JP7023724B2 - Package and electronics - Google Patents

Description

The present invention relates to a package and an electronic device for sealing an electronic component with a wiring board and a lid.

There is an electronic device in which electronic components such as semiconductor elements and sensor elements are mounted on a wiring substrate, and a lid is bonded and sealed with a resin adhesive. Electronic components are stored and mounted in the recesses of the wiring board, and the openings of the recesses are closed with a lid to make the electronic components airtightly sealed. At this time, since the epoxy resin used as the resin adhesive has moisture permeability, there is a package in which the inside of the resin adhesive is a water-absorbent adhesive such as an epoxy resin and the outside is a water-repellent adhesive (for example, Patent Documents). See 1.). Since the water-absorbent adhesive can prevent dew condensation in the sealing space, the package is suitable for sealing semiconductor devices having optical characteristics. Further, a MEMS (Micro Electro Mechanical System) mounting structure in which a lid body is joined with a resin adhesive and the resin adhesive and the outer surface of the lid body are coated with a moisture-proof layer to improve moisture resistance is also known (for example). See Patent Document 2).

Japanese Unexamined Patent Publication No. 4-85559 JP-A-2015-160286

With the miniaturization of electronic devices, the joint width between the lid and the wiring board has also become extremely small. Therefore, it becomes difficult to bond with two kinds of adhesives as in the package of Patent Document 1, and even if they can be bonded, the width of the resin adhesive that mainly contributes to the bonding strength and the airtight sealing property is further reduced. There was a risk that the characteristics of the would deteriorate.

As in the package described in Patent Document 2, only a resin adhesive may be used for joining the lid and the wiring substrate, and a moisture-proof layer may be provided on the outside thereof. However, this moisture-proof layer is made of an inorganic insulating material by a vapor deposition technique. Because it was formed, it was very expensive. Further, since the moisture-proof layer is a thin film, it may be damaged by contact with an external device or the like when handling a package or an electronic device, and the moisture-proof property may be impaired, resulting in low sealing reliability.

A package according to one aspect of the present invention comprises a wiring board on which electronic components are mounted, a lid that forms a space in which the electronic components are housed, and between the wiring board and the lid. A first resin adhesive having an exposed portion between the outer surface of the wiring board and the outer surface of the lid while joining these outer peripheral portions to each other, and the first resin adhesive. A second resin adhesive, which is bonded by covering the outer surface of the wiring board and the outer surface of the lid so as to straddle the exposed portion of the resin adhesive and has water repellency, and the second resin. It covers the outer surface of the adhesive and is joined, and includes a cover member made of a member harder than the second resin adhesive.

An electronic device according to one aspect of the present invention includes the above package and electronic components mounted on the wiring board in the package.

According to the package of one aspect of the present disclosure, since it has the above configuration, it is bonded with a first resin adhesive having excellent bonding strength and sealing property, and the lid and the wiring substrate are bonded from the outer surface of the first resin adhesive. Since the outer surface of the second adhesive is covered with a water-repellent second resin adhesive, it is excellent in bonding strength and airtight sealing property as well as moisture resistance, and the outer surface of the second adhesive is harder than this. Since it is covered with a cover member made of a member, the possibility that the second adhesive is damaged due to contact with an external device or the like is reduced, so that the sealing reliability is further improved.

According to the electronic device of one aspect of the present disclosure, since the package having the above configuration is included, the sealing reliability of the electronic component mounted on the wiring board is excellent.

It is a perspective view which shows an example of a package, (a) is a perspective view from a lid side, and (b) is a perspective view from a wiring board side. It is an exploded perspective view of the package shown in FIG. (A) is a plan view of the package shown in FIG. 1, and (b) is a cross-sectional view taken along the line BB of (a). It is an exploded perspective view which shows the other example of a package. (A) is a plan view of the package shown in FIG. 4, and (b) is a cross-sectional view taken along the line BB of (a). (A) is a plan view showing another example of the package, and (b) is a cross-sectional view taken along the line BB of (a). (A) is a plan view showing another example of the package, and (b) is a cross-sectional view taken along the line BB of (a). (A) is a plan view showing another example of the package, and (b) is a cross-sectional view taken along the line BB of (a). It is an exploded perspective view which shows an example of an electronic device. (A) is a plan view of the electronic device shown in FIG. 9, and (b) is a cross-sectional view taken along the line BB of (a).

