JP6408341B2 - Imaging device mounting substrate, imaging device, and imaging module - Google Patents

Imaging device mounting substrate, imaging device, and imaging module Download PDF

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JP6408341B2
JP6408341B2 JP2014220404A JP2014220404A JP6408341B2 JP 6408341 B2 JP6408341 B2 JP 6408341B2 JP 2014220404 A JP2014220404 A JP 2014220404A JP 2014220404 A JP2014220404 A JP 2014220404A JP 6408341 B2 JP6408341 B2 JP 6408341B2
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image sensor
imaging
imaging element
imaging device
wiring board
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JP2016092436A (en
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浩毅 田中
浩毅 田中
大樹 岩元
大樹 岩元
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)

Description

本発明は、例えばＣＣＤ（Charge Coupled Device）型またはＣＭＯＳ（Complementary
Metal Oxide Semiconductor）型等の撮像素子が実装される撮像素子実装用基板、撮像装置および撮像モジュールに関するものである。 The present invention is, for example, a CCD (Charge Coupled Device) type or CMOS (Complementary).
The present invention relates to an image pickup device mounting substrate, an image pickup apparatus, and an image pickup module on which an image pickup device such as a metal oxide semiconductor) type is mounted.

従来から撮像素子を撮像素子実装用基板に実装した撮像装置が知られている。また、撮像装置は、撮像素子実装用基板の上面に蓋体やレンズ筐体等が設けられ、撮像装置と成る。   2. Description of the Related Art Conventionally, an imaging device in which an imaging element is mounted on an imaging element mounting substrate is known. In addition, the imaging apparatus is provided with a lid, a lens housing, and the like on the upper surface of the imaging element mounting substrate.

また、このような撮像装置を、外部回路基板などの配線基板に実装した撮像モジュールが知られている。このような撮像モジュールとして、配線基板に、撮像装置を２つ設けた３次元映像や測定等を用途とする撮像モジュールが知られている。（特許文献１参照）。   An imaging module in which such an imaging apparatus is mounted on a wiring board such as an external circuit board is known. As such an imaging module, there is known an imaging module for use in 3D video, measurement, or the like in which two imaging devices are provided on a wiring board. (See Patent Document 1).

特開２０１２−８５２９０号公報JP 2012-85290 A

近年、３次元映像や測定を用途とする撮像モジュールは高機能化が進んでおり、２つの撮像素子の受光面に垂直な軸すなわち光軸の精度も求められている。しかしながら、上記従来の配線基板は平板状となっているため、２つの撮像装置における各撮像素子の受光面の向きは固定されるものとなり、各撮像素子を所望の傾きに実装することが難しく、２つの撮像素子の光軸の精度が低下してしまうことが懸念されている。   In recent years, imaging modules for use in three-dimensional video and measurement have become highly functional, and the accuracy of the axis perpendicular to the light receiving surfaces of the two imaging elements, that is, the accuracy of the optical axis is also required. However, since the conventional wiring board has a flat plate shape, the orientation of the light receiving surface of each imaging element in the two imaging devices is fixed, and it is difficult to mount each imaging element at a desired inclination. There is a concern that the accuracy of the optical axes of the two image sensors will be reduced.

このことから、撮像モジュールにより得られる画像に不具合が生じることが懸念されていた。   For this reason, there has been a concern that defects may occur in the image obtained by the imaging module.

本発明の１つの態様に係る撮像素子実装用基板は、主面を有している配線基板と、前記主面に設けられ、撮像素子を実装する複数の撮像素子実装部とを有しており、該撮像素子実装部は、それぞれ縦断面視で前記配線基板の厚み方向に凸状または凹状であり、前記複数の撮像素子実装部は、それぞれの間に中間部を有しており、前記中間部の中央を前記配線基板の厚み方向に通る仮想軸を中心として線対称または点対称の最高点または最低点を有している。
本発明の１つの態様に係る撮像素子実装用基板は、主面を有している配線基板と、前記主面に設けられ、撮像素子を実装する複数の撮像素子実装部とを有しており、該撮像素子実装部は、それぞれ縦断面視で前記配線基板の厚み方向に凸状または凹状であり、前記複数の撮像素子実装部に挟まれる前記主面の領域は、縦断面視における外縁形状が円弧状である。 An imaging element mounting substrate according to an aspect of the present invention includes a wiring board having a main surface and a plurality of imaging element mounting portions that are provided on the main surface and mount the imaging element. The imaging device mounting portions are each convex or concave in the thickness direction of the wiring board in a longitudinal sectional view, and the plurality of imaging device mounting portions have intermediate portions therebetween, and the intermediate It has the highest or lowest point of line symmetry or point symmetry about a virtual axis passing through the center of the part in the thickness direction of the wiring board .
An imaging element mounting substrate according to an aspect of the present invention includes a wiring board having a main surface and a plurality of imaging element mounting portions that are provided on the main surface and mount the imaging element. The imaging device mounting portions are each convex or concave in the thickness direction of the wiring board in a longitudinal sectional view, and the region of the main surface sandwiched between the plurality of imaging device mounting portions is an outer edge shape in the longitudinal sectional view Is arcuate.

本発明の１つの態様に係る撮像装置は、上記の撮像素子実装用基板と、前記撮像素子実装部に実装された撮像素子を有する。   An imaging device according to an aspect of the present invention includes the above-described imaging element mounting substrate and an imaging element mounted on the imaging element mounting portion.

本発明の１つの態様に係る撮像モジュールは、上記の撮像装置と、該撮像装置に設けられたレンズ筐体とを有する。   An imaging module according to one aspect of the present invention includes the imaging device described above and a lens housing provided in the imaging device.

本発明の撮像素子実装用基板は、主面を有している配線基板と、主面に設けられ、撮像素子を実装する複数の撮像素子実装部とを有しており、撮像素子実装部は、それぞれ縦断面視で配線基板の厚み方向に凸状または凹状であることから、複数の撮像素子を各撮像素子実装部に実装する場合に、撮像素子実装用基板が撮像素子を支持する面積を小さくする、または面積の小さい複数の点で支持することができ、それぞれの撮像素子の傾きを容易かつ精度よく調整することができる。したがって、複数の撮像素子を各撮像素子実装部に
容易にかつ精度よく実装することが可能となる。 The image pickup device mounting substrate of the present invention includes a wiring board having a main surface and a plurality of image pickup device mounting portions that are provided on the main surface and mount the image pickup device. Since each of them is convex or concave in the thickness direction of the wiring board in a longitudinal sectional view, when mounting a plurality of imaging elements on each imaging element mounting part, the area on which the imaging element mounting substrate supports the imaging element It can be made small or supported at a plurality of points having a small area, and the inclination of each image sensor can be adjusted easily and accurately. Therefore, a plurality of image sensors can be easily and accurately mounted on each image sensor mounting portion.

本発明の１つの態様に係る撮像装置は、上記構成の撮像素子実装用基板を有することによって撮像装置を用いて得られる画像に発生する不具合を低減させることが可能となる。   The image pickup apparatus according to one aspect of the present invention can reduce defects occurring in an image obtained using the image pickup apparatus by having the image pickup element mounting substrate having the above-described configuration.

本発明の１つの態様に係る撮像モジュールは、上記構成の撮像素子実装用基板を有することによって撮像装置を用いて得られる画像に発生する不具合を低減させることが可能となる。   The imaging module according to one aspect of the present invention has an imaging element mounting substrate having the above-described configuration, thereby reducing problems occurring in an image obtained using the imaging device.

