JP2005223018A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of removing dust even if it is found in the opening of a package before shipping. <P>SOLUTION: The semiconductor device 25 comprises a package 1 having an opening 2 defined by the bottom face 5 and the sidewall 4 arranged to surround the bottom face 5, a plurality of lead terminals 7 provided to extend from the inside of the sidewall 4 of the package 1 toward the outside thereof, a semiconductor element 8 secured to the bottom face 5 of the package 1, a conductor 11 for connecting each lead 7 with the semiconductor element 8, and a dust-proof film 19 provided to cover the opening 2 of the package 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor device provided with a dustproof film and a dustproof lid in a package on which a semiconductor element having an imaging function or a light receiving function is mounted.

  FIG. 11 is a perspective view showing a configuration of a conventional semiconductor device 25E, and FIG. 12 is a cross-sectional view taken along a plane JJ shown in FIG. The structure of the conventional semiconductor device 25E is a mixture of a main component epoxy resin, a curing agent phenol resin, an amine curing accelerator, a release wax, carbon black, an adhesive, a filler mixed with silica fine particles, etc. in a predetermined ratio. It is made of resin.

The semiconductor device 25E includes a bottom surface 5 of the package 1 provided in the opening 2, an internal terminal 6 provided in the periphery above the bottom surface 5, an outer peripheral side wall 4 of the resin portion formed in the package 1, and an outer periphery thereof. A resin package 1 having an upper surface 3 and external terminals 7 extending from the outer wall of the surrounding side wall 4 of the package 1 and molded into a predetermined shape, and a bottom surface 5 of the package 1 is made of a thermosetting resin. A semiconductor element 8 having an imaging function attached by a fixed object 12, an electrode terminal 10 provided around the main surface 9 of the semiconductor element 8, an internal terminal 6 and an electrode terminal of the hollow resin package 1 10, and a structure in which a glass plate 23 for dustproof and moistureproof purposes is sealed with a sealing material 24 having the performance of heat, ultraviolet light, or both on the outer peripheral upper surface 3 of the package 1. (Patent text Reference 1).
JP-A-11-54543 (5th page, FIG. 7)

  However, in the conventional configuration, when the glass plate 23 is attached to the outer peripheral surface 3 of the package 1, an adhesive 24 that is cured by ultraviolet rays or heating is applied between the glass plate 23 and the outer peripheral surface 3 of the package 1. I do. Therefore, if dust or moisture is mistakenly taken into the opening 2 of the package 1 at the time of bonding, the semiconductor device in a high value-added state becomes defective at that stage, which is crucial for manufacturing costs and customer shipping plans. In addition to being hit, even if dust or moisture is not taken into the opening 2 of the package 1, the transport mode at the time of shipment is forced to be excessively responsive to dust and moisture.

  In addition, since the semiconductor device requires optical performance, if an object that obstructs optical information is interposed in the optical path of the semiconductor element 8 having an imaging function, the transmittance of the object (the influence of the thickness of the inclusion and the incident light wavelength) In other words, there is a problem that the semiconductor sensitivity characteristic caused by Further, in order not to deteriorate the optical characteristics, it is necessary to use an expensive high flat cover glass for the glass plate.

  An object of the present invention is to provide a semiconductor device capable of removing dust even if dust in a package opening is found before shipment.

  A semiconductor device according to the present invention is provided so that an opening is formed by a bottom surface and a side wall disposed so as to surround the bottom surface, and the package extends from the inside to the outside of the side wall of the package. A plurality of lead terminals, a semiconductor element fixed to the bottom surface of the package, a conductor for connecting each lead terminal and the semiconductor element, and a dust-proof film provided to cover the opening of the package It is characterized by comprising.

  ADVANTAGE OF THE INVENTION According to this invention, even if the dust in a package opening part is discovered before shipment, the semiconductor device which can remove dust can be provided.

  In the semiconductor device according to the present embodiment, a dustproof film is provided so as to cover the opening of the package. For this reason, even if dust in the package opening is found before shipment of the semiconductor device, the removable dustproof film is removed to remove the dust, and then the lid is covered again to make it non-defective.

  In this embodiment, it is preferable to further include an adhesive formed between the dust-proof film and the upper surface of the side wall.

