JP2794912B2 - Hermetically sealed package and joining members - Google Patents
Hermetically sealed package and joining membersInfo
- Publication number
- JP2794912B2 JP2794912B2 JP2198784A JP19878490A JP2794912B2 JP 2794912 B2 JP2794912 B2 JP 2794912B2 JP 2198784 A JP2198784 A JP 2198784A JP 19878490 A JP19878490 A JP 19878490A JP 2794912 B2 JP2794912 B2 JP 2794912B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- adhesive layer
- package
- lid
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は耐湿性に優れた気密封止パッケージ、特に半
導体装置用として用いられる気密封止パッケージ、およ
びパッケージ用接合部材に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetically sealed package excellent in moisture resistance, particularly to a hermetically sealed package used for a semiconductor device, and a bonding member for a package.
CCD（Charge Coupled Device）、MOS（Metal Oxide S
emiconductor）、CPD（Charge Primming Device）等の
固体撮像素子、およびEPROM（Erasable and Programmab
le/Read Only Memory）等の光による書込、消去可能な
メモリーなど、光学特性を有する半導体素子を用いた半
導体装置には、気密封止性、特に耐湿性が要求される。CCD (Charge Coupled Device), MOS (Metal Oxide S
semiconductor), solid-state imaging devices such as CPD (Charge Primming Device), and EPROM (Erasable and Programmab)
A semiconductor device using a semiconductor element having optical characteristics, such as a memory that can be written and erased by light such as le / Read Only Memory), is required to have hermetic sealing properties, particularly moisture resistance.
一般に半導体装置では、ゴミ等の異物が入らないよう
に気密封止性が要求されるが、特に光学特性を有する半
導体装置では、光透過性が要求され、水分が結露して光
透過率を低下させるのを防止するため、気密封止性、特
に耐湿性が要求される。In general, a semiconductor device requires hermetic sealing to prevent foreign matter such as dust from entering, but in particular, a semiconductor device having optical characteristics requires a light transmittance, and moisture condenses to lower the light transmittance. In order to prevent such a phenomenon, hermetic sealing properties, particularly, moisture resistance are required.
このような光学特性を有する半導体装置では、箱型の
ケーシング内に形成されたダイパッドに、半導体素子
（ICチップ）が固着されて、ボンディングワイヤにより
リードに接続されており、ケーシングの開口部は、リッ
ド（蓋）が気密封止用の接着剤層により接着され、気密
封止されている。In a semiconductor device having such optical characteristics, a semiconductor element (IC chip) is fixed to a die pad formed in a box-shaped casing and connected to a lead by a bonding wire. The lid (lid) is adhered by an adhesive layer for hermetic sealing, and hermetically sealed.
気密封止用の接着剤層としては、エポキシ樹脂、ポリ
イミド樹脂等の熱硬化性樹脂が用いられており、相当の
気密封止性を有するが、さらに湿気の侵入を防止するた
めに、耐湿性の高い気密封止パッケージが要望されてい
る。As the adhesive layer for hermetic sealing, a thermosetting resin such as an epoxy resin or a polyimide resin is used, and has a considerable hermetic sealing property. There is a demand for a hermetically sealed package having a high density.
本発明の目的は、このような要望に応えるため、耐湿
性に優れた気密封止パッケージ、特に半導体装置用とし
て優れた気密封止パッケージおよびパッケージ用接合部
材を提供することである。An object of the present invention is to provide a hermetically sealed package excellent in moisture resistance, particularly, a hermetically sealed package excellent for a semiconductor device and a bonding member for a package, in order to meet such a demand.
本発明は次の気密封止パッケージおよび接合部材であ
る。The present invention is the following hermetically sealed package and joining member.
（１）パッケージを形成するケーシングと、このケーシ
ングの開口部に接合されるリッドと、前記ケーシングお
よびリッド間に形成された撥水性接着剤層と、この撥水
性接着剤層の内周側に形成された吸水性接着剤層とを有
することを特徴とする気密封止パッケージ。(1) A casing forming a package, a lid joined to an opening of the casing, a water-repellent adhesive layer formed between the casing and the lid, and an inner peripheral side of the water-repellent adhesive layer And a water-absorbing adhesive layer.