（ａ）は、本発明の第１の実施形態に係る撮像素子実装用基板、および撮像装置の外観を示す上面図であり、（ｂ）は、（ａ）のＡ−Ａ線に対応する縦断面図である。(A) is a top view which shows the external appearance of the image pick-up element mounting board | substrate based on the 1st Embodiment of this invention, and an imaging device, (b) is a longitudinal section corresponding to the AA line of (a). FIG. （ａ）は、本発明の第１の実施形態のその他の態様に係る撮像素子実装用基板、および撮像装置の外観を示す上面図であり、（ｂ）は、（ａ）のＡ−Ａ線に対応する縦断面図である。(A) is a top view which shows the external appearance of the imaging device mounting board | substrate which concerns on the other aspect of the 1st Embodiment of this invention, and an imaging device, (b) is the AA line of (a). It is a longitudinal cross-sectional view corresponding to. （ａ）は、本発明の第１の実施形態のその他の態様に係る撮像モジュールの外観を示す上面図であり、（ｂ）は、（ａ）のＡ−Ａ線に対応する縦断面図である。(A) is a top view which shows the external appearance of the imaging module which concerns on the other aspect of the 1st Embodiment of this invention, (b) is a longitudinal cross-sectional view corresponding to the AA line of (a). is there. 本発明の第２の実施形態に係る撮像素子実装用基板、および撮像装置の縦断面図である。It is a longitudinal cross-sectional view of the image pick-up element mounting board | substrate which concerns on the 2nd Embodiment of this invention, and an imaging device. 本発明の第３の実施形態に係る撮像素子実装用基板、および撮像装置の縦断面図である。It is a longitudinal cross-sectional view of the image pick-up element mounting board | substrate and imaging device which concern on the 3rd Embodiment of this invention. （ａ）は、本発明の第４の実施形態に係る撮像素子実装用基板、および撮像装置の外観を示す上面図であり、（ｂ）は、（ａ）のＡ−Ａ線に対応する縦断面図である。(A) is a top view which shows the external appearance of the image pick-up element mounting board | substrate and imaging device which concern on the 4th Embodiment of this invention, (b) is a longitudinal section corresponding to the AA line of (a). FIG. （ａ）は、本発明の第５の実施形態に係る撮像素子実装用基板、および撮像装置の外観を示す上面図であり、（ｂ）は、（ａ）のＡ−Ａ線に対応する縦断面図である。(A) is a top view which shows the external appearance of the image pick-up element mounting board | substrate and imaging device which concern on the 5th Embodiment of this invention, (b) is a longitudinal section corresponding to the AA line of (a). FIG.

以下、本発明のいくつかの例示的な実施形態について図面を参照して説明する。なお、以下の説明では、複数の撮像素子実装部を有する撮像素子実装用基板を撮像素子実装用基板とする。また、撮像素子実装用基板に撮像素子が実装された構成を撮像装置とする。また、撮像装置にレンズ筐体を設けた構成を撮像モジュールとする。撮像素子実装用基板および撮像装置は、いずれの方向が上方若しくは下方とされてもよいものであるが、便宜的に、直交座標系ｘｙｚを定義するとともに、ｚ方向の正側を上方として、上面若しくは下面の語を用いるものとする。   Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an image sensor mounting substrate having a plurality of image sensor mounting portions is referred to as an image sensor mounting substrate. In addition, a configuration in which an imaging element is mounted on an imaging element mounting substrate is an imaging device. In addition, a configuration in which a lens housing is provided in the imaging apparatus is an imaging module. The image pickup device mounting substrate and the image pickup apparatus may be either upward or downward. For convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is defined as the upper surface. Or use the word on the bottom.

（第１の実施形態）
図１〜図３を参照して本発明の第１の実施形態における撮像装置２１、及び撮像素子実装用基板１について説明する。本実施形態における撮像装置２１は、撮像素子実装用基板１と撮像素子１０とを有している。 (First embodiment)
The imaging device 21 and the imaging element mounting substrate 1 according to the first embodiment of the present invention will be described with reference to FIGS. The imaging device 21 in the present embodiment includes an imaging element mounting substrate 1 and an imaging element 10.

図１に示す例において、主面を有している配線基板２と、主面に設けられ、撮像素子１０を実装する複数の撮像素子実装部１１とを有しており、撮像素子実装部１１は、それぞれ縦断面視で凸状または凹状である。   In the example shown in FIG. 1, the wiring board 2 having a main surface and a plurality of image sensor mounting portions 11 provided on the main surface and mounting the image sensor 10 are provided. Are respectively convex or concave in a longitudinal sectional view.

図１〜図３に示す例では、配線基板２は主面を有しており、絶縁層から成る。   In the example shown in FIGS. 1 to 3, the wiring board 2 has a main surface and is made of an insulating layer.

図１〜図３に示す例では、絶縁層からなる配線基板２は撮像素子実装部１１の外周部に
撮像素子接続用パッド３が設けられている。 In the example shown in FIGS. 1 to 3, the wiring board 2 made of an insulating layer is provided with an image sensor connecting pad 3 on the outer periphery of the image sensor mounting portion 11.

配線基板２を構成する絶縁層の材料は例えば、電気絶縁性セラミックス、または樹脂（プラスティックス）等が使用される。   As the material of the insulating layer constituting the wiring board 2, for example, electrically insulating ceramics or resin (plastics) is used.

配線基板２を形成する絶縁層の材料として使用される電気絶縁性セラミックスとしては例えば、酸化アルミニウム質焼結体，ムライト質焼結体，炭化珪素質焼結体，窒化アルミニウム質焼結体，窒化珪素質焼結体，またはガラスセラミックス焼結体等が挙げられる。   Examples of the electrically insulating ceramic used as the material of the insulating layer forming the wiring board 2 include an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a nitrided body. Examples thereof include a silicon-based sintered body or a glass ceramic sintered body.

配線基板２を形成する絶縁層の材料として使用される樹脂としては例えば、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂，フェノール樹脂，またはフッ素系樹脂等が挙げられる。フッ素系樹脂としては例えば、ポリエステル樹脂、または四フッ化エチレン樹脂が挙げられる。   Examples of the resin used as the material of the insulating layer forming the wiring board 2 include epoxy resin, polyimide resin, acrylic resin, phenol resin, or fluorine resin. Examples of the fluorine-based resin include polyester resin and tetrafluoroethylene resin.

図１〜図３に示す例において、配線基板２を形成する絶縁層は、前述した材料から成る絶縁層を複数上下に積層して形成されている。   In the example shown in FIGS. 1 to 3, the insulating layer forming the wiring substrate 2 is formed by laminating a plurality of insulating layers made of the above-described materials.

配線基板２を形成する絶縁層は、図１〜図３に示すように２層の絶縁層から形成されていても良いし、１層または３層以上の絶縁層から形成されていても良い。   The insulating layer forming the wiring substrate 2 may be formed of two insulating layers as shown in FIGS. 1 to 3, or may be formed of one or more insulating layers.

また、図示していないが配線基板２の上面、側面、または下面に、外部回路接続用電極が設けられていてもよい。外部回路接続用電極は、配線基板２と外部回路基板若しくは外部装置等と電気的に接続する為に設けられる。   Although not shown, external circuit connection electrodes may be provided on the upper surface, side surface, or lower surface of the wiring board 2. The external circuit connection electrode is provided to electrically connect the wiring board 2 to an external circuit board or an external device.

配線基板２の内部には、例えば、絶縁層間に形成される内部配線、またはこの内部配線同士を上下に接続する貫通導体が設けられる。これら内部配線、または貫通導体は、配線基板２の表面に露出していても良い。この内部配線、または貫通導体によって、外部回路接続用電極、及び撮像素子接続用パッド３が電気的に接続されていても良い。   Inside the wiring board 2, for example, an internal wiring formed between insulating layers or a through conductor that connects the internal wirings up and down is provided. These internal wirings or through conductors may be exposed on the surface of the wiring board 2. The external circuit connection electrode and the imaging element connection pad 3 may be electrically connected by the internal wiring or the through conductor.

