JP6951134B2 - Capsule for image pickup device and image pickup device - Google Patents

Description

The present invention relates to a lid for an image pickup device and an image pickup device used in an image pickup device equipped with an image pickup device such as a CCD (Charged-Coupled Device) and a CMOS (Complementary Metal-Oxide Semiconductor).

As the image pickup device used for a digital camera or the like, an image pickup device in which an image pickup element such as a CCD or CMOS is mounted on a substrate for the image pickup device is used. An image sensor is mounted on the bottom surface of the recess of the image sensor substrate, and a translucent lid is bonded to the upper surface of the image sensor substrate to airtightly seal the image sensor to form an image sensor (for example, a patent). See Reference 1.).

This lid had a rectangular parallelepiped shape, and its side surface was a plane substantially perpendicular to the light receiving surface of the image sensor. Therefore, the unnecessary light incident on the side surface from the upper surface of the lid is reflected on the side surface and easily incident on the image sensor, and flare and ghost due to the unnecessary light are likely to occur. It is known that the side surface is inclined in order to prevent unnecessary light reflected by the side surface from being incident on the image sensor (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2006-41270 Japanese Unexamined Patent Publication No. 2006-41183

In recent years, there has been an increasing demand for higher image quality for mirrorless single-lens digital cameras and compact digital cameras, which are more compact and easier to handle than single-lens reflex cameras, and large-sized image sensors are being used. The image pickup device is required to be small while being equipped with a large image sensor. Further, even if the mounting area of the image sensor is increased in the substrate for the image sensor, the other areas must be as small as possible. Therefore, the width of the bonding region (width of the bonding material) between the lid and the substrate for the imaging device is reduced, and the position of the side surface of the lid when viewed in a plan view is closer to the imaging element.

In the conventional lid whose side surface is inclined, the reflected light incident from the upper surface and reflected on the surface of the image sensor or around the image sensor becomes unnecessary light, and this unnecessary light is reflected on the side surface of the lid to be reflected on the image sensor. It was easy to get into the light. Further, it is difficult to prevent unnecessary light reflected on the side surface from being incident on the image sensor unless the inclination angle of the side surface is increased. Met.

The image pickup apparatus lid according to one aspect of the present disclosure is a second surface which is a surface opposite to the first surface and in which the outer edge and the outer edge of the first surface are at the same position in plan perspective. comprising a surface and a side surface between the first surface and the second surface, a plate-like member made of a translucent material, music face the whole side surface in perpendicular cross section to the first surface it is.

An imaging device according to one aspect of the present disclosure includes the above-mentioned lid for an imaging device and an imaging element provided below the lid for the imaging device.

According to the imaging device for the lid of the present disclosure, since the whole side surface is music surface, possibly incident light be small is incident and reflected by the side surface to the imaging element, and the surface or the like of the imaging device The possibility that the unnecessary light reflected by the above is reflected on the side surface and is incident on the image sensor is reduced.

According to the image pickup apparatus of the present disclosure, since the lid body for the image pickup apparatus is used, unnecessary light is less likely to be incident on the image pickup region, and flare or ghost is suppressed.

It is a perspective view which shows an example of the image pickup apparatus. (A) is a plan view of the image pickup apparatus shown in FIG. 1, (b) is a cross-sectional view taken along the line BB of (a), and (c) is a cross-sectional view taken along the line CC of (a). be. Both (a) and (b) are enlarged cross-sectional views showing an example of part A in FIG. 2 (b). It is a perspective view which shows by cutting a part of an example of the lid body for an image pickup apparatus. It is a perspective view which shows by cutting a part of the other example of the lid body for an image pickup apparatus. (A) to (c) are cross-sectional views showing another example of the image pickup apparatus.

Hereinafter, the imaging apparatus of the present disclosure will be described with reference to the drawings. It should be noted that the distinction between the top and bottom in the following description is for convenience, and does not limit the top and bottom when the substrate for an imaging device or the like is actually used. FIG. 1 is a perspective view showing an example of an imaging device. 2 (a) is a plan view of the image pickup apparatus shown in FIG. 1, FIG. 2 (b) is a cross-sectional view taken along the line BB of FIG. 2 (a), and FIG. 2 (c) is FIG. 2 (a). ) Is a cross-sectional view taken along the line CC. 3 (a) and 3 (b) are both cross-sectional views showing an enlarged example of part A in FIG. 2 (b). 4 and 5 are both perspective views showing a part of the lid for the imaging device cut out.