（２）パッケージが半導体装置用のものである上記
（１）記載の気密封止パッケージ。(2) The hermetically sealed package according to (1), wherein the package is for a semiconductor device.
（３）ケーシングまたはリッドと接合してパッケージを
形成するための接合部材であって、リッド、ケーシング
またはスペーサの接合面の外周側に撥水性接着剤層、内
周側に吸水性接着剤層を形成したことを特徴とするパッ
ケージ用接合部材。(3) A joining member for joining with a casing or a lid to form a package, wherein a water-repellent adhesive layer is provided on an outer peripheral side of a joining surface of the lid, the casing or the spacer, and a water-absorbing adhesive layer is provided on an inner peripheral side. A bonding member for a package, wherein the bonding member is formed.
（４）パッケージが半導体装置用のものである上記
（３）記載のパッケージ用接合部材。(4) The package joining member according to (3), wherein the package is for a semiconductor device.
本発明の気密封止パッケージは、半導体素子等の被封
止物を収容して気密封止するためのもので、半導体装置
用のものとして優れているが、他の被封止物を気密封止
するものでもよい。The hermetically sealed package of the present invention is for hermetically sealing by housing an object to be sealed such as a semiconductor element, and is excellent for a semiconductor device, but hermetically seals other objects to be sealed. It may stop.
パッケージを形成するケーシングは、被封止物を収容
できる構造のものであればよく、その開口部にリッドが
接合され、その接合面に撥水性接着剤層および吸水性結
着剤層が形成されるようになっている。ケーシングおよ
びリッドの材質としては制限はなく、プラスチック、セ
ラミックス、ガラス、金属など、任意のものが採用可能
である。The casing forming the package may have any structure capable of accommodating the object to be sealed.The lid is joined to the opening, and the water-repellent adhesive layer and the water-absorbing binder layer are formed on the joint surface. It has become so. The materials of the casing and the lid are not limited, and any material such as plastic, ceramics, glass, and metal can be adopted.
撥水性接着剤層としては、ケーシングとリッドを気密
封止状に接着する接着剤であって、撥水性を有する接着
剤が使用される。このような撥水性接着剤としては、例
えばシリコーン樹脂、含フッ素シリコーン樹脂、フッ素
樹脂、シリコーン変性エポキシ樹脂、含フッ素エポキシ
樹脂、フェノールノボラック硬化エポキシ樹脂、疎水化
エポキシ樹脂、疎水化剤配合シリコーン樹脂、エポキシ
樹脂などがあげられる。As the water-repellent adhesive layer, an adhesive having a water-repellent property, which is an adhesive for hermetically sealing the casing and the lid, is used. As such a water-repellent adhesive, for example, silicone resin, fluorine-containing silicone resin, fluorine resin, silicone-modified epoxy resin, fluorine-containing epoxy resin, phenol novolak cured epoxy resin, hydrophobized epoxy resin, silicone resin containing a hydrophobizing agent, Epoxy resins and the like can be mentioned.
吸水性接着剤層はケーシングとリッドを気密封止状に
接着する接着剤であって、吸水性を有する接着剤が使用
される。このような吸水性接着剤は飽和吸水量の大きい
接着剤であり、例えばポリビニールアルコール系樹脂お
よびアクリル酸金属塩共重合ポリマー等の高吸水性ポリ
マー、ゼオライト、シリカゲルならびに活性炭などの充
填物を配合したエポキシ樹脂、ポリイミド樹脂などがあ
げられ、これらの中でも特にアミン硬化、ポリアミドア
ミン硬化またはジシアンジアミド硬化エポキシ樹脂が好
ましい。The water-absorbing adhesive layer is an adhesive for hermetically sealing the casing and the lid in a hermetically sealed manner, and uses a water-absorbing adhesive. Such a water-absorbing adhesive is an adhesive having a large saturated water absorption.For example, a high-water-absorbing polymer such as a polyvinyl alcohol resin and a metal acrylate copolymer, a filler such as zeolite, silica gel and activated carbon are blended. Epoxy resin, polyimide resin and the like. Among them, amine cured, polyamideamine cured or dicyandiamide cured epoxy resin is particularly preferable.
