JP7227019B2 - Electronic device mounting board, electronic device, and electronic module - Google Patents

Description

The present invention relates to an electronic element mounting substrate, an electronic device, and an electronic module on which an electronic element or the like is mounted.

2. Description of the Related Art An electronic device mounting board is known which includes a substrate having a concave portion and including an insulating layer and a wiring layer. Also, an electronic device using such an electronic element mounting substrate is known to have a structure in which a cover is mounted on the upper surface of the concave portion. (See Patent Document 1).

Japanese Unexamined Patent Application Publication No. 2002-111148

In recent years, electronic devices are required to have higher functionality. Therefore, electronic element mounting substrates used in electronic devices are required to improve the mounting accuracy (position/balance) of the lid mounted on the upper surface of the recess. In order to meet this demand, it is conceivable to polish the top surface of the substrate for mounting electronic devices, but if the polishing process is performed, alignment marks cannot be provided on the top surface, and the mounting accuracy (position) of the lid cannot be provided. There was concern that improvement would become difficult.

An electronic device mounting substrate according to one aspect of the present invention has a substrate having a first mounting region on which an electronic device is mounted, and a second mounting region on which a cover is joined. and a frame positioned surrounding the first mounting area on an upper surface of the frame, the upper surface of the frame being polished, and a plurality of It is characterized by having a hole of

An electronic device according to one aspect of the present invention includes: an electronic element mounting substrate; an electronic element mounted in the first mounting area; and a lid covering the electronic element and mounted in the second mounting area. It is characterized by having

An electronic device mounting substrate according to one aspect of the present invention has a plurality of holes positioned on the polished upper surface of the frame. This allows the holes to be used as alignment marks. Therefore, it is possible to improve the mounting accuracy (positional accuracy) of the lid while improving the balance by polishing the surface of the frame. As a result, it is possible to improve the mounting accuracy of the lid of the electronic device, and to achieve high functionality of the electronic device.

FIG. 1(a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to the first embodiment of the present invention, and FIG. 1(b) is taken along line X1-X1 of FIG. 1(a). Fig. 4 is a corresponding longitudinal sectional view; FIG. 2(a) is a top view showing the appearance of an electronic element mounting substrate and an electronic device according to another aspect of the first embodiment of the present invention, and FIG. 2(b) is X2 in FIG. 2(a). It is a vertical cross-sectional view corresponding to the -X2 line. FIG. 3(a) is a top view showing the appearance of an electronic element mounting substrate and an electronic device according to another aspect of the first embodiment of the present invention. FIG. 4(a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to another aspect of the first embodiment of the present invention, and FIG. 4(b) is X4 in FIG. 4(a). - It is a longitudinal cross-sectional view corresponding to X4 line. FIG. 5(a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to a second embodiment of the present invention, and FIG. 5(b) is taken along line X5-X5 of FIG. 5(a). Fig. 4 is a corresponding longitudinal sectional view; FIG. 6(a) is a top view showing the appearance of an electronic element mounting board and an electronic device according to a third embodiment of the present invention, and FIG. 6(b) is taken along line X6-X6 of FIG. 6(a). Fig. 4 is a corresponding longitudinal sectional view; FIG. 7(a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to a fourth embodiment of the present invention, and FIG. 7(b) is taken along line X7-X7 of FIG. 7(a). Fig. 4 is a corresponding longitudinal sectional view; FIG. 8 is a top view showing the appearance of an electronic device mounting board and an electronic device according to a fifth embodiment of the present invention. FIG. 9 is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to another aspect of the fifth embodiment of the present invention. FIG. 10 is a longitudinal sectional view of an electronic device mounting board and an electronic device according to a sixth embodiment of the present invention. FIG. 11 is a vertical cross-sectional view of an electronic device mounting board and an electronic device according to another aspect of the sixth embodiment of the present invention. FIG. 12 is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to a seventh embodiment of the present invention, and FIG. 12(b) is an enlarged view of the main part A of FIG. 12(a). . FIG. 13 is a top view showing the appearance of an electronic device mounting substrate according to the eighth embodiment of the present invention, and FIG. 13(b) is an enlarged view of the main part B of FIG. 13(a). FIG. 14 is a top view showing the appearance of an electronic element mounting substrate and an electronic device according to the ninth embodiment of the present invention, and FIG. 14(b) is an enlarged view of the main part C of FIG. .

<Structure of Electronic Device Mounting Board and Electronic Device>
Several exemplary embodiments of the invention will now be described with reference to the drawings. In the following description, an electronic device is defined as a structure in which an electronic element is mounted on an electronic element mounting board. Further, an electronic module is defined as a structure having a housing or member provided so as to be located on the upper surface side of the electronic device mounting substrate or to surround the electronic device. The electronic element mounting board, the electronic device, and the electronic module may be oriented upward or downward, but for the sake of convenience, an orthogonal coordinate system xyz is defined, and the positive side in the z direction is oriented upward.

(First embodiment)
An electronic device mounting board 1 according to a first embodiment of the present invention and an electronic device 21 having the same will be described with reference to FIGS. 1 to 4. FIG. 1, 2 and 4 show a top view and a cross-sectional view of the electronic device 21, and FIG. 3 shows a top view of the electronic device mounting substrate 1. As shown in FIG.

The electronic device mounting substrate 1 has a substrate 2a and a frame 2b. The substrate 2a has a first mounting area 4 on which the electronic element 10 is mounted. The frame 2b has a second mounting area 5 to which the lid 12 is joined on its upper surface, and is located on the upper surface of the substrate 2a so as to surround the first mounting area 4. As shown in FIG. The frame 2b has its upper surface polished. The frame 2b has a plurality of holes 6 located on the upper surface of the frame 2b in plan view.

The electronic device mounting substrate 1 has a substrate 2a and a frame 2b. The substrate 2a has a first mounting area 4 on which the electronic element 10 is mounted. The frame 2b has a second mounting area 5 to which the lid 12 is joined on its upper surface, and is located on the upper surface of the substrate 2a so as to surround the first mounting area 4. As shown in FIG.

The first mounting area 4 is an area in which at least one or more electronic elements 10 are mounted, and can be appropriately determined, for example, inside or above the outermost periphery of the electrode pads 3 to be described later. Further, the component to be mounted on the first mounting area 4 is not limited to the electronic element 10, and may be, for example, an electronic component, and the number of electronic elements 10 and/or electronic components is not specified.