The image pickup device 100 includes a wiring board 2, an image pickup device 4, and a lid body 1 for the image pickup device, as shown in the examples shown in FIGS. 1 and 2.

The image pickup apparatus lid 1 of the present disclosure is a surface opposite to the first surface 11 and the first surface 11, and the outer edge and the outer edge of the first surface 11 are at the same position in plan perspective. And a side surface 13 between the first surface 11 and the second surface 12, which is a plate-like body made of a translucent material. The side surface 13 has a curved surface in a cross-sectional view perpendicular to the first surface 11.

According to the lid 1 for an image pickup device of the present disclosure, since the side surface 13 has a curved surface, there is a possibility that incident light is reflected by the side surface 13 and incident on the image pickup device 3, even if it is small, and the image pickup device 3 The possibility that unnecessary light reflected on the surface of the image sensor 3 is reflected on the side surface 13 and is incident on the image sensor 3 is reduced. The fact that the outer edge and the outer edge of the first surface 11 are at the same position in plan perspective means that the virtual line connecting the upper end and the lower end of the side surface 13 is perpendicular to the first surface 11 (and the second surface 12). It means that it is not inclined as a whole like the conventional lid for an image pickup device. Moreover, the same position does not have to be exactly the same position. That is, the angle formed by the virtual line L (broken line shown in FIGS. 3 to 5) connecting the upper end and the lower end of the side surface 13 and the first surface 11 (and the second surface 12) does not have to be a strict right angle. The angle formed by the virtual line L connecting the upper end and the lower end of the side surface 13 and the first surface 11 (and the second surface 12) may be about 85 degrees to 95 degrees. Further, as in the example shown in FIG. 2, the side surface 13 is a curved surface in a cross-sectional view perpendicular to the first surface 11. The shape of the image pickup apparatus lid 1 in a plan view is rectangular, and the side surface 13 in the plan view is not a curved surface. In other words, the side surface 13 has a curved surface in the thickness direction. Here, the fact that the side surface 12 has a curved surface means that the side surface 13 does not have to be a strict curved surface. For example, as in the example shown in FIG. 4, the side surface 13 has a flat top 13a of a convex curved surface. It may have a shape like a shape, or a shape having a flat surface portion at the center in the thickness direction on the side surface 13. In the case of this example as well, the overall shape of the side surface 13 in cross-sectional view is a curved surface, and 50% or more of the side surface 13 is a curved surface. The top portion 13a of the convex curved surface is the outermost peripheral portion of the image pickup apparatus lid 1 in a plan view, and is the portion farthest from the image pickup element. Therefore, even if this portion is flat, it is affected by the reflection of unnecessary light. Is small. The width of the flat top portion 13a in the thickness direction (W shown in FIG. 4) is, for example, about 50% or less of the thickness of the image pickup apparatus lid 1.

The side surface 13 of the image pickup apparatus lid 1 may be curved, may be a convex curved surface as shown in FIG. 2A, or may be concave as shown in FIG. 2B. It may be a curved surface. If the side surface 13 is a convex curved surface as shown in the example shown in FIG. 2 (a), the space between the main surface (first surface 11 and the second surface 12) and the side surface 13 does not form an acute angle, and the thickness is extremely high. Since a thin portion cannot be formed, the lid 1 for the imaging device is unlikely to be chipped. Further, when the wiring board 2 is joined with the joining material 3, cracks are unlikely to occur in the joining material 3 starting from the corners, so that the joining reliability can be made high.

Further, in the image pickup apparatus lid 1 of the present disclosure, as in the example shown in FIG. 5, the side surface 13 may have a plurality of grooves 13g extending along the first surface 11. With such a configuration, since the side surface 13 has irregularities with respect to the traveling direction of the unnecessary light, the unnecessary light is likely to be diffusely reflected on the side surface 13, and the possibility that the unnecessary light is incident on the image sensor 4 is further reduced. can. Further, since the light incident from the outside of the side surface 13 is likely to be diffusely reflected, the possibility that the light is incident from the side surface and becomes unnecessary light can be reduced. When the groove extends in the thickness direction of the image pickup device lid, the thickness direction of the image pickup device lid and the traveling direction of the unwanted light are almost the same, so that the portion of the side surface exposed to the unwanted light is uneven. Is not formed, and unnecessary light may not be diffusely reflected. By forming a plurality of grooves 13g extending along the first surface 11, unevenness can be easily formed in a portion exposed to unnecessary light. Further, by having the groove 13g on the side surface 13, when the lid 1 for the imaging device is joined to the substrate (wiring substrate 2) by the joining material 3, the joining material 3 enters the groove 13g and the joining strength is improved. .. At this time, since the groove 13g extends along the first surface 11 of the image pickup apparatus lid 1, the groove 13g is in the direction in which the image pickup apparatus lid 1 is peeled off from the substrate (wiring substrate 2).
The joined material 3 that has entered has a shape in which the resistance to peeling becomes larger.