The packages and electronic devices of the embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the distinction between the upper and lower parts in the following description is for convenience, and does not limit the upper and lower parts when the package and the electronic device are actually used. 1 is a perspective view showing an example of a package, FIG. 1A is a perspective view from the lid side, and FIG. 1B is a perspective view from the wiring board side. FIG. 2 is an exploded perspective view of the package shown in FIG. 3 (a) is a plan view of the package shown in FIG. 1, and FIG. 3 (b) is a cross-sectional view taken along the line BB of FIG. 3 (a). FIG. 4 is an exploded perspective view showing another example of the package. 5 (a) is a plan view of the package shown in FIG. 4, and FIG. 5 (b) is a cross-sectional view taken along the line BB of (a). 6 (a) is a plan view showing another example of the package, and FIG. 6 (b) is a cross-sectional view taken along the line BB of FIG. 6 (a). 7 (a) is a plan view showing another example of the package, and FIG. 7 (b) is a cross-sectional view taken along the line BB of FIG. 7 (a). 8 (a) is a plan view showing another example of the package, and FIG. 8 (b) is a cross-sectional view taken along the line BB of FIG. 8 (a). FIG. 9 is an exploded perspective view showing an example of an electronic device. 10 (a) is a plan view of the electronic device shown in FIG. 9, and FIG. 10 (b) is a cross-sectional view taken along the line BB of FIG. 10 (a). In these figures, the lid 20 is shown as transparent, and the wiring conductor 2 (connection pad 2a, terminal electrode 2d) of the wiring substrate 10, the first resin adhesive 30, and the second resin adhesive 40 are shown. Is shaded with dots to make it easier to distinguish.

As shown in the examples shown in FIGS. 1 to 8, in the package 100, the wiring board 10 on which the electronic component 200 described later is mounted and the lid 20 forming a space S in which the electronic component 200 is housed are formed by the wiring board 10. The first resin adhesive 30 which is located between the wiring board 10 and the lid 20 and joins the outer peripheral portions thereof, and the outer surface of the wiring board 10 of the first resin adhesive 30. A second resin adhesive 40, which is bonded by covering the outer surface of the wiring board 10 and the outer surface of the lid 20 from a portion exposed between the outer surface of the lid 20 and having water repellency, and a second resin adhesive 40. The cover member 50 is joined so as to cover the outer surface of the resin adhesive 40 and is made of a member harder than the second resin adhesive 40.

According to such a package, because of the above configuration, the first resin adhesive 30 excellent in bonding strength and sealing property over the entire width of the bonding surface on which the lid 20 and the wiring board 10 face each other. Since it is bonded with, the bonding strength and airtight sealing property are excellent even if the size is small. Further, since the outer surface of the first resin adhesive 30 to the outer surface of the lid 20 and the wiring substrate 30 are covered with the second resin adhesive 40 having water repellency, the moisture resistance is also excellent. It can be formed at a lower cost than a film made of an inorganic insulating material formed by a vapor deposition technique. Further, the brittle inorganic insulating film is easily broken by contact with an external device or the like, whereas the second resin adhesive 40 having water repellency such as a soft silicone resin does not. The soft film-like second resin adhesive 40 may be damaged by contact or the like, but since the outer surface of the second adhesive 40 is covered with a cover member 50 made of a harder member than this, the outer surface of the second adhesive 40 is covered with a cover member 50. The possibility that the second adhesive 40 will be damaged due to contact with an external device or the like is reduced, and the package has more excellent sealing reliability. Since the soft second resin adhesive 40 is present inside the cover member 50, the impact due to contact with the outside is absorbed, so that the possibility that the cover member 50 is cracked is reduced, and the cover member 50 is also reduced. The function of protecting the second resin adhesive 40 is maintained even if the second resin adhesive 40 is damaged and cracks or the like are present.