撮像素子接続用パッド３、外部回路接続用電極、内部配線、及び貫通導体は配線基板２が電気絶縁性セラミックスから成る場合には、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）若しくは銅（Ｃｕ）またはこれらから選ばれる少なくとも１種以上の金属材料を含有する合金等から成る。また、撮像素子接続用パッド３、外部回路接続用電極、内部配線、及び貫通導体は、配線基板２が樹脂から成る場合には、銅（Ｃｕ），金（Ａｕ），アルミニウム（Ａｌ），ニッケル（Ｎｉ），クロム（Ｃｒ），モリブデン（Ｍｏ）若しくはチタン（Ｔｉ）またはこれらから選ばれる少なくとも１種以上の金属材料を含有する合金等から成る。   The imaging device connection pad 3, external circuit connection electrode, internal wiring, and through conductor are tungsten (W), molybdenum (Mo), manganese (Mn), silver when the wiring board 2 is made of electrically insulating ceramics. (Ag) or copper (Cu) or an alloy containing at least one metal material selected from these. In addition, the imaging element connection pad 3, the external circuit connection electrode, the internal wiring, and the through conductor are copper (Cu), gold (Au), aluminum (Al), nickel when the wiring board 2 is made of resin. (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), or an alloy containing at least one metal material selected from these.

撮像素子接続用パッド３、外部回路接続用電極、内部配線、及び貫通導体の露出表面に、めっき層が設けられることが好ましい。この構成によれば、撮像素子接続用パッド３、外部回路接続用電極、内部配線、及び貫通導体の露出表面を保護して酸化を防止できる。また、この構成によれば、撮像素子接続用パッド３と撮像素子１０とのワイヤボンディング等の接続部材１３を介した電気的接続、または外部回路接続用電極と外部回路基板との電気的接続を良好にできる。めっき層は、例えば、厚さ０．５〜１０μｍのＮｉめっき層を被着させるか、またはこのＮｉめっき層および厚さ０．５〜３μｍの金（Ａｕ）めっき層を順次被着させてもよい。   It is preferable that a plating layer is provided on the exposed surface of the imaging element connection pad 3, the external circuit connection electrode, the internal wiring, and the through conductor. According to this configuration, it is possible to protect the exposed surface of the imaging element connection pad 3, the external circuit connection electrode, the internal wiring, and the through conductor and prevent oxidation. Further, according to this configuration, the electrical connection between the imaging element connection pad 3 and the imaging element 10 via the connection member 13 such as wire bonding, or the electrical connection between the external circuit connection electrode and the external circuit board is performed. Can be good. As the plating layer, for example, a Ni plating layer having a thickness of 0.5 to 10 μm may be deposited, or even if this Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 to 3 μm are sequentially deposited. Good.

図１〜図３に示す例のように、撮像素子実装用基板１は、撮像素子１０を実装する複数の撮像素子実装部１１を有しており、撮像素子実装部１１は、それぞれ縦断面視で凸状または凹状である。   As illustrated in the example illustrated in FIGS. 1 to 3, the image pickup device mounting substrate 1 includes a plurality of image pickup device mounting portions 11 on which the image pickup device 10 is mounted. It is convex or concave.

図１〜図３に示す例のように、複数の撮像素子実装部１１がそれぞれ断面視で配線基板２の厚み方向に凸状または凹状であることで、撮像素子実装部１１が平板状である場合と比較して、複数の撮像素子１０を各撮像素子実装部１１に実装する場合に、撮像素子実装用基板１が撮像素子１０を支持する面積を小さくする、または面積の小さい複数の点で支持することができ、それぞれの撮像素子１０の傾きを容易かつ精度よく調整することができる。したがって、複数の撮像素子１０を各撮像素子実装部１１に容易にかつ精度よく実装することが可能となる。   As in the example shown in FIGS. 1 to 3, the plurality of image pickup device mounting portions 11 are each convex or concave in the thickness direction of the wiring board 2 in a cross-sectional view, so that the image pickup device mounting portion 11 has a flat plate shape. Compared to the case, when mounting a plurality of image pickup devices 10 on each image pickup device mounting portion 11, the area where the image pickup device mounting substrate 1 supports the image pickup device 10 is reduced, or at a plurality of points with a small area. The inclination of each image sensor 10 can be easily and accurately adjusted. Therefore, a plurality of image sensors 10 can be easily and accurately mounted on each image sensor mounting portion 11.

撮像素子実装部１１は、撮像素子１０が実装される領域をいう。図１〜図３に示す例では、撮像素子実装部１１は撮像素子接続用パッド３の内側の領域を示しているが、撮像素子接続用パッド３を含めた領域としてもよい。   The image sensor mounting unit 11 is a region where the image sensor 10 is mounted. In the example shown in FIGS. 1 to 3, the image sensor mounting portion 11 indicates the area inside the image sensor connection pad 3, but may be an area including the image sensor connection pad 3.

図１及び図３に示す例では、撮像素子実装部１１は第１撮像素子実装部１１ａと第２撮像素子実装部１１ｂとを有しており、それぞれに凹状の第１最低点２ａと第２最低点２ｃとを有している。第１撮像素子実装部１１ａ及び第２撮像素子実装部１１ｂが凹状の第１最低点２ａと第２最低点２ｃとを有することで、撮像素子１０の中心付近を配線基板２と離すことが可能となり、撮像素子１０に対する影響を小さくすることができる。また二つの第１最低点２ａと第２最低点２ｃとが、中間部４の中央を配線基板２の厚み方向（ｚ方向）に通る仮想軸を中心として、点対称または線対称であることによって、撮像素子１０を実装する工程において、それぞれの撮像素子１０の傾きを、中間部４の中央を配線基板２の厚み方向（ｚ方向）に通る仮想軸を中心として、対称とすることが容易となる。   In the example shown in FIGS. 1 and 3, the image sensor mounting portion 11 includes a first image sensor mounting portion 11 a and a second image sensor mounting portion 11 b, each having a concave first lowest point 2 a and a second one. And the lowest point 2c. Since the first image sensor mounting portion 11a and the second image sensor mounting portion 11b have the concave first lowest point 2a and the second lowest point 2c, the vicinity of the center of the image sensor 10 can be separated from the wiring board 2. Thus, the influence on the image sensor 10 can be reduced. The two first lowest points 2a and 2c are point-symmetrical or line-symmetrical with a virtual axis passing through the center of the intermediate portion 4 in the thickness direction (z direction) of the wiring board 2 as a center. In the process of mounting the image sensor 10, it is easy to make the inclination of each image sensor 10 symmetrical about the virtual axis passing through the center of the intermediate portion 4 in the thickness direction (z direction) of the wiring board 2. Become.

図２に示す例では、撮像素子実装部１１は第１撮像素子実装部１１ａと第２撮像素子実装部１１ｂとに分かれており、それぞれに凸状の第１最高点２ｂと第２最高点２ｄとを有している。図２に示す例のように撮像素子実装部１１の形状が縦断面視で前記配線基板の厚み方向に凸状であると、撮像素子１０を実装する工程において、撮像素子１０が凸状部で接するため、撮像素子１０の傾きの調整が容易とすることができる。   In the example shown in FIG. 2, the image sensor mounting unit 11 is divided into a first image sensor mounting unit 11 a and a second image sensor mounting unit 11 b, each having a convex first highest point 2 b and a second highest point 2 d. And have. When the shape of the image sensor mounting portion 11 is convex in the thickness direction of the wiring board in a longitudinal sectional view as in the example shown in FIG. 2, in the process of mounting the image sensor 10, the image sensor 10 is a convex portion. Therefore, the adjustment of the inclination of the image sensor 10 can be facilitated.