The image pickup apparatus 100 of the present disclosure includes the above-mentioned image pickup apparatus lid 1 and an image pickup element 4 provided so as to face the image pickup apparatus lid 1. The upper surface (light receiving surface) of the image sensor 4 including the light receiving portion faces the lower surface of the image sensor lid 1. Therefore, it becomes difficult for unnecessary light to be incident on the image pickup region of the image pickup device 4, and the image pickup device 100 has flare or ghost suppressed.

In the example shown in FIGS. 1 and 2, the image pickup device 100 has an image pickup device 4 mounted on a substrate (wiring board 2) having a recess, and the image sensor lid 1 is formed around the recess on the upper surface of the wiring board 2. It is joined to the portion with the joining material 3. The image pickup device 100 may be provided with an image pickup element 4 provided so as to face the image pickup device lid 1, and is not limited to this example.

Here, FIGS. 6A to 6C are cross-sectional views showing another example of the imaging apparatus. In the example shown in FIG. 6A, the wiring substrate 2 has a metal plate-shaped frame 6 as a brazing material, glass, or a resin adhesive with respect to the wiring substrate 2 in the examples shown in FIGS. 1 and 2. The lid 1 for the image pickup apparatus is bonded to the upper surface of the frame 6 by the bonding material 3. It can be said that the image pickup device 4 is mounted on a substrate having a recess formed by the frame body 6 and the wiring substrate 2. The frame body 6 has a portion protruding outward from the outer edge of the wiring board 2 in a plan view, and the protruding portion is provided with a through hole 6a. Using the through hole 6a, for example, the image pickup apparatus 100 can be positioned in the camera and fixed by screwing. Further, in the example shown in FIG. 6B, the image sensor 4 is mounted on the flat plate-shaped wiring board 2, and the frame body 6 is joined to the upper surface of the wiring board 2 by the second joining material 32. The image sensor lid 1 is joined to the upper part of the frame 6 with a joining material 3 so as to close the upper surface of the image sensor 6. The thickness of the frame body 6 is thicker than that of the example shown in FIG. 6A, and is thicker than the height of the image sensor 4 and the bonding wire 5 from the upper surface of the wiring board 2. As a result, a space for accommodating the image pickup device 4 is formed between the inner surface of the frame body 6 and the upper surface of the wiring board 2. The frame body 6 and the wiring board 2 form a board having a recess. In the example shown in FIG. 6 (c), the image sensor 4 is mounted on the lower side of the frame-shaped wiring board 2, and the lens barrel 7 is bonded to the upper surface of the wiring board 2 by the second bonding material 32. The image sensor lid 1 is joined to the upper end of the lens barrel 7 with a joining material 3 so as to close the upper end of the cylinder 7. The light receiving surface of the image sensor 4 faces the image sensor lid 1 through the through hole of the frame-shaped wiring board 2. Further, the image pickup apparatus 100 of the example shown in FIG. 6C includes a lens 71 held between the upper end and the lower end of the lens barrel 7. In the example shown in FIG. 6C, the frame-shaped wiring board 2 has a recess on the lower surface and can be seen to penetrate from the bottom surface to the upper surface of the recess, that is, the substrate (wiring) of this example. It can be said that the substrate 2) has a recess. The image sensor lid 1 has a side surface in which the image sensor lid 1 and the image sensor 4 are close to each other as in the image sensor 100 shown in FIGS. 1 and 2, 6 (a) and 6 (b). It is more effective when applied to a device in which the light reflected by the image sensor 13 is likely to be incident on the image sensor 4 (in other words, a device in which the side surface 13 and the light receiving portion of the image sensor 4 are connected by a straight line).