本発明のパッケージ用接合部材は、ケーシングまたは
リッドと接合して気密封止パッケージを形成する接合部
材であって、リッド、ケーシングまたはスペーサの接合
面の外周側に撥水性接着剤層、その内周側に吸水性結着
剤層を形成したものである。このように接合部材として
は、リッドに各接着剤層を形成したものが一般的である
が、ケーシングに形成したものでもよく、場合によって
はケーシングとリッド間に挿入されるスペーサに各接着
剤層を形成したものでもよい。The bonding member for a package of the present invention is a bonding member that forms a hermetically sealed package by bonding to a casing or a lid, and a water-repellent adhesive layer is formed on the outer peripheral side of the bonding surface of the lid, the casing or the spacer, and the inner periphery thereof. On the side, a water-absorbing binder layer is formed. As described above, the bonding member is generally formed by forming each adhesive layer on the lid, but may be formed on the casing. In some cases, each adhesive layer is formed on the spacer inserted between the casing and the lid. May be formed.
この場合、各接着剤としては、部分硬化物またはプレ
ポリマーとなったものを使用し、ケーシングまたはリッ
ドと接合する段階で完全硬化させて各接着剤層を形成す
ることができる。In this case, a partially cured product or a prepolymer can be used as each adhesive, and the adhesive can be completely cured at the stage of joining with the casing or lid to form each adhesive layer.
本発明のパッケージ用接合部材は、被封止物を収容し
たケーシングまたはリッドと接合し、撥水性接着剤層お
よび吸水性接着剤層を硬化させて、気密封止パッケージ
を形成する。接着剤層はパッケージ形成に際して塗布し
て形成してもよい。The bonding member for a package of the present invention is bonded to a casing or a lid containing an object to be sealed, and cures the water-repellent adhesive layer and the water-absorbent adhesive layer to form a hermetically sealed package. The adhesive layer may be formed by applying when forming the package.
こうして形成された気密封止パッケージは、接合面に
形成された撥水性接着剤層および吸水性接着剤層により
気密封止状に接着されているので、ゴミ、その他の異物
の侵入が防止される。この場合、水分は外周側の撥水性
接着剤層により浸入を阻止され、水蒸気等の形で侵入す
る湿気は内周側の吸水性接着剤層に吸着されるため、リ
ッド等の透光面への結露は防止される。Since the hermetically sealed package thus formed is hermetically sealed by the water-repellent adhesive layer and the water-absorbent adhesive layer formed on the joint surface, entry of dust and other foreign matter is prevented. . In this case, moisture is prevented from entering by the water-repellent adhesive layer on the outer peripheral side, and moisture that enters in the form of water vapor or the like is adsorbed by the water-absorbent adhesive layer on the inner peripheral side, so that the water enters the light-transmitting surface such as a lid. Condensation is prevented.
以下、本発明を図面の実施例について説明する。 Hereinafter, the present invention will be described with reference to embodiments in the drawings.
第１図は実施例の光学特性を有する半導体装置の気密
封止パッケージを示す断面図、第２図は接合部材の下面
図、第３図はそのＡ−Ａ断面図である。FIG. 1 is a cross-sectional view showing a hermetically sealed package of a semiconductor device having optical characteristics according to an embodiment, FIG. 2 is a bottom view of a bonding member, and FIG.
第１図において、半導体装置１は、箱型のケーシング
２内に形成されたダイパッド３に、半導体素子（ICチッ
プ）４が固着され、ボンディングワイヤ５によりリード
６に接続されている。ケーシング２の開口部は、透明な
材料からなるリッド（蓋）７が撥水性接着剤層８および
吸水性接着剤層９により接着され、気密封止パッケージ
10が形成されている。撥水性接着剤層８はケーシング２
とリッド７の接合面の周辺部の全周にわたって、外周側
に形成され、吸水性接着剤層９はその内周側に形成され
ている。撥水性接着剤層８を形成する接着剤としては、
フッ素含有エポキシ樹脂が、吸水性接着剤層９を形成す
る接着剤としては、ゼオライト配合アミン硬化エポキシ
樹脂が使用されている。In FIG. 1, a semiconductor device (IC chip) 4 is fixed to a die pad 3 formed in a box-shaped casing 2 of a semiconductor device 1, and is connected to a lead 6 by a bonding wire 5. A lid (lid) made of a transparent material is adhered to the opening of the casing 2 by a water-repellent adhesive layer 8 and a water-absorbent adhesive layer 9 to form an airtight sealing package.