また、図１〜図３に示す例では、撮像素子実装部１１が２個設けられており、２つの撮像素子実装部１１は２つとも凹状または凹状のどちらかである。このことによって、より撮像素子１０の傾きの調整が容易となるため、好ましい。   In the example shown in FIGS. 1 to 3, two image pickup device mounting portions 11 are provided, and the two image pickup device mounting portions 11 are either concave or concave. This is preferable because the tilt of the image sensor 10 can be easily adjusted.

また、一般的に、撮像素子１０を実装する工程において、撮像素子１０は主面側から加圧される場合がある。例えば撮像素子実装部１１が凹状で角を有する場合、近年の撮像素子実装用基板の薄型化の影響で、撮像素子１０を実装する際の応力が加わる工程において、配線基板２の角にクラックまたは割れが発生する可能性がある。特に縦断面視で凹状の最低点（第１最低点２ａまたは第２最低点２ｃ）で角を有する場合は、顕著なものとなる。また、例えば撮像素子実装部１１の凸状の最高点の断面図が角度を有する場合は、撮像素子１０を実装する際の圧力が加わる工程において、配線基板２の第１最高点２ｂまたは、第２最高点２ｄに欠けが発生する可能性と、及び撮像素子１０の下面にクラックまたは欠けが発生する可能性とがある。   In general, in the process of mounting the image sensor 10, the image sensor 10 may be pressurized from the main surface side. For example, when the image sensor mounting portion 11 is concave and has a corner, a crack or a corner is formed at the corner of the wiring board 2 in the process of applying stress when mounting the image sensor 10 due to the recent thinning of the image sensor mounting substrate. Cracks may occur. In particular, when there is a corner at the concave lowest point (the first lowest point 2a or the second lowest point 2c) in the longitudinal sectional view, it becomes remarkable. For example, when the cross-sectional view of the convex highest point of the image sensor mounting portion 11 has an angle, the first highest point 2b of the wiring board 2 or the first point in the process of applying pressure when mounting the image sensor 10 is used. 2 There is a possibility that a chipping occurs at the highest point 2d and a crack or a chipping on the lower surface of the image sensor 10.

これに対し、図１〜図３に示す例のように、撮像素子実装部１１の凸状部または凹状部は、縦断面視における外縁形状が円弧状であることで、例えば２つの撮像素子実装部１１が凹状の場合は、撮像素子実装部の最低点が応力の起点となりにくく、配線基板２が第１最低点２ａまたは、第２最低点２ｃからクラックまたは割れが発生する事を低減させることができる。また、例えば２つの撮像素子実装部１１が凸状の場合には、頂点が緩やかな円弧状となるため、第１最高点２ｂまたは、第２最高点２ｄを起点とした配線基板２の欠けの発生を低減させることができる。また、第１最高点２ｂまたは、第２最高点２ｄから
撮像素子１０の下面にかかる応力を小さくすることが可能となり、撮像素子１０にクラックまたは欠けが発生する可能性を低減させることができる。 On the other hand, as in the example shown in FIGS. 1 to 3, the convex portion or the concave portion of the imaging element mounting portion 11 has, for example, two imaging element mountings because the outer edge shape in the longitudinal sectional view is an arc shape. When the portion 11 is concave, the lowest point of the image sensor mounting portion is less likely to be the starting point of stress, and the wiring board 2 is reduced from being cracked or cracked from the first lowest point 2a or the second lowest point 2c. Can do. Further, for example, when the two image sensor mounting portions 11 are convex, the apex has a gentle arc shape, so that the wiring board 2 lacks from the first highest point 2b or the second highest point 2d. Generation can be reduced. In addition, it is possible to reduce the stress applied to the lower surface of the image sensor 10 from the first highest point 2b or the second highest point 2d, and it is possible to reduce the possibility of the image sensor 10 being cracked or chipped.

さらに図１〜図３に示す例のように、複数の撮像素子実装部１１に挟まれる主面の領域である中間部４は、縦断面視における外縁形状が円弧状であることが好ましい。近年、撮像素子１０は、高画素化が進んでおりそれに伴い、動作時の発熱量も大きくなっている。そのため、撮像素子１０の発熱により、撮像素子実装用基板１が変形する際、撮像素子実装用基板１の２つの撮像素子実装部１１の間の中間部４に角部が存在すると、その変形の応力が集中し、撮像素子実装用基板１にクラックが発生する可能性があった。本形態のように、２つの撮像素子実装部１１の間の中間部４が円弧状となっていることで、応力を集中しづらくさせ、クラックの発生を低減させることができる為好ましい。   Further, as in the example illustrated in FIGS. 1 to 3, the intermediate portion 4 that is the region of the main surface sandwiched between the plurality of image sensor mounting portions 11 preferably has an arc shape in the outer cross-sectional view. In recent years, the number of pixels of the image sensor 10 has increased, and accordingly, the amount of heat generated during operation has increased. Therefore, when the imaging element mounting substrate 1 is deformed by the heat generation of the imaging element 10, if there is a corner portion in the intermediate portion 4 between the two imaging element mounting portions 11 of the imaging element mounting substrate 1, the deformation is reduced. There was a possibility that stress was concentrated and cracks occurred in the image pickup device mounting substrate 1. As in the present embodiment, it is preferable that the intermediate portion 4 between the two image sensor mounting portions 11 has an arc shape because stress can be hardly concentrated and occurrence of cracks can be reduced.

また、図１〜図３に示す例のように、複数の撮像素子実装部１１の凸状の最高点または凹状の最低点の、配線基板２の厚み方向における位置は同じであることが好ましい。なお、配線基板２の厚み方向における位置が同じであるとは、各撮像素子実装部１１の凸状の最高点の、配線基板２の厚み方向における距離、または各撮像素子実装部１１の凹状の最低点の、配線基板２の厚み方向における距離が０．２ｍｍ以下であることを含んでいる。一般的に、２つの撮像素子１０とレンズ２２との距離は等しい方が好ましい。そのため、本構造によって、２つの撮像素子１０とレンズとの距離を等しくすることが容易となるため好ましい。   Moreover, it is preferable that the position in the thickness direction of the wiring board 2 of the convex highest point or the concave lowest point of the plurality of imaging element mounting portions 11 is preferably the same as in the example illustrated in FIGS. Note that the same position in the thickness direction of the wiring board 2 means that the highest point of the convex shape of each imaging element mounting portion 11 is the distance in the thickness direction of the wiring board 2 or the concave shape of each imaging element mounting portion 11. It includes that the distance of the lowest point in the thickness direction of the wiring board 2 is 0.2 mm or less. In general, it is preferable that the distance between the two image pickup devices 10 and the lens 22 is equal. Therefore, this structure is preferable because it is easy to equalize the distance between the two imaging elements 10 and the lens.

次に、図３を用いて、撮像装置２１と撮像モジュール３０について説明する。図３に示す例において、撮像装置２１は撮像素子実装用基板１と、撮像素子実装部１１に実装された撮像素子１０と、を有している。また、図３に示す例において、撮像モジュール３０は撮像素子実装用基板１の上面に接合されたレンズ筐体３１を有している。   Next, the imaging device 21 and the imaging module 30 will be described with reference to FIG. In the example illustrated in FIG. 3, the imaging device 21 includes the imaging element mounting substrate 1 and the imaging element 10 mounted on the imaging element mounting portion 11. In the example shown in FIG. 3, the imaging module 30 has a lens housing 31 bonded to the upper surface of the imaging element mounting substrate 1.