Further, when the image sensor 4 is mounted in the recess of the substrate having the recess, and the image sensor lid 1 closes the opening of the recess and is joined to the substrate by the bonding material 3, the image sensor lid 1 Since the image sensor 4 is housed in the recess of the substrate at the time of joining, the possibility that the image sensor 4 collides with an external object and is damaged is reduced. As described above, the substrate includes the wiring board 2, and the wiring conductor 22 of the wiring board 2 and the electrode 4a of the image sensor 4 are electrically connected. When the substrate is a wiring board 2 having a recess that does not penetrate the frame 6 or the like, the image sensor 4 can be hermetically sealed only by the image sensor lid 1 and the bonding material 3. , The reliability of airtightness becomes higher.

Further, as shown in the example shown in FIG. 3A, the side surface 13 of the image pickup apparatus lid 1 has a convex curved surface shape, and the bonding material 3 is a portion of the side surface 13 on the substrate (wiring substrate 2) side and the substrate (). The image pickup apparatus 100 which is joined to the upper surface of the wiring board 2) can be used. With such a configuration, a space in which the bonding material 3 is collected is formed between the side surface 13 of the image pickup apparatus lid 1 and the substrate (wiring substrate 2). Therefore, since the bonding strength can be obtained without the bonding material 3 being widely wetted and spread on the substrate (wiring board 2), the area for bonding the image pickup apparatus lid 1 on the substrate (wiring board 2) is reduced. This makes the imaging device 100 smaller.

The wiring board 2 has a mounting area 2a of the image pickup device 4 on the upper surface and has a rectangular shape in a plan view. In the examples shown in FIGS. 1 and 2, the wiring board 2 is a frame portion having a rectangular shape in a plan view and surrounding the base portion and the mounting area 2a provided on the base portion, which are formed by laminating the insulating layers 21. And have. It has a recess formed by the upper surface of the base portion and the frame portion, and the mounting region 2a is located on the bottom surface of the recess. The wiring board 2 may have a flat plate shape having only a base portion without a frame portion as shown in the example shown in FIG. 6 (b), or may be large as shown in the example shown in FIG. 6 (c). It may have a frame shape composed of different frame bodies.

The wiring board 2 includes, for example, an insulating layer 21 made of a ceramic material and a wiring conductor 22. The wiring board 2 is for fixing the image pickup device 4 and electrically connecting it to an external circuit. The image sensor 4 is mounted in the mounting area 2a of the wiring board 2, and the electrode 4a of the image sensor 4 and the wiring conductor 22 are electrically connected so that the image sensor 4 is electrically connected to the external circuit via the wiring board 2. Is connected. When the wiring board 2 includes a base portion and a frame portion, these are integrally formed by firing. In the example shown in FIG. 2, the base portion is composed of two layers of insulating layers 21, the frame portion is composed of three layers of insulating layers 21, and the insulating layer 21 of five layers is provided as a whole. The number of layers of 21 is not limited to this.

The insulating layer 21 of the wiring board 2 is made of a ceramic material, for example, aluminum oxide (
Alumina: Al ₂ O ₃ ) quality sintered body, aluminum nitride (AlN) quality sintered body, or the like. A resin material such as epoxy can also be used. When the insulating layer 21 of the wiring board 2 is made of an aluminum oxide sintered body, the wiring board 2 is less likely to warp due to its high mechanical strength, and has an appropriate thermal conductivity. The heat generated from the image pickup element 4 can be easily dissipated to the outside. Therefore, when the wiring board 2 is made of an aluminum oxide sintered body, the wiring board 2 is preferable in terms of mechanical strength, thermal conductivity, and cost.

The wiring conductor 22 is for electrical connection with the image sensor 4 and further for connection with an external circuit. The wiring conductors 22 are arranged adjacent to the mounting region 2a, for example, a connection pad connected to the electrode 4a of the image pickup element 4 by a bonding wire 5 or the like, an external electrode provided on the lower surface of the base portion, and electrically connected to these. Includes an internal wiring provided between the insulating layers 21 and a through conductor that penetrates the insulating layer 21 and connects the upper and lower wires. In the example shown in FIG. 2B, the frame body portion has a stepped portion inside, and the wiring conductor 22 is provided from the upper surface of the stepped portion of the frame body portion to the lower surface of the base portion. Assuming that the frame body portion has no step portion, the wiring conductor 22 may be provided from the region adjacent to the mounting region 2a on the upper surface of the base portion to the lower surface of the base portion.