10 are formed. The water-repellent adhesive layer 8 covers the casing 2
The outer periphery is formed over the entire periphery of the joining surface of the and the lid 7, and the water-absorbing adhesive layer 9 is formed on the inner periphery thereof. Examples of the adhesive forming the water-repellent adhesive layer 8 include:
A zeolite-containing amine-cured epoxy resin is used as an adhesive for forming the water-absorbing adhesive layer 9 with the fluorine-containing epoxy resin.
第２図および第３図において、接合部材11はリッド７
の裏面の周辺部の接合面の全周にわたって撥水性接着剤
層８が形成され、その内周側に吸水性接着剤層９が形成
されている。2 and 3, the joining member 11 is a lid 7
A water-repellent adhesive layer 8 is formed over the entire periphery of the bonding surface at the peripheral portion of the back surface of the substrate, and a water-absorbing adhesive layer 9 is formed on the inner peripheral side.
第１図の半導体装置１では、一般にゴミ等が入らない
ように気密封止性が要求されるが、特に光学特性を有す
る半導体装置では、リッド７はガラス等の透明な材料か
らなり、光透過性が要求されるので、水分が結露して光
透過率を低下させるのを防止するために、撥水性接着剤
層８および吸水性接着剤層９により気密封止性、特に耐
湿性が付与される。The semiconductor device 1 shown in FIG. 1 generally requires hermetic sealing so as to prevent dust or the like from entering. In a semiconductor device having optical characteristics, in particular, the lid 7 is made of a transparent material such as glass and has a light transmission property. The water-repellent adhesive layer 8 and the water-absorbent adhesive layer 9 provide hermetic sealing properties, particularly moisture resistance, in order to prevent moisture from condensing and lowering the light transmittance. You.
第１図の半導体装置１において、接着剤層８、９によ
る接着は、半導体装置１のパッケージングに際して、ケ
ーシング２またはリッド７に塗布して硬化させることに
より接着を行いパッケージ10を形成することができる
が、第２図および第３図に示すように、予めリッド７に
接着剤を塗布して乾燥し、接着剤層８、９を形成して接
合部材11としておき、この接合部材11をケーシング２に
取付けて、加熱、加圧により硬化させ接着を行いパッケ
ージ10を形成することもできる。In the semiconductor device 1 shown in FIG. 1, the bonding by the adhesive layers 8 and 9 may be performed by applying the coating to the casing 2 or the lid 7 and curing the semiconductor device 1 during packaging to form the package 10. However, as shown in FIGS. 2 and 3, an adhesive is applied to the lid 7 in advance and dried, and adhesive layers 8 and 9 are formed as a joining member 11, and this joining member 11 is formed into a casing. 2, the package 10 can be formed by being cured by heating and pressurizing and bonding.
こうして形成された半導体装置１の気密封止パッケー
ジ10は、接合面の外周側に形成された撥水性接着剤層８
および内周側に形成された吸水性接着剤層９により気密
封止状に接着されているので、ゴミ、その他の異物の侵
入が防止される。この場合、水分は外周側の撥水性接着
剤層８により浸入を阻止され、水蒸気等の形で侵入する
湿気は内周側の吸水性接着剤層９に吸着されるため、リ
ッド７の透光面への結露は防止される。The hermetically sealed package 10 of the semiconductor device 1 formed in this manner is provided with the water-repellent adhesive layer 8 formed on the outer peripheral side of the bonding surface.
In addition, since they are hermetically sealed by the water-absorbing adhesive layer 9 formed on the inner peripheral side, intrusion of dust and other foreign substances is prevented. In this case, water is prevented from entering by the water-repellent adhesive layer 8 on the outer peripheral side, and moisture entering in the form of water vapor or the like is adsorbed by the water-absorbent adhesive layer 9 on the inner peripheral side. Condensation on the surface is prevented.