  It is preferable that the dust-proof film is provided so as to seal the opening of the package.

  The dust-proof film is preferably provided so as to cover at least a part of the surface of the side wall.

  It is preferable that one end of the dust-proof film is folded back on the upper surface of the side wall.

  The dust-proof film preferably has a convex shape or a concave shape in the opening of the package.

  The pressure-sensitive adhesive preferably has a characteristic that the pressure-sensitive adhesive strength is lowered by reacting with either ultraviolet light or heat.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
1 is a perspective view showing the configuration of the semiconductor device 25 excluding the dust-proof film according to the first embodiment, FIG. 2 is a perspective view showing the configuration of the semiconductor device 25 according to the first embodiment, and FIG. FIG. 3 is a cross-sectional view along a plane AA shown in FIG. 2.

  The semiconductor device 25 includes a rectangular parallelepiped package 1 in which an opening 2 is formed by a bottom surface 5 and an outer side wall 4 arranged so as to surround the bottom surface 5. The package 1 is provided with a plurality of lead terminals 7 provided so as to extend from the inside to the outside of the surrounding side wall 4. A semiconductor element 8 is fixed to the bottom surface 5 of the package 1 by a fixed object 12.

  A plurality of electrode terminals 10 are provided on the periphery of the main surface 9 of the semiconductor element 8. An end of each lead terminal 7 on the inner side of the surrounding side wall 4 forms an internal terminal 6, and the internal terminal 6 is connected to the electrode terminal 10 and the conductor 11.

  On the upper surface 3 of the outer peripheral side wall 4 of the package 1, a dustproof film 19 provided with an adhesive 27 is disposed so as to cover the entire surface so as to seal the opening 2 of the package 1. The dustproof film 19 can be easily peeled off by providing a handle (not shown) at one end thereof. Adhesion of the dust-proof film 19 to the upper surface 3 of the outer peripheral side wall 4 is performed by pressing or heating and pressing. The dust-proof film 19 is composed of two layers of a base material and an adhesive material 27, and the representative thickness of each of the base material layer is 150 μm and the adhesive material 27 is 20 μm.

  As described above, according to the present embodiment, the dust-proof film 19 is provided so as to cover the opening 2 of the package 1. For this reason, even if dust in the opening 2 of the package 1 is found before shipment of the semiconductor device 25, the removable dustproof film 19 is removed to remove the dust, and then the lid is closed again to make it non-defective. it can.

  FIG. 4 is a perspective view showing a configuration of another semiconductor device 25A according to the first embodiment. The same components as those of the semiconductor device 25 according to the first embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  An opening 2 is formed on the top surface of the package 1. In the opening 2, a semiconductor element 8 having an imaging function, a bottom surface 5 on which the semiconductor element 8 is fixed and fixed by a fixed object 12, and an internal terminal disposed around the bottom surface 5. 6, a conductor 11 for connecting the internal terminal 6 and the electrode terminal 10 around the main surface 9 of the semiconductor element 8 is provided. The package 1 includes an outer peripheral side wall 4. The outer peripheral side wall 4 is connected to the inner terminal 6 and the outer peripheral side wall. 4 is provided with an external terminal 7 extending through 4.

  The outer surface 3 of the package 1 covers the entire surface so that a dust-proof film 19A having an adhesive 27 applied to at least the connecting portion 18 corresponding to the outer surface 3 covers the opening 2 of the package 1. As shown in FIG. 4, one end or both ends of the dustproof film 19 </ b> A are disposed so as to exceed the outer surface 3. The dust-proof film 19A is connected to the outer peripheral surface 3 by pressing or heating and pressing. The dust-proof film 19A is composed of two layers of a base material and an adhesive 27, and the representative thickness of each of the base material layer is 150 μm and the adhesive layer is 20 μm.

  FIG. 5 is a perspective view showing a configuration of still another semiconductor device 25B according to the first embodiment, and FIG. 6 is a cross-sectional view taken along the plane A “A” shown in FIG. An opening 2 is formed on the top surface of the package 1, and the semiconductor element 8 having an imaging function, the bottom surface 5 on which the semiconductor element 8 is fixed and fixed by a fixed object 12, and the periphery of the bottom surface 5 are disposed in the opening 2. An internal terminal 6, and a conductor 11 that connects the internal terminal 6 and the electrode terminal 10 around the main surface 9 of the semiconductor element 8. The package 1 includes an outer peripheral side wall 4, And an external terminal 7 extending through the outer side wall 4.