If the insulating layer 21 is made of ceramic, the wiring conductor 22 is formed as a metallized layer using, for example, a metal powder such as tungsten, molybdenum, copper, or silver. If the insulating layer 21 is made of a resin material, it is formed of, for example, copper foil. On the exposed surface of the wiring conductor 22, for example, in order to protect the wiring conductor 22 and improve the bondability with the bonding wire 5 for connecting to the image pickup element 4 or the solder for connecting to an external circuit, for example. , Nickel and gold plating coatings can be formed.

When the insulating layer 21 of the wiring board 2 is made of, for example, an aluminum oxide sintered body, it can be produced as follows. First, an appropriate organic solvent, solvent, etc. are added and mixed with raw material powders such as alumina (Al ₂ O ₃ ) or silica (SiO ₂ ), calcia (CaO), and magnesia (MgO) to form a slurry, which is well known. A ceramic green sheet (hereinafter, also referred to as a green sheet) to be an insulating layer 21 can be obtained by molding into a sheet shape by using a doctor blade method, a calendar roll method, or the like.

A conductor paste for the wiring conductor 22 is printed on the surface of the ceramic green sheet to form a wiring conductor pattern. When a through conductor is provided, a through hole is formed in the green sheet prior to printing the conductor paste, and the through hole is filled with the conductor paste. The conductor paste can be prepared by kneading the metal powder as described above with an organic component such as an organic solvent or a binder.

After that, a plurality of green sheets on which a wiring conductor pattern is formed are laminated to prepare a laminated body, and the laminated body is fired at a temperature of, for example, about 1600 (° C.) to manufacture a wiring board 2.

In the examples shown in FIGS. 1 and 2, the image pickup apparatus lid 1 is provided on the upper surface of the wiring board 2 via a bonding material 3 so as to close the opening (opening of the recess) of the frame body of the wiring board 2. It is joined. It suffices if the portion outside the opening on the upper surface of the wiring board 2 and the outer edge portion on the lower surface of the lid 1 for the imaging device that overlaps this portion are joined, as in the examples shown in FIGS. Further, when the side surface 13 of the image pickup apparatus lid 1 is also joined, the joining area is increased and the meniscus is also increased, so that the joining strength is higher.

The image pickup apparatus lid 1 is a plate-like body made of a translucent material, that is, a material that transmits visible light. For example, a plate material made of a transparent glass material such as soda glass or borosilicate glass, and a glass material having high light transmittance is preferable. Further, a crystal plate can be used as the lid 1 for the imaging device. Since the crystal plate emits almost no α-ray or β-ray radiation and the S / N of the image pickup device 4 is unlikely to decrease, the image pickup device 100 using the crystal plate as the image pickup device lid 1 is of high quality. You can get an image.

The dimensions of the image sensor lid 1 are set according to the size of the image sensor 4 mounted on the image sensor 100, the size of the opening of the recess of the wiring substrate 2, and the like, and are, for example, 6 mm to 40 mm × 4 mm to 30 mm. It has a rectangular shape and a thickness of 0.2 mm to 1 mm.

The image pickup apparatus lid 1 is, for example, cut from a large plate made of a translucent material as described above and processed into a rectangular plate having a predetermined size (hereinafter, also referred to as a rectangular plate). Made in. For example, a groove can be formed on the main surface of a large plate by laser, dicing, or the like, and cutting can be performed by applying mechanical stress or thermal stress to the groove. The side surface of the rectangular plate obtained by this cutting is formed to be substantially flat. In order to make the side surface 13 of the image pickup apparatus lid 1 curved, for example, the side surface of the rectangular plate may be polished with a polishing grindstone. By using a polishing grindstone having a predetermined shape, a lid 1 for an imaging device having a side surface 13 having a predetermined shape can be manufactured. In order to polish the side surface 13 having a convex curved surface shape as in the example shown in FIG. 3A, for example, the polished surface has a concave curved surface corresponding to the convex curved surface of the side surface 13 of the lid 1 for an imaging device. Using a rotary grindstone, the polished surface of the rotary grindstone may be pressed against the side surface of the rectangular plate to be polished. As a result, the side surface 13 can be a lid 1 for a cutting image pickup device having a constant convex curved surface at any portion. Further, in order to make the side surface 13 of the image pickup device lid 1 a concave curved surface as shown in the example shown in FIG. 3 (b), the polished surface corresponds to the concave curved surface of the side surface 13 of the image pickup device cover 1. A rotary grindstone having a convex curved surface may be used.