なお、以上の実施例は光学特性を有する半導体装置に
関するものであったが、一般の半導体装置の気密封止パ
ッケージ、あるいは他の被封止物の気密封止パッケージ
にも同様に適用可能である。また接合部材11として、リ
ッド７に接着剤層８、９を形成した例を示したが、ケー
シングまたはスペーサに接着剤層８、９を形成したもの
を接合部材11とすることもできる。Although the above embodiments relate to a semiconductor device having optical characteristics, the present invention can be similarly applied to a hermetically sealed package of a general semiconductor device or a hermetically sealed package of another object to be sealed. . Further, although the example in which the adhesive layers 8 and 9 are formed on the lid 7 as the joining member 11 has been described, a member in which the adhesive layers 8 and 9 are formed on a casing or a spacer may be used as the joining member 11.
以上の通り、本発明によれば、接合面の外周側に撥水
性接着剤層および内周側に吸水性接着剤層を形成したた
め、耐湿性に優れた気密封止パッケージが得られ、水分
が侵入して結露するのを防止することができる。As described above, according to the present invention, since the water-repellent adhesive layer is formed on the outer peripheral side of the joining surface and the water-absorbing adhesive layer is formed on the inner peripheral side, a hermetically sealed package excellent in moisture resistance can be obtained, and moisture is reduced. It is possible to prevent intrusion and dew condensation.
第１図は実施例の半導体装置の気密封止パッケージを示
す断面図、第２図は接合部材の下面図、第３図はそのＡ
−Ａ断面図である。 各図中、同一符号は同一または相当部分を示し、１は半
導体装置、２はケーシング、３はダイパッド、４は半導
体素子、５はボンディングワイヤ、６はリード、７はリ
ッド、８は撥水性接着剤層、９は吸水性接着剤層、10は
気密封止パッケージ、11は接合部材である。FIG. 1 is a cross-sectional view showing a hermetically sealed package of a semiconductor device according to an embodiment, FIG. 2 is a bottom view of a joining member, and FIG.
It is -A sectional drawing. In the drawings, the same reference numerals denote the same or corresponding parts, 1 denotes a semiconductor device, 2 denotes a casing, 3 denotes a die pad, 4 denotes a semiconductor element, 5 denotes a bonding wire, 6 denotes a lead, 7 denotes a lid, and 8 denotes a water-repellent adhesive. 9 is a water-absorbing adhesive layer, 10 is a hermetically sealed package, and 11 is a joining member.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−54756（ＪＰ，Ａ) 実開 平２−101542（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/10 H01L 23/02──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-54756 (JP, A) JP-A-2-101542 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H01L 23/10 H01L 23/02
Claims (4)
ケーシングの開口部に接合されるリッドと、前記ケーシ
ングおよびリッド間に形成された撥水性接着剤層と、こ
の撥水性接着剤層の内周側に形成された吸水性接着剤層
とを有することを特徴とする気密封止パッケージ。1. A casing forming a package, a lid joined to an opening of the casing, a water-repellent adhesive layer formed between the casing and the lid, and an inner peripheral side of the water-repellent adhesive layer. And a water-absorbing adhesive layer formed on the airtight sealing package.
求項（１）記載の気密封止パッケージ。2. The hermetically sealed package according to claim 1, wherein the package is for a semiconductor device.
ージを形成するための接合部材であって、リッド、ケー
シングまたはスペーサの接合面の外周側に撥水性接着剤
層、内周側に吸水性接着剤層を形成したことを特徴とす
るパッケージ用接合部材。3. A joining member for joining to a casing or lid to form a package, wherein a water-repellent adhesive layer is provided on an outer peripheral side of a joining surface of the lid, the casing or the spacer, and a water-absorbing adhesive is provided on an inner peripheral side. A bonding member for a package, wherein a layer is formed.