  The outer surface 3 of the package 1 covers the entire surface so that the opening 2 of the package 1 is sealed with a dust-proof film 19B in which an adhesive 27 is applied to at least the connecting portion 18 corresponding to the outer surface 3 and further the dust-proof film. One end of 19 </ b> B is disposed so as to exceed the outer peripheral surface 3, and the end is folded back so as to exceed the outer peripheral surface 3. The dust-proof film 19B is connected to the outer peripheral surface 3 by pressing or heating and pressing. The dust-proof film 19B is composed of two layers of a base material and an adhesive 27, and the representative thickness of each of the base material layer is 150 μm and the adhesive layer is 20 μm.

  In the above configuration, the adhesive 27 may be cured in response to, for example, ultraviolet rays or heat, and the adhesive strength may be reduced to facilitate the peeling of the dust-proof film 19B. The adhesive material 27 may be, for example, acrylic, epoxy, urethane and PET alone or a polymer, a polymer compound, or a material obtained by adding a photoreaction initiator to these.

  4 to 5, the cleaning of the opening 2 including the main surface 9 of the semiconductor element 8 mounted inside the package 1 and the cleaning of the dust-proof film 19 on the outer surface 3 are performed. After performing the process, the dust-proof films 19A and 19B and the outer surface 3 are quickly connected in a clean atmosphere, so that there is no fear of taking dust into the opening 2 of the package 1, and ultraviolet irradiation or heating immediately before incorporation into the apparatus. By reducing the adhesive strength of the adhesive film 27 and peeling off the dust-proof film 19, it becomes unnecessary not only to manage dust from shipping to immediately before installation in the apparatus, but also the expensive cover glass plate 23 is unnecessary. It is possible to realize the semiconductor devices 25A and 25B having an inexpensive and highly sensitive imaging function that can be easily managed after assembly.

  4 and 5, since the end portions of the dustproof films 19A and 19B are formed beyond the outer peripheral upper surface 3, it is easy to grasp and remove the end portions.

  In addition, although the example which used the dual line type | mold for the external shape of the package 1 was demonstrated as Embodiment 1, this invention is not limited to this. A quad type, a non-lead type, a ball grid type, and a land grid type may be used. The material of the package 1 may be a molded resin, a laminated resin substrate, ceramic, and mold glass. Further, the dustproof films 19, 19A and 19B may be made of an organic film having flexibility, a metal film, or thin glass.

(Embodiment 2)
FIG. 7 is a perspective view showing the configuration of the semiconductor device 25C according to the second embodiment, and FIG. 8 is a cross-sectional view taken along the plane BB shown in FIG. The same components as those of the semiconductor device 25 according to the first embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  An opening 2 is formed on the top surface of the package 1. In the opening 2, a semiconductor element 8 having an imaging function, a bottom surface 5 on which the semiconductor element 8 is fixed and fixed by a fixed object 12, and an internal terminal disposed around the bottom surface 5. 6, a conductor 11 for connecting the internal terminal 6 and the electrode terminal 10 around the main surface 9 of the semiconductor element 8 is provided. The package 1 includes an outer peripheral side wall 4. The outer peripheral side wall 4 is connected to the inner terminal 6 and the outer peripheral side wall. 4 is provided with an external terminal 7 extending through 4.

  A dust-proof lid 20 that protrudes upward and has a space portion 14 is attached to the outer peripheral upper surface 3 of the package 1. The connecting portion 18 of the dustproof lid 20 connected to the outer peripheral surface 3 has a narrow connecting surface, and an adhesive is applied in the vicinity of the connecting surface. The dust-proof lid 20 is connected to the outer upper surface 3 by pressing or heating and pressing. In order to remove the dustproof lid 20 after the connection, a handle 20P is provided on a part of the connecting portion 18 of the dustproof lid 20 in consideration of ease of peeling. The thickness of the dustproof lid 20 is 150 μm, but this thickness is not particular.

  FIG. 9 is a perspective view showing a configuration of another semiconductor device 25D according to the second embodiment, and FIG. 10 is a cross-sectional view taken along a plane B′B ′ shown in FIG. The same components as those of the semiconductor device 25 according to the first embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  An opening 2 is formed on the top surface of the package 1. In the opening 2, a semiconductor element 8 having an imaging function, a bottom surface 5 on which the semiconductor element 8 is fixed and fixed by a fixed object 12, and an internal terminal disposed around the bottom surface 5. 6, a conductor 11 for connecting the internal terminal 6 and the electrode terminal 10 around the main surface 9 of the semiconductor element 8 is provided. The package 1 includes an outer peripheral side wall 4. The outer peripheral side wall 4 is connected to the inner terminal 6 and the outer peripheral side wall. 4 is provided with an external terminal 7 extending through 4.

  A dustproof lid 20 </ b> A that protrudes upward and has a space portion 14 is attached to the outer peripheral upper surface 3 of the package 1. The connecting portion 18A of the dustproof lid 20A connected to the outer surface 3 has an L-shape that spreads outward on the outer surface 3 and has a wide adhesive surface, and the adhesive 27 is in the vicinity of the connecting surface. It has been subjected. The dust-proof lid 20A is connected to the outer upper surface 3 by pressing or heating and pressing. In order to remove the dustproof lid 20A after the connection, a handle 20P is provided on a part of the connecting portion 18A of the dustproof lid 20A in consideration of ease of peeling. The thickness of the dustproof lid 20A is 150 μm, but this thickness is not particular.

  FIG. 11 is a perspective view showing a configuration of still another semiconductor device 25E according to the second embodiment, and FIG. 12 is a cross-sectional view taken along a plane B “B” shown in FIG. The same components as those of the semiconductor device 25 according to the first embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals. Therefore, detailed description of these components is omitted.

  An opening 2 is formed on the top surface of the package 1. In the opening 2, a semiconductor element 8 having an imaging function, a bottom surface 5 on which the semiconductor element 8 is fixed and fixed by a fixed object 12, and an internal terminal disposed around the bottom surface 5. 6, a conductor 11 for connecting the internal terminal 6 and the electrode terminal 10 around the main surface 9 of the semiconductor element 8 is provided. The package 1 includes an outer peripheral side wall 4. The outer peripheral side wall 4 is connected to the inner terminal 6 and the outer peripheral side wall. 4 is provided with an external terminal 7 extending through 4.

  A dust-proof lid 33 having a shape that sinks into the opening 2 except for the outer peripheral upper surface 3 and its periphery is attached to the outer peripheral upper surface 3 of the package 1. The connecting portion 18B of the dustproof lid 23 connected to the outer upper surface 3 has a wide adhesive surface, and an adhesive 27 is applied in the vicinity of the connecting surface. The dustproof lid 33 is connected to the outer upper surface 3 by pressing or heating and pressing. In order to remove the dust-proof lid 33 after connection, a handle 23P is provided on a part of the connecting portion 18B of the dust-proof lid 33 in consideration of ease of peeling. The thickness of the dustproof lid 33 is 150 μm, but this thickness is not particular.

  In the above configuration, the adhesive 27 may be cured in response to ultraviolet light or heat, for example, and the adhesive strength may be reduced to facilitate the peeling of the dustproof films 20, 20 </ b> A, and 33. The adhesive material 27 may be, for example, acrylic, epoxy, urethane and PET alone or a polymer, a polymer compound, or a material obtained by adding a photoreaction initiator to these.

  According to the configuration shown in FIGS. 7 to 12, the opening 2 including the main surface 9 of the semiconductor element 8 mounted inside the package 1 is cleaned, and the dust-proof covers 20, 20 </ b> A and 33 are placed on the outer upper surface 3. After cleaning the affixing side, the dust-proof covers 20, 20A and 33 and the outer peripheral surface 3 are quickly connected in a clean atmosphere, so that there is no fear of taking dust into the opening 2 of the package 1. For this reason, it is not necessary to manage dust from shipping to immediately before incorporation into the device by peeling the dustproof lids 20, 20A and 33 by reducing the adhesive strength of the adhesive film 27 by ultraviolet irradiation or heating immediately before incorporation into the device. In addition, an expensive cover glass plate 23 is not required, and a low-cost and high-sensitivity imaging function that can be easily managed after assembly can be realized.

  In addition, in the structure shown in FIG. 7, since the dust-proof cover 20 is convex upward, it is easy to hold | maintain and attachment / detachment is easy. Moreover, in the structure shown in FIG. 9, since the area of the connection part 18A of the dust-proof lid 20A is large, the adhesive strength at the time of adhesion can be increased. Further, the configuration shown in FIG. 11 has a feature that the height can be minimized.

  The dustproof lids 20, 20A and 33 are made of metal or resin and can be reused after being cleaned. Here, the dustproof lid is not limited to metal or resin, but may be any other as long as it can withstand repeated cleaning.

  In addition, although the example which used the dual line type | mold for the external shape of the package 1 was demonstrated as Embodiment 2, you may use a quad type | mold, a non-lead type | mold, a ball grid type, and a land grid type. The material of the package 1 may be a molded resin, a laminated resin substrate, ceramic, and mold glass. Further, an organic film, a metal film, and a thin glass plate may be used for the dust cover 20, 20A and 33.

  As described above, in the incorporation of the conventional imaging device into the camera module, the dust management must be carefully performed from the shipment of the product to the incorporation into the device by the customer. According to the semiconductor device according to 1 and 2, it is not necessary to manage it from product shipment to just before installation of the device. Further, dust found inside the package can be removed, and the yield can be improved.

  In addition, since the semiconductor device having the structure according to the first and second embodiments is incorporated into the device without attaching an expensive high flat glass plate, one having good optical characteristics can be obtained.

  The present invention can be applied to a package on which a semiconductor element having an imaging function or a light receiving function is mounted.

1 is a perspective view showing a configuration of a semiconductor device excluding a dustproof film according to a first embodiment. 1 is a perspective view showing a configuration of a semiconductor device according to a first embodiment. FIG. 3 is a cross-sectional view along a plane AA shown in FIG. 2. FIG. 10 is a perspective view showing a configuration of another semiconductor device according to the first embodiment. FIG. 10 is a perspective view showing a configuration of still another semiconductor device according to the first embodiment. FIG. 6 is a sectional view taken along a plane A “A” shown in FIG. 5. FIG. 6 is a perspective view showing a configuration of a semiconductor device according to a second embodiment. FIG. 8 is a sectional view taken along a plane BB shown in FIG. 7. FIG. 10 is a perspective view showing a configuration of another semiconductor device according to the second embodiment. FIG. 10 is a sectional view taken along a plane B′B ′ shown in FIG. 9. FIG. 10 is a perspective view showing a configuration of still another semiconductor device according to the second embodiment. FIG. 12 is a cross-sectional view taken along a plane B “B” shown in FIG. 11. It is a perspective view which shows the structure of the conventional semiconductor device. It is sectional drawing along the surface JJ shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package 2 Opening 4 Side wall 5 Bottom face 7 Lead terminal 8 Semiconductor element 11 Conductor 19 Dust-proof film 25 Semiconductor device

Claims (9)

A package in which an opening is formed by a bottom surface and a side wall disposed so as to surround the bottom surface;
A plurality of lead terminals provided so as to extend from the inside to the outside of the side wall of the package;
A semiconductor element fixed to the bottom surface of the package;
A conductor for connecting each lead terminal and the semiconductor element;
A semiconductor device comprising: a dustproof film provided so as to cover the opening of the package. The semiconductor device according to claim 1, further comprising an adhesive formed between the dust-proof film and the upper surface of the side wall. The semiconductor device according to claim 1, wherein the dustproof film is provided so as to seal an opening of the package. The semiconductor device according to claim 1, wherein the dust-proof film is provided so as to cover at least a part of a surface of the side wall. The semiconductor device according to claim 1, wherein one end of the dustproof film is folded back on an upper surface of the side wall. The semiconductor device according to claim 1, wherein the dust-proof film has a convex shape or a concave shape in the opening of the package. The semiconductor device according to claim 1, wherein the dustproof film is made of an organic film. The semiconductor device according to claim 1, wherein the dust-proof film is made of a resin or a metal film. The semiconductor device according to claim 2, wherein the pressure-sensitive adhesive has a characteristic that the pressure-sensitive adhesive strength decreases in response to either ultraviolet light or heat.

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