撮像素子１０は例えば、ＣＣＤ型またはＣＭＯＳ型等の撮像素子等が用いられる。図３に示す例においては、撮像素子１０の各電極は、接続部材１３（ボンディングワイヤ）によって撮像素子接続用パッド３に電気的に接続されている。   For example, an image sensor such as a CCD type or a CMOS type is used as the image sensor 10. In the example shown in FIG. 3, each electrode of the image sensor 10 is electrically connected to the image sensor connection pad 3 by a connection member 13 (bonding wire).

撮像素子実装用基板１の上面には、レンズ筐体３１が接合されている。レンズ筐体３１は、上部の開口にレンズ２２を有しており、光学フィルタ２３が接合されていてもよい。   A lens housing 31 is bonded to the upper surface of the imaging element mounting substrate 1. The lens housing 31 has a lens 22 in an upper opening, and an optical filter 23 may be bonded thereto.

また、図３に示すように、レンズ筐体３１は複数のレンズ２２の間に撮像素子実装用基板１まで到達する柱を設けていることが好ましい。一般的に、撮像素子実装用基板１に実装される撮像素子１０が２つになると、伴ってレンズ２２が２つになることで、レンズ筐体３１が大型化する。このとき、２つのレンズ２２の間に柱を設けることにより、外部からの衝撃などにより大型化したレンズ筐体３１の上面が変形することを防ぐことができる為である。また、複数のレンズ２２の間に柱を設けることにより、左側に設けられたレンズ２２から入射した光が右側の撮像素子１０へ、また右側に設けられたレンズ２２から入射した光が左側の撮像素子１０へ到達することを低減することが可能となる。よって、画像にノイズが発生することを低減させることが可能となる。   In addition, as shown in FIG. 3, the lens housing 31 is preferably provided with a column that reaches the imaging device mounting substrate 1 between the plurality of lenses 22. In general, when the number of the image pickup devices 10 mounted on the image pickup device mounting substrate 1 is two, the number of the lenses 22 is increased, so that the lens housing 31 is enlarged. This is because by providing a column between the two lenses 22, it is possible to prevent the upper surface of the lens housing 31 that has been enlarged due to an external impact or the like from being deformed. Further, by providing a column between the plurality of lenses 22, light incident from the lens 22 provided on the left side is input to the right image sensor 10 and light incident from the lens 22 provided on the right side is imaged on the left side. Reaching the element 10 can be reduced. Therefore, it is possible to reduce the occurrence of noise in the image.

本発明の撮像装置２１は、上記構成の撮像素子実装用基板１と、撮像素子実装部１１に実装された撮像素子１０と、撮像素子実装用基板１の上面に接合されたレンズ筐体３１とを有していることにより、撮像モジュール３０を用いて得られる画像に発生する不具合を低減させることが可能となる。   The imaging device 21 of the present invention includes an imaging element mounting substrate 1 having the above-described configuration, an imaging element 10 mounted on the imaging element mounting portion 11, and a lens housing 31 bonded to the upper surface of the imaging element mounting substrate 1. Therefore, it is possible to reduce problems occurring in an image obtained using the imaging module 30.

次に、本実施形態の撮像素子実装用基板１の製造方法の一例について説明する。   Next, an example of a method for manufacturing the imaging element mounting substrate 1 of the present embodiment will be described.

なお、下記で示す製造方法の一例は、多数個取り配線基板を用いた製造方法である。   In addition, an example of the manufacturing method shown below is a manufacturing method using a multi-piece wiring board.

（１）まず、配線基板２を構成するセラミックグリーンシートを形成する。例えば、酸化アルミニウム（Ａｌ２Ｏ３）質焼結体である配線基板２を得る場合には、Ａｌ２Ｏ３の粉末に焼結助材としてシリカ（ＳｉＯ２），マグネシア（ＭｇＯ）またはカルシア（ＣａＯ）等の粉末を添加し、さらに適当なバインダー、溶剤および可塑剤を添加し、次にこれらの混合物を混錬してスラリー状となす。その後、従来周知のドクターブレード法またはカレンダーロール法等の成形方法によって多数個取り用のセラミックグリーンシートを得る。 (1) First, a ceramic green sheet constituting the wiring board 2 is formed. For example, when obtaining the wiring board 2 which is an aluminum oxide (Al 2 O 3 ) sintered material, silica (SiO 2 ), magnesia (MgO) or calcia (as a sintering aid) is added to the Al 2 O 3 powder. A powder such as CaO) is added, an appropriate binder, a solvent and a plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

なお、配線基板２が、例えば樹脂から成る場合は、所定の形状に成形できるような金型を用いて、トランスファーモールド法またはインジェクションモールド法等で成形することによって配線基板２を形成することができる。   When the wiring board 2 is made of, for example, a resin, the wiring board 2 can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. .

また、配線基板２は、例えばガラスエポキシ樹脂のように、ガラス繊維から成る基材に樹脂を含浸させたものであってもよい。この場合には、ガラス繊維から成る基材にエポキシ樹脂の前駆体を含浸させ、このエポキシ樹脂前駆体を所定の温度で熱硬化させることによって配線基板２を形成できる。   Moreover, the wiring board 2 may be obtained by impregnating a base material made of glass fiber with a resin, such as glass epoxy resin. In this case, the wiring board 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermosetting the epoxy resin precursor at a predetermined temperature.

（２）次に、スクリーン印刷法等によって、上記（１）の工程で得られたセラミックグリーンシートに撮像素子接続用パッド３、外部回路接続用電極及び貫通導体や内部配線を含んだ配線導体となる部分に金属ペーストを塗布または充填する。   (2) Next, by the screen printing method or the like, the ceramic green sheet obtained in the step (1) is connected to the imaging element connecting pad 3, the external circuit connecting electrode, the wiring conductor including the through conductor and the internal wiring, A metal paste is applied or filled into the part.

この金属ペーストは、前述した金属材料から成る金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、金属ペーストは、配線基板２との接合強度を高めるために、ガラス、セラミックスを含んでいても構わない。   This metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the metal powder made of the above-described metal material and kneading. The metal paste may contain glass or ceramics in order to increase the bonding strength with the wiring board 2.

（３）次に、各絶縁層となるセラミックグリーンシートを積層して加圧することにより配線基板２となるセラミックグリーンシート積層体を作製する。また、本工程で例えば金型や樹脂等で撮像素子実装部１１となる部分を上面または下面から押圧することで撮像素子実装部１１を凹状または凸状とすることが可能となる。または撮像素子実装部１１となる部分を上面または下面から吸引することで撮像素子実装部１１を凸状または凹状とすることが可能となる。   (3) Next, the ceramic green sheets used as the wiring board 2 are produced by laminating and pressing the ceramic green sheets used as the insulating layers. Further, in this step, the image sensor mounting portion 11 can be formed in a concave shape or a convex shape by pressing a portion that becomes the image sensor mounting portion 11 from the upper surface or the lower surface with, for example, a mold or a resin. Alternatively, it is possible to make the image sensor mounting portion 11 convex or concave by sucking a portion to be the image sensor mounting portion 11 from the upper surface or the lower surface.

（４）次に、このセラミックグリーンシート積層体を約１５００〜１８００℃の温度で焼成して、配線基板２が複数配列された多数個取り配線基板を得る。なお、この工程によって、前述した金属ペーストは、配線基板２となるセラミックグリーンシートと同時に焼成され、撮像素子接続用パッド３、外部回路接続用電極、または配線導体となる。   (4) Next, this ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece wiring board in which a plurality of wiring boards 2 are arranged. In this step, the above-described metal paste is fired simultaneously with the ceramic green sheet to be the wiring substrate 2, and becomes the imaging element connection pad 3, the external circuit connection electrode, or the wiring conductor.