When the side surface 13 of the image pickup apparatus lid 1 is formed by polishing, the side surface 13 having a plurality of grooves 13g extending along the first surface 11 can be formed as in the example shown in FIG. can. The direction of polishing, that is, the moving direction of the grindstone may be the direction along the surface of the first surface 11 and the circumferential direction of the side surface 13. When a rotary grindstone is used, it is preferable that the rotational direction and the moving direction of the rotary grindstone are along the circumferential direction of the side surface 13.

Further, as in the example shown in FIG. 4, in order to form the side surface 13 having a convex curved surface shape and the top portion 13a of the curved surface is a flat surface, a grindstone having a concave portion having a shape corresponding to this shape is used on the polished surface. Alternatively, a grindstone whose polishing surface is a concave curved surface may be used, and polishing may be performed so that the bottom of the concave curved surface of the grindstone does not reach the side surface of the rectangular plate body. In the former case, the groove 13g is also formed on the top 13a of the side surface 13, and in the latter case, the groove 13 is not formed on the top 13a of the side surface 13.

The groove 13g on the side surface 13 of the image pickup apparatus lid 1 has an opening width of about 0.5 μm to 5 μm and a depth of about 0.01 μm to 0.1 μm. At this level, the image pickup apparatus lid 1 will not be cracked starting from the groove 13 g. Further, since a large number of irregularities can be formed on the side surface 13, unnecessary light can be easily diffusely reflected on the side surface 13. The length of the first surface 11 in the direction along the surface is not particularly limited, and may be the same as or shorter than the length of each of the four side surfaces 13 of the rectangular image pickup apparatus lid in a plan view. You may. Even if it is short, a plurality of grooves 13g are arranged side by side in the thickness direction of the side surface 13, and a large number of recesses are formed on the side surface 13 in a cross-sectional view perpendicular to the first surface 11, and the side surface 13 has irregularities. It is a curved surface. Also, groove 13g
The distance between them can be 10 μm or less, and the grooves 13 g may overlap. In this way, fine irregularities are formed over almost the entire area of the side surface 13, so that unnecessary light is more likely to be diffusely reflected. In the example shown in FIG. 5, the groove 13g is schematically shown, and it is made easy to understand by showing it larger than the size of the image pickup apparatus lid 1.

In FIG. 3A, the first surface 11, the second surface 12, and the side surface 1 of the main surface of the image pickup apparatus lid 1 are shown.
It touches at the boundary of 3 at no angle. In other words, the side surface 13 is semicircular in a cross-sectional view perpendicular to the first surface 11 (and the second surface 12), and the first surface 11 and the second surface 12 are circumscribed by this semicircle and have corners. Not done. Not limited to this example, as in the example shown in FIG. 4, an angled corner portion may be provided at the boundary between one main surface or both main surfaces and the side surface 13. In that case, if the angle between the first surface 11, the second surface 12 and the side surface 13 is 135 ° or more, the corners are less likely to be chipped when the lid 1 for the imaging device is handled, and dust is generated. It becomes difficult.

Further, a C-plane or an R-plane can be formed at the four corners of the image pickup apparatus lid 1 which is rectangular in a plan view. In this way, when handling the image pickup apparatus lid 1, the corners are less likely to be chipped and dust is less likely to be generated. For example, it is preferable to form R with a size equal to or larger than the thickness of the image pickup apparatus lid 1.

The bonding material 3 is made of, for example, a resin adhesive. The resin adhesive can be mainly composed of an epoxy resin having a dense three-dimensional network structure from the viewpoint of moisture resistance or bonding strength. The resin adhesive includes, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative epoxy resin, biphenol skeleton. Epoxy resins such as type epoxy resins, to which imidazole-based, amine-based, phosphorus-based, hydrazine-based, imidazole adduct-based, amine adduct-based, cationic polymerization-based, or dicyandiamide-based curing agents are added. It is composed of. The bonding material 3 may be used by mixing two or more types of epoxy resins.

Further, as the bonding material 3, a material having a low elastic modulus is used in order to relieve the stress due to the difference in the coefficient of thermal expansion between the lid 1 for the image pickup device and the substrate (wiring substrate 2), the frame 6 or the lens barrel 7. Can be done. As the bonding material 3, for example, a resin adhesive having an elastic modulus of 5 GPa or less can be used as a filler by adding about 50 (%) or less of acrylic rubber particles or the like by external addition. can.