The second mounting area 5 is an area where the lid 12 located on the upper surface of the electronic element 10 is mounted when viewed from the top. good. The lid body 12 is joined by a lid body joining member 14, which will be described later, and the lid body joining member 14 may be positioned inside the second mounting area 5 or outside the second mounting area.

A combination of the substrate 2a and the frame 2b is hereinafter referred to as a base 2. As shown in FIG.

In the example shown in FIG. 1, the base 2 consisting of the substrate 2a and the frame 2b is composed of a plurality of insulating layers. A configuration of only one layer or the like may also be used. The material of the insulating layer forming the base 2 includes, for example, electrically insulating ceramics or resin.

Examples of electrically insulating ceramics used as materials for the insulating layer forming the substrate 2 include aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and silicon nitride. sintered bodies or glass-ceramic sintered bodies; Examples of resins used as materials for the insulating layer forming the substrate 2 include thermoplastic resins, epoxy resins, polyimide resins, acrylic resins, phenolic resins, fluorine-based resins, and the like. The fluororesin includes, for example, tetrafluoroethylene resin.

The substrate 2 may be formed of 7 insulating layers as shown in FIG. 1, or may be formed of 6 or less or 8 or more insulating layers. When the number of insulating layers is six or less, the thickness of the electronic element mounting substrate 1 can be reduced. Further, when the number of insulating layers is eight or more, the rigidity of the electronic element mounting substrate 1 can be increased.

For example, the size of one side of the outermost circumference of the electronic device mounting substrate 1 is 0.3 mm to 10 cm. There may be. Further, for example, the thickness of the electronic element mounting board 1 is 0.2 mm or more.

The frame 2b is located on the upper surface of the substrate 2a so as to surround the first mounting area 4. As shown in FIG. Here, "surrounding the first mounting area 4" means that, for example, the inner wall of the frame 2b may be approximately the same as the first mounting area 4, and the inner wall of the frame 2b may be the same as the first mounting area when viewed from above. It may be greater than 4.

The substrate 2 of the electronic device mounting substrate 1 may have electrode pads 3 . Here, the electrode pads 3 refer to pads electrically connected to, for example, the electronic element 10 and/or electronic components.

External circuit connection electrodes may be provided on the upper surface, side surface, or lower surface of the substrate 2 of the electronic element mounting board 1 . The external circuit connection electrodes may electrically connect the substrate 2 and the external circuit board, or the electronic device 21 and the external circuit board.

In addition to the electrode pads 3 and/or external circuit connection electrodes, the upper or lower surface of the substrate 2 is provided with electrodes formed between insulating layers, internal wiring conductors, and through conductors for vertically connecting the internal wiring conductors. may be These electrodes, internal wiring conductors or through conductors may be exposed on the surface of the substrate 2 . The electrode pads 3 and/or the external circuit connection electrodes may be electrically connected by the electrodes, internal wiring conductors, or through conductors.

When the substrate 2 is made of electrically insulating ceramics, the electrode pads 3, external circuit connection electrodes, electrodes, internal wiring conductors and/or through conductors are made of tungsten (W), molybdenum (Mo), manganese (Mn), Palladium (Pd), silver (Ag), copper (Cu), or alloys containing at least one metal material selected from these are included. Moreover, it may consist only of copper (Cu). When the base 2 is made of resin, the electrode pads 3, external circuit connection electrodes, internal wiring conductors and/or penetrating conductors may be copper (Cu), gold (Au), aluminum (Al), nickel (Ni ), molybdenum (Mo), palladium (Pd), titanium (Ti), or alloys containing at least one metal material selected from these.

The exposed surfaces of the electrode pads 3, external circuit connection electrodes, electrodes, internal wiring conductors and/or through conductors may further have a plating layer. According to this configuration, it is possible to protect the exposed surfaces of the electrode for external circuit connection, the conductor layer, and the through conductor and reduce oxidation. Moreover, according to this configuration, the electrode pads 3 and the electronic element 10 can be electrically connected well through the electronic element connection member 13 such as wire bonding. The plating layer is, for example, a Ni plating layer with a thickness of 0.5 μm to 10 μm, or a Ni plating layer and a gold (Au) plating layer with a thickness of 0.5 μm to 3 μm. good.

The upper surface of the frame 2b of the electronic device mounting board 1 is polished. Here, the polished state may be a state in which, when the surface is observed with a scanning electron microscope or the like, a part or the whole of the surface has an intragranular fracture region. The polished state may be, for example, the case where the upper surface of the frame 2b has a larger surface roughness than the lower surface of the substrate 2a. The polished state may be, for example, a case where the upper surface of the frame has a larger surface roughness than the upper surface of the substrate 2a. In either case, since the frame 2b is in a polished state, the flatness of the top surface of the frame 2b can be improved, and the mounting accuracy of the lid 12 can be improved.

In addition, surface roughness is arithmetic mean roughness. For the arithmetic mean roughness Ra, the arithmetic mean roughness according to the 1994 JIS standard B0601 (partially revised in 2001) is adopted, and the surface roughness of a contact type with a needle or a non-contact type such as a laser is used. Measured using a measuring instrument. At this time, the arithmetic mean roughness may be calculated from the arithmetic mean height. The arithmetic mean height can be calculated from how much the surface area of the domain increases with respect to the area of the domain. In other words, while the area of the defined domain is Sdr=0 based on the JIS standard, if the defined domain has irregularities, Sdr increases. It can be calculated by these methods.

The frame 2b of the electronic device mounting substrate 1 has a plurality of holes 6 positioned on the upper surface of the frame 2b in plan view.

In recent years, electronic devices are required to have higher functionality. Therefore, electronic element mounting substrates used in electronic devices are required to improve the mounting accuracy (position/balance) of the lid mounted on the upper surface of the recess. In order to meet this demand, polishing the upper surface of the electronic device mounting substrate to improve the degree of balance has been considered. Therefore, there was a concern that it would be difficult to improve the mounting accuracy (position) of the lid.

On the other hand, in the present embodiment, the frame 2b of the electronic device mounting substrate 1 has a plurality of holes 6 positioned on the upper surface of the frame 2b in plan view. Having the plurality of holes 6 makes it possible to use the plurality of holes 6 as alignment marks in the process of mounting the lid 12 . Therefore, it is possible to improve the mounting position accuracy of the lid 12 while improving the flatness of the upper surface of the electronic element mounting substrate 1 by polishing. Therefore, it is possible to enhance the functionality of the electronic device 21 .