In the package 100 of the example shown in FIGS. 1 to 3, the wiring board 10 has a recess 1a (opening) on the first surface 1b (upper surface), and the step surface 1c of the step portion provided in the recess 1a. The lid 20 on the flat plate is placed on the plate and bonded with the first resin adhesive 30. The electronic component 200 is housed in a closed space S surrounded by an inner surface 20a (lower surface) facing the recess 1a and the recess 1a of the lid 20. The outer peripheral edge and the side surface of the inner surface of the lid 20 and the stepped surface 1c of the recess 1a of the wiring board 10 and the inner wall surface of the stepped surface 1c and the recess 1a (the inner wall surface between the stepped surface 1c and the first surface 1b) It is joined with the first resin adhesive 30. The first resin adhesive 30 is exposed between the outer surface 20b (upper surface) of the lid 20 and the first surface 1b (upper surface) of the wiring board 10. The second resin adhesive covers the exposed portion of the first resin adhesive 30, the outer surface 20b (upper surface) of the lid 20 adjacent to the exposed portion, and a part of the first surface 1b (upper surface) of the wiring board 10. 40 are joined. The first resin adhesive 30 is frame-shaped because it is provided along the inner wall of the recess 1a, and the second resin adhesive 40 is also a frame-shaped film. Then, the frame-shaped cover member 50 is bonded to the second resin adhesive 40 so as to cover the outer surface (upper surface) of the frame-shaped second resin adhesive 40.

In the example package 100 shown in FIGS. 4 and 5, the wiring board 10 also has the recess 1a, but the lid 20 has a plate shape larger than the size of the opening of the recess 1a, and the wiring board 10 has a recess. It is arranged on the first surface 1b (upper surface). A first resin adhesive 30 is arranged between the first surface 1b (upper surface) of the wiring board 10 and the outer edge portion of the inner surface (lower surface) of the lid 20 to join them. Therefore, the first resin adhesive 30 is exposed between the side surface of the lid 20 and the side surface of the wiring board 10. Therefore, the second resin adhesive 40 is joined so as to cover the exposed portion and the side surfaces of the lid 20 and the wiring board 10. The cover member 50 has a frame shape (cylindrical shape) that covers the side surface of the wiring board 10 from the side surface of the lid body 20, and is joined by the second resin adhesive 40. In the examples shown in FIGS. 4 and 5, a part of the side surface of the wiring board 10 on the side of the second surface 1d (lower surface) protrudes, and the second resin adhesive 40 is provided up to the upper surface of the protruding portion. , The cover member 50 is placed on the protrusion and joined. With such a configuration, the cover member 50 can be easily fixed. It is not necessary to provide a protrusion on the side surface of the wiring board 10, and in that case, the position of the lower end of the second resin adhesive 40 and the cover member 50 (the end on the second surface 1d side of the wiring board 10) is set.
It may be the same as the second surface 1d of the wiring board 10, or may be located between the first surface 1b and the second surface 1d of the wiring board 10.

In the package 100 of the example shown in FIG. 6, the wiring board 10 has a flat plate shape, and the lid 20 has a box shape having a recess. The inner surface 20a of the recess of the lid 20 and the first surface 1b of the wiring board 10 are formed. Space S is formed. A first resin adhesive 30 is arranged between the first surface 1b (upper surface) of the wiring board 10 and the lower surface (the surface surrounding the opening of the recess) of the lid 20 to join them. Since the size of the lid 20 in a plan view is one size smaller than that of the wiring board 10 (first surface 1b), the first resin adhesive 30 is the outer surface of the lid 20 and the first surface 1b (first surface 1b) of the wiring board 10. It is exposed between the top surface). The second resin adhesive 40 covers and joins the exposed portion with the outer surface of the lid 20 and the outer edge of the first surface 1b (upper surface) of the wiring board 10. The cover member 50 has a frame shape (cylindrical shape) that covers the side surface of the lid 20, the inner side surface thereof is on the outer surface of the lid body 20, and the lower surface thereof is on the outer edge portion of the first surface 1b of the wiring board 10. It is joined by the resin adhesive 40.