Further, the bonding material 3 may contain a pigment, a dye or a filler in order to reduce the transmission of visible light. Light that is about to enter from the side surface 13 of the image pickup apparatus lid 1 or between the image pickup apparatus lid 1 and the substrate can be absorbed or scattered by these, and unnecessary light can be suppressed.

The method of joining the image pickup apparatus lid 1 using the joining material 3 is as follows, for example, in the case of joining to the wiring substrate 2 using a resin adhesive as the joining material 3. First, using a conventionally known method such as screen printing, a resin adhesive is formed around the opening of the recess of the wiring board 2 or the entire circumference of the outer peripheral edge of the image pickup device 1 to form the wiring board 2. The image pickup apparatus lid 1 is placed on the lid 1 via a resin adhesive. Then, by curing the resin adhesive using heat, ultraviolet rays, or the like, the wiring substrate 2 and the image pickup apparatus lid 1 are joined via the joining material 3.

The metal frame 6 in the case of the example shown in FIG. 6A is made of, for example, a metal such as 42 alloy or stainless steel, and can be manufactured by punching a metal plate. As the second bonding material 32 at this time, the same resin adhesive as the bonding material 3, a metal bonding material such as silver brazing or solder, glass, or the like can be used.

The frame body 6 in the case of the example shown in FIG. 6 (b) and the lens barrel 7 in the case of the example shown in FIG. 6 (c) are, for example, the same metal, epoxy, etc. as the above-mentioned metal frame body 6. If it is made of the same ceramics as the insulating layer 21 of the wiring substrate 2, and if it is made of metal, it is molded by the same method as the above-mentioned metal frame 6, and if it is made of resin, it is molded by a known resin such as injection molding. In the body forming method, when it is made of ceramics, it can be produced by a known method such as producing a product form by press molding and firing the ceramic powder. As the second joining material 32 in this case, the same material as described above can be used. Further, the lens 71 is made of, for example, glass or resin, and is joined to and fixed to the lens barrel 7 with an adhesive.

The image pickup element 4 is, for example, CMOS or CCD, and is mounted in the mounting area 2a of the wiring board 2 and electrically connected to the wiring conductor 22 of the wiring board 2 as in the examples shown in FIGS. 1, 2 and 6. Is connected. The image pickup element 4 is fixed to the mounting area 2a via an adhesive or the like, and is electrically connected to a wiring conductor 22 provided on the wiring board 2 by a bonding wire 5. The image sensor 4 may be mounted by being electrically connected to the wiring conductor 22 by a flip chip method. In this case, it can be fixed by using an underfill material.

The present invention is not limited to the examples of the above embodiments, and various modifications and improvements can be made without departing from the gist of the present invention.

1 ... Cover for imaging device 11 ... First surface 12 ... Second surface 13 ... Side surface 13a ... Top 13g ... Groove 2 ... Wiring board 2a ... Mounting area 21 ... Insulation layer 22 ... Wiring conductor 3 ... Bonding material 32 ... Second bonding material 4 ... Imaging element 4a ... Electrode 5 ... Bonding wire 6 ... Frame body 6a ... Through hole 7 ... Lens tube 71 ... Lens 100 ... Imaging device

Claims (6)

The first surface, the second surface opposite to the first surface, and the outer edge and the outer edge of the first surface at the same position in plan perspective, and the first surface and the second surface. and a side surface between a plate-like body made of a translucent material, an imaging device for lid is song plane in perpendicular cross section the whole side surface to the first surface. The aspect is the imaging device for closure of claim 1 which is convex curved surface. The side has a plurality of grooves are arranged in the thickness direction of Rutotomoni the side extending along said first surface, the opening width of the groove is 2.5% or less of the thickness of said plate-like body , and the that has irregularities over the entire of the side claim 1 or claim 2 in the imaging device for the lid according. The image pickup apparatus lid according to any one of claims 1 to 3.
An image pickup device including an image pickup element provided so as to face the lid body for the image pickup device. The imaging device according to claim 4, wherein the image pickup element is mounted in the recess of a substrate having a recess, and the lid for the image pickup device closes the opening of the recess and is joined to the substrate with a bonding material. Device. The imaging device according to claim 5, wherein the side surface of the lid for an imaging device has a convex curved surface, and the joining material joins a portion of the side surface on the substrate side and an upper surface of the substrate.

Images