In the electronic device mounting substrate 1, the inner wall of the frame 2b may be stepped in a cross-sectional view as in the example shown in FIG. At this time, as in the example shown in FIG. 1, the electrode pads 3 may be positioned in the stepped portions of the frame body 2b having a stepped shape. Accordingly, since the electrode pads 3 are positioned in the stepped portion of the frame 2b, the upper surface of the electronic element 10 mounted in the mounting area 4 and the electrode pads 3 are positioned at approximately the same height in a cross-sectional view. position. Therefore, it is possible to shorten the length of the electronic element connection member 13 . This makes it possible to improve electrical characteristics. Further, since the length of the electronic element connecting member 13 between the pad of the electronic element 10 and the electrode pad 3 can be shortened, the positional accuracy of the electronic element connecting member 13 can be improved. . Therefore, it is possible to enhance the functionality of the electronic device 21 .

The frame 2b of the electronic device mounting board 1 may contain a ceramic material. Frame body 2b
contains a ceramic material, the frame 2b and the substrate 2a can be laminated and joined together by sintering. This makes it possible to further improve the bonding strength between the frame 2b and the substrate 2a. Further, since the frame body 2b is made of a ceramic material, it becomes possible to collectively form a plurality of holes 6 by punching with a mold or the like. Therefore, it is possible to improve the positional accuracy of the plurality of holes 6, and it is possible to further improve the positional accuracy of mounting the lid body 12. FIG. Therefore, it is possible to further improve the effect of the present embodiment.

The frame 2b of the electronic element mounting substrate 1 may contain a resin, and the substrate 2a and the frame 2b may be joined with a joining material 16. FIG. Since the frame 2 contains resin and is bonded to the substrate 2a with the bonding material 16, the materials of the frame 2b and the substrate 2a can be appropriately changed. This makes it possible, for example, to select a resin material that is not easily deformed by heat or the like for the frame 2b, and select a material having a coefficient of thermal expansion close to that of the electronic element 10 for the substrate 2a. This makes it possible to reduce the load on the electronic element 10 due to the difference in thermal expansion coefficient between the substrate 2a and the electronic element 10 while reducing the thermal deformation of the frame 2b in the process of manufacturing the electronic device 21. It is possible to reduce the occurrence of defects in the electronic element 10 while improving the positional accuracy in mounting the lid 12 . Therefore, it becomes possible to improve the effect of this embodiment. Further, since the frame body 2b contains resin, it becomes possible to produce a plurality of holes 6 by laser or the like. Therefore, the size of the plurality of holes 6 can be made smaller, dust or water is trapped in the plurality of holes 6, and the dust or water is discharged from the plurality of holes 6 in actual use, resulting in noise. It is possible to reduce the Further, deterioration of the electronic element mounting board 1 due to dust or moisture being trapped in the plurality of holes 6 can be reduced.

The plurality of holes 6 in the electronic device mounting board 1 may be located outside the second mounting area 5 as in the example shown in FIG. It may be located inside the region 5 . As in the example shown in FIG. 2, since the plurality of holes 6 of the electronic element mounting substrate 1 are located outside the second mounting region 5, the shadow or It is possible to reduce the overlapping of the lid body joining member 14 with the plurality of holes 6 . Therefore, it is possible to improve the accuracy of the mounting position of the lid 12, and to improve the process yield. Further, the plurality of holes 6 of the electronic element mounting board 1 may be positioned inside the second mounting area 5 as in the example shown in FIG. In this case, the openings of the plurality of holes 6 can be covered with the lid 12 after the lid 12 is mounted. Therefore, when the electronic device 21 after mounting the lid 12 is mounted on, for example, an external device, dust or moisture is trapped in the plurality of holes 6, and the dust or moisture is trapped in the plurality of holes 6 when actually used. It is possible to reduce the noise emitted from the Further, deterioration of the electronic element mounting board 1 due to dust or moisture being trapped in the plurality of holes 6 can be reduced.

The depth of the plurality of holes 6 in the electronic device mounting substrate 1 is the same as that of the frame 2b and the substrate 2 in plan view.
It may be shallower than the depth of the concave portion surrounded by a. As a result, by making the depth of the plurality of holes 6 different from the depth of the bottom surface of the recesses surrounded by the substrate 2a, the color tone of the plurality of holes 6 and the depth of the recesses surrounded by the substrate 2a when light is projected from the upper surface can be changed. It is possible to make the color tone different from that of the bottom surface of the . Therefore, when a plurality of holes 6 are recognized by an imaging device or the like, malfunction of the imaging device can be reduced. Therefore, it is possible to improve the mounting positional accuracy of the lid body 12, and it is possible to further improve the effect of the present embodiment. Further, since the depth of the plurality of holes 6 is shallower than the depth of the recesses surrounded by the frame 2b and the substrate 2a in plan view, shadows are generated when light is projected from the upper surface of the electronic element mounting substrate 1. It gets tough. Therefore, when a plurality of holes 6 are recognized by an imaging device or the like, malfunction of the imaging device can be reduced. Therefore, it is possible to improve the mounting positional accuracy of the lid body 12, and it is possible to further improve the effect of the present embodiment.

The plurality of holes 6 in the electronic device mounting substrate 1 may be circular in plan view. Since the plurality of holes 6 are circular in plan view, when light is projected from the upper surface of the electronic element mounting board 1 by an image machine or the like, the light enters evenly. This makes it possible to reduce the occurrence of distorted shadows or the like inside the plurality of holes 6 . Therefore, when a plurality of holes 6 are recognized by an imaging device or the like, malfunction of the imaging device can be reduced. Therefore, it is possible to improve the mounting positional accuracy of the lid body 12, and it is possible to further improve the effect of the present embodiment.

When the frame 2b is made of a plurality of insulating layers, the plurality of holes 6 in the electronic device mounting board 1 may be at least one layer deep in a cross-sectional view as in the example shown in FIG. 4, the depth may be halfway through one of the uppermost insulating layers. As in the example shown in FIG. 1, since the depth is at least one layer or more in a cross-sectional view, even if an error occurs in the amount of polishing when the frame 2b is polished, the plurality of holes 6 become shallow. It is possible to reduce the possibility that the image recognition becomes impossible due to too much. In addition, as in the example shown in FIG. 4, by setting the depth to the middle of the uppermost one layer among the plurality of insulating layers, it is possible to provide wiring directly under the layer in which the plurality of holes 6 are provided. becomes. Therefore, it is possible to improve the degree of freedom in wiring design of the electronic element mounting board 1 . Further, the bottom surfaces of the plurality of holes 6 may be arc-shaped as in the example shown in FIG. This makes it difficult for dust or moisture to become trapped in the plurality of holes 6 . As a method for producing a plurality of holes 6 as in the example shown in FIG.

As in the example shown in FIG. 3, at least three holes 6 are sufficient, and when the cover 12 is rectangular, the three holes 6 are positioned near each corner of the cover 12. may be The presence of at least three holes 6 enables alignment in the X direction, the Y direction, and the rotational direction in mounting the lid 12 . Accordingly, it is possible to improve the mounting positional accuracy of the lid body 12, and to further improve the effect of the present embodiment. In addition, since the electronic element mounting substrate 1 has three or more holes 6, it is possible to express the directionality of the electronic element mounting substrate 1 as well. Therefore, it is possible to reduce the problem of joining the lids 12 with different orientations, and to reduce the load of the mounting process of the lids 12 .

<Structure of Electronic Device>
An example of an electronic device 21 is shown in FIG. The electronic device 21 includes an electronic element mounting board 1 and an electronic element 10 mounted on the upper surface of the electronic element mounting board 1 .

An electronic device 21 has an electronic element mounting substrate 1 and an electronic element 10 mounted on a mounting area 4 of a substrate 2 a of the electronic element mounting substrate 1 . Examples of the electronic device 10 include an imaging device such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting device such as an LED (Light Emitting Diode), pressure, air pressure, acceleration, gyro, and the like. An element having a sensor function, an integrated circuit, or the like. Note that the electronic element 10 may be arranged on the upper surface of the substrate 2a via an adhesive. For this adhesive, for example, silver epoxy or thermosetting resin is used.

The electronic element 10 and the electronic element mounting substrate 1 may be electrically connected by an electronic element connecting member 13, for example.

The electronic device 21 may have a lid 12 that covers the electronic element 10 and is joined to the upper surface of the electronic element mounting board 1 .

For example, when the electronic device 10 is an imaging device such as a CMOS or CCD, or a light emitting device such as an LED, a highly transparent member such as a glass material is used for the lid. Further, for example, when the electronic element 10 is an integrated circuit or the like, the lid body may be made of a metallic material, a ceramic material, or an organic material.

The lid may be joined to the electronic element mounting substrate 1 via the lid connecting member 14 . Examples of the material forming the lid connecting member 14 include thermosetting resin, low-melting-point glass, brazing material made of metal components, and the like.

Since the electronic device 21 has the electronic element mounting substrate 1 as shown in FIGS. 1 to 4, it is possible to improve the accuracy of balance and the accuracy of the position in mounting the lid 12. FIG. Therefore, it is possible to enhance the functionality of the electronic device 21 .

<Structure of electronic module>
The electronic device mounting substrate 1 and the electronic device 21 of the present embodiment may constitute an electronic module 31 having the electronic device 21 and a housing 32 positioned on the upper surface of the electronic device 21 or on the electronic device 21. . For the sake of explanation, the following example will be described using an imaging module as an example. Here, the housing 32 positioned on the upper surface of the electronic device 21 means that a part of the housing 32 is positioned on the electronic device 21 even when the electronic device 21 itself is covered with the housing 32, for example. Therefore, it is included in this configuration.

The electronic module 31 may have a housing 32 (such as a lens holder). Having the housing 32 makes it possible to improve the airtightness or reduce the direct application of external stress to the electronic device 21 . The housing 32 is made of, for example, resin or metal material. Further, when the housing 32 is a lens holder, the housing 32 may incorporate one or more lenses made of resin, liquid, glass, crystal, or the like. Further, the housing 32 is equipped with a driving device or the like for driving up, down, left, or right, and is electrically connected to pads or the like located on the surface of the electronic element mounting substrate 1 via a bonding material such as solder. good too.

The housing 32 may have openings in four directions or at least one side on the bottom side when viewed from above. An external circuit board may be inserted through the opening of the housing 32 and electrically connected to the electronic element mounting board 1 . After the external circuit board is electrically connected to the electronic element mounting board 1, the opening of the housing 32 is closed with a sealing material such as resin to keep the inside of the electronic module 31 airtight. may have been

<Electronic device mounting board and manufacturing method for electronic device>
Next, an example of a method for manufacturing the electronic element mounting substrate 1 and the electronic device 21 of this embodiment will be described. An example of the manufacturing method described below is a manufacturing method of the substrate 2 using a multi-piece wiring board.

(1) First, a ceramic green sheet constituting the base 2 (substrate 2a, frame 2b) is formed. For example, when obtaining the substrate 2 which is an aluminum oxide (Al ₂ O ₃ ) based sintered body, silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) is added to Al ₂ O ₃ powder as a sintering aid. ) are added, followed by the addition of suitable binders, solvents and plasticizers, and then the mixture is kneaded to form a slurry. After that, a molding method such as a doctor blade method or a calender roll method is used to obtain a ceramic green sheet for multi-piece production.

When the substrate 2 is made of, for example, a resin, the substrate 2 is molded by a transfer molding method, an injection molding method, or by pressing with a mold or the like using a mold that can be molded into a predetermined shape. can be formed. Further, the substrate 2 may be a substrate made of glass fiber impregnated with a resin such as a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a substrate made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

(2) Next, the aforementioned green sheet is processed with a mold or the like. Here, an opening is formed in the frame 2b. Moreover, when the substrate 2 has a notch or the like, the notch or the like may be similarly formed at a predetermined portion of the green sheet that becomes the substrate 2 . Further, in this step, a plurality of through-holes to be the holes 6 may be formed in the green sheet to be the frame 2b by using a mold, a laser, or the like.

(3) Next, the ceramic green sheets to be each insulating layer of the substrate 2 are stacked and pressed. As a result, the green sheets to be the insulating layers are laminated to form a ceramic green sheet laminate to be the base 2 (substrate 1 for mounting electronic elements). At this time, a portion to be a notch portion or the like may be appropriately formed by using a mold or the like.

(4) Next, a metal paste is applied or filled on the ceramic green sheets or ceramic green sheet laminate by screen printing or the like on the portions to be the electrode pads 3, the electrodes for external circuit connection, the internal wiring conductors and the internal penetrating conductors. do. Note that the metal paste may be applied or filled before the step of laminating the ceramic green sheets. This metal paste is prepared by adjusting the viscosity to an appropriate level by adding a suitable solvent and binder to the metal powder made of the metal material described above and kneading the mixture. In addition, the metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2 .

Further, when the substrate 2 is made of resin, the electrode pads 3, external circuit connection electrodes, internal wiring conductors, and through conductors can be produced by a sputtering method, a vapor deposition method, or the like. Moreover, after providing a metal film on the surface, you may manufacture using the plating method.

(5) Next, dividing grooves are provided at predetermined positions of the green sheet using a die, punching, laser, or the like. Incidentally, the dividing grooves can be formed by cutting with a slicing apparatus after firing to a size smaller than the thickness of the multi-cavity wiring board. It may be formed by cutting the ceramic green sheet laminate to a size smaller than the thickness thereof using a slicing machine. In this step, the plurality of holes 6 may be formed by pressing with a mold or the like. Also, in this step, a plurality of holes 6 may be opened by, for example, a laser.

(6) Next, this ceramic green sheet laminate is fired at a temperature of about 1500° C. to 1800° C. to obtain a multi-piece wiring board on which a plurality of substrates 2 (electronic element mounting substrates 1) are arranged. In this step, the metal paste described above is fired at the same time as the ceramic green sheet serving as the substrate 2 (electronic device mounting substrate 1), and becomes the electrode pads 3, external circuit connection electrodes, internal wiring conductors, and through conductors. .

(7) Next, the multi-cavity wiring board obtained by firing is divided into a plurality of substrates 2 (electronic element mounting substrates 1). In this division, division grooves are formed in the multi-cavity wiring board in step (5) along the outer edge of the substrate 2 (electronic device mounting substrate 1), and the substrate is broken along the division grooves. There is a way to divide There is also a method of cutting along the outer edge of the substrate 2 (electronic device mounting substrate 1) by a slicing method or the like without performing the step (5). Before or after dividing the multi-cavity wiring board described above into a plurality of substrates 2 (electronic element mounting substrates 1), the electrode pads 3 and the external connection pads are formed by electrolytic or electroless plating, respectively. and exposed wiring conductors may be plated.

(8) Next, the electronic device 10 is mounted on the electronic device mounting board 1 . The electronic element 10 is electrically connected to the electronic element mounting board 1 by the electronic element connecting member 13 . At this time, the electronic element 10 or the electronic element mounting substrate 1 may be fixed to the electronic element mounting substrate 1 by providing an adhesive or the like.

The electronic device 21 can be manufactured by manufacturing the electronic device mounting board 1 and mounting the electronic device 10 in the steps (1) to (7) described above. Note that the order of steps (1) to (8) above is not specified as long as it is a workable order. In addition to the processes described above, it is also possible to manufacture by using, for example, a 3D printer.

(Second embodiment)
Next, an electronic device mounting board 1 according to a second embodiment of the present invention will be described with reference to FIG.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that a plurality of holes 6 pass through the frame 2b.

In the example shown in FIG. 5, the plurality of holes 6 of the electronic device mounting board 1 penetrate the frame portion 2b in a cross-sectional view. Even in such a case, it is possible to use the plurality of holes 6 as alignment marks in the process of mounting the lid 12, and even if the surface of the frame 2b is polished, It is possible to improve the mounting positional accuracy of the lid body 12 while improving the flatness of the lid 12 . Therefore, it is possible to obtain the effects of the present invention. Moreover, since the plurality of holes 6 pass through the frame 2b, the depth of the plurality of holes 6 can be increased. Therefore, even if dust or the like is trapped in a plurality of holes 6, the trapped dust is less likely to come out to the surface. As a result, dust or the like trapped in the process of mounting the lid 12 is exposed to the surface, and image recognition errors for mounting the lid 12 can be reduced. Therefore, it is possible to improve the mounting position accuracy of the lid 12 and to improve the process yield of the process of mounting the lid 12 .

As a method of manufacturing the electronic element mounting board 1 of the present embodiment, it is possible to manufacture by making the holes 6 deeper in the step of forming the plurality of holes 6 with a mold or the like in the first embodiment. becomes.

(Third embodiment)
Next, an electronic device mounting board 1 according to a third embodiment of the present invention will be described with reference to FIG.

The electronic element mounting substrate 1 of this embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that the bottom surfaces of the plurality of holes 6 have a metal layer 6a.

In the example shown in FIG. 6, the plurality of holes 6 of the electronic device mounting substrate 1 have metal layers 6a on the bottom surfaces. This makes it possible to make the color tone of the bottom surfaces of the plurality of holes 6 and the color tone of the bottom surfaces of the recesses surrounded by the substrate 2a different. Therefore, when a plurality of holes 6 are recognized by an imaging device or the like, malfunction of the imaging device can be reduced. Therefore, it is possible to improve the mounting positional accuracy of the lid body 12, and it is possible to further improve the effect of the present embodiment.

The metal layer 6 a may cover the entire bottom surface of the hole 6 when viewed from above, or may be provided only on a part of the bottom surface of the hole 6 . In either case, the effect of this embodiment can be obtained. Further, since the metal layer 6a covers the entire bottom surface of the hole 6, it is possible to improve the accuracy of image recognition. In addition, even if there is a process error in the process of manufacturing the frame 2b because the metal layer 6a is larger than the bottom surface of the hole 6 in planar see-through, the metal layer 6a is prevented from being exposed at the bottom surface of the hole 6. becomes possible.

When the electronic device mounting substrate 1 has a plurality of holes 6, the metal layer 6a may be provided only in some of them. The orientation of the electronic element mounting board 1 can be confirmed by the position of the hole having the metal layer 6a, and the rotation of the electronic element mounting board 1 can be detected.

The metal layer 6a may be electrically connected to the internal wiring of the electronic device mounting substrate 1 or the like, or may be insulated. Moreover, the metal layer 6 a may be formed by exposing the internal wiring of the electronic element mounting substrate 1 through a plurality of holes 6 .

The metal layer 6a is made of tungsten (W), molybdenum (Mo), manganese (Mn), palladium (Pd), silver (Ag), copper (Cu), or a mixture thereof when the substrate 2 is made of electrically insulating ceramics. Alloys and the like containing at least one selected metal material are included. When the substrate 2 is made of resin, the metal layer 6a may be copper (Cu), gold (Au), aluminum (Al), nickel (Ni), molybdenum (Mo), palladium (Pd) or titanium (Ti). ) or alloys containing at least one metal material selected from these.

A plated layer may be further provided on the exposed surface of the metal layer 6a. With this configuration, the exposed surface of the metal layer 6a can be protected to reduce oxidation. The plating layer is, for example, a Ni plating layer with a thickness of 0.5 μm to 10 μm, or a Ni plating layer and a gold (Au) plating layer with a thickness of 0.5 μm to 3 μm. good.

The method of manufacturing the electronic device mounting substrate 1 of this embodiment is basically the same as that of the first embodiment. In the manufacturing method of the first embodiment, the electronic element mounting substrate 1 of the present embodiment can be manufactured by applying a metal paste to the bottom surfaces of the plurality of holes 6 by screen printing or the like. .

(Fourth embodiment)
Next, an electronic device mounting board 1 according to a fourth embodiment of the present invention will be described with reference to FIG.

The electronic device mounting substrate 1 of the present embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the lid bonding member 14 is inserted into the plurality of holes 6 .

In the example shown in FIG. 7, the electronic device 21 has a plurality of holes 6 at positions overlapping the lid 12, and the lid bonding member 14 for bonding the lid 12 and the frame 2b enters the plurality of holes 6. I'm in. Even in such a case, the effects of the present invention can be obtained. In addition, since the lid joining member 14 for joining the lid 12 and the frame 2b is inserted into the plurality of holes 6, the joining area between the lid 12 and the frame 2b can be increased. Therefore, even when the electronic device 21 is miniaturized, it is possible to improve the bonding strength between the lid 12 and the frame 2b.

Further, the electronic device 21 has a plurality of holes 6 at positions overlapping the lid 12 . As a result, even if there is a process error in the application amount of the lid bonding member 14 in the process of applying the lid bonding member 14 or if there is variation in the amount of the lid bonding member 14 within the range of the second region 5, the lid bonding can be prevented. The amount of error or variation can be absorbed by the member 14 entering the plurality of holes. Therefore, it is possible to further improve the degree of balance in mounting the lid 12, and to further improve the effects of the present invention.

(Fifth embodiment)
Next, an electronic device mounting substrate 1 according to a fifth embodiment of the present invention will be described with reference to FIGS. 8 and 9. FIG.

The electronic element mounting substrate 1 of the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that the shapes of the plurality of holes 6 are different.

In the example shown in FIG. 8, the plurality of holes 6 of the electronic device mounting substrate 1 are L-shaped in plan view. Even in such a case, having a plurality of holes 6 makes it possible to use these plurality of holes 6 as alignment marks in the process of mounting the lid body 12 . Therefore, it is possible to improve the mounting position accuracy of the lid 12 while improving the flatness by polishing the upper surface of the electronic element mounting substrate 1 . Therefore, it is possible to enhance the functionality of the electronic device 21 . In addition, since the plurality of holes 6 are L-shaped in plan view, it is possible to provide the plurality of holes 6 with corners that are perpendicular to each other. It is also possible to perform image recognition of L-shaped straight line portions and use their intersections as corners for alignment. The presence of these corners enables alignment with the corners of the lid body 12 . As a result, the rotation of the lid body 12 can be easily detected, and image recognition is also facilitated. Therefore, it is possible to improve the positional accuracy in mounting the lid 12 and to reduce the process load of the process of mounting the lid 12 .

In the example shown in FIG. 9, the plurality of holes 6 of the electronic device mounting substrate 1 are cross-shaped in plan view. Even in such a case, having a plurality of holes 6 makes it possible to use these plurality of holes 6 as alignment marks in the process of mounting the lid 12 . Therefore, it is possible to improve the mounting position accuracy of the lid 12 while improving the flatness by polishing the upper surface of the electronic element mounting substrate 1 . Therefore, it is possible to enhance the functionality of the electronic device 21 . In addition, since the plurality of holes 6 are cross-shaped in plan view, it is possible to provide the plurality of holes 6 with corners that are perpendicular to each other. It is also possible to perform image recognition of a cross-shaped linear portion and use the intersection point as a corner portion to perform alignment. Therefore, it is possible to achieve the same effect as in the case of the L-shape described above. Furthermore, since the plurality of holes 6 are cross-shaped, it becomes easier to specify the central portions of the plurality of holes 6 . This makes it possible to reduce the process load of the process of mounting the lid 12 .

Note that the plurality of holes 6 need not all have the same shape, and may be provided by combining the above-described circular, L-shaped, or cross-shaped shapes. Even when the plurality of holes 6 have different shapes, the plurality of holes 6 can be used as alignment marks in the step of mounting the lid 12 . Therefore, it is possible to improve the mounting position accuracy of the lid 12 while improving the flatness by polishing the upper surface of the electronic element mounting substrate 1 .

Moreover, since the plurality of holes 6 have different shapes, they can be used as alignment marks for different purposes or meanings. As a result, image recognition in each process facilitates determination, making it possible to reduce erroneous alignment and reduce the process load.

The method of manufacturing the electronic device mounting substrate 1 of this embodiment is basically the same as that of the first embodiment. In the step of forming a plurality of holes 6 in the manufacturing method of the first embodiment, the electronic element mounting substrate 1 of the present embodiment is produced by punching using a mold suitable for each hole or punching with a laser. It becomes possible to

(Sixth embodiment)
Next, an electronic device mounting substrate 1 according to a sixth embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG.

The electronic element mounting substrate 1 of the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that the shapes of the plurality of holes 6 in a cross-sectional view are different.

In the example shown in FIG. 10, the openings of the plurality of holes 6 of the electronic element mounting substrate 1 are wider on the upper surface side of the frame body 2b than on the substrate 2a side in a cross-sectional view. Even with such a configuration, the plurality of holes 6 can be used as alignment marks in the process of mounting the lid 12, and the effects of the present invention can be achieved. Further, since the plurality of holes 6 are wider on the upper surface side of the frame body 2b than on the substrate 2a side in a cross-sectional view, when light is projected from the upper surface of the electronic element mounting substrate 1, shadows are less likely to occur. Therefore, when a plurality of holes 6 are recognized by an imaging device or the like, malfunction of the imaging device can be reduced. Therefore, it is possible to improve the mounting positional accuracy of the lid body 12, and it is possible to further improve the effect of the present embodiment.

In the example shown in FIG. 10, the openings of the plurality of holes 6 are continuously wider toward the upper surface side of the frame 2b than toward the substrate 2a side in a cross-sectional view. The opening of the insulating layer may be widened, and the opening of the insulating layer below it may be narrowed. (It does not have to change continuously.) Even in such a case, the effects of the present invention can be obtained, and the same effects as in the example shown in FIG. 10 can be obtained.

