JP2007059746A - Electronic component storage package and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component storage package that ensures a high parallelism between an insulating base and a lid, a long-term reliability and a good reliability for moisture absorption, and to provide the electronic apparatus. <P>SOLUTION: The electronic component storage package X includes an insulating base 10 with a mount area 11 for mounting an electronic component D, a lid 30 for determining a storage space A for housing the insulating base 10 and electronic component D, and a bond 60 for bonding the insulating base 10 and electronic component 30. The insulating base 10 has, in an area adjacent to the bond 60, one or more grooves 12 where one end extends up to the storage space A and the other end extends up to the outer space. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component storage package applied to store an electronic component such as a semiconductor element, and an electronic device configured to store the electronic component in the electronic component storage package.

  An electronic component storage package for storing an electronic component includes a mounting portion for mounting the electronic component, and an insulating base having a conductor portion including a wiring conductor electrically connected to the electronic component, and the like And a lid for defining a storage space for storing electronic components together with the insulating base. When an electronic device is configured by storing an electronic component in such an electronic component storage package, the electronic component is mounted on the mounting portion of the insulating base and the lid is bonded to the insulating base. The electronic component is hermetically sealed. Note that the electrodes of the electronic component are electrically connected to an electric circuit board or the like located outside the electronic device via a conductor portion.

  The insulating base and the lid are joined through a joining material (for example, a resin material). Here, an example of a method for joining the insulating base and the lid when a thermosetting resin is employed as the joining material will be described. First, an uncured and fluid thermosetting resin is applied in a frame shape around the mounting portion of the insulating substrate. Next, the lid is pressed against the insulating substrate coated with the thermosetting resin. Next, the thermosetting resin is cured by heating. As described above, the insulating base and the lid are joined (airtight sealing). An electronic component storage package to be joined by such a joining method is disclosed in, for example, Patent Document 1.

When the above joining method is adopted, the volume of the storage space is reduced by pressing the lid, and therefore it is necessary to release the air in the storage space to the outside in order to suppress the pressure increase in the storage space. Therefore, an example of a method for releasing the air in the accommodation space to the outside when pressing the lid will be described below. First, a frame-like pattern in which a part of the insulating base is not coated in a slit shape (that is, a continuous coating pattern is temporarily interrupted, and the coating pattern is continuously formed again at a certain distance around the mounting portion. The thermosetting resin is applied in such a pattern. Next, the lid is pressed against the insulating substrate coated with the thermosetting resin. At this time, the air in the storage space is released to the outside through the non-application portion between the insulating base and the lid. Further, the uncured thermosetting resin enters the slit-like non-application portion from the adjacent portion and is cured.
JP 2005-20464 A

  However, in the joining method adopting the above-described air release method, a predetermined amount (an amount corresponding to the volume of the storage space that is reduced by pressing the lid) is not applied before the air is completely discharged from the storage space to the external space. May be blocked (closed quickly).

  When such an early closing occurs, air remains excessively in the storage space and the pressure in the storage space increases, so that the lid body may be inclined. In particular, when an optical semiconductor element (e.g., a photodiode or an image sensor element) is used as an electronic component and a translucent lid is employed as a lid, the translucent lid is inclined so that, for example, incident light from the outside Disturbance occurs. When such a disturbance occurs, a focus failure occurs, and for example, a reduction in image recognition accuracy occurs. Therefore, the inclination of the lid body has a significant influence on the function as an electronic device.

  Moreover, when the pressure in the storage space rises and the lid is pushed up, the thermosetting resin may be pulled upward to narrow the width, so-called resin thinning may occur. When such resin thinning occurs, the thermosetting resin cannot be ensured within a predetermined sealing range, and the bonding strength of the lid to the insulating substrate is lowered, and the long-term reliability is lowered. In addition, if a sufficient width of the thermosetting resin cannot be ensured, it is difficult to appropriately prevent moisture from entering the storage space from the external space, and reliability for moisture absorption is also reduced.

  The present invention has been conceived under such circumstances, and an electronic component storage package having high parallelism between an insulating base and a lid, excellent in long-term reliability and reliability against moisture absorption, and An object is to provide an electronic device.

  An electronic component storage package according to a first aspect of the present invention includes an insulating base having a mounting portion for mounting an electronic component, and a lid that defines a storage space for storing the electronic component together with the insulating base. And a bonding material for bonding the insulating base body and the lid body. The insulating base body and / or the lid body has one end extending to the storage space and the other end extending to the external space at a portion in contact with the bonding material. Or it has several groove parts. Here, the insulating base and / or lid means two things: the insulating base and lid, and the insulating base or lid.