The package 100 of the example shown in FIG. 7 has a different shape of the cover member 50 from the example shown in FIG. The cover member 50 has a shape that covers not only the side surface of the lid 20 but also the outer edge of the upper surface (outer surface 20b) of the lid 20 from the side surface of the wiring board 10, and the upper surface of the lid 20 is also the second resin adhesive 40. Is joined to the inner surface of the cover member 50. Therefore, the upper end of the cover member 50 projects upward from the upper surface (outer surface 20b) of the lid 20. Further, in the example shown in FIG. 6, the upper end of the cover member 50 projects upward from the upper surface (outer surface 20b) of the lid 20. Since the cover member 50 in the examples shown in FIGS. 1 to 3 is arranged on the upper surface (outer surface 20b) of the lid 20, it also projects upward from the upper surface (outer surface 20b) of the lid 20.

As described above, the package 100 is such that the cover member 50 projects from the outer surface 20b on the side opposite to the inner surface 20a facing the space S of the lid 20 to the side (outer side, upper side) opposite to the wiring board 10. be able to. With such a configuration, the possibility that the lid 20 is damaged due to contact with an external device or the like can be reduced, so that the package 100 has higher sealing reliability. This is especially effective when the lid 20 is made of a brittle material such as glass.

The package 100 of the example shown in FIG. 8 is the same as the package 100 of the example shown in FIGS. 1 to 3, but the height from the stepped surface 1c to the first surface 1b of the wiring board 10 is higher. The point is different. As a result, the first surface 1b of the wiring board 10 projects upward from the upper surface (outer surface 20b) of the lid 20. In this case as well, the possibility that the lid 20 will be damaged due to contact with an external device or the like can be reduced, so that the package 100 has higher sealing reliability.

The electronic component 200 mounted on the wiring board 10 is, for example, a light receiving element such as an image pickup element or a photodiode, a light emitting element such as an LED (Light Emitting Diode) or a semiconductor laser, or a DMD <Digital Micro-mirror Device: digital. In the case of an optical element such as a MEMS element (micromirror device), the light received and emitted can be transmitted. At this time, the cover member 50 and the second resin adhesive 40 may function as light-shielding members. That is, the lid 20 is made of a translucent material, and at least one of the cover member 50 and the second resin adhesive 40 can be a package 100 made of a light-shielding material. With such a configuration, it is possible to limit the incident of unnecessary light from the outside or the emission of light in an undesired direction to the outside, so that an electronic device 300 having excellent optical characteristics can be obtained. It becomes a package 100 that can be made. The light-shielding material is a material having a small transmittance of light received and emitted, specifically a material having a transmittance of 10% or less, but a material that absorbs light, in other words, a material having a small reflectance (for example, a reflectance of 10). % Or less) It is even better if it is a material. In this case, the light emitted from the electronic component 200 or the light reflected by the electronic component 200 or the wiring board 10 is reflected by the cover member 50 or the second resin adhesive 40 and is reflected by the electronic component 20.
It is also possible to prevent the incident on 0.

In the example shown in FIG. 5, the cover member 50 and the second resin adhesive 40 cover only the side surface of the lid 20, whereas in the example shown in FIG. 7, the cover member 50 and the second resin adhesive 40 are covered. Covers the outer edge of the upper surface (outer surface 20b) in addition to the side surface of the lid 20. Therefore, when at least one of the cover member 50 and the second resin adhesive 40 is made of a light-shielding material, for example, in the example shown in FIG. 5, light can be prevented from entering from the side surface of the lid 20. Further, in the example shown in FIG. 7, it is possible to prevent the intrusion of light from the outer edge portion of the upper surface (outer surface 20b) of the lid 20. In the example shown in FIG. 10, only the electronic component 200 is visible in a plan view by the cover member 50 and the second resin adhesive 40. When the electronic component 200 is an image pickup device, the inner end portions of the cover member 50 and the second resin adhesive 40 extend inward from the outer periphery of the electronic component 200 so as to be incident only on the light receiving area of the image pickup element. You can also let it.