求項（３）記載のパッケージ用接合部材。4. The package joining member according to claim 3, wherein the package is for a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198784A JP2794912B2 (en) | 1990-07-26 | 1990-07-26 | Hermetically sealed package and joining members |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198784A JP2794912B2 (en) | 1990-07-26 | 1990-07-26 | Hermetically sealed package and joining members |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485859A JPH0485859A (en) | 1992-03-18 |
| JP2794912B2 true JP2794912B2 (en) | 1998-09-10 |
Family
ID=16396860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2198784A Expired - Lifetime JP2794912B2 (en) | 1990-07-26 | 1990-07-26 | Hermetically sealed package and joining members |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2794912B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006121052A (en) * | 2004-09-27 | 2006-05-11 | Idc Llc | Method and system for packaging mems device together with incorporated getter |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3513168B2 (en) * | 1992-10-06 | 2004-03-31 | ソニー株式会社 | Semiconductor device |
| JP3216314B2 (en) * | 1993-03-31 | 2001-10-09 | ソニー株式会社 | Semiconductor device, method of manufacturing the same, and semiconductor device manufacturing apparatus |
| JP3410173B2 (en) * | 1993-11-02 | 2003-05-26 | 三井化学株式会社 | Hollow package for semiconductor device molded from epoxy resin composition and semiconductor device using the same |
| JP3426726B2 (en) * | 1994-09-08 | 2003-07-14 | 京セラ株式会社 | Package for storing semiconductor elements |
| JPH11145337A (en) * | 1997-11-12 | 1999-05-28 | Tomoegawa Paper Co Ltd | Electronic component encapsulating package |
| JP2002043450A (en) * | 2001-06-15 | 2002-02-08 | Sony Corp | Semiconductor device |
| JP3941598B2 (en) * | 2002-06-10 | 2007-07-04 | 株式会社村田製作所 | Method for manufacturing piezoelectric component |
| JP4179061B2 (en) * | 2003-06-09 | 2008-11-12 | 松下電器産業株式会社 | Semiconductor device |
| JP2011014767A (en) * | 2009-07-03 | 2011-01-20 | Nippon Electric Glass Co Ltd | Light-emitting device, and method of manufacturing the same |
| JP5771921B2 (en) * | 2010-08-26 | 2015-09-02 | 大日本印刷株式会社 | SEALED DEVICE AND MANUFACTURING METHOD THEREOF |
| JP6179681B2 (en) * | 2015-01-08 | 2017-08-16 | 株式会社村田製作所 | Method for manufacturing piezoelectric vibration component |
| JP6787180B2 (en) * | 2017-02-28 | 2020-11-18 | 三菱電機株式会社 | Semiconductor devices and their manufacturing methods |
| JP7023724B2 (en) * | 2018-01-24 | 2022-02-22 | 京セラ株式会社 | Package and electronics |
-
1990
- 1990-07-26 JP JP2198784A patent/JP2794912B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006121052A (en) * | 2004-09-27 | 2006-05-11 | Idc Llc | Method and system for packaging mems device together with incorporated getter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0485859A (en) | 1992-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2794912B2 (en) | Hermetically sealed package and joining members | |
| US4710797A (en) | Erasable and programable read only memory devices | |
| US6906403B2 (en) | Sealed electronic device packages with transparent coverings | |
| JP3435925B2 (en) | Semiconductor device | |
| US6774481B2 (en) | Solid-state image pickup device | |
| US8986588B2 (en) | Electronic device and process for manufacturing electronic device | |
| JP3355881B2 (en) | Solid-state imaging device and manufacturing method thereof | |
| US20060278820A1 (en) | Semiconductor module | |
| US6940140B1 (en) | Package structure of solid-state image sensor | |
| JP3885670B2 (en) | Semiconductor device | |
| JP3513168B2 (en) | Semiconductor device | |
| JP2878875B2 (en) | CCD module | |
| JP2890731B2 (en) | Method of manufacturing semiconductor device package and bonding member | |
| JPH0311757A (en) | Semiconductor device and manufacture thereof | |
| JPH06326283A (en) | Solid-state imaging device | |
| JPH1074865A (en) | Hollow package for solid-state image pickup element | |
| JPH10321826A (en) | Solid-state image-pickup device with built-in optical low-pass filter and its manufacture | |
| TWI782857B (en) | Sensor package structure | |
| JP2003060114A (en) | Semiconductor device and solid-state image pickup device | |
| JP2937429B2 (en) | Image sensor manufacturing method | |
| TWI222333B (en) | Dual adhesive package method of organic light emitting device and apparatus thereof | |
| JP3288394B2 (en) | Method for manufacturing solid-state imaging device | |
| JPH03288462A (en) | Photodetecting semiconductor device | |
| JPH05182999A (en) | Semiconductor device | |
| JPS58112351A (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |