JP6208447B2 - Electronic element storage package and electronic device - Google Patents

Description

  The present invention relates to a package and an electronic apparatus in which an electronic element such as an imaging element is accommodated.

  A package (hereinafter also referred to as an electronic element storage package or package) used in an electronic device (for example, an imaging device) is a frame made of, for example, a ceramic material or the like and a metal material or the like and bonded to the substrate. A member and a lid made of, for example, a glass material and joined to the frame-like member by the joining member are included. In an electronic device, an electronic element (for example, an imaging element) is mounted on a base and covered with a lid.

JP 2010-238888

  However, since there is a difference in the coefficient of thermal expansion between the frame-shaped member and the lid of the package, for example, when the electronic device is assembled or the electronic device is in operation, the electronic device may be warped. There is a possibility that the bonding member bonded to the frame-shaped member may peel off.

An electronic element storage package according to an aspect of the present invention has a base including a cavity portion opened upward, a frame-shaped member made of a metal material and bonded to a peripheral region on the upper surface of the base, and has a light-transmitting property. A lid made of a material and joined to the upper surface of the frame-like member by the joining member so as to seal the cavity portion. The upper surface of the frame-like member includes a first recess provided in a portion where the lid is joined. In plan view, the first concave portion extends outward from the inner peripheral portion of the peripheral region on the upper surface of the base. The upper surface of the frame-shaped member includes a second recess, and the second recess is located outside the outer edge of the base body in plan view.
An electronic element storage package according to another aspect of the present invention has a base including a cavity portion opened upward, a frame-shaped member made of a metal material and bonded to a peripheral region on the upper surface of the base, and translucency. A lid made of a material and joined to the upper surface of the frame-like member by the joining member so as to seal the cavity portion. The upper surface of the frame-like member includes a first recess provided in a portion where the lid is joined. In plan view, the first concave portion extends outward from the inner peripheral portion of the peripheral region on the upper surface of the base. In plan view, the outer edge of the first recess of the frame-shaped member is located outside the outer edge of the base.

  In the electronic device according to one aspect of the present invention, the bonding member is formed such that the upper surface of the frame-shaped member includes a first recess provided in the bonding portion with the lid, and the lid is bonded to the frame-shaped member. By adhering to the recess, the thickness of the joining member can be increased by the depth of the recess, and it becomes easier to absorb the stress caused by the difference in thermal expansion coefficient between the lid and the frame-like member. The possibility of peeling from the shaped member can be reduced.

(A) is a top view which shows the electronic device in embodiment of this invention, (b) is a longitudinal cross-sectional view in the AA line of the electronic device shown by (a). (A) is a top view which shows the structure of the base | substrate in the electronic device shown by Fig.1 (a), (b) is a plane which shows the structure of the frame-shaped member in the electronic device shown by Fig.1 (a). FIG. It is an enlarged view of the principal part B of FIG. (A)-(c) is an enlarged view which shows the other example of the principal part of the electronic device shown by FIG.1 (b). (A) is a top view of the electronic device shown by Fig.4 (a), (b) is a top view of the electronic device shown by FIG.4 (b).

  Hereinafter, an electronic device according to an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1, 2, and 3, an electronic device according to an embodiment of the present invention includes an electronic element storage package 1 (hereinafter also referred to as a package 1) and an electronic element mounted on the package 1. 2 is included. The electronic device in this embodiment is an imaging device, for example. In FIG. 1A, the base 11 is indicated by a broken line with the frame-like member 13 seen through.

  The package 1 includes a base body 11, a frame-shaped member 13 bonded to a peripheral region on the upper surface of the base body 11, and a lid body 15 bonded to the upper surface of the frame-shaped member 13.

The substrate 11 is made of, for example, a ceramic material, and examples of the material include an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body, an aluminum nitride (AlN) sintered body, and the like.

The thermal expansion coefficient (hereinafter also referred to as the first thermal expansion coefficient) of the substrate 11 is about 7.2 × 10 ⁻⁶ / ° C. when the substrate 11 is made of, for example, aluminum oxide. If the substrate 11 is made of aluminum nitride, for example, the coefficient of thermal expansion of the substrate 11 is about 4.6 × 10 ⁻⁶ / ° C.

  As shown in FIG. 1B, the base 11 includes a bottom base 11a and a frame base 11b. When the base 11 is made of a ceramic material, the bottom base 11a and the frame base 11b. Are formed integrally by firing, for example. The cavity portion 11e of the base 11 is a space defined by the bottom base portion 11a and the frame base portion 11b.

  The bottom base portion 11a is a flat plate-like portion having a rectangular shape in plan view. The upper surface of the bottom base portion 11a has a mounting region 11c for the electronic element 2, and the mounting region 11c is located, for example, in the central region of the upper surface of the bottom base portion 11a.

  The frame base portion 11b has, for example, a shape and dimensions corresponding to the planar shape of the bottom base portion 11a, and has an opening corresponding to the mounting region 11c of the bottom base portion 11a. The frame base portion 11b has a plurality of recesses 11d for positioning with the frame-shaped member 13, and the plurality of recesses 11d are arranged in a plane.

  Here, “planarly arranged” means that at least three or more concave portions 11d are two-dimensionally arranged in a virtual xy plane direction as shown in FIG. Illustratively, the plurality of recesses 11d are arranged so as to surround the cavity 11e of the base 11. In the example shown in FIG. 2A, the plurality of recesses 11d are a total of four in the virtual x-axis direction and two in the virtual y-axis direction with reference to the central portion of the frame base portion 11b. One is provided.

  Each of the plurality of concave portions 11d has a shape extending along a radial straight line with the center portion of the frame base portion 11b as a reference. Each of the plurality of recesses 11d has, for example, a linear shape as illustrated.

  In FIG. 2A, the recess 11d is shown as a shape extending from the inside of the cavity portion 11e toward the outside of the base 1, but the recess 11d is formed from the outer edge side of the base 1 toward the inside. May be. The “concave portion” is a portion that is recessed from the upper surface to the lower surface of the frame base portion 11b, and as shown in the drawing, the inner wall is partially in contact with the edge of the lower surface of the frame base portion 11b in plan view. In addition to those which are not present in the above, those which are arranged away from the edge and have an inner wall over the entire circumference are also included.

If the substrate 11 is made of, for example, an aluminum oxide sintered body, first, an organic solvent suitable for the raw material powder such as alumina (Al ₂ O ₃ ) or silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. , A solvent is added and mixed to form a slurry, and this is formed into a sheet by a known doctor blade method or calendar roll method to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1,600 ° C. When the base 11 is made of an aluminum oxide sintered body, the mechanical strength is high, so that the base is unlikely to warp and has an appropriate thermal conductivity, so heat generated from the image sensor is dissipated to the outside. This is preferable because the mechanical strength, thermal conductivity, and cost are reasonable.

The frame member 13 is bonded to the upper surface of the base 11 by a first bonding member 12 such as a resin adhesive or a brazing material. The frame-like member 13 is joined in a peripheral region surrounding the cavity portion 11e on the upper surface of the base 11. The frame-like member 13 is made of, for example, a metal material and has an opening corresponding to the cavity 11e of the base 11. When the first bonding member 12 is a resin adhesive, the heat applied at the time of bonding can be suppressed to about 150 ° C. or lower, so that the base 11 has a difference in thermal expansion coefficient between the base 11 and the frame member 13. Warpage deformation is reduced, and an improvement in image quality can be obtained when the electronic element 2 is an image sensor.

When the frame member 13 is made of a metal material, an example of the material is SUS410 or 50 alloy. When the frame member 13 is made of SUS410, the thermal expansion coefficient of the frame member 13 (hereinafter also referred to as the second thermal expansion coefficient) is about 11 × 10 ⁻⁶ / ° C. When the frame-shaped member 13 is made of 50 alloy, the thermal expansion coefficient of the frame-shaped member 13 is about 9.8 × 10 ⁻⁶ / ° C.