（５）次に、焼成して得られた多数個取り配線基板を複数の配線基板２に分断する。この分断においては、配線基板２の外縁となる箇所に沿って多数個取り配線基板に分割溝を形成しておき、この分割溝に沿って破断させて分割する方法、またはスライシング法等により配線基板２の外縁となる箇所に沿って切断する方法等を用いることができる。なお、分割溝は、焼成後にスライシング装置により多数個取り配線基板の厚みより小さく切り込むことによって形成することができるが、多数個取り配線基板用のセラミックグリーンシート積層体にカッター刃を押し当てたり、スライシング装置によりセラミックグリーンシート積層体の厚みより小さく切り込んだりすることによって形成してもよい。   (5) Next, the multi-piece wiring board obtained by baking is divided into a plurality of wiring boards 2. In this division, a wiring substrate is formed by a method in which a dividing groove is formed in a multi-piece wiring substrate along a portion serving as an outer edge of the wiring substrate 2 and then divided by breaking along the dividing groove, or by a slicing method. The method etc. which cut | disconnect along the location used as 2 outer edges can be used. In addition, the dividing groove can be formed by cutting less than the thickness of the multi-piece wiring board with a slicing device after firing, but the cutter blade is pressed against the ceramic green sheet laminate for the multi-piece wiring board, You may form by cutting smaller than the thickness of a ceramic green sheet laminated body with a slicing apparatus.

上記（１）〜（５）の工程によって、撮像素子実装用基板１が得られる。なお、上記（
１）〜（５）の工程順番は指定されない。 Through the steps (1) to (5), the image sensor mounting substrate 1 is obtained. The above (
The process order of 1) to (5) is not specified.

このようにして形成された撮像素子実装用基板１の撮像素子実装部１１に撮像素子１０を実装することで、撮像装置２１を作製することができる。   The imaging device 21 can be manufactured by mounting the imaging element 10 on the imaging element mounting portion 11 of the imaging element mounting substrate 1 formed in this way.

（第２の実施形態）
次に、本発明の第２の実施形態による撮像素子実装用基板１および撮像装置２１について、図４を参照しつつ説明する。 (Second Embodiment)
Next, the imaging device mounting substrate 1 and the imaging device 21 according to the second embodiment of the present invention will be described with reference to FIG.

本実施形態における撮像装置２１において、第１の実施形態の撮像装置２１と異なる点は、撮像素子実装部１１の第１最低点２ａおよび第２最低点２ｃの最低点の撮像素子１０に対する位置が異なる点である。   The imaging device 21 in the present embodiment is different from the imaging device 21 in the first embodiment in that the position of the lowest point of the first lowest point 2a and the second lowest point 2c of the imaging element mounting unit 11 with respect to the imaging element 10 is different. It is a different point.

図４に示す例では、撮像素子１０は主面に受光面１０ａを有しており、撮像素子実装部１１の凹状部の最低点と撮像素子１０の受光面１０ａの中心とが平面視においてずれている、すなわち偏心している。   In the example shown in FIG. 4, the image pickup device 10 has a light receiving surface 10 a on the main surface, and the lowest point of the concave portion of the image pickup device mounting portion 11 and the center of the light receiving surface 10 a of the image pickup device 10 are shifted in plan view. That is, it is eccentric.

この形状によって、撮像素子１０を特定の方向に傾かせやすくなる。そのため、２つの撮像素子１０の受光面１０ａに垂直な軸すなわち光軸を容易に調整することができる為、より撮像装置２１で得られる画像を良好とすることが可能となる。   This shape makes it easy to tilt the image sensor 10 in a specific direction. Therefore, since the axis perpendicular to the light receiving surface 10a of the two image pickup elements 10, that is, the optical axis can be easily adjusted, the image obtained by the image pickup device 21 can be improved.

また、撮像素子実装部１１の凹状部の第１最低点２ａは、撮像素子１０の受光面１０ａの中心よりも、複数の撮像素子実装部１１間の中央側に位置している。このことによって、２つの撮像素子１０の受光面１０ａを配線基板２の中央方向へ傾けることが容易となる。よって、２つの撮像素子１０の光軸を１点に集光することが容易となり、より撮像装置２１で得られる画像を良好とすることが可能となる。   Further, the first lowest point 2 a of the concave portion of the image sensor mounting portion 11 is located on the center side between the plurality of image sensor mounting portions 11 with respect to the center of the light receiving surface 10 a of the image sensor 10. This makes it easy to incline the light receiving surfaces 10 a of the two image sensors 10 toward the center of the wiring board 2. Therefore, it becomes easy to condense the optical axes of the two imaging elements 10 to one point, and the image obtained by the imaging device 21 can be made more favorable.

また、第１撮像素子実装部１１ａの形状と第２撮像素子実装部１１ｂの形状を、中間部４の中心点に対して点対称または線対称となるように作製することで、２つの撮像素子１０の傾きを２つの撮像素子１０の光軸が１点で集光するようにより容易に調整することが可能となるため、好ましい。   In addition, two image pickup devices can be obtained by making the shape of the first image pickup device mounting portion 11a and the shape of the second image pickup device mounting portion 11b to be point symmetric or line symmetric with respect to the center point of the intermediate portion 4. The inclination of 10 can be adjusted more easily so that the optical axes of the two image sensors 10 are focused at one point, which is preferable.

また、２つの撮像素子実装部１１の間の中間部４が保持する空間４ａの空気の体積をより小さくすることが可能となる。このことで、２つの撮像素子１０が動作し発熱した場合において、第１撮像素子実装部１１ａと第２撮像素子実装部１１ｂとの温度を均等にすることが可能となる。よって、２つの撮像素子１０の状態を等しくすることができる為、より撮像装置２１で得られる画像を良好とすることが可能となる。   In addition, the volume of air in the space 4a held by the intermediate portion 4 between the two image sensor mounting portions 11 can be further reduced. This makes it possible to equalize the temperatures of the first image sensor mounting portion 11a and the second image sensor mounting portion 11b when the two image sensors 10 operate and generate heat. Therefore, since the states of the two imaging elements 10 can be made equal, the image obtained by the imaging device 21 can be made better.

このような、撮像素子実装用基板１の作製する方法として、例えば凹状部の中心が偏心するように作製した金型を用いて撮像素子実装用基板１となるセラミックグリーンシートを押圧する方法がある。また、例えば撮像素子実装用基板１となるセラミックグリーンシートを吸引する際に、撮像素子実装部１１の中心からずらして吸引する方法等が挙げられる。   As a method for producing such an image pickup device mounting substrate 1, for example, there is a method of pressing a ceramic green sheet to be the image pickup device mounting substrate 1 using a mold prepared so that the center of the concave portion is eccentric. . Further, for example, when a ceramic green sheet serving as the image pickup device mounting substrate 1 is sucked, a method of sucking the ceramic green sheet while being shifted from the center of the image pickup device mounting portion 11 is exemplified.

（第３の実施形態）
次に、本発明の第３の実施形態による撮像素子実装用基板１および撮像装置２１について、図５を参照しつつ説明する。 (Third embodiment)
Next, an imaging element mounting substrate 1 and an imaging device 21 according to a third embodiment of the present invention will be described with reference to FIG.

本実施形態における撮像装置２１において、第１の実施形態の撮像装置２１と異なる点は、撮像素子実装部１１の第１最高点２ｂおよび第２最高点２ｄの最高点の撮像素子１０
に対する位置が異なる点である。 The imaging device 21 in the present embodiment is different from the imaging device 21 in the first embodiment in that the imaging device 10 is the highest point of the first highest point 2b and the second highest point 2d of the imaging device mounting unit 11.
The position with respect to is different.

