) to 400 (° C.) by controlling the glass phase composition or the amount of cristobalite crystals and mullite crystals deposited. The coefficient of thermal expansion in the temperature range can be adjusted to about 12 × 10 −6 / ° C.
For example, the frame member 13 is SUS410 (thermal expansion coefficient: about 11 (× 10 −6 / ° C.)), and the lid body 15 is quartz (thermal expansion coefficient: about 11 (× 10 −6 / ° C.)). Furthermore, when the substrate 11 is a glass ceramic sintered body, the difference in the thermal expansion coefficient of each member becomes small, so that the stress caused by the difference in the respective thermal expansion coefficients can be reduced.
枠状部材13は、図１（ｂ）および図３に示すように、複数の凸部13aを有しており、こ
の複数の凸部13aは基体11の複数の凹部11dに対応している。また、複数の凸部13ａは、エッチング法またはプレス加工等を用いて枠状部材13の下面に形成される。
As shown in FIGS. 1B and 3, the frame-like member 13 has a plurality of convex portions 13 a, and the plurality of convex portions 13 a correspond to the plurality of concave portions 11 d of the base 11. Further, the plurality of convex portions 13a are formed on the lower surface of the frame-shaped member 13 by using an etching method or press working.
また、枠状部材13の上面は、図３に示すように、蓋体15と枠状部材13との接合部の外側に設けられた応力吸収部として機能する凹部13ｂ(第１の凹部13bともいう）を含んでいる。このように、枠状部材13は、応力を吸収するための応力吸収部として凹部13bが設けら
れており、この凹部13bは枠状部材13に加わる応力を吸収するものである。
Further, as shown in FIG. 3, the upper surface of the frame-shaped member 13 has a concave portion 13b (also referred to as a first concave portion 13b) that functions as a stress absorbing portion provided outside the joint portion between the lid 15 and the frame-shaped member 13. Say). Thus, the frame-like member 13 is provided with the concave portion 13b as a stress absorbing portion for absorbing stress, and the concave portion 13b absorbs stress applied to the frame-like member 13.
また、凹部13bは、枠状部材13において下方に向かって凹んだ形状を有しており、平面
視において、図１（ａ）に示すように、枠状部材13の開口部を囲むように枠状部材13の上面に設けられている。凹部13bは、四角形状の断面形状を有しているが、これに限らず、
逆台形状または半円形状等の断面形状であってもよいし、応力を緩和する形状のものであればよい。また、凹部13bは枠状部材13の孔部13cよりも内側に設けられている。
Further, the recess 13b has a shape that is recessed downward in the frame-shaped member 13, and the frame is formed so as to surround the opening of the frame-shaped member 13 as shown in FIG. It is provided on the upper surface of the member 13. The recess 13b has a square cross-sectional shape, but is not limited thereto,
It may have a cross-sectional shape such as an inverted trapezoidal shape or a semicircular shape, or any shape that relieves stress. The recess 13b is provided on the inner side of the hole 13c of the frame-like member 13.
このように、本実施形態の電子装置では、枠状部材13は、応力を吸収するための応力吸収部となる凹部13bを含んでおり、例えば、電子装置を組み立てる場合に、この凹部13bでもって枠状部材13に加わる応力が吸収される。したがって、かりに枠状部材13に応力が加わっても枠状部材13の応力吸収部となる凹部13bで応力が吸収されて、蓋体15が枠状部材13から剥がれる可能性を低減させることができる。
As described above, in the electronic device according to the present embodiment, the frame-like member 13 includes the concave portion 13b serving as a stress absorbing portion for absorbing stress. For example, when the electronic device is assembled, the frame-like member 13 is provided with the concave portion 13b. The stress applied to the frame member 13 is absorbed. Therefore, even if stress is applied to the frame-shaped member 13, the stress is absorbed by the concave portion 13b serving as the stress-absorbing portion of the frame-shaped member 13, and the possibility that the lid 15 is peeled off from the frame-shaped member 13 can be reduced. .
このように、枠状部材13は、応力が加わることによって蓋体15から剥がれる可能性があるが、加わる応力を応力吸収部となる凹部13bで吸収することになる。枠状部材13は、凹
部13bが応力吸収部であり、凹部13bでは底部の厚みが凹部13b以外の他の枠状部材13の厚
みよりも薄くなっており、曲げ強度または引っ張り強度とも小さくなるので、枠状部材13に応力が加わると凹部13b自体が変形しやすくなる。これによって、内側に位置している
蓋体15の外縁部に応力が伝わりにくくなる。
As described above, the frame-like member 13 may be peeled off from the lid body 15 when stress is applied, but the applied stress is absorbed by the concave portion 13b serving as a stress absorbing portion. In the frame-like member 13, the concave portion 13b is a stress absorbing portion, and the thickness of the bottom portion of the concave portion 13b is thinner than the thickness of the other frame-like member 13 other than the concave portion 13b, and the bending strength or the tensile strength is also small. When the stress is applied to the frame member 13, the recess 13b itself is easily deformed. This makes it difficult for stress to be transmitted to the outer edge portion of the lid 15 located inside.
具体的には、枠状部材13を枠状部材13の孔部13cを基準にして実装基板または筐体等に
位置合わせを行なって電子装置を組み立てる場合には、枠状部材13は凹部13bが枠状部材13の他の部分よりも変形しやすいので、この凹部13bが枠状部材13に加わった応力を吸収しやすくなり、枠状部材13に加わる応力で蓋体15が枠状部材13から剥れる可能性を低減させることができる。
Specifically, when the electronic device is assembled by aligning the frame-shaped member 13 with the mounting substrate or the housing with reference to the hole 13c of the frame-shaped member 13, the frame-shaped member 13 has the recess 13b. Since it is easier to deform than the other parts of the frame-shaped member 13, the recess 13b can easily absorb the stress applied to the frame-shaped member 13, and the lid 15 is removed from the frame-shaped member 13 by the stress applied to the frame-shaped member 13. The possibility of peeling can be reduced.
蓋体15は、第２の接合部材14によって枠状部材13の上面に接合されており、電子素子２を覆うとともに基体11のキャビティ部11ｅを封止している。第２の接合部材14は、例えば、ガラス接合部材または樹脂接着剤等である。
The lid body 15 is joined to the upper surface of the frame-like member 13 by the second joining member 14, covers the electronic element 2, and seals the cavity portion 11e of the base body 11. The second bonding member 14 is, for example, a glass bonding member or a resin adhesive.
第２の接合部材14が樹脂接着剤である場合には、封止時に加わる熱を150（℃）程度以
下に抑えることができるために、電子素子２が撮像素子である場合には撮像素子上に配置された有機物からなるカラーフィルタへのダメージが抑制されて、電子装置は画像の質の向上が得られる。
When the second bonding member 14 is a resin adhesive, the heat applied at the time of sealing can be suppressed to about 150 (° C.) or less. Therefore, when the electronic element 2 is an imaging element, As a result, damage to the color filter made of organic matter disposed in the electronic device is suppressed, and the image quality of the electronic device can be improved.
電子装置が、例えば、撮像装置である場合には、蓋体15は、透光性を有する材料から成り、その材料例としては、ガラスまたは水晶等がある。蓋体15の熱膨張係数（以下、第３の熱膨張係数ともいう）は、蓋体15がガラスから成る場合、約8.5（×10−６／℃）であ
る。蓋体15が水晶から成る場合、蓋体15の熱膨張係数は、約11（×10−６／℃）である。
When the electronic device is, for example, an imaging device, the lid 15 is made of a light-transmitting material, and examples of the material include glass or quartz. The thermal expansion coefficient (hereinafter also referred to as a third thermal expansion coefficient) of the lid 15 is about 8.5 (× 10 −6 / ° C.) when the lid 15 is made of glass. When the lid 15 is made of quartz, the thermal expansion coefficient of the lid 15 is about 11 (× 10 −6 / ° C.).
また、電子装置は、基体11と枠状部材13とが異なる熱膨張係数を有している場合には、この熱膨張係数の違いによって枠状部材13に応力が発生して枠状部材13に反り等が生じる場合があり、この枠状部材13の反りを矯正しながら枠状部材13を実装基板または筐体等に位置合わせをすると、枠状部材13に反り等がない場合に比べてさらに応力が加わり、その応力によって蓋体15と枠状部材13との接合部で剥がれが生じる虞があった。
Further, in the electronic device, when the base 11 and the frame-shaped member 13 have different thermal expansion coefficients, stress is generated in the frame-shaped member 13 due to the difference in the thermal expansion coefficient, and the frame-shaped member 13 is affected. When the frame-shaped member 13 is aligned with the mounting substrate or the housing while correcting the warpage of the frame-shaped member 13 in some cases, the frame-shaped member 13 is further compared with the case where the frame-shaped member 13 is not warped. Stress is applied, and the stress may cause peeling at the joint between the lid 15 and the frame member 13.
しかしながら、基体11および枠状部材13がそれぞれ異なる熱膨張係数を有しており、これらの熱膨張係数の違いによって応力が発生して枠状部材13に反りが生じる場合であったとしても、本実施形態の電子装置では、図１および図３に示すように、枠状部材13は、上面に蓋体15との接合部よりも外側に応力吸収部となる凹部13bを含んでいる。したがって
、たとえ枠状部材13に反り等が生じて、この枠状部材13の反りを矯正しながら枠状部材13の孔部13cを基準にして枠状部材13を実装基板または筐体等に対して位置合わせを行なっ
たとしても、枠状部材13の凹部13bが枠状部材13の他の部分よりも変形しやすいので凹部13bが枠状部材13に加わる応力を吸収しやすく、枠状部材13に加わる応力で蓋体15が枠状部材13から剥れる可能性を低減させることができる。
However, even if the base body 11 and the frame-shaped member 13 have different thermal expansion coefficients, and stress is generated due to the difference in these thermal expansion coefficients, the frame-shaped member 13 may be warped. In the electronic device according to the embodiment, as shown in FIGS. 1 and 3, the frame-like member 13 includes a recess 13 b serving as a stress absorbing portion on the outer side of the joint portion with the lid 15 on the upper surface. Therefore, even if the frame-like member 13 is warped, the frame-like member 13 is fixed to the mounting board or the case with reference to the hole 13c of the frame-like member 13 while correcting the warp of the frame-like member 13. Even if the alignment is performed, the concave portion 13b of the frame-shaped member 13 is more easily deformed than the other portions of the frame-shaped member 13, so that the concave portion 13b can easily absorb the stress applied to the frame-shaped member 13, and the frame-shaped member 13 It is possible to reduce the possibility that the lid 15 is peeled off from the frame-like member 13 by the stress applied to the frame member 13.
また、枠状部材13は、上面に蓋体15との接合部よりも外側の位置に凹部13bが設けられ
ており、図３に示すように、凹部13bを間に置いて蓋体15との接合部を含む部分と凹部13bよりも外側に位置する部分とを有しており、この２つの部分は凹部13bの底部で繋がるよ
うな形状となっている。すなわち、枠状部材13は、凹部13bによって蓋体15との接合部を
含む上面部分と凹部13bによって凹部13bの外側に位置する上面部分とを有しており、これら２つの上面部分が凹部13bの底部を介して繋がるような形状となっている。このように
、枠状部材13の２つの上面部分が凹部13bの底部で繋がるような形状を有しているので、
凹部13bよりも外側の枠状部材13に加わる応力が枠状部材13と蓋体15との接続部に伝わり
にくくなり、枠状部材13の応力で蓋体15が枠状部材13から剥れる可能性を低減させることができる。
Further, the frame-like member 13 is provided with a concave portion 13b on the upper surface at a position outside the joint portion with the lid body 15, and as shown in FIG. It has a part including a joint part and a part located outside the recess 13b, and the two parts are shaped to be connected at the bottom of the recess 13b. That is, the frame-like member 13 has an upper surface portion including a joint portion with the lid 15 by the concave portion 13b and an upper surface portion positioned outside the concave portion 13b by the concave portion 13b, and these two upper surface portions are the concave portion 13b. The shape is such that they are connected via the bottom of each other. Thus, since the two upper surface portions of the frame-shaped member 13 have a shape that is connected at the bottom of the recess 13b,
Stress applied to the frame-shaped member 13 outside the recess 13b is not easily transmitted to the connecting portion between the frame-shaped member 13 and the lid 15 and the lid 15 can be peeled off from the frame-shaped member 13 by the stress of the frame-shaped member 13. Can be reduced.
本実施形態の電子素子収納用パッケージ１において、平面視において、枠状部材13は、複数の凸部13aが平面的に配置されており、枠状部材13が基体11に対して複数の凸部13ａ
によって位置決めされている場合には、枠状部材13に対する基体11の平面位置の位置ばらつきを低減させることができる。
In the electronic element housing package 1 of the present embodiment, the planar member 13 has a plurality of convex portions 13a arranged in a plan view in plan view, and the frame-shaped member 13 has a plurality of convex portions with respect to the base 11. 13a
When the positioning is performed, the positional variation of the planar position of the base body 11 with respect to the frame member 13 can be reduced.
また、本実施形態の電子素子収納用パッケージ１において、枠状部材13が複数の凸部13aで基体11に対して位置決めされており、枠状部材13が基体11に対して位置決めされてお
り、枠状部材13が、実装基板に対する平面方向における位置決め手段(例えば、図１（ａ
）に示す孔部13ｃ)を有している場合には、その位置決め手段(例えば、孔部13ｃ)と実装
基板の位置決め手段（例えば、孔部13cに嵌合するように実装基板に形成された凸部）と
によって平面位置を決めるように電子装置を実装すれば、実装基板に対する電子素子２の平面位置の位置ばらつきを低減させることができる。したがって、本実施形態の電子装置は、実装基板に対する電子素子２の平面位置の位置ばらつきを低減させた電子モジュールを実現することができる。なお、電子モジュールは、電子素子２が撮像素子である場合には、電子素子(すなわち、撮像素子)２の平面位置の位置ばらつきが低減されており、画像の質の向上が図られる。なお、電子モジュールは、電子装置が実装基板等に実装されたものである。
Further, in the electronic element housing package 1 of the present embodiment, the frame-shaped member 13 is positioned with respect to the base body 11 by the plurality of convex portions 13a, and the frame-shaped member 13 is positioned with respect to the base body 11, The frame-shaped member 13 has positioning means (for example, FIG.
), The positioning means (for example, the hole 13c) and the positioning means (for example, the hole 13c) are formed on the mounting substrate so as to fit in the mounting portion. If the electronic device is mounted so that the plane position is determined by the projection), the position variation of the plane position of the electronic element 2 with respect to the mounting substrate can be reduced. Therefore, the electronic device according to the present embodiment can realize an electronic module in which the variation in the planar position of the electronic element 2 with respect to the mounting substrate is reduced. In the electronic module, when the electronic element 2 is an image sensor, the positional variation of the planar position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved. The electronic module is an electronic device mounted on a mounting board or the like.
電子装置は、基体11のキャビティ部11ｅに電子素子２を接着剤等で接着し、電子素子２の端子と基体11の端子とをボンディングワイヤ等を用いて電気的に接続する。電子装置は、枠状部材13の複数の凸13aと基体11の複数の凹11dとで位置決めされているので、電子素子２は基体11の凹部11dを基準として位置合わせすることで電子素子２と枠状部材13の孔
部13cとの位置関係を正確に位置決めすることができるようになる。なお、直接的に基体11の凹部11dが上面から確認できない場合は、電子素子２は、基体11の端子を基準として位置合わせを行なうことができる。または、枠状部材13の凸部13aの裏面に基準となる印等
を形成することによって、電子素子２は、それを基準として位置合わせを行なうことができる。このような場合であっても、本発明の構造を用いることで電子素子２と枠状部材13の孔部13cとの位置関係を正確に位置決めすることができる。
In the electronic device, the electronic element 2 is bonded to the cavity portion 11e of the base 11 with an adhesive or the like, and the terminals of the electronic element 2 and the terminals of the base 11 are electrically connected using a bonding wire or the like. Since the electronic device is positioned by the plurality of protrusions 13a of the frame-shaped member 13 and the plurality of recesses 11d of the base 11, the electronic element 2 is aligned with the concave portions 11d of the base 11 as a reference. The positional relationship with the hole 13c of the frame member 13 can be accurately positioned. If the concave portion 11d of the base 11 cannot be directly confirmed from the upper surface, the electronic element 2 can be aligned with the terminal of the base 11 as a reference. Alternatively, by forming a reference mark or the like on the back surface of the convex portion 13a of the frame-like member 13, the electronic element 2 can be aligned based on that. Even in such a case, the positional relationship between the electronic element 2 and the hole 13c of the frame-like member 13 can be accurately positioned by using the structure of the present invention.
電子装置は、基体11の搭載部11cに電子素子２を位置決めして電子素子２を接着固定し
た後で、基体11の上面に枠状部材13を第１の接合部材12を用いて接着固定し、その後で蓋体15を第2の接合部材14を用いて接着して作製することができる。
In the electronic device, after positioning the electronic element 2 on the mounting portion 11c of the base 11 and bonding and fixing the electronic element 2, the frame-like member 13 is bonded and fixed to the upper surface of the base 11 using the first bonding member 12. Then, the lid body 15 can be produced by bonding using the second bonding member 14.
また、電子装置は、先に基体11に枠状部材13を位置決めして基体11と枠状部材13とを第１の接合部材12を用いて接着固定した後に、枠状部材13の孔部13cに対して電子素子２を
位置決めして基体11に電子素子２を接着固定し、その後で蓋体15を接着して作製することもできる。このような場合には、かりに枠状部材13の基体11に対する位置決めが本来の位置から位置ずれていたとしても、電子素子２が枠状部材13の孔部13cに対して位置決めさ
れており、枠状部材13の孔部13cに対する電子素子２の位置ずれは抑制される。
Further, the electronic device first positions the frame member 13 on the base 11 and bonds and fixes the base 11 and the frame member 13 using the first bonding member 12, and then the hole 13 c of the frame member 13. Alternatively, the electronic element 2 can be positioned with respect to the substrate 11 and bonded and fixed to the base 11, and then the lid 15 can be bonded. In such a case, the electronic element 2 is positioned with respect to the hole 13c of the frame-like member 13 even if the positioning of the frame-like member 13 with respect to the base 11 is displaced from the original position. The positional shift of the electronic element 2 with respect to the hole 13c of the member 13 is suppressed.
このような電子装置は、実装基板の位置決め手段（例えば、孔部13cに嵌合するように
実装基板に形成された凸部）によって枠状部材13の孔部13cとの位置決めを行った場合に
は、実装基板に対する電子素子２の位置は本来の位置からのずれが抑制される。したがって、かりに基体11の凹部11dと枠状部材13の凸部13ａとを用いて正確な位置合わせが行な
えなくても、電子装置は、電子素子２が枠状部材13の孔部13cを基準として位置決めされ
ており、さらに、孔部13cを基準にして実装基板への位置決めが行なわれているので、実
装基板に対する電子素子２の平面位置は、基体11と枠状部材13との位置ずれに影響されなくなる。このように、電子装置は、実装における基準を孔部13cとしているので、実装基
板に対して電子素子２を正確に実装することができる。
Such an electronic device is used when positioning with the hole 13c of the frame-shaped member 13 by positioning means of the mounting board (for example, a convex portion formed on the mounting board so as to fit into the hole 13c). In other words, the position of the electronic element 2 with respect to the mounting substrate is restrained from shifting from the original position. Therefore, even if accurate alignment cannot be performed using the concave portion 11d of the base 11 and the convex portion 13a of the frame-like member 13, the electronic device 2 uses the hole 13c of the frame-like member 13 as a reference. In addition, since the positioning with respect to the mounting board is performed with reference to the hole 13c, the planar position of the electronic element 2 with respect to the mounting board affects the positional deviation between the base 11 and the frame member 13. It will not be done. As described above, since the electronic device uses the hole 13c as a reference for mounting, the electronic element 2 can be accurately mounted on the mounting substrate.
ここで、枠状部材13の凹部13bの他の例について以下に説明する。
Here, another example of the recess 13b of the frame member 13 will be described below.
また、枠状部材13は、凹部13bの外縁が基体11の外縁よりも外側に位置するように設け
られていてもよい。凹部13bは、底部の一部が基体11の外縁より外側に位置するように枠
状部材13に設けられており、また、底部の一部が基体11に接合されていない枠状部材13の領域に位置している。枠状部材13は、図４（ａ）および図５（ａ）に示すように、凹部13bの底部の一部が基体11の外縁よりも外側に位置するように設けられており基体11に接合
されていない領域を有している。また、平面視において、枠状部材13は、凹部13bの底部
の一部が基体11に重なるとともに底部の一部が基体11の外縁よりも外側に位置するように設けられている。
Further, the frame-like member 13 may be provided so that the outer edge of the recess 13b is located outside the outer edge of the base 11. The recess 13b is provided in the frame-like member 13 so that a part of the bottom is positioned outside the outer edge of the base 11, and a region of the frame-like member 13 in which a part of the bottom is not joined to the base 11. Is located. As shown in FIGS. 4A and 5A, the frame-shaped member 13 is provided so that a part of the bottom of the recess 13b is located outside the outer edge of the base 11, and is joined to the base 11. It has a region that is not. In plan view, the frame-like member 13 is provided such that a part of the bottom of the recess 13b overlaps the base 11 and a part of the bottom is located outside the outer edge of the base 11.
例えば、電子装置の実装時に、枠状部材13に加わる応力は、この凹部13bの底部の基体11に接合していない部分が変形しやすいので、枠状部材13bに加わる応力が凹部13bに吸収
されて、蓋体15の外周縁部の枠状部材13との接合部まで伝わりにくくなり、蓋体15が枠状部材13から剥れにくくなる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。
For example, when the electronic device is mounted, the stress applied to the frame-shaped member 13 is easily deformed at the bottom portion of the recess 13b that is not bonded to the base 11, so that the stress applied to the frame-shaped member 13b is absorbed by the recess 13b. Thus, it is difficult for the lid 15 to be transmitted to the joint portion with the frame-shaped member 13 at the outer peripheral edge, and the lid 15 is difficult to peel off from the frame-shaped member 13. Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period.
また、枠状部材13は、凹部13bの外縁だけでなく、凹部13bが基体11の外縁よりも外側に位置するように設けられていてもよい。図４（ｂ）に示すように、凹部13bは、基体11に
接合されていない枠状部材13の領域に基体11の外縁よりも外側に位置するように設けられている。例えば、電子装置の実装時に、枠状部材13に加わる応力は、枠状部材13の凹部13bが枠状部材13の他の部分よりも変形しやすいので、枠状部材13に加わる応力が凹部13bに吸収されて蓋体15の外周部の枠状部材13との接合部まで伝わりにくくなり、蓋体15が枠状部材13から剥れにくくなる。
Further, the frame-like member 13 may be provided so that the recess 13b is located outside the outer edge of the base 11 as well as the outer edge of the recess 13b. As shown in FIG. 4B, the recess 13 b is provided in a region of the frame-like member 13 that is not joined to the base 11 so as to be located outside the outer edge of the base 11. For example, the stress applied to the frame-shaped member 13 during mounting of the electronic device is such that the recess 13b of the frame-shaped member 13 is more easily deformed than the other parts of the frame-shaped member 13, so that the stress applied to the frame-shaped member 13 is the recess 13b. And is not easily transmitted to the joint portion between the outer peripheral portion of the lid body 15 and the frame-like member 13, and the lid body 15 is less likely to peel off from the frame-like member 13.
また、枠状部材13は、図４（ｂ）に示すように、枠状部材13と基体11との接合領域が大きくなるので、枠状部材13と基体11の外縁部との接合部が変形しにくく、枠状部材13が基体11からさらに剥がれにくくなる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。
Further, as shown in FIG. 4B, the frame-shaped member 13 has a large bonding area between the frame-shaped member 13 and the base 11, so that the joint between the frame-shaped member 13 and the outer edge of the base 11 is deformed. The frame-like member 13 is more difficult to peel off from the base 11. Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period.
枠状部材13は、図４（ｂ）では、凹部13bが枠状部材13の上面に設けられているが、応
力吸収部となる凹部13bは、枠状部材13の下面に設けられていてもよく、同様に、下面に
凹部13bを有する枠状部材13は、枠状部材13に加わる応力を下面に設けた凹部13bで吸収することができる。
In FIG. 4 (b), the frame-like member 13 is provided with a recess 13 b on the upper surface of the frame-like member 13, but the recess 13 b serving as a stress absorbing portion may be provided on the lower surface of the frame-like member 13. Similarly, the frame-shaped member 13 having the recess 13b on the lower surface can absorb the stress applied to the frame-shaped member 13 by the recess 13b provided on the lower surface.
また、枠状部材13の主面(上面)には、第1の凹部13bの外側に位置するように第２の凹部13dが設けられていてもよい。枠状部材13は、図４（ｃ）および図５（ｂ）に示すように
、平面視において、第２の凹部13dが第１の凹部13bよりも外側に位置するとともに基体11の外縁よりも外側に位置するように設けられている。例えば、電子装置の実装時には、枠状部材13に加わる応力は、第２の凹部13dの底部の厚みが薄くなった部分が変形すること
で、枠状部材13に加わる応力が吸収されるとともに、第１の凹部13bでも応力が吸収され
るので、蓋体15の外周縁部の枠状部材13との接合部までさらに伝わりにくくなる。
Further, the main surface (upper surface) of the frame-shaped member 13 may be provided with a second recess 13d so as to be positioned outside the first recess 13b. As shown in FIGS. 4C and 5B, the frame-shaped member 13 has a second recessed portion 13d located outside the first recessed portion 13b in plan view and more than the outer edge of the base body 11. It is provided so that it may be located outside. For example, when the electronic device is mounted, the stress applied to the frame-shaped member 13 is absorbed by the stress applied to the frame-shaped member 13 by deforming the portion where the thickness of the bottom of the second recess 13d is reduced. Since the stress is absorbed also in the first concave portion 13b, it is further difficult to be transmitted to the joint portion of the outer peripheral edge portion of the lid body 15 with the frame-like member 13.
これによって、蓋体15と枠状部材13とが剥れにくくなることで、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。なお、第２の凹部13d
は、第１の凹部13bと孔部13cとの間に設けられていればよく、図５（ｂ）に示すように、第１の凹部13bに隣接して直線形状に設けられていても、また、第１の凹部13bを囲むような形状で設けられていてもよい。また、第２の凹部13dは、四角形状の断面形状を有して
いるが、これに限らず、逆台形状または半円形状等の断面形状を有していてもよい。第２の凹部13dの形状は、枠状部材13の応力を緩和する形状のものであればよい。
As a result, the lid 15 and the frame-shaped member 13 are less likely to be peeled off, so that the electronic device can protect the electronic element 2 from the external environment for a longer period. The second recess 13d
May be provided between the first recess 13b and the hole 13c, and as shown in FIG. 5B, even if it is provided in a linear shape adjacent to the first recess 13b, Further, it may be provided in a shape surrounding the first recess 13b. The second recess 13d has a quadrangular cross-sectional shape, but is not limited thereto, and may have a cross-sectional shape such as an inverted trapezoidal shape or a semicircular shape. The shape of the second recess 13d may be any shape that relieves the stress of the frame member 13.