In the example shown in FIG. 11, the openings of the plurality of holes 6 in the electronic element mounting substrate 1 are narrower on the upper surface side of the frame 2b than on the substrate 2a side in a cross-sectional view. Even with such a configuration, the plurality of holes 6 can be used as alignment marks in the process of mounting the lid 12, and the effects of the present invention can be achieved. In addition, since the openings of the plurality of holes 6 are narrower on the upper surface side of the frame body 2b than on the substrate 2a side in a cross-sectional view, even if dust or the like is trapped in the plurality of holes 6, the trapped dust becomes difficult to come out to the surface. As a result, dust or the like trapped in the process of mounting the lid 12 is exposed to the surface, and image recognition errors for mounting the lid 12 can be reduced. Therefore, it is possible to improve the mounting position accuracy of the lid 12 and to improve the process yield of the process of mounting the lid 12 . Also, after the electronic device 21 is mounted on an external device or the like, it becomes difficult for dust or the like trapped in the plurality of holes 6 to come out to the surface due to vibration during use. It is possible to reduce noise generation.

In the example shown in FIG. 11, the openings of the plurality of holes 6 are continuous and narrower toward the upper surface side of the frame 2b than toward the substrate 2a side in a cross-sectional view. The opening of the insulating layer may be narrow, and the opening of the insulating layer below it may be wide. Even in such a case, the effect of the present invention can be obtained, and the same effect as the example shown in FIG. 11 can be obtained. Further, with such a structure, even if dust or the like is trapped in the plurality of holes 6, the dust or the like can be caught by the stepped portion of the insulating layer. Therefore, it becomes more difficult for the trapped dust to come out to the surface. As a result, dust or the like trapped in the process of mounting the lid 12 is exposed to the surface, and it is possible to further reduce malfunctions of image recognition for mounting the lid 12 .

Further, as in the example shown in FIG. 11, the openings of the plurality of holes 6 are continuous and narrower toward the upper surface side of the frame body 2b than toward the substrate 2a side in a cross-sectional view. can be detected and used for alignment. Therefore, even when the light source of the image machine is insufficient, the image can be easily recognized, and the process load can be reduced.

The method of manufacturing the electronic device mounting substrate 1 of this embodiment is basically the same as that of the first embodiment. In the step of forming the plurality of holes 6 in the manufacturing method of the first embodiment, it is possible to manufacture by punching with a die or the like having a different opening diameter for each insulating layer. Alternatively, it is possible to manufacture the electronic element mounting substrate 1 of the present embodiment by using a 3D printer to shave the respective shapes with a laser.

(Seventh embodiment)
Next, an electronic device mounting board 1 according to a seventh embodiment of the present invention will be described with reference to FIG. Here, the center point P indicates the centers of the multiple holes 6 . A first imaginary straight line α connecting the center points P of the two holes 6 is indicated by a chain double-dashed line. Also, the second virtual line β perpendicularly crossing the center of the first virtual line α is indicated by a chain double-dashed line.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the first embodiment in that the positions of the plurality of holes 6 are different.

In the example shown in FIG. 12, the inner wall of the frame 2b of the electronic device mounting substrate 1 is rectangular in plan view, and the plurality of holes 6 are positioned across the corners of the inner wall of the frame 2b in plan view. are doing. Even with such a configuration, the plurality of holes 6 can be used as alignment marks in the process of mounting the lid 12, and the effects of the present invention can be achieved. Further, since the plurality of holes 6 sandwich the corners of the inner wall of the frame 2b in a plan view, it is possible to easily align the lid 12. As shown in FIG. For example, it is possible to facilitate alignment in image recognition, such as by aligning the cover 12 on a virtual line connecting the midpoints of the plurality of holes 6 .

In addition, the fact that the plurality of holes 6 are located across the corners of the inner wall of the frame 2b in plan view means that the plurality of holes 6 are located on extension lines of the corners of the frame 2b in plan view. It can be said that it is not located. In recent years, substrates for mounting electronic devices have become thinner, and there are cases where cracks occur in the frame. At this time, cracks may occur starting from the corners of the inner wall of the frame 2 . If these cracks reach a plurality of holes, there is a concern that cracks may occur in the area from the inner wall of the frame to the plurality of holes due to the pressure in the process of mounting the lid. On the other hand, in the present embodiment, it can be said that the plurality of holes 6 are not positioned on the extended lines of the corners of the frame 2b in a plan view, so cracks start from the corners of the inner wall of the frame 2b. Even when cracks occur, it is possible to reduce the number of cracks reaching the plurality of through holes 6 . Therefore, it is possible to reduce the occurrence of cracks in the area from the inner wall of the frame 2b to the plurality of holes 6 due to the pressure in the process of mounting the lid 12, and the process of mounting the lid 12 can be reduced. It is possible to reduce the process load and improve the process yield.

In the example shown in FIG. 12 , the plurality of holes 6 are circular in plan view, and in plan view, a first imaginary center P connecting the centers P of the two holes 6 sandwiching the corners of the inner wall of the frame 2b. A second imaginary straight line β that perpendicularly intersects the center of the straight line α intersects corners of the inner wall of the frame 2b. Even with such a configuration, the plurality of holes 6 can be used as alignment marks in the process of mounting the lid 12, and the effects of the present invention can be achieved. Further, by aligning so that the corners of the lid 12 are on the second imaginary straight line β, alignment of the inner wall of the frame 2b and the lid 12 becomes easy. Therefore, the process load of the process of mounting the lid 12 can be reduced, and the process yield can be improved.

Also, with such a configuration, the distance between the two holes 6 and the corners of the inner wall of the frame 2b can be made equal. Therefore, even if a crack occurs starting from the corner of the inner wall of the frame 2b, it is possible to reduce the crack reaching the plurality of through holes 6. FIG. Furthermore, the pressure in the process of mounting the lid 12 can be evenly distributed near the corners of the frame 2b, and cracks can be prevented from progressing to either one of the holes 6. FIG. Therefore, it is possible to reduce the occurrence of cracks in the area from the inner wall of the frame 2b to the plurality of holes 6 due to the pressure in the process of mounting the lid 12, and the process of mounting the lid 12 can be reduced. It is possible to reduce the process load and improve the process yield.

(Eighth embodiment)
Next, an electronic element mounting board 1 according to an eighth embodiment of the present invention will be described with reference to FIG. Here, the center point P indicates the centers of the multiple holes 6 . A first imaginary straight line α connecting the center points P of the two holes 6 is indicated by a chain double-dashed line. Also, the second virtual line β perpendicularly crossing the center of the first virtual line α is indicated by a chain double-dashed line.

The electronic device mounting substrate 1 of this embodiment differs from the electronic device mounting substrate 1 of the seventh embodiment in that it has an alignment mark 7 on the first mounting region 4 .