図５に示す例では、撮像素子１０は主面に受光面１０ａを有しており、撮像素子実装部１１の凸状部の最上点と撮像素子１０の受光面１０ａの中心とが平面視においてずれている、すなわち偏心している。   In the example shown in FIG. 5, the image pickup device 10 has a light receiving surface 10 a on the main surface, and the uppermost point of the convex portion of the image pickup device mounting portion 11 and the center of the light receiving surface 10 a of the image pickup device 10 are in a plan view. Misaligned, that is, eccentric.

この形状によって、撮像素子１０を特定の方向に傾かせやすくなる。そのため、２つの撮像素子１０の光軸を容易に調整することができる為、より撮像装置２１で得られる画像を良好とすることが可能となる。   This shape makes it easy to tilt the image sensor 10 in a specific direction. Therefore, since the optical axes of the two image sensors 10 can be easily adjusted, it is possible to improve the image obtained by the imaging device 21.

また、撮像素子実装部１１の凸状部の最高点は、受光面１０ａの中心よりも複数の撮像素子実装部１１全体における外側に位置している。このことによって、２つの撮像素子１０の受光面１０ａを配線基板２の中央方向へ傾けることが容易となる。よって、２つの撮像素子１０の光軸を容易に調整することが容易となり、より撮像装置２１で得られる画像を良好とすることが可能となる。   Further, the highest point of the convex portion of the image sensor mounting portion 11 is located outside the center of the plurality of image sensor mounting portions 11 with respect to the center of the light receiving surface 10a. This makes it easy to incline the light receiving surfaces 10 a of the two image sensors 10 toward the center of the wiring board 2. Therefore, the optical axes of the two image sensors 10 can be easily adjusted, and the image obtained by the image pickup device 21 can be improved.

また、第１撮像素子実装部１１ａの形状と第２撮像素子実装部１１ｂの形状を、中間部４の中央を配線基板２の厚み方向（ｚ方向）に通る仮想軸を中心として、点対称または線対称となるように作製することで、２つの撮像素子１０の受光面１０ａを容易に傾けることが可能となる。よって、２つの撮像素子１０の光軸がより容易に調整することが可能となるため、好ましい。   Further, the shape of the first imaging element mounting portion 11a and the shape of the second imaging element mounting portion 11b are point-symmetric with respect to the virtual axis passing through the center of the intermediate portion 4 in the thickness direction (z direction) of the wiring board 2 or By making it line symmetrical, it becomes possible to easily tilt the light receiving surfaces 10a of the two imaging elements 10. Therefore, it is preferable because the optical axes of the two imaging elements 10 can be adjusted more easily.

このような、撮像素子実装用基板１の作製する方法として、例えば凹状部の中心が偏心するように作製した金型を用いて撮像素子実装用基板１となるセラミックグリーンシートを押圧する方法がある。また、例えば撮像素子実装用基板１となるセラミックグリーンシートを吸引する際に、撮像素子実装部１１の中心からずらして吸引する方法等が挙げられる。   As a method for producing such an image pickup device mounting substrate 1, for example, there is a method of pressing a ceramic green sheet to be the image pickup device mounting substrate 1 using a mold prepared so that the center of the concave portion is eccentric. . Further, for example, when a ceramic green sheet serving as the image pickup device mounting substrate 1 is sucked, a method of sucking the ceramic green sheet while being shifted from the center of the image pickup device mounting portion 11 is exemplified.

（第４の実施形態）
次に、本発明の第４の実施形態による撮像素子実装用基板１および撮像装置２１について、図６を参照しつつ説明する。 (Fourth embodiment)
Next, an imaging element mounting substrate 1 and an imaging device 21 according to a fourth embodiment of the present invention will be described with reference to FIG.

本実施形態における撮像装置２１において、第１の実施形態の撮像装置２１と異なる点は、撮像素子実装部１１の第１最低点２ａおよび第２最低点２ｃと撮像素子１０との下面との間に接着剤１９が設けられている点である。   The imaging device 21 according to the present embodiment is different from the imaging device 21 according to the first embodiment in that it is between the first lowest point 2a and the second lowest point 2c of the imaging element mounting portion 11 and the lower surface of the imaging element 10. The adhesive 19 is provided.

図６に示す例では、撮像素子実装用基板１の撮像素子実装部１１の第１最低点２ａおよび第２最低点２ｃと撮像素子１０の下面との間には接着剤１９が充填されている。このことによって、撮像素子実装用基板１と撮像素子１０との接合強度を向上させることが可能となる。   In the example shown in FIG. 6, an adhesive 19 is filled between the first lowest point 2 a and the second lowest point 2 c of the imaging element mounting portion 11 of the imaging element mounting substrate 1 and the lower surface of the imaging element 10. . This makes it possible to improve the bonding strength between the imaging element mounting substrate 1 and the imaging element 10.

また、接着剤１９を大目に塗布することにより、撮像素子１０を実装する工程において撮像素子１０の傾きの調整が可能となり２つの撮像素子１０の光軸を調整することが、より容易となる、より。また、その後接着剤１９を硬化させる工程において、接着剤１９の体積が小さくなり撮像素子実装用基板１と当接する。この時、図６に示すように、凹状部が円弧状を描いていることによって、撮像素子１０にかかる応力を低減させることができる為、撮像素子１０に欠けやクラック等が発生することを低減させることができる。   In addition, by applying the adhesive 19 roughly, it is possible to adjust the tilt of the image sensor 10 in the process of mounting the image sensor 10, and it is easier to adjust the optical axes of the two image sensors 10. ,Than. Further, in the step of curing the adhesive 19 thereafter, the volume of the adhesive 19 is reduced and comes into contact with the image sensor mounting substrate 1. At this time, as shown in FIG. 6, since the stress on the image sensor 10 can be reduced because the concave portion has an arc shape, the occurrence of chipping or cracking in the image sensor 10 is reduced. Can be made.

接着剤１９は、例えば、銀エポキシや熱硬化性樹脂等が使用される。また、熱伝導性の良い接着剤１９を用いることで、撮像素子１０の放熱性を向上させることができる為、好
ましい。 For example, silver epoxy or thermosetting resin is used as the adhesive 19. In addition, it is preferable to use the adhesive 19 having good thermal conductivity because the heat dissipation of the imaging element 10 can be improved.

（第５の実施形態）
次に、本発明の第５の実施形態による撮像素子実装用基板１および撮像装置２１について、図７を参照しつつ説明する。 (Fifth embodiment)
Next, an imaging element mounting substrate 1 and an imaging device 21 according to a fifth embodiment of the present invention will be described with reference to FIG.

本実施形態における撮像装置２１において、第１の実施形態の撮像装置２１と異なる点は、撮像素子実装部１１の第１最高点２ｂおよび第２最高点２ｄと撮像素子１０の下面との間に接着剤１９が設けられている点である。   The imaging device 21 according to this embodiment differs from the imaging device 21 according to the first embodiment between the first highest point 2b and the second highest point 2d of the imaging element mounting unit 11 and the lower surface of the imaging element 10. The adhesive 19 is provided.

図６に示す例では、撮像素子実装用基板１の撮像素子実装部１１の第１最高点２ｂおよび第２最高点２ｄと撮像素子１０の下面との間には接着剤１９が充填されている。このことによって、撮像素子実装用基板１と撮像素子１０との接合強度を向上させることが可能となる。特に、図６に示す形状であると、接着剤１９がフィレット形状を形成することが可能となる。よって、撮像素子１０を下側に引っ張る力が大きくなるため、より接合強度を向上させることが可能となる。   In the example illustrated in FIG. 6, an adhesive 19 is filled between the first highest point 2 b and the second highest point 2 d of the imaging element mounting portion 11 of the imaging element mounting substrate 1 and the lower surface of the imaging element 10. . This makes it possible to improve the bonding strength between the imaging element mounting substrate 1 and the imaging element 10. In particular, when the shape is as shown in FIG. 6, the adhesive 19 can form a fillet shape. Therefore, the force for pulling the image sensor 10 downward increases, so that the bonding strength can be further improved.