  Preferably, the storage space has a substantially rectangular shape in plan view, and among the plurality of groove portions, one groove portion and the other groove portion are positioned so as to be symmetric with respect to the substantially square center of gravity. It is characterized by.

  An electronic device according to a second aspect of the present invention includes the electronic component storage package according to the first aspect of the present invention and an electronic component mounted on the mounting portion.

  In the electronic component storage package according to the first aspect of the present invention, one or a plurality of the insulating base and / or the lid extends to the storage space and the other end extends to the external space at a portion in contact with the bonding material. It has a groove part. For this reason, in the electronic component storage package, when the lid is pressed against the insulating substrate to which the bonding material is applied, the gap between the bonding material (uncured) applied to the groove and the lid is interposed. Thus, the air in the storage space can be more appropriately discharged to the external space, so that the pressure in the storage space can be within a more appropriate range. Therefore, in the electronic component storage package, it is possible to prevent the parallelism between the insulating base body and the cover body from being lowered by the inclination of the cover body due to the pressure in the storage space being unduly increased. it can.

  Further, in this electronic component storage package, the bonding material is thinned (a phenomenon in which the width of the bonding material becomes narrow) due to an unreasonably high pressure in the storage space. It can suppress that intensity falls or reliability with respect to moisture absorption falls.

  Furthermore, in the electronic component storage package, since a special design (for example, a design having a slit-like non-application portion) is not required with respect to the application pattern of the bonding material, the application pattern of the bonding material can be simplified.

  From the above, this electronic component storage package has high parallelism between the insulating base and the lid, and is excellent in long-term reliability and reliability against moisture absorption.

  The electronic component storage package in which one groove portion and the other groove portion are positioned symmetrically with respect to the substantially square center of gravity is more efficient in releasing air from the storage space to the external space. It is suitable for performing effectively.

  The electronic device according to the second aspect of the present invention includes the electronic component storage package according to the first aspect of the present invention. In other words, the electronic device is designed to store electronic components with high parallelism between the insulating base and the lid, and excellent long-term reliability and reliability against moisture absorption by suppressing tilting of the lid and thinning of the bonding material. Electronic components are stored in the package storage space. Therefore, this electronic device is excellent in the reliability of hermetic sealing. Further, when an optical semiconductor element is used as an electronic component, the parallelism between the insulating base and the lid is high, so that the electronic device (optical semiconductor device) is excellent in reliability and characteristics such as image recognition accuracy. be able to.

  FIG. 1 is a cross-sectional view illustrating an electronic device Y in which an electronic component D is stored in an electronic component storage package X according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing the electronic device Y shown in FIG. FIG. 3 is a plan view showing the electronic device Y shown in FIG. FIG. 4 is a plan view showing the electronic component storage package X. FIG. Note that the lid 30 is omitted in FIG. 3 and the lid 30 and the bonding material 60 are omitted in FIG.

  Electronic components D include optical semiconductor elements (line sensors, area sensors, image sensors, charge-coupled elements, EPROM (Erasable and Programmable Read Only Memory), etc.), piezoelectric elements (pressure sensors, acceleration sensors, crystal oscillators, etc.), Examples include a semiconductor integrated circuit element (IC), a capacitor, a resistor, and the like. In the present embodiment, an optical semiconductor element is used for explanation. Note that the electronic component D in the present embodiment has an electrode Da for power supply or signal and a light receiving part Db for receiving light from the outside on the upper surface.

  The electronic component storage package X includes the insulating base 10, the wiring conductor 20, the lid 30, the bonding wire 40, the adhesive 50, and the bonding material 60, and is a member for storing the electronic component D therein.

  The insulating base 10 has a mounting portion 11 and a plurality of (four in this embodiment) groove portions 12, and has, for example, a substantially square shape or a substantially rectangular shape in plan view. The mounting part 11 is a part for mounting the electronic component D, and is provided on the bottom surface of the storage part 10a of the insulating base 10 in this embodiment.

  The plurality of groove portions 12 are portions for discharging air in the storage space A having a substantially rectangular shape in a plan view defined by the insulating base 10 and a lid body 30 to be described later to the external space. The one groove portion 12 is positioned so as to be symmetrical with respect to the center of gravity of the substantially square shape. Each groove 12 has one end extending to the storage space A and the other end extending to the external space. Here, the substantially quadrangular shape includes, in addition to a perfect square as defined, a shape in which corners are chamfered (cut into straight lines), a shape in which corners are rounded into an arc shape or an elliptical arc shape, and the like. Means.