In the example shown in FIG. 13, the substrate 2a has the alignment marks 7 in the first mounting area 4, the plurality of holes 6 are circular in plan view, and the corners of the inner wall of the frame 2b in plan view. A second imaginary straight line β that perpendicularly intersects the center of the first imaginary straight line α that connects the centers P of the two holes 6 sandwiching the two holes 6 is the corner of the inner wall of the frame 2b and the corner of the alignment mark 7 (center ). Here, the alignment marks 7 are alignment marks provided in the first mounting area 4 and used when the electronic element 10 is mounted. Even with such a configuration, the plurality of holes 6 can be used as alignment marks in the process of mounting the lid 12, and the effects of the present invention can be achieved.

In addition, with such a configuration, alignment between the electronic element 10 and the inner wall of the frame 2b, alignment between the inner wall of the frame 2b and the lid 12, and alignment between the electronic element 10 and the lid 12 can be achieved. becomes possible. Therefore, when the electronic device 10 is an imaging device such as a CCD or a CMOS, the electronic device 10 and the lid 12 can be aligned with high accuracy, and the occurrence of optical axis misalignment can be reduced. It becomes possible. Therefore, it is possible to further improve the function of the electronic device 21 .

Although the two holes 6 are circular in the example shown in FIG. 13, the shape of the two holes 6 may be other shapes such as the aforementioned L-shape or cross-shape. If the two holes 6 are not circular, the midpoint P can be appropriately determined, for example, at the intersection of diagonal lines or at the intersection of imaginary lines passing through the midpoints of the sides.

(Ninth embodiment)
Next, an electronic element mounting substrate 1 according to a ninth embodiment of the present invention will be described with reference to FIG. Here, the center point P indicates the centers of the multiple holes 6 . A first imaginary straight line α connecting the center points P of the two holes 6 is indicated by a chain double-dashed line. Also, the second virtual line β perpendicularly crossing the center of the first virtual line α is indicated by a chain double-dashed line.

The electronic element mounting substrate 1 of this embodiment differs from the electronic element mounting substrate 1 of the seventh embodiment in that the positions of the plurality of holes 6 are different.

In the example shown in FIG. 14, the plurality of holes 6 are circular in plan view, and in plan view, a first imaginary center P connecting the centers P of the two holes 6 sandwiching the corners of the inner wall of the frame 2b. A second imaginary straight line β that perpendicularly intersects the center of the straight line α is shifted from the corners of the outer edge of the frame 2b. Even with such a configuration, having a plurality of holes 6 makes it possible to use these plurality of holes 6 as alignment marks in the process of mounting the lid body 12 . Therefore, it is possible to improve the mounting position accuracy of the lid 12 while improving the flatness of the upper surface of the electronic element mounting substrate 1 by polishing. Therefore, it is possible to enhance the functionality of the electronic device 21 . Moreover, with such a structure, even if the lid 12 and the base 2 are not in a similar relationship, the lid 12 can be aligned with the plurality of holes 6 .

The present invention is not limited to the examples of the embodiments described above, and various modifications such as numerical values are possible. Further, for example, in the examples shown in the drawings, the shape of the electrode pad 3 is rectangular when viewed from above, but it may be circular or other polygonal shapes. In addition, the arrangement, number, and shape of the electrode pads 3, the mounting method of the electronic elements, and the like in this embodiment are not specified. Various combinations of characteristic portions in this embodiment are not limited to the examples of the above embodiments. Combinations of the respective embodiments are also possible.

REFERENCE SIGNS LIST 1 Electronic element mounting substrate 2 Substrate 2a Substrate 2b Frame 3 Electrode pad 4 First mounting area 5 Second Mounting area 6 Hole 6a Metal layer 7 Alignment mark 10 Electronic element 12 Lid 13 Electronic element connecting member 14 Lid connecting member 16 ... bonding material 21 ... electronic device 31 ... electronic module 32 ... housing α ... first virtual line β ... second virtual line P ... center point (center )

Claims (13)

a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
An electronic element mounting substrate, wherein the upper surface of the frame has a surface roughness larger than that of the lower surface of the substrate. a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
An electronic element mounting board, wherein the upper surface of the frame has a surface roughness larger than that of the upper surface of the substrate. 3. The electronic element mounting board according to claim 1 , wherein the plurality of holes are positioned outside the second mounting area. a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
An electronic element mounting substrate, wherein the depth of the plurality of holes is shallower than the depth of the recess surrounded by the frame and the substrate. 5. The electronic element mounting board according to claim 1 , wherein the plurality of holes are circular in plan view. a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
The inner wall of the frame is rectangular in plan view,
An electronic element mounting substrate, wherein the plurality of holes are located across corners of the inner wall of the frame in a plan view. a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
The plurality of holes are circular in plan view,
A second imaginary straight line that perpendicularly intersects the center of a first imaginary straight line that connects the centers of two holes sandwiching the corners of the inner wall of the frame in plan view intersects the corners. board for mounting electronic devices. In a plan view, the second imaginary straight line that perpendicularly intersects the center of the first imaginary straight line that connects the centers of the two holes sandwiching the corners of the inner wall of the frame is the corner of the outer edge of the frame. 8. The substrate for mounting an electronic element according to claim 7 , wherein the substrate is offset from the part. a substrate having a first mounting region on which an electronic element is mounted;
a frame having a second mounting area to which a lid is joined on the upper surface, and a frame positioned on the upper surface of the substrate so as to surround the first mounting area;
The frame has a polished upper surface and has a plurality of holes positioned on the upper surface of the frame in plan view,
The plurality of holes are circular in plan view,
In a plan view, a second imaginary straight line perpendicular to the center of the first imaginary straight line connecting the centers of the two holes sandwiching the corners of the inner wall of the frame is displaced from the corners of the outer edge of the frame. An electronic device mounting substrate, characterized in that: The substrate for mounting an electronic element according to any one of claims 1 to 9 , wherein the inner wall of the frame has a stepped shape when viewed in cross section. The substrate for mounting an electronic element according to any one of claims 1 to 10 , wherein the substrate and the frame contain a ceramic material. The electronic device according to any one of claims 1 to 10 , wherein the substrate and the frame contain resin, and the substrate and the frame are bonded with a bonding material. Board for mounting. An electronic device mounting substrate according to any one of claims 1 to 12 ;
an electronic element mounted in the first mounting region;
and a lid that covers the electronic element and is mounted in the second mounting area.

Images