接着剤１９は、例えば、銀エポキシや熱硬化性樹脂等が使用される。また、熱伝導性の高い接着剤１９を用いることで、撮像素子１０の放熱性を向上させることができる為、好ましい。   For example, silver epoxy or thermosetting resin is used as the adhesive 19. In addition, it is preferable to use the adhesive 19 having high thermal conductivity because heat dissipation of the imaging element 10 can be improved.

また、熱伝導性の高い接着剤１９を第５の実施形態で用いることで、接着剤１９のフィレットの部分でより表面積が大きくなるため、より放熱性を向上させることができる為、好ましい。またこの時、凸状部の円弧が大きい程、フィレットを大きく形成することができ、接合強度と放熱性をより向上させることができる為、好ましい。   In addition, it is preferable to use the adhesive 19 having high thermal conductivity in the fifth embodiment because the surface area of the fillet portion of the adhesive 19 becomes larger and the heat dissipation can be further improved. At this time, the larger the arc of the convex portion, the larger the fillet can be formed, and the bonding strength and heat dissipation can be further improved.

なお、本発明は上述の実施形態の例に限定されるものではなく、数値などの種々の変形は可能である。   In addition, this invention is not limited to the example of the above-mentioned embodiment, Various modifications, such as a numerical value, are possible.

また、例えば、図１〜図７に示す例では、撮像素子接続用パッド３の形状は矩形状であるが、円形状やその他の多角形状であってもかまわない。   For example, in the example illustrated in FIGS. 1 to 7, the shape of the image sensor connection pad 3 is a rectangular shape, but may be a circular shape or other polygonal shapes.

また、本実施形態における撮像素子接続用パッド３の配置、数、形状などは指定されない。   In addition, the arrangement, number, shape, and the like of the image sensor connection pad 3 in the present embodiment are not specified.

また、本実施形態における特徴部の種々の組み合わせは上述の実施形態の例に限定されるものではい。   In addition, various combinations of the characteristic portions in the present embodiment are not limited to the above-described embodiments.

１・・・・撮像素子実装用基板
２・・・・配線基板
２ａ・・・第１最低点
２ｂ・・・第１最高点
２ｃ・・・第２最低点
２ｄ・・・第２最高点
３・・・・撮像素子接続用パッド
４・・・・中間部
４ａ・・・中間部が保持する空間
１０・・・撮像素子
１０ａ・・受光面
１１・・・撮像素子実装部
１１ａ・・第１撮像素子実装部
１１ｂ・・第２撮像素子実装部
１３・・・接続部材
１９・・・接着剤
２１・・・撮像装置
２２・・・レンズ
２３・・・光学フィルタ
３０・・・撮像モジュール
３１・・・レンズ筐体 DESCRIPTION OF SYMBOLS 1 ... Imaging device mounting board 2 ... Wiring board 2a ... 1st lowest point 2b ... 1st highest point 2c ... 2nd lowest point 2d ... 2nd highest point 3 ··· Image sensor connecting pad 4 ··· Intermediate portion 4a · Space 10 held by intermediate portion · · · Image sensor 10a · · Light receiving surface 11 · · · Image sensor mounting portion 11a ··· First Image sensor mounting part 11b ... Second image sensor mounting part 13 ... Connection member 19 ... Adhesive 21 ... Imaging device 22 ... Lens 23 ... Optical filter 30 ... Imaging module 31 ... ..Lens housing

Claims (8)

主面を有している配線基板と、
前記主面に設けられ、撮像素子を実装する複数の撮像素子実装部とを有しており、
該撮像素子実装部は、それぞれ縦断面視で前記配線基板の厚み方向に凸状または凹状であり、
前記複数の撮像素子実装部に挟まれる前記主面の領域は、縦断面視における外縁形状が円弧状であることを特徴とする撮像素子実装用基板。 A wiring board having a main surface;
A plurality of image sensor mounting portions provided on the main surface for mounting the image sensor;
The imaging element mounting portions are each convex or concave in the thickness direction of the wiring board in a longitudinal sectional view,
The imaging element mounting substrate, wherein the region of the main surface sandwiched between the plurality of imaging element mounting portions has an arc shape in an outer edge in a longitudinal sectional view. 前記撮像素子実装部の凸状部または凹状部は、縦断面視における外縁形状が円弧状であることを特徴とする請求項１に記載の撮像素子実装用基板。   2. The image sensor mounting substrate according to claim 1, wherein the convex portion or the concave portion of the image sensor mounting portion has an arcuate outer edge shape in a longitudinal sectional view. 前記複数の凸状部の最高点または凹状部の最低点の、前記配線基板の厚み方向における位置は同じであることを特徴とする請求項１または請求項２に記載の撮像素子実装用基板。 Wherein the plurality of the lowest point of the highest point or concave portion of the convex portion, the imaging element mounting board according to claim 1 or claim 2 position is characterized by the same in the thickness direction of the wiring board. 請求項１〜請求項３のいずれか１つに記載の撮像素子実装用基板と、
該撮像素子実装用基板の前記撮像素子実装部に実装された撮像素子とを有することを特徴とする撮像装置。 The imaging device mounting substrate according to any one of claims 1 to 3 ,
An imaging device comprising: an imaging device mounted on the imaging device mounting portion of the imaging device mounting substrate. 主面を有している配線基板と、
前記主面に設けられ、撮像素子を実装する複数の撮像素子実装部とを有しており、
該撮像素子実装部は、それぞれ縦断面視で前記配線基板の厚み方向に凸状または凹状である撮像素子実装用基板と、
該撮像素子実装用基板の前記撮像素子実装部に実装された撮像素子とを有しており、
前記撮像素子は主面に受光面を有しており、
前記撮像素子実装部の凸状部の最高点または凹状部の最低点と前記撮像素子の前記受光面の中心とが偏心していることを特徴とする撮像装置。 A wiring board having a main surface;
A plurality of image sensor mounting portions provided on the main surface for mounting the image sensor;
The imaging element mounting portion is an imaging element mounting substrate that is convex or concave in the thickness direction of the wiring board in a longitudinal sectional view,
An image pickup device mounted on the image pickup device mounting portion of the image pickup device mounting substrate,
The image sensor has a light receiving surface on the main surface,
An imaging apparatus, wherein the highest point of the convex part or the lowest point of the concave part of the imaging element mounting part and the center of the light receiving surface of the imaging element are eccentric. 前記撮像素子は主面に受光面を有しており、
前記撮像素子実装部の凹状部の最低点は、前記受光面の中心よりも前記複数の撮像素子実装部間の中央側に位置していることを特徴とする請求項５に記載の撮像装置。 The image sensor has a light receiving surface on the main surface,
The imaging apparatus according to claim 5, wherein the lowest point of the concave portion of the imaging element mounting portion is located closer to the center between the plurality of imaging element mounting portions than the center of the light receiving surface. 前記撮像素子は主面に受光面を有しており、
前記撮像素子実装部の凸状部の最高点は、前記受光面の中心よりも前記複数の撮像素子
実装部全体における外側に位置していることを特徴とする請求項５に記載の撮像装置。 The image sensor has a light receiving surface on the main surface,
The imaging device according to claim 5, wherein the highest point of the convex portion of the imaging device mounting portion is located outside the center of the light receiving surface in the whole of the plurality of imaging device mounting portions. 請求項４または請求項５に記載の撮像装置と、
該撮像装置に設けられたレンズ筐体とを有することを特徴とする撮像モジュール。 An imaging device according to claim 4 or 5 ,
An imaging module comprising: a lens housing provided in the imaging device.
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