In the example package 100 shown in FIGS. 1 to 3 and 8 to 10, the wiring board 10 has a recess 1a having a bottom surface on which the electronic component 200 is housed and mounted on the first surface 1b, and the recess 1a is provided. Provided a stepped portion having a stepped surface 1c between the first surface 1a and the bottom surface. Further, the lid body 20 has a flat plate shape and is located on the stepped surface 1c in the recess 1a, and the first resin adhesive 30 is the lid body 20 from between the inner surface 20a of the lid body 20 and the stepped surface 1c. The lid 20 and the wiring board 10 are joined to each other by being located between the side surface of the surface and the inner wall surface of the recess 1a located between the stepped surface 1c and the first surface 1b. The cover member 50 has a frame shape in which the outer periphery is located outside the recess 1a and the inner circumference is located inside the outer periphery of the lid 20 in a plan view, and the second resin adhesive 40 is the outer surface of the lid 20. The first surface 1b of the wiring board 10 is covered from the outer peripheral portion of 20b, and the cover member 50 is joined to the wiring board 10 and the lid 20.

In the package 100 having such a configuration, even if the wiring board 10 is made small and the region where the lid 20 and the wiring board 10 overlap in a plan view, that is, the width of the first resin adhesive 30 is reduced, the lid 20 Recessed portion 1a located not only between the inner surface 20a (lower surface) of the wiring board 10 (lower surface) and the wiring board 10 (stepped surface 1c) but also between the side surface of the lid 20 and the wiring board 10 (stepped surface 1c and the first surface 1b). Since it is also bonded to the inner wall surface of the first resin adhesive 30 with the first resin adhesive 30, sufficient bonding strength can be obtained. Since the lid 20 has a flat plate shape, its manufacturing cost is low, and the first resin adhesive 30 is exposed on the upper side, and the flat plate frame-shaped cover member 50 and the second resin adhesive 40 are exposed. You can cover this exposed area with. Therefore, the cover member 50 projects from the outer surface 20b on the side opposite to the inner surface 20a facing the space S of the lid 20 to the side (outer side, upper side) opposite to the wiring board 10. It is possible to reduce the possibility that the package 100 will be damaged due to contact with an external device or the like, and the package 100 will have higher sealing reliability. Further, the manufacturing cost of the cover member 50 is also lower than that of the tubular shape. That is, the package 100 is lower in cost, smaller in size, and has higher sealing reliability.

The electronic device 300 includes the above-mentioned package 100 and the electronic components 200 mounted on the wiring board 10 in the package 100. Since the electronic device 300 includes the package 100 having the above configuration, the electronic component 200 mounted on the wiring board 10 has excellent sealing reliability.

In the example shown in FIGS. 9 and 10, the electronic component 200 is mounted on the bottom surface of the recess 1a of the wiring board 10 and is housed in the space S formed by the recess 1a and the lid 20. The wiring board 10 includes a connection pad 2a in the recess 1a. Further, the wiring board 10 is provided with a terminal electrode 2d on the second surface 1d (lower surface) of the outer surface. The connection pad 2a and the terminal electrode 2d are electrically connected by a through conductor 2b and an internal wiring layer 2c provided inside the wiring board 10 (insulating substrate 1). The electrode 200a of the electronic component 200 and the connection pad 2a are electrically connected by a connection member 201 such as a bonding wire. By connecting the terminal electrode 2d to an external electric circuit, the electronic component 200 is electrically connected to the external electric circuit.

The wiring board 10 in the package 100 is an insulating substrate 1 provided with a wiring conductor 2.

The insulating substrate 1 is a basic structural part of the wiring board 10, and has functions such as ensuring mechanical strength as the wiring board 10 and ensuring insulation between a plurality of wiring conductors 2. The insulating substrate 1 has a square shape such as a square shape (in a plan view) when viewed from above. The quadrangle shape is not a strict quadrangle, but includes a quadrangle whose corners are rounded or C-chamfered.