  As shown in FIGS. 1B and 3, the frame-shaped member 13 has a plurality of convex portions 13 a corresponding to the plurality of concave portions 11 d of the base 11. The plurality of convex portions 13a are formed by etching, pressing, or the like.

  Note that the upper surface of the frame-shaped member 13 includes a recess 13b (also referred to as a first recess 13b) provided at a joint with the lid 15. The recess 13b has a shape that is recessed downward in the frame-shaped member 13, and is provided so as to surround the opening in plan view.

  The lid 15 is bonded to the upper surface of the frame-shaped member 13 by a second bonding member 14 such as a glass bonding member or a resin adhesive, for example, covers the electronic element 2 and seals the cavity portion 11e of the base 11. It has stopped.

The second bonding member 14 is attached to the bottom surface and the inner surface of the recess 13b of the frame-shaped member 13. When the second bonding member 14 is a resin adhesive, the heat applied at the time of sealing can be suppressed to about 150 ° C. or less. Therefore, when the electronic element 2 is an image sensor, it is disposed on the image sensor. Further, the image quality can be improved without damaging the organic color filter.

When the electronic device is, for example, an imaging device, the lid 15 is made of a light-transmitting material, and examples of the material include glass or quartz. The thermal expansion coefficient (hereinafter also referred to as a third thermal expansion coefficient) of the base body of the lid 15 is about 8.5 × 10 ⁻⁶ / ° C. when the lid 15 is made of glass. When the base body of the lid body 15 is made of quartz, the thermal expansion coefficient of the base body of the lid body 15 is about 11 × 10 ⁻⁶ / ° C.

In the electronic device of the present embodiment, the upper surface of the frame-like member 13 includes a first recess 13b provided at the joint portion with the lid body 15, and the lid body 15 is joined to the frame-like member 13. Since the second joining member 14 is attached to the recess 13b, the thickness of the second joining member 14 can be increased by the depth of the recess 13b, and the thermal expansion coefficient between the lid 15 and the frame-like member 13 can be increased. The stress caused by the difference can be easily absorbed, and the possibility that the lid 15 is peeled off from the frame-like member 13 can be reduced.

  In the electronic element housing package 1 of the present embodiment, the plurality of convex portions 13a of the frame-like member 13 are arranged in a plan view in plan view, and the frame-like member 13 has a plurality of convex portions with respect to the base body 11. When the positioning is performed by 13a, the variation in the planar position of the base 11 with respect to the frame member 13 can be reduced. Therefore, the electronic element storage package 1 of the present embodiment can realize an electronic module in which the variation in the planar position of the electronic element 2 with respect to the mounting substrate is reduced. In the case where the electronic element 2 is an image sensor, the variation in the planar position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

  In the electronic element housing package 1 of the present embodiment, the frame-shaped member 13 has positioning means (for example, the hole 13c shown in FIG. 1A) in the planar direction with respect to the mounting substrate. The electronic device is arranged so that the plane position is determined by the positioning means (for example, the hole 13c) and the positioning means of the mounting board (for example, a convex portion formed on the mounting board so as to fit into the hole 13c). When mounted, it is possible to reduce variations in the planar position of the electronic element 2 with respect to the mounting substrate. Therefore, the electronic device according to the present embodiment can realize an electronic module in which variation in the planar position of the electronic element 2 with respect to the mounting substrate is reduced. In the case where the electronic element 2 is an image sensor, the variation in the planar position of the electronic element (that is, the image sensor) 2 is reduced, and the image quality is improved.

The electronic element 2 is bonded to the cavity portion 11e of the base 11 with an adhesive or the like, and the terminals of the electronic element 2 and the terminals of the base 11 are electrically connected using a bonding wire or the like. By aligning the electronic element 2 with the concave portion 11d of the base 11 as a reference, the positional relationship between the electronic element 2 and the hole 13c of the frame-like member 13 can be accurately positioned. If the concave portion 11d of the base body 11 cannot be confirmed directly from the upper surface, alignment is performed with reference to the terminal of the base body 11, or a reference mark or the like is formed on the back surface of the convex portion 13a of the frame member 13, Even if the alignment is performed as a reference, the positioning can be performed accurately by using the structure of the present invention.

  4A and 5A, when the outer edge of the recess 13b of the frame-like member 13 is positioned outside the outer edge of the base 11 in a plan view. Since the stress applied when the electronic device is mounted is not easily transmitted to the second bonding member 14 due to the deformation of the portion where the recess 13b is formed and the metal is thin, the second bonding member is peeled off from the frame-shaped member. By becoming difficult, it becomes possible to protect the electronic device 2 from the external environment for a longer period.

  Further, as in the example shown in FIGS. 4B and 5B, the main surface (upper surface) of the frame member 13 has a second recess 13d, and the second recess 13d in plan view. Is outside the outer edge of the base 11, the stress applied during mounting of the electronic device is difficult to be transmitted to the second bonding member 14 due to the deformation of the portion where the second recess 13d is formed and the metal is thinned. Since the second joining member is less likely to peel from the frame-like member, the electronic element 2 can be protected from the external environment for a longer period. The second recess 13d only needs to be provided between the first recess 13b and the hole 13c. Even if the second recess 13d has a linear shape as shown in FIG. Moreover, the shape surrounding the 1st recessed part 13b may be sufficient.

  Furthermore, as in the example shown in FIG. 4C, the second recess 13 d may be formed on the lower surface, and even if a plurality of second recesses 13 d are formed, the stress is less likely to be transmitted to the second bonding member 14. It will be good.

When the lid 15 is made of quartz, it can also function as one of the three quartz crystals normally used as a low-pass filter in the imaging optical system, so the low-pass filter and lid 15 are combined. Since the number of articles as the lid can be reduced, the cost can be reduced and the thickness can be reduced.

  The lid 15 may have an optical film such as a dielectric multilayer film provided on the surface of a light-transmitting substrate. As an example of the optical film, light in a specific wavelength region (for example, infrared light) is reflected and blocked. Here, when the lid 15 has an optical film provided on the surface of the substrate, the thermal expansion coefficient of the substrate of the lid 15 (that is, the second thermal expansion coefficient) is the entire lid 15 including the optical film. It refers to the thermal expansion coefficient.

1 Electronic device storage package
11 Substrate
11a Bottom base
11b Frame base
11c Installation area
11d recess
11e Cavity
12 First joining member
13 Frame member
13a Convex
13b recess
13c hole
14 Second joining member
15 Lid 2 Electronic element

Claims (3)

A base including a cavity portion opened upward;
A frame-shaped member made of a metal material and bonded to a peripheral region on the upper surface of the base;
It is made of a light-transmitting material , and includes a lid that is bonded to the upper surface of the frame-shaped member by a bonding member so as to seal the cavity portion.
The upper surface of the frame-shaped member includes a first recess provided in a portion to which the lid body is joined, and the first recess is a plan view of the surrounding region on the upper surface of the base body. Extending outward from the inner periphery,
The upper surface of the frame-like member includes a second recess, and the second recess is located outside the outer edge of the base body in a plan view. package. A base including a cavity portion opened upward;
A frame-shaped member made of a metal material and bonded to a peripheral region on the upper surface of the base;
It is made of a light-transmitting material , and includes a lid that is bonded to the upper surface of the frame-shaped member by a bonding member so as to seal the cavity portion.
The upper surface of the frame-shaped member includes a first recess provided in a portion to which the lid body is joined, and the first recess is a plan view of the surrounding region on the upper surface of the base body. Extending outward from the inner periphery,
The package for storing an electronic element, wherein an outer edge of the first recess of the frame-like member is located on an outer side than an outer edge of the base body in plan view. The electronic element storage package according to claim 1 or 2,
An electronic element provided in the cavity portion,
The lid of the electronic element storage package is bonded to the upper surface of the frame-shaped member by a bonding member so as to seal the cavity portion, and has a thermal expansion coefficient different from that of the frame-shaped member. And
The electronic device according to claim 1, wherein the joining member is attached to the first recess included in the upper surface of the frame-shaped member.

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