枠状部材13の第２の凹部13dは、図４（c）では、枠状部材13の上面に設けられているが、枠状部材13の下面に設けられていてもよい。このように、下面に第２の凹部13dを有す
る枠状部材13は、枠状部材13に加わる応力を下面に設けた第２の凹部13dで吸収すること
ができる。
The second recess 13d of the frame member 13 is provided on the upper surface of the frame member 13 in FIG. 4C, but may be provided on the lower surface of the frame member 13. Thus, the frame-shaped member 13 having the second recess 13d on the lower surface can absorb the stress applied to the frame-shaped member 13 by the second recess 13d provided on the lower surface.
（実施の形態２）
本発明の第２の実施形態(実施の形態２という)における電子装置および電子素子収納用パッケージ1Aについて、図６および図７を参照しながら以下に説明する。
(Embodiment 2)
An electronic device and an electronic element housing package 1A according to a second embodiment (referred to as a second embodiment) of the present invention will be described below with reference to FIGS.
図６および図７に示すように、本発明の第２の実施形態(実施の形態２という)における電子装置は、電子素子収納用パッケージ1A(以下、パッケージ1Aともいう)と、パッケージ1Aに実装された電子素子２とを含んでいる。本実施形態における電子装置は、例えば、撮像装置等である。なお、図６（ａ）において、基体11は枠状部材13を透視した状態で破線によって示されている。
As shown in FIGS. 6 and 7, an electronic device according to a second embodiment (referred to as a second embodiment) of the present invention is mounted on an electronic element housing package 1A (hereinafter also referred to as package 1A) and package 1A. The electronic device 2 is included. The electronic device in this embodiment is, for example, an imaging device. In FIG. 6A, the substrate 11 is indicated by a broken line in a state where the frame-like member 13 is seen through.
図６および図７に示すように、本発明の第２の実施形態における電子素子収納用パッケージ1Aにおいて、枠状部材13は応力を吸収するための応力吸収部を含んでいる。枠状部材13は、貫通孔13e(第１の貫通孔13ｅともいう)が枠体部材13の上面から下面を貫通して設
けられている。また、平面視において、複数の貫通孔13eは枠状部材13の開口部を囲むよ
うに枠状部材13に設けられている。パッケージ1Aでは、貫通孔13eは長辺方向(ｘ方向)お
よび短辺方向(ｙ方向)にそれぞれ３個ずつの合計12個が枠状部材13に設けられており、これらの複数の貫通孔13eが枠状部材13の開口部を囲むように配置されている。
As shown in FIGS. 6 and 7, in the electronic element housing package 1 </ b> A according to the second embodiment of the present invention, the frame-like member 13 includes a stress absorbing portion for absorbing stress. The frame-like member 13 is provided with a through hole 13e (also referred to as a first through hole 13e) penetrating from the upper surface to the lower surface of the frame member 13. The plurality of through holes 13e are provided in the frame member 13 so as to surround the opening of the frame member 13 in plan view. In the package 1A, a total of twelve through-holes 13e, three in each of the long side direction (x direction) and the short side direction (y direction), are provided in the frame-shaped member 13, and the plurality of through holes 13e Is arranged so as to surround the opening of the frame-shaped member 13.
枠状部材13は、互いに隣接する貫通孔13eの間に位置する領域が応力吸収部として機能
する。このように、枠状部材13は応力を吸収するための応力吸収部を含んでおり、互いに隣接する貫通孔13eの間に位置する領域が応力吸収部として機能している。すなわち、枠
状部材13eに貫通孔13eを設けることにより、隣接する貫通孔13eの間の領域が応力吸収部
として機能する。枠状部材13は、図６（ａ）に示すように、隣接する貫通孔13eの間に位
置する領域が応力吸収領域13h1となり、この応力吸収領域13h1が枠状部材13の応力吸収部となる。
In the frame-like member 13, a region located between mutually adjacent through holes 13e functions as a stress absorbing portion. Thus, the frame-shaped member 13 includes a stress absorbing portion for absorbing stress, and a region located between the adjacent through holes 13e functions as a stress absorbing portion. That is, by providing the frame-shaped member 13e with the through holes 13e, the region between the adjacent through holes 13e functions as a stress absorbing portion. As shown in FIG. 6A, in the frame-shaped member 13, a region located between adjacent through holes 13e is a stress absorbing region 13h1, and this stress absorbing region 13h1 is a stress absorbing portion of the frame-shaped member 13. .
図６（ａ）に示すように、枠状部材13と基体11を含んだ領域をラインL1およびラインL2でそれぞれ見た場合には、貫通孔13eが設けられたラインL1における断面積は、貫通孔13eが設けられていないラインL2における断面積よりも小さくなるので、応力吸収領域13h1は、枠状部材13に加わる応力を吸収することができる。また、応力吸収領域13h1は、基体11の熱膨張に応じて変形して応力を吸収して枠状部材13の反り等の発生を抑制することができる。
As shown in FIG. 6A, when the region including the frame-like member 13 and the base 11 is viewed along the line L1 and the line L2, the cross-sectional area in the line L1 provided with the through hole 13e is the through-hole. Since it is smaller than the cross-sectional area in the line L2 in which the hole 13e is not provided, the stress absorbing region 13h1 can absorb the stress applied to the frame member 13. Further, the stress absorbing region 13h1 can be deformed in accordance with the thermal expansion of the base 11 to absorb the stress and suppress the occurrence of warp or the like of the frame-shaped member 13.
また、枠状部材13は、第１の接合部材12によって基体11の上面に接合されている。枠状
部材13は、図７に示すように、第１の接合部材12が貫通孔13eの内壁面を含むように、す
なわち、第１の接合部材12が貫通孔13eの内壁面にも付着して基体11の上面に接合されて
いる。このように、枠状部材13は、第１の接合部材12が貫通孔13eの内壁面を含んで基体11の上面に接合されているので、基体11との接合領域が大きくなり、基体11との接合性が
向上する。
The frame-like member 13 is joined to the upper surface of the base 11 by the first joining member 12. As shown in FIG. 7, the frame-like member 13 is attached so that the first joining member 12 includes the inner wall surface of the through hole 13e, that is, the first joining member 12 also adheres to the inner wall surface of the through hole 13e. Are bonded to the upper surface of the substrate 11. Thus, the frame-shaped member 13 has the first joining member 12 joined to the upper surface of the base 11 including the inner wall surface of the through hole 13e. Bondability is improved.
このように、枠状部材13は、貫通孔13eを設けることによって、隣接する貫通孔13eの間の応力吸収領域13h1が外側からの応力に対して吸収効果が向上するので、蓋体15と枠状部材13との接合部に応力が伝わりにくくなり、蓋体15と枠状部材13との剥がれが生じにくくなる。
Thus, since the frame-like member 13 is provided with the through-hole 13e, the stress-absorbing region 13h1 between the adjacent through-holes 13e improves the absorption effect against the stress from the outside, so the lid 15 and the frame Stress is less likely to be transmitted to the joint portion with the member 13 and peeling between the lid 15 and the frame member 13 is less likely to occur.
応力吸収部の構造を貫通孔13ｅとした場合には、貫通孔13eが設けられたラインL1にお
ける断面積は、凹部13bを形成した場合の断面積より小さくすることができるので、外側
からの応力の応力吸収効果が向上して、枠状部材13と蓋体15との接続部に伝わりにくくなる。また、貫通孔13eは、枠状部材13にプレス加工等によって形成することができるので
、貫通孔13eを枠状部材13に形成する際の工数の増加が少なく、量産性に優れた枠状部材13の応力吸収部となる。
When the structure of the stress absorbing portion is the through-hole 13e, the cross-sectional area in the line L1 provided with the through-hole 13e can be made smaller than the cross-sectional area when the concave portion 13b is formed. This improves the stress absorption effect, and is less likely to be transmitted to the connection portion between the frame member 13 and the lid 15. Further, since the through-hole 13e can be formed in the frame-shaped member 13 by pressing or the like, the frame-shaped member is excellent in mass productivity with little increase in man-hours when forming the through-hole 13e in the frame-shaped member 13. 13 stress absorption parts.
ここで、枠状部材13の貫通孔13eの他の例について以下に説明する。
Here, another example of the through hole 13e of the frame member 13 will be described below.
枠状部材13は、貫通孔13ｅの外縁が、基体11の外縁よりも外側に位置しており、貫通孔13eの一部が基体11の外縁よりも外側に位置するように設けられていてもよい。枠状部材13は、図８（ａ）および図９（ａ）に示すように、貫通孔13eの一部が基体11の外縁よりも外側に位置するように設けられており、基体11の外縁は貫通孔13eの中央部に位置してい
る。なお、基本11の外縁は貫通孔13eの中央部からずれて位置していてもよい。また、平
面視において、枠状部材13は、貫通孔13eの一部が基体11に重なるとともに一部が基体11
の外縁よりも外側に位置している。
The frame-like member 13 may be provided such that the outer edge of the through hole 13e is located outside the outer edge of the base 11, and a part of the through hole 13e is located outside the outer edge of the base 11. Good. As shown in FIGS. 8A and 9A, the frame-like member 13 is provided so that a part of the through hole 13e is located outside the outer edge of the base 11, and the outer edge of the base 11 Is located at the center of the through hole 13e. Note that the outer edge of the base 11 may be positioned so as to be displaced from the central portion of the through hole 13e. In plan view, the frame-shaped member 13 has a part of the through hole 13e overlapping the base 11 and a part of the base 11
It is located outside the outer edge.
例えば、電子装置の実装時に、特に枠状部材13の応力吸収領域13h1の基体11と接合していない部分が、すなわち、応力吸収領域13h1において基体11の外側に位置している部分が変形しやすくなるので、枠状部材13に加わる応力は、枠状部材13に加わる応力が枠状部材13の応力吸収領域13h1の基体11と接合していない部分に吸収されて、蓋体15の外周縁部の枠状部材13との接合部まで伝わりにくくなり、蓋体15が枠状部材13から剥れにくくなる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。
For example, when the electronic device is mounted, a portion of the frame member 13 that is not joined to the base 11 of the stress absorbing region 13h1, that is, a portion that is located outside the base 11 in the stress absorbing region 13h1, is easily deformed. Therefore, the stress applied to the frame-shaped member 13 is absorbed by the portion of the stress-absorbing region 13h1 of the frame-shaped member 13 where the stress applied to the frame-shaped member 13 is not joined to the base 11, and the outer peripheral edge of the lid 15 Therefore, the lid 15 is difficult to be peeled off from the frame-shaped member 13. Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period.
また、貫通孔13eの蓋体15側の内壁面は、第１の接合部材12が付着するように設けられ
ているので、基体11と枠状部材13との接合領域が大きくなり、基体11と枠状部材13との接合性が向上する。
Further, since the inner wall surface on the lid 15 side of the through hole 13e is provided so that the first bonding member 12 adheres, the bonding area between the base 11 and the frame-like member 13 is increased, and the base 11 Bondability with the frame-like member 13 is improved.
また、枠状部材13は、貫通孔13eの外縁だけでなく、貫通孔13eが基体11の外縁よりも外側に位置するように設けられていてもよい。図８（ｂ）に示すように、貫通孔13eは、基
体11の外縁よりも外側の枠状部材13に設けられている。そして、隣接する貫通孔13eの間
の応力吸収領域13h1が基体11に接合されていない。例えば、電子装置の実装時に、枠状部材13の応力吸収領域13h1が変形しやすいので、枠状部材13に加わる力は、枠状部材13の応力吸収領域13h1に吸収されて蓋体15の外周縁部の枠状部材13との接合部まで伝わりにくくなり、蓋体15が枠状部材13から剥がれにくくなる。また、枠状部材13と基体11との接合領域が大きくなり、枠状部材13と基体11の外縁部との接合部は変形しにくく、枠状部材13が基体11から剥がれにくくなる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。なお、貫通孔13eは、基本11の外縁よりも
外側で孔部13cよりも内側に設けられる。
Further, the frame-like member 13 may be provided so that the through-hole 13e is located not only on the outer edge of the through-hole 13e but also on the outer side of the outer edge of the base 11. As shown in FIG. 8B, the through hole 13 e is provided in the frame-like member 13 outside the outer edge of the base body 11. The stress absorbing region 13h1 between the adjacent through holes 13e is not joined to the base 11. For example, since the stress absorbing region 13h1 of the frame-shaped member 13 is easily deformed when the electronic device is mounted, the force applied to the frame-shaped member 13 is absorbed by the stress absorbing region 13h1 of the frame-shaped member 13 and the outside of the lid 15 It is difficult for the peripheral portion to join to the frame-shaped member 13 and the lid 15 is difficult to peel off from the frame-shaped member 13. In addition, the joining region between the frame-shaped member 13 and the base 11 is increased, the joint between the frame-shaped member 13 and the outer edge of the base 11 is not easily deformed, and the frame-shaped member 13 is difficult to peel off from the base 11. Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period. The through hole 13e is provided outside the outer edge of the base 11 and inside the hole 13c.
また、枠状部材13は、主面（上面）には第１の貫通孔13eに隣接するとともに平行にな
るように第２の貫通孔13fが設けられていてもよい。枠状部材13は、この隣接する第２の
貫通孔13fの間を第２の応力吸収領域13h2としている。また、図８（ｃ）または図９（ｂ
）に示すように、平面視において、第２の貫通孔13fは基体11の外縁よりも外側に位置し
ており、この第２の応力吸収領域13h2は、基体11には接合されていない。
The frame-like member 13 may be provided with a second through hole 13f on the main surface (upper surface) so as to be adjacent to and parallel to the first through hole 13e. The frame-shaped member 13 forms a second stress absorption region 13h2 between the adjacent second through holes 13f. Further, FIG. 8C or FIG.
), The second through hole 13f is located outside the outer edge of the base 11 in plan view, and the second stress absorption region 13h2 is not joined to the base 11.
例えば、電子装置の実装時に、枠状部材13に加わる応力は、第２の貫通孔13fが基体11
と接合していないので、第２の応力吸収領域13h1が変形しやすくなり、枠状部材13に加わる応力が第２の応力吸収領域13h1に吸収されるとともに、応力吸収領域13h1によっても、蓋体15の外周縁部の枠状部材13の接合部まで伝わりにくくなり、蓋体15が枠状部材13から剥れにくくなる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。
For example, when the electronic device is mounted, the stress applied to the frame member 13 is caused by the second through-hole 13f in the base 11.
Since the second stress absorbing region 13h1 is easily deformed, the stress applied to the frame-like member 13 is absorbed by the second stress absorbing region 13h1, and the lid is also formed by the stress absorbing region 13h1. It is difficult for the outer peripheral edge of the frame-like member 13 to be transmitted to the joining portion of the frame-like member 13, and the lid 15 is difficult to peel off from the frame-like member 13. Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period.
第２の貫通孔13fは、第１の貫通孔13ｅと孔部13cとの間に設けられていればよく、図９（ｂ）に示すように、第１の貫通孔13eに対して、隣接して直線形状に配置されていても
、また、第１の貫通孔13ｅを囲むように配置されていてもよい。また、第２の貫通孔13f
は、図９（ｂ）に示すように、第１の貫通孔13eに対して、並列に設けられているが、こ
れに限らず、第１の応力吸収領域13h1と第２の応力吸収領域13h2の位置がｙ方向にずれるように設けられていてもよい。すなわち、第１の応力吸収領域13h1と第２の応力吸収領域13h2との中心位置が互いにｙ方向にずれて配置さていてもよい。
The second through hole 13f only needs to be provided between the first through hole 13e and the hole 13c, and is adjacent to the first through hole 13e as shown in FIG. 9B. Then, they may be arranged in a straight line shape, or may be arranged so as to surround the first through hole 13e. Also, the second through hole 13f
As shown in FIG. 9B, the first through hole 13e is provided in parallel, but not limited to this, the first stress absorbing region 13h1 and the second stress absorbing region 13h2 are provided. May be provided so as to be displaced in the y direction. That is, the center positions of the first stress absorption region 13h1 and the second stress absorption region 13h2 may be arranged so as to be shifted from each other in the y direction.
ここで、枠状部材１３の貫通項13eの他の例について説明する。
Here, another example of the penetrating item 13e of the frame member 13 will be described.
貫通孔13gは枠状部材13の内部で貫通孔の開口部の大きさが異なっていてもよい。貫通
孔13gは、図１０および図１１に示すように、枠状部材13の上面側に貫通孔の開口部の大
きな部分と枠状部材13の下面側に上面側よりも貫通孔の開口部が小さい部分とを有している。貫通孔13gは、内部に段差部を有する形状となっている。このように、貫通孔13ｇは
、異なった開口部の大きさの貫通孔を有しており、枠状部材13を上面から下面にかけて貫通しており、平面視において枠状部材13の開口部を囲むように設けられている。なお、以下、枠状部材13の上面側の貫通孔の開口部の大きな部分を第１の貫通部とし、枠状部材13の下面側の上面側よりも貫通孔の開口部の小さい部分を第２の貫通部として説明する。
In the through hole 13g, the size of the opening of the through hole may be different inside the frame-shaped member 13. As shown in FIGS. 10 and 11, the through-hole 13 g has a large portion of the opening of the through-hole on the upper surface side of the frame-shaped member 13 and an opening of the through-hole on the lower surface side of the frame-shaped member 13 than the upper surface side. And has a small part. The through hole 13g has a shape having a step portion inside. Thus, the through-hole 13g has through-holes having different opening sizes, penetrates the frame-shaped member 13 from the upper surface to the lower surface, and the opening of the frame-shaped member 13 in plan view. It is provided to surround. Hereinafter, a large portion of the opening portion of the through hole on the upper surface side of the frame-shaped member 13 is referred to as a first through portion, and a portion having a smaller opening portion of the through hole than the upper surface side of the lower surface side of the frame-shaped member 13 is referred to as the first through portion. This will be described as the two through portions.
枠状部材13は、互いに隣接する貫通孔13gの間に位置する領域が応力吸収部として機能
する。すなわち、枠状部材13に貫通孔13gを設けることにより、隣接する貫通孔13gの間の領域が応力吸収部として機能する。また、枠状部材13に貫通孔13gを設けた場合には、貫
通孔13ｇは枠状部材13の第２の貫通部の下側の貫通孔の開口部の大きさが小さく、枠状部材13は基体11との接合領域を大きくすることができる。このように、枠状部材13は、貫通孔13gを設けることによって、枠状部材13に加わる応力を吸収して蓋体15との接続部に伝
わりにくくするとともに、基体11との接合部の変形を抑制することができる。また、貫通孔13gは、第１の貫通部と第2の貫通部の中心部が一致するように設けられているが、これに限らず、第１の貫通部と第2の貫通部との位置関係は適宜設定される。
In the frame-like member 13, a region located between mutually adjacent through holes 13g functions as a stress absorbing portion. That is, by providing the through-hole 13g in the frame-shaped member 13, the region between the adjacent through-holes 13g functions as a stress absorbing portion. Further, when the through-hole 13g is provided in the frame-shaped member 13, the through-hole 13g has a small size of the opening of the through-hole below the second through-portion of the frame-shaped member 13, and the frame-shaped member 13 Can increase the bonding area with the substrate 11. As described above, the frame-like member 13 is provided with the through-hole 13g, so that the stress applied to the frame-like member 13 is absorbed and is not easily transmitted to the connection portion with the lid 15, and the joint portion with the base body 11 is deformed. Can be suppressed. Moreover, although the through-hole 13g is provided so that the center part of the 1st penetration part and the 2nd penetration part may correspond, not only this but the 1st penetration part and the 2nd penetration part The positional relationship is set as appropriate.
ここで、枠状部材13の貫通孔13gの他の例について説明する。
Here, another example of the through hole 13g of the frame member 13 will be described.
また、貫通孔13gは、枠状部材13の内部で貫通孔の開口部の大きさが異なり、内部に第
１の貫通部と第２の貫通部とを有して、外縁が基体11の外縁よりも外側に位置していてもよい。図１２（ａ）および図１３（ａ）に示すように、貫通孔13gは、第１の貫通部と第
２の貫通部が互いに異なる大きさの開口部を有しており、枠状部材13を上面から下面にか
けて貫通して枠状部材13の開口部を囲むように設けられている。貫通孔13gは、内部に段
差部を有する形状となっている。また、図１３（ａ）では、貫通孔13gは、枠状部材13の
短辺方向と長辺方向とで上面側の貫通孔13gの開口部の大きさが異なっているが、同じ大
きさの開口部になるように設けてもよい。
The through hole 13g has a different size of the opening of the through hole inside the frame-like member 13 and has a first through part and a second through part inside, and the outer edge is the outer edge of the base body 11. It may be located outside. As shown in FIGS. 12A and 13A, the through-hole 13g has an opening having a size different from each other in the first and second penetrating portions. Is provided so as to penetrate from the upper surface to the lower surface and surround the opening of the frame-shaped member 13. The through hole 13g has a shape having a step portion inside. In FIG. 13A, the through hole 13g has the same size although the size of the opening of the through hole 13g on the upper surface side differs between the short side direction and the long side direction of the frame-like member 13. You may provide so that it may become an opening part.
図１３（ａ）に示すように、平面視において、枠状部材13の貫通孔13gの外縁が、基体11の外縁よりも外側に位置しており、貫通孔13gの一部が基体11の外縁よりも外側に位置するように設けられている。例えば、電子装置の実装時に、枠状部材13に加わる応力は、隣接する貫通孔13gの間の応力吸収領域のうちの基体11と接合していない部分が変形しやす
くなり、隣接する貫通孔13gの間の応力吸収領域のうちの基体11と接合していない部分に
吸収されて、蓋体15の外周縁部まで伝わりにくくなり、蓋体15が枠状部材13から剥れにくくなる。
As shown in FIG. 13A, in plan view, the outer edge of the through hole 13g of the frame-like member 13 is located outside the outer edge of the base 11, and a part of the through hole 13g is the outer edge of the base 11. It is provided so that it may be located outside. For example, when the electronic device is mounted, the stress applied to the frame-shaped member 13 is easily deformed in the portion of the stress absorption region between the adjacent through holes 13g that is not joined to the base 11, and the adjacent through holes 13g. In the stress absorption region between the two, the portion is not absorbed by the portion that is not joined to the base body 11 and is hardly transmitted to the outer peripheral edge portion of the lid body 15, and the lid body 15 is difficult to peel off from the frame-shaped member 13.
これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。なお、貫通孔13g外縁が基体11の外縁より外側に位置しているとは、貫
通孔13ｇの第2の貫通部の外縁が基体11の外縁より外側に位置していることを言う。また
、貫通孔13ｇは、第２の貫通部が上側に位置する第１の貫通部の中心部に設けられているが、これに限らない。また、第２の接合部材12が貫通孔13gの第２の貫通部に付着するよ
うに設けることで、基体11と枠状部材13との接合性が向上する。
Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period. The phrase “the outer edge of the through hole 13g is located outside the outer edge of the base 11” means that the outer edge of the second through portion of the through hole 13g is located outside the outer edge of the base 11. Moreover, although the through-hole 13g is provided in the center part of the 1st penetration part in which the 2nd penetration part is located above, it is not restricted to this. Further, by providing the second bonding member 12 so as to adhere to the second through portion of the through hole 13g, the bonding property between the base 11 and the frame-shaped member 13 is improved.
また、枠状部材13は、貫通孔13gが枠状部材13の内部で貫通孔の開口部の大きさが異な
り、第１の貫通部と第２の貫通部が互いに異なる大きさの開口部を有するとともに、第１の貫通部の内縁と第２の貫通部の内縁とが揃っており、枠状部材13を上面から下面にかけて貫通して、枠状部材13の開口部を囲むように設けられていてもよい。
Further, the frame-shaped member 13 has through-holes 13g having different sizes of openings in the through-holes inside the frame-shaped member 13, and the first through-hole and the second through-hole have different sizes of openings. And the inner edge of the first penetrating part and the inner edge of the second penetrating part are aligned so as to pass through the frame-shaped member 13 from the upper surface to the lower surface and surround the opening of the frame-shaped member 13. It may be.
図１２（ｂ）に示すように、貫通孔13ｇが基体11の外縁よりも外側に位置しており、電子装置の実装時に、基体11と接合していない応力吸収領域が変形しやすく、枠状部材13に加わる応力は、隣接する貫通孔13gの間の応力吸収領域に吸収されて蓋体15の外周縁部の
枠状部材13との接合部まで伝わりにくくなり、枠状部材13が基体11からより剥がれにくくなる。また、枠状部材13は、貫通孔13gの基体15側が外周側よりも変形しにくく、枠状部
材13に加わる応力が蓋体15と枠状部材13との接合部に伝わりにくくすることができる。これによって、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。なお、貫通孔13ｇは、図１２（ｂ）のように、下側に位置する第２の貫通部が上側に位置する第１の貫通部の内側に合わせて設けられているが、これに限らず、第１の貫通部の外側に合わせて下側に位置する第２の貫通部を設けてもよい。また、第２の接合部材12が貫通孔13gの第２の貫通部に付着するように設けることで、基体11と枠状部材13との接合性が向上する。
As shown in FIG. 12B, the through-hole 13g is located outside the outer edge of the base 11, and the stress absorption region that is not joined to the base 11 is easily deformed when the electronic device is mounted. The stress applied to the member 13 is absorbed in the stress absorption region between the adjacent through holes 13g and is not easily transmitted to the joint portion with the frame-like member 13 on the outer peripheral edge of the lid 15, so that the frame-like member 13 becomes the base 11 More difficult to peel off. Further, the frame-shaped member 13 is less likely to be deformed on the base 15 side of the through-hole 13g than the outer peripheral side, and the stress applied to the frame-shaped member 13 is not easily transmitted to the joint between the lid 15 and the frame-shaped member 13. . Thus, the electronic device can protect the electronic element 2 from the external environment for a longer period. As shown in FIG. 12B, the through hole 13g is provided so that the second through part located on the lower side is aligned with the inside of the first through part located on the upper side, but this is not limitative. Instead, a second penetrating portion located on the lower side may be provided in accordance with the outside of the first penetrating portion. Further, by providing the second bonding member 12 so as to adhere to the second through portion of the through hole 13g, the bonding property between the base 11 and the frame-shaped member 13 is improved.
また、枠状部材13は、貫通孔13gが枠状部材13の内部で貫通孔の開口部の大きさが異な
り、第１の貫通部と第２の貫通部が互いに異なる大きさの開口部を有するとともに、第１の貫通部の下に複数の第２の貫通部を有しており、枠状部材13を上面から下面にかけて貫通して、枠状部材13の開口部を囲むように設けられていてもよい。貫通孔13gは、図１２
（ｃ）および図１３（ｂ）に示すように、枠状部材13の上側に位置する第１の貫通部の下に上側に位置する貫通孔よりも貫通孔径が小さい第２の貫通部が複数個設けられている。図１２（ｃ）では、第２の貫通部が２つ設けられている場合を例示しているが、これに限らない。
Further, the frame-shaped member 13 has through-holes 13g having different sizes of openings in the through-holes inside the frame-shaped member 13, and the first through-hole and the second through-hole have different sizes of openings. And having a plurality of second through portions below the first through portion, penetrating the frame-shaped member 13 from the upper surface to the lower surface, and surrounding the opening of the frame-shaped member 13 It may be. The through hole 13g is shown in FIG.
As shown in FIG. 13C and FIG. 13B, a plurality of second through portions having a through hole diameter smaller than the through hole located above the first through portion located above the frame-shaped member 13 are provided. One is provided. Although FIG. 12C illustrates a case where two second through portions are provided, the present invention is not limited to this.
また、下側に位置する第２の貫通部が枠状部材13の外側に設けられており、この第２の貫通部が基体11の外縁よりも外側に位置している。例えば、電子装置の実装時に、隣接する貫通孔13gの間の第２の貫通部で位置する第２の貫通部を含む部分の応力吸収領域が変
形しやすくなり、この応力吸収領域で枠状部材13に加わる応力が吸収されるとともに、内側の第２の貫通部よって蓋体15の外周縁部まで伝わりにくくなる。また、第２の接合部材14が枠状部材13から剥れにくくなることで、電子装置は、電子素子２を外部の環境からより長期に保護することができるようになる。なお、貫通孔13ｇは、孔部13cが設けられた
辺側に設けられていればよく、図１３（ｂ）に示されているように直線形状を有していても、また、枠状部材13の開口部を囲むような形状であってもよい。第２の接合部材12が貫通孔13gの第２の貫通部の内壁面に付着するように設けることによって、基体11と枠状部
材13との接合性が向上する。また、枠状部材13は、貫通孔13gが中央部（貫通孔13gが設けられていない領域）で基体11と接合されるように設けられているので、基体11と枠状部材13との接合性が向上する。
Further, a second penetrating portion located on the lower side is provided outside the frame-shaped member 13, and the second penetrating portion is located outside the outer edge of the base 11. For example, when the electronic device is mounted, the stress absorption region of the portion including the second through portion located at the second through portion between the adjacent through holes 13g is likely to be deformed. The stress applied to 13 is absorbed, and it is difficult for the stress to be transmitted to the outer peripheral edge of the lid body 15 by the second inner through portion. In addition, since the second bonding member 14 is less likely to be peeled off from the frame-like member 13, the electronic device can protect the electronic element 2 from the external environment for a longer period. The through-hole 13g only needs to be provided on the side where the hole 13c is provided. Even though the through-hole 13g has a linear shape as shown in FIG. The shape may surround the 13 openings. By providing the second bonding member 12 so as to adhere to the inner wall surface of the second through portion of the through hole 13g, the bondability between the base 11 and the frame-shaped member 13 is improved. In addition, since the frame-shaped member 13 is provided so that the through-hole 13g is bonded to the base 11 at the central portion (a region where the through-hole 13g is not provided), the bonding between the base 11 and the frame-shaped member 13 is performed. Improves.
また、貫通孔13gは、枠状部材13の厚み方向に第１の貫通部と第２の貫通部を有してい
るが、この構成に限定はされない。例えば、貫通孔13gは、枠状部材13の上面から下面に
かけて開口部の大きさが漸次小さくなる構成であっても、枠状部材13の上面から下面にかけて開口部の大きさが漸次大きくなる構成であってもよい。
Moreover, although the through-hole 13g has the 1st penetration part and the 2nd penetration part in the thickness direction of the frame-shaped member 13, it is not limited to this structure. For example, the through hole 13g has a configuration in which the size of the opening gradually increases from the top surface to the bottom surface of the frame-shaped member 13 even if the size of the opening gradually decreases from the top surface to the bottom surface of the frame-shaped member 13. It may be.
ここで、さらに、枠状部材13の貫通孔13eの他の例について説明する。
Here, another example of the through hole 13e of the frame-like member 13 will be further described.
図１４（ａ）および図４（ｂ）に示すように、枠状部材13は、蓋体15との接合部に設けられた貫通孔13ｅを含んでおり、第２の接合部材14は、貫通孔13ｅの下面に位置する基体11に付着していてもよい。このように、第２の接合部材14は、枠状部材13の厚みの分だけの厚さを厚くすることができ、蓋体15と枠状部材13との熱膨張係数差によって生じる応力を吸収しやすくなる。例えば、電子装置を実装時に枠状部材13に加わる応力だけでなく、枠状部材13と蓋体15との熱膨張係数の違いにより発生する応力で蓋体15が枠状部材13から剥れる可能性を低減させることができる。
As shown in FIGS. 14 (a) and 4 (b), the frame-like member 13 includes a through hole 13e provided in a joint portion with the lid body 15, and the second joint member 14 has a through hole. You may adhere to the base | substrate 11 located in the lower surface of the hole 13e. Thus, the second joining member 14 can be thickened by the thickness of the frame-like member 13 and absorbs stress caused by the difference in thermal expansion coefficient between the lid 15 and the frame-like member 13. It becomes easy to do. For example, the lid 15 can be peeled off from the frame-shaped member 13 not only by the stress applied to the frame-shaped member 13 when mounting the electronic device, but also by the stress generated by the difference in thermal expansion coefficient between the frame-shaped member 13 and the lid 15 Can be reduced.
また、枠状部材13の貫通孔13gの他の例について説明する。
Another example of the through hole 13g of the frame member 13 will be described.
同様に、図１４（ｃ）に示すように、枠状部材13は、蓋体15との接合部に設けられた貫通孔13ｇを含んでおり、貫通孔13gが第１の貫通部と第２の貫通部とで段差部を有してい
る。第２の接合部材14は、貫通孔13ｇの第１の貫通部と第２の貫通部の貫通孔の開口部の大きさの差による段差の上面に付着していてもよい。第２の接合部材14は、貫通孔13ｇの段差の分だけ厚さを厚くすることができ、蓋体15と枠状部材13との熱膨張係数差によって生じる応力を吸収しやすくなり、電子装置を実装時に枠状部材13に加わる応力だけでなく、蓋体15と枠状部材13との熱膨張係数の違いにより発生する応力で蓋体15が枠状部材13から剥れる可能性を低減させることができる。
Similarly, as shown in FIG. 14C, the frame-like member 13 includes a through-hole 13g provided at a joint portion with the lid body 15, and the through-hole 13g is connected to the first through-portion and the second through-hole 13g. A step portion is formed between the through portion and the through portion. The second bonding member 14 may be attached to the upper surface of the step due to the difference in size between the opening portions of the first through portion and the second through portion of the through hole 13g. The second joining member 14 can be thickened by the level difference of the through-hole 13g, and can easily absorb the stress generated by the difference in thermal expansion coefficient between the lid 15 and the frame-like member 13, and the electronic device This reduces not only the stress applied to the frame-like member 13 during mounting, but also the possibility that the lid 15 peels from the frame-like member 13 due to the stress generated by the difference in thermal expansion coefficient between the lid 15 and the frame-like member 13. be able to.
（実施の形態３）
本発明の第３の実施形態(実施の形態３という)における電子装置および電子素子収納用パッケージ1Cについて、図１５を参照しながら以下に説明する。
(Embodiment 3)
An electronic device and an electronic element storage package 1C according to a third embodiment (referred to as Embodiment 3) of the present invention will be described below with reference to FIG.
図１５に示すように、本発明の第２の実施形態(実施の形態３という)における電子装置は、電子素子収納用パッケージ1C(以下、パッケージ1Cともいう)と、パッケージ1Cに実装された電子素子２とを含んでいる。なお、電子素子収容用パッケージ1Aと異なる点は、貫通孔13eの配置である。また、本実施形態における電子装置は、例えば、撮像装置等であ
る。なお、図１５（ａ）において、基体11は枠状部材13を透視した状態で破線によって示されている。
As shown in FIG. 15, an electronic device according to a second embodiment (referred to as a third embodiment) of the present invention includes an electronic element housing package 1C (hereinafter also referred to as a package 1C) and an electronic device mounted on the package 1C. Element 2 is included. The difference from the electronic element housing package 1A is the arrangement of the through holes 13e. Moreover, the electronic device in this embodiment is an imaging device etc., for example. In FIG. 15A, the base 11 is indicated by a broken line in a state where the frame-like member 13 is seen through.
電子素子収納用パッケージ1Cは、枠状部材13が、図１５に示すように、貫通孔13eの外
縁が基体11の外縁よりも外側に位置しており、開口部11eを取り囲むように設けられてい
る。そして、枠状部材13は、四角形状を有しており、貫通孔13eが角部に沿った形状で枠
状部材13の各内周角部に沿って設けられているとともに、隣接する貫通孔13eの間の領域
、すなわち、応力緩和領域13h1が枠状部材13の各辺部の中央部に位置している。貫通孔13eは、図１５に示すように、角部に沿ったＬ字形状を有しており、そのＬ字形状の貫通孔13eが枠状部材13の各内周角部に沿って設けられている。そして、枠状部材13は、Ｌ字形状の貫通孔13eの端部同士が枠状部材13eの辺部の中央部で互いに対向している。このように、枠状部材13は、貫通孔13eが各内周角部に沿ってＬ字形状で設けられているので、辺部
の中央部において内周部と外周部とが繋がるような形状となっている。
As shown in FIG. 15, the electronic element storage package 1C has a frame-like member 13 such that the outer edge of the through hole 13e is located outside the outer edge of the base 11, and surrounds the opening 11e. Yes. The frame-shaped member 13 has a quadrangular shape, and through holes 13e are provided along the inner peripheral corners of the frame-shaped member 13 in a shape along the corners, and adjacent through holes. The region between 13e, that is, the stress relaxation region 13h1 is located at the center of each side of the frame-shaped member 13. As shown in FIG. 15, the through-hole 13 e has an L shape along the corner, and the L-shaped through hole 13 e is provided along each inner peripheral corner of the frame-shaped member 13. ing. In the frame-like member 13, the ends of the L-shaped through holes 13e are opposed to each other at the center of the side portion of the frame-like member 13e. Thus, the frame-like member 13 has a shape in which the inner peripheral portion and the outer peripheral portion are connected to each other at the central portion of the side portion because the through-hole 13e is provided in an L shape along each inner peripheral corner portion. It has become.
また、貫通孔13eの幅は、Ｌ字形状において同じ幅で設けられているが、これに限らな
い。貫通孔13eは、Ｌ字形状において部分的に幅が異なっていてもよい。例えば、枠状部
材13は、Ｌ字形状において貫通孔13eの幅が角部の近傍で広くなるように設けられていて
もよい。
Moreover, although the width | variety of the through-hole 13e is provided with the same width in L shape, it is not restricted to this. The through hole 13e may have a partially different width in an L shape. For example, the frame-shaped member 13 may be provided so that the width of the through hole 13e is wide in the vicinity of the corner in the L shape.
このように、枠状部材13は、貫通孔13eが枠状部材13の各内周角部に沿って設けられて
いるので、この枠状部材13の各内周角部の領域において、枠状部材13と基体11との接合部分と枠状部材13の貫通孔13eよりも外側の部分とは直接繋がっていない状態になる。すな
わち、枠状部材13は、枠状部材13の各内周角部の領域において、貫通孔13ｅよりも内側部分と貫通孔13eよりも外側部分とが存在することになり、枠状部材13の内側部分（内周部
）と外側部分（外周部）との間に貫通孔13eが介在することによって、枠状部材13と基体11との接合部分と枠状部材13の貫通孔13eよりも外側の部分とは直接繋がっていない状態になる。
Thus, since the frame-shaped member 13 is provided with the through holes 13e along the respective inner peripheral corners of the frame-shaped member 13, the frame-shaped member 13 has a frame-like shape in the region of each inner peripheral corner of the frame-shaped member 13. The joining portion between the member 13 and the base 11 is not directly connected to the portion outside the through hole 13e of the frame-like member 13. That is, the frame-shaped member 13 has an inner portion than the through-hole 13e and an outer portion than the through-hole 13e in each inner peripheral corner region of the frame-shaped member 13, and the frame-shaped member 13 The through hole 13e is interposed between the inner part (inner peripheral part) and the outer part (outer peripheral part), so that the joint part between the frame-like member 13 and the base 11 and the through-hole 13e of the frame-like member 13 are outside. It is in a state that is not directly connected to the part.
枠状部材13と基体11とは第１の接合部材12で全周にわたって接合されており、枠状部材13の角部の領域では、枠状部材13と基体11との接合部分と枠状部材13の外周部との間に貫通孔13が設けられているので、枠状部材13の外周部が基体11とは接合されておらず、基体11は、枠状部材13との熱膨張係数の違いによる応力の影響を受けにくくなる。
The frame-like member 13 and the base 11 are joined over the entire circumference by the first joining member 12, and in the corner area of the frame-like member 13, the joint between the frame-like member 13 and the base 11 and the frame-like member Since the through hole 13 is provided between the outer peripheral portion of the frame 13, the outer peripheral portion of the frame-shaped member 13 is not joined to the base 11, and the base 11 has a coefficient of thermal expansion with the frame-shaped member 13. Less susceptible to stress due to differences.
枠状部材13は、辺部の中央部において内周部と外周部とが繋がるような形状であり、各辺部の中央部に隣接する貫通孔13eの間の応力緩和領域13h1が位置しており、外周部が各
辺部の中央部の反りに対する影響が最も小さい領域で基体11に接合されることになる。例えば、電子装置の実装基板への実装時または電子装置と光学系との組立時の位置合わせ時に、かりに、変形しやすい枠状部材13の外周部の角部に応力が加わって枠状部材13の外周部が反ったとしても、内周部には各辺の中央の応力緩和領域13h1を介して応力が伝わるため、枠状部材13の応力が加わった部分から応力緩和領域13h1までの部分が緩衝材として作用することにより、電子装置には反りに影響する応力が加わりにくく、枠状部材13と蓋体15とが剥がれにくくなる。
The frame-shaped member 13 has a shape in which the inner peripheral portion and the outer peripheral portion are connected at the central portion of the side portion, and the stress relaxation region 13h1 between the through holes 13e adjacent to the central portion of each side portion is located. Thus, the outer peripheral portion is joined to the base 11 in a region having the least influence on the warp of the central portion of each side portion. For example, when the electronic device is mounted on the mounting substrate or when the electronic device and the optical system are assembled, stress is applied to the corners of the outer peripheral portion of the frame-shaped member 13 that is easily deformed, and the frame-shaped member 13 Even if the outer periphery of the frame is warped, the stress is transmitted to the inner periphery via the stress relaxation region 13h1 at the center of each side, so the portion from the portion where the stress of the frame member 13 is applied to the stress relaxation region 13h1 By acting as a buffer material, the electronic device is unlikely to be subjected to stress that affects warping, and the frame-like member 13 and the lid 15 are less likely to peel off.
また、枠状部材13は、辺部の中央部において内周部と外周部とが繋がるような形状であり、各辺部の中央部に隣接する貫通孔13eの間の応力緩和領域13h1が位置しており、外周
部が各辺部の中央部の反りに対する影響が最も小さい領域で基体11に接合されることになり、かりに、基体11と枠状部材13との接合部分において、枠状部材13が基体11との熱膨張係数の違いによる応力によって反った（変形した）としても、内周部と外周部が繋がっているのは反り(変形)の影響の小さい各辺の中央部であるため、枠状部材13の外周部の角部に与える影響は小さい。したがって、枠状部材13の外周部は反り（変形し）にくく、実装基板に接続するための孔部13cへの影響が低減されるので、実装基板との実装時に枠状部
材13の変形がより発生しにくい電子装置となる。
Further, the frame-shaped member 13 has a shape such that the inner peripheral portion and the outer peripheral portion are connected at the central portion of the side portion, and the stress relaxation region 13h1 between the through holes 13e adjacent to the central portion of each side portion is located. The outer peripheral portion is bonded to the base body 11 in the region where the influence on the warp of the central portion of each side portion is the smallest, and the frame-shaped member is joined at the joint portion between the base body 11 and the frame-shaped member 13. Even if 13 is warped (deformed) by the stress due to the difference in thermal expansion coefficient with the base 11, the inner peripheral part and the outer peripheral part are connected to the central part of each side where the influence of the warp (deformation) is small. Therefore, the influence on the corner portion of the outer peripheral portion of the frame-shaped member 13 is small. Therefore, the outer peripheral portion of the frame-shaped member 13 is unlikely to warp (deform), and the influence on the hole 13c for connecting to the mounting board is reduced. Therefore, the frame-shaped member 13 is more deformed when mounted on the mounting board. The electronic device is less likely to occur.
また、図１５において、貫通孔13eは、基体11の外縁よりも外側に形成されているが、
貫通孔13eの内縁は、基体11の上面に位置していてもよい。
Further, in FIG. 15, the through hole 13 e is formed outside the outer edge of the base body 11.
The inner edge of the through hole 13e may be located on the upper surface of the base 11.
また、図１５においては枠状部材13と基体11とが接合している部分には貫通孔や凹部が形成されていないが、図１に示す凹部13bまたは図６に示す貫通孔13eと組み合わせても構わない。
Further, in FIG. 15, a through hole or a recess is not formed in a portion where the frame-shaped member 13 and the base 11 are joined, but in combination with the recess 13b shown in FIG. 1 or the through hole 13e shown in FIG. It doesn't matter.
蓋体15が水晶から成る場合には、撮像光学系中のローパスフィルターとして通常３枚使用される水晶中の１枚としての機能も同時に持たせることができるので、ローパスフィルターと蓋体15を合わせた構成から、蓋体としての品数を減らすことができるので、コスト低下や厚みを薄くできるので好ましい。
When the lid 15 is made of quartz, it can also function as one of the three quartz crystals normally used as a low-pass filter in the imaging optical system, so the low-pass filter and lid 15 are combined. Since the number of articles as the lid can be reduced, the cost can be reduced and the thickness can be reduced.
また、蓋体15は、透光性を有する基体の表面に設けられた、例えば、誘電体多層膜等の光学膜を有するものであってもよい。光学膜の例としては、特定の波長領域の光（例えば赤外光等）を反射して遮断するものである。ここで、蓋体15が基体の表面に設けられた光学膜を有する場合、蓋体15の基体の熱膨張係数（すなわち第２の熱膨張係数）とは、光学膜を含む蓋体15全体の熱膨張係数のことをいう。
Further, the lid 15 may have an optical film such as a dielectric multilayer film provided on the surface of a light-transmitting substrate. As an example of the optical film, light in a specific wavelength region (for example, infrared light) is reflected and blocked. Here, when the lid 15 has an optical film provided on the surface of the substrate, the thermal expansion coefficient of the substrate of the lid 15 (that is, the second thermal expansion coefficient) is the entire lid 15 including the optical film. It refers to the thermal expansion coefficient.
また、基体11に凹部11dまたは枠状部材13に凸部13aを形成した例を示したが、本発明は、凹部11dや凸部13aが形成されていない電子素子収納用パッケージやそれを使用した電子装置でも適用することができる。
In addition, an example in which the concave portion 11d is formed on the base 11 or the convex portion 13a is formed on the frame-like member 13 is shown. However, the present invention uses an electronic element housing package in which the concave portion 11d and the convex portion 13a are not formed or the same. It can also be applied to electronic devices.