The insulating substrate 1 may be a flat plate as shown in the example shown in FIG. 6, or may have a recess 1a on the first surface 1b (upper surface). In the case of a flat plate, the electronic component 200 is mounted on the central portion of the first surface (upper surface), and in the case of having the recess 1a, the electronic component 200 is mounted on the bottom surface of the recess 1a. The shape of the recess 1a in a plan view is also a square shape such as a square shape.

The dimensions of the insulating substrate 1 are, for example, a square having a side length of 5 mm to 30 mm and a thickness of 0.5 mm to 3 mm. When the recess 1a is provided, the dimensions of the recess 1a are such that the length of one side of the quadrangle is 3 mm to 28 mm and the depth is 0.2 mm to 2 mm.

The insulating substrate 1 is formed by laminating a plurality of insulating layers made of an insulating material including a ceramic material such as an aluminum oxide sintered body, a glass ceramic sintered body, a mulite sintered body, or an aluminum nitride material sintered body. Has been done. In the example shown in FIGS. 3 and 10, the insulating layer is 5 layers, in the examples shown in FIGS. 5 and 7, the insulating layer is 4 layers, and in the example shown in FIG. 6, the insulating layer is 2 layers. The number of layers is not limited to these. Further, in the examples shown in FIGS. 1 to 5 and 7 to 10, the recess 1a has the above-mentioned step portion on the entire circumference, and further, the recess 1a has a step portion on the opposite two side portions on the bottom surface side. It is a three-stage recess 1a having. The connection pad 2a is provided on the stepped portion on the bottom surface side, and the height of the electrode 200a of the electronic component 200 mounted on the bottom surface and the connection pad 2a are about the same, so that the connection by the bonding wire is easy. Become. The shape of the recess 1a including the shape of the step portion and the shape and arrangement of the connection pad 2a may be appropriately set according to the size and shape of the electronic component 200 to be mounted. For example, the step portion on the bottom surface side also covers the entire circumference. Can be provided.

The insulating substrate 1 can be manufactured as follows, for example, when it is made of an aluminum oxide sintered body. That is, first, a ceramic green sheet to be an insulating layer is produced. Raw material powders such as aluminum oxide and silicon oxide are formed into a sheet together with an appropriate organic binder and an organic solvent to prepare a plurality of square sheet-shaped ceramic green sheets. Next, these ceramic green sheets are laminated to prepare a laminated body. The recess 1a may be provided with a through hole in the ceramic green sheet using a mold or the like. Then, the insulating substrate 1 can be manufactured by firing this laminated body at a temperature of 1300 to 1600 ° C.

The wiring board 10 including the insulating board 1 can also be manufactured as a multi-layer board in which a plurality of board regions to be such a wiring board 10 are arranged on a mother board. It is also possible to more efficiently manufacture the plurality of wiring boards 10 by dividing the mother board including the plurality of board areas into each board area. In this case, a groove for division may be provided along the boundary of the substrate region in the mother substrate. Further, even if the electronic component 200 is mounted on each substrate region of the multi-layer board, the lid 20 (and the cover member 50) is joined, and then the lid 20 (and the cover member 50) is cut and divided to obtain a plurality of electronic devices 300. good.

A wiring conductor 2 is provided on the surface and inside of the insulating substrate 1. As described above, the connection pad 2a, the through conductor 2b, the internal wiring layer 2c, and the terminal electrode 2d are provided. The penetrating conductor 2b penetrates the insulating layer, and the internal wiring layer 2c is arranged between the insulating layers. The terminal electrode 2d may be provided from the lower surface to the side surface or on the side surface instead of the lower surface (second surface 1d) of the insulating substrate 1.

The wiring conductor 2 mainly contains, for example, a metal such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt, or a metal material of an alloy containing these metals as a conductor material. Such a metal material is provided on the surface of the insulating substrate 1 as a metal layer such as a metallized layer or a plating layer. This metal layer may be one layer or a plurality of layers. Further, it is provided inside the insulating substrate 1 by metallizing.

When the connection pad 2a, the internal wiring layer 2c, and the terminal electrode 2d of the wiring conductor 2 are, for example, a metallized layer of tungsten, a metal paste prepared by mixing tungsten powder with an organic solvent and an organic binder is used as an insulating substrate. It can be formed by a method of printing and firing at a predetermined position of the ceramic green sheet to be No. 1 by a method such as a screen printing method. Further, among these, even if the exposed surface of the metallized layer to be the connection pad 2a and the terminal electrode 2d is further coated with a plating layer such as nickel and gold by a plating method such as an electrolytic plating method or a non-electrolytic plating method. good. In this case, as described above, when the wiring board 10 or the electronic device 300 is manufactured in the form of a multi-layer board, if the wiring conductors in the plurality of board regions are electrically connected to each other, the plurality of wiring boards 10 are manufactured. It is also possible to coat the wiring conductors of the above with a plating layer all at once. Further, the through conductor 2b can be formed by providing a through hole at a predetermined position on the ceramic green sheet prior to printing the metal paste and filling the through hole with the same metal paste as described above. can.

The electronic component 200 is mounted on such a wiring board 10, sealed with a lid 20 and a first resin adhesive 30, and further joined with a cover member 50 with a second resin adhesive 40 to form an electronic device 300. Can be made.

Examples of the electronic component 200 include various sensor elements such as angular velocity sensor elements, angle sensor elements, acceleration sensor elements, pressure sensor elements and temperature sensor elements, and passive components such as resistors, capacitors and inductors, in addition to the above-mentioned optical elements. It may be an active component such as a transistor, a diode, or an IC (Integrated Circuit).

After the electronic component 200 is fixed, for example, the lower surface of the electronic component 200 is joined and fixed to the mounting area of the insulating substrate 1 (the bottom surface of the recess 1a in the example shown in FIGS. 9 and 10) by a bonding material (not shown). The electrode 200a arranged on the upper surface of the electronic component 200 and the connection pad 2a are connected by a connection member 201 such as a bonding wire and electrically connected to the wiring board 10. For example, when the electronic component 200 is an image pickup element, the optical signal received by the electronic component 200 is converted into an electric signal and electrically derived to an outer surface such as the lower surface of the insulating substrate 1 via the wiring conductor 2. ..

As the bonding material for bonding and fixing the electronic component 200 to the wiring board 10, for example, a gold-tin (Au-Sn) brazing material, a brazing material containing solder, a glass bonding material, or a resin adhesive such as an epoxy resin may be used. can. When the bonding material is a brazing material containing solder, a bonding metal layer formed of a metal film such as a plating film or a metallized layer can be provided in the mounting area of the wiring board 10.

The electrical connection between the electrode 200a of the electronic component 200 and the connection pad 2a of the wiring board 10 is not limited to wire bonding as in the examples shown in FIGS. 9 and 10. For example, so-called flip-chip connection using solder, bumps, conductive adhesive, or the like may be used.

As described above, if the electronic component 200 mounted on the wiring board 10 is an optical element as described above and the lid 20 is made of a translucent material, it is made of a resin such as glass, crystal, or epoxy. Things can be used. Other than the translucent material, metals, resins, ceramics and the like can be used.

As the first resin adhesive 30, for example, a thermosetting epoxy resin, a UV (Ultra Violet: ultraviolet) curable epoxy resin, a UV curable acrylic resin, or the like can be used. Among these, thermosetting epoxy resin and UV curable epoxy resin are excellent in bonding strength and sealing property. The uncured first resin adhesive 30 is applied to a predetermined position on the lid 20 or the wiring board 10 and cured, so that the lid 20 is joined to and fixed to the wiring board 10 by the first resin adhesive 30 to be fixed. The inside of the space S can be hermetically sealed.

As the second resin adhesive 40, a resin having water repellency, for example, a silicone resin, a fluororesin, a resin containing these, or the like can be used. When the second resin adhesive 40 is a light-shielding member or a low-reflection member, for example, those resin materials containing a pigment such as carbon black can be used. The viscosity and coatability can be adjusted with the ceramic filler, and the light-shielding property can be adjusted with the ceramic filler.

The cover member 50 may be made of a material harder than the second resin adhesive 40, for example, a metal such as stainless steel, Fe—Ni alloy, Fe—Ni—Co alloy, epoxy, liquid crystal polymer, BT resin (Bismaleimide). -A resin such as Triazine Resin (bismaleimidotriazine resin), ceramics, etc. can be used. When the cover member 50 has a cylindrical shape as shown in the example shown in FIG. 4, it may be composed of a plurality of members. For example, a plurality of cover members 50 having a U-shape, an L-shape, or a flat plate shape in a plan view may be combined to form a cylinder. Further, even if there are some gaps between the plurality of cover members 50 when combined, there is no problem in terms of the function of protecting the second resin adhesive 40.

If the cover member 50 is made of metal or ceramics, for example, a plate-shaped member may be bonded with a second resin adhesive 40. The uncured second resin adhesive 40 is applied from the outer surface of the cover member 50 or the first resin adhesive 30 to the outer surface of the lid 20 and the wiring substrate 10, and the cover member 50 is arranged at a predetermined position. By curing, the cover member 50 can be joined by the second resin adhesive 30. If the cover member 50 is a resin material, for example, a plate-shaped resin material may be bonded with the second resin adhesive 40, or the uncured resin material may be bonded with the second resin adhesive 40. It may be applied over the surface and cured.

The first resin adhesive 30 and the second resin adhesive 40 are not limited to the above-mentioned thermosetting and UV curable ones, and may be, for example, two-component room temperature curable.

1 ... Insulated substrate 1a ... Recessed portion 1b ... First surface 1c ... Stepped surface 1d ... Second surface 2 ... Wiring conductor 2a ... Connection pad 2b ... Through conductor 2c ... Internal wiring layer 2d ... Terminal electrode 10 ... Wiring board 20 ... Lid body 20a ... Inner surface 20b ... Outer surface 30 ... First resin adhesive 40 ... Second resin Adhesive 50 ... Cover member 100 ... Package 200 ... Electronic component 200a ... Electrode 201 ... Connecting member 300 ... Electronic device

Claims (5)

Wiring boards on which electronic components are mounted and
A lid that forms a space in which the electronic components are housed with the wiring board, and
It is located between the wiring board and the lid, and has a portion exposed between the outer surface of the wiring board and the outer surface of the lid while joining the outer peripheral portions thereof. With the first resin adhesive,
A second resin adhesive which is bonded by covering the outer surface of the wiring board and the outer surface of the lid so as to straddle the exposed portion of the first resin adhesive and has water repellency.
A package including a cover member which is joined so as to cover the outer surface of the second resin adhesive and is made of a member harder than the second resin adhesive. The package according to claim 1, wherein the cover member projects from an outer surface of the lid body opposite to the inner surface facing the space to a side opposite to the wiring board. The package according to claim 1 or 2, wherein the lid is made of a translucent material, and at least one of the cover member and the second resin adhesive is made of a light-shielding material. The wiring board has a recess on the first surface having a bottom surface on which the electronic component is housed and mounted, and the recess has a stepped portion having a stepped surface between the first surface and the bottom surface. And
The lid has a flat plate shape and is located on the stepped surface in the recess.
The first resin adhesive is applied between the inner surface of the lid and the stepped surface, and between the side surface of the lid and the inner wall surface of the recess located between the stepped surface and the first surface. Positioned to join the lid and the wiring board,
The cover member has a frame shape in which the outer circumference is located outside the recess and the inner circumference is located inside the lid in a plan view.
The second resin adhesive covers the first surface of the wiring board from the outer peripheral portion of the outer surface of the lid, and joins the cover member to the wiring board and the lid. The package according to any one of claims 3. An electronic device comprising the package according to any one of claims 1 to 4 and an electronic component mounted on the wiring board in the package.

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