  The groove depths h of the respective groove portions 12 are set to be substantially the same. Such a configuration is suitable for discharging the air in the storage space A to the external space more efficiently and effectively. The groove width w of each groove portion 12 is sufficient to release the air in the storage space A to the external space between the lid body 30 and the bonding material 60 having fluidity applied to the groove portion 12. Appropriately, the size can be secured, and when the insulating substrate 10 and the lid body 30 are bonded by the bonding material 60, the gap for discharging the air to the groove portion 12 can be sufficiently sealed. You only have to set it. For example, the insulating base 10 made of an aluminum oxide sintered body having a side length of about 10 to 15 mm in a plan view, and a planar dimension comparable to the insulating base 10 and a thickness of 0.5 to 0 When the lid 30 made of .8 mm borosilicate glass is used and the insulating substrate 10 and the lid 30 are bonded using an ultraviolet curable epoxy resin as the bonding material 60, the thickness of the bonding material 60 is 20 to 20 mm. When set to 80 μm, it is preferable to set the groove depth h of the groove portion 12 in the range of 0.1 to 0.5 mm and the groove width w of the groove portion 12 in the range of 0.5 to 2 mm. Note that when the thickness of the bonding material 60 is increased, the groove depth h of the groove 12 is increased, and conversely, when the thickness is decreased, the groove depth h of the groove 12 is decreased.

  Examples of the material constituting the insulating base 10 include ceramics and resins. Here, ceramics means an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body (aluminum nitride ceramic), a silicon carbide sintered body (silicon carbide ceramic), and a silicon nitride sintered body (nitriding). Silicon ceramics), glassy sintered bodies (glass ceramics), mullite sintered bodies, etc., and resins are thermosetting or ultraviolet curing types such as epoxy resins, polyimide resins, acrylic resins, phenolic resins, polyester resins, etc. Resin.

  Here, an example of a method for manufacturing the insulating substrate 10 in the case where an alumina sintered body is employed as the material constituting the insulating substrate 10 will be described. First, raw material powders such as aluminum oxide (alumina) and silica are formed into a sheet shape together with an organic solvent and a binder to produce a plurality of ceramic green sheets. Next, a part of the produced ceramic green sheet is punched out into a rectangular plate shape having a predetermined size in which the electronic component D can be stored. Further, a part of the produced ceramic green sheet is punched into a shape having a predetermined dimension that allows the groove 12 to be formed. Next, the punched ceramic green sheets are stacked to a predetermined size that can accommodate the electronic component D and the groove 12 can be formed, and the ceramic green sheets that are not punched are stacked to a predetermined size. After stacking, firing is performed at a predetermined firing temperature (for example, 1300 to 1600 ° C.). As described above, the insulating base 10 is manufactured. Note that the method for manufacturing the insulating substrate 10 is not limited to the above-described method, and a predetermined processing means (for example, mechanical cutting or cutting using laser light) is performed after a fired body having no groove 12 is formed. ) To form the groove 12. In addition, the method for manufacturing the insulating substrate 10 is not limited to the above-described method by simultaneous firing, and a frame shape using a bonding material (for example, brazing material, glass, resin) on the outer peripheral portion of the upper surface of the plate-like insulator. A method of joining the insulators may be adopted.

  The wiring conductor 20 has a wiring pad portion 21 and a terminal electrode portion 22, and is a member for obtaining electrical continuity inside and outside the electronic component storage package X. Moreover, as a form of the wiring conductor 20, metallized layer shape, plating layer shape, vapor deposition layer shape, metal foil layer shape, etc. are mentioned. The wiring pad portion 21 is exposed in the storage portion 10a and is a portion that is electrically connected to the electrode Da of the electronic component D via a bonding wire 40 described later. The terminal electrode portion 22 is exposed on the lower surface of the insulating base 10 and is a portion that is electrically connected to an external electric circuit (not shown) via a conductive connecting material (for example, solder). The wiring pad part 21 and the terminal electrode part 22 are formed in a relatively larger area than the part between them. According to such a configuration, electrical connection can be more reliably and easily performed. Examples of the material constituting the wiring conductor 20 include metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold. The member for obtaining electrical continuity inside and outside the electronic component storage package X is not limited to the wiring conductor 20, and for example, a metal lead terminal (lead frame) or the like may be adopted.

  Here, an example of a method of forming the wiring conductor 20 when tungsten is adopted as a material constituting the wiring conductor 20 and the wiring conductor 20 is formed in a metallized layer will be described. First, a tungsten paste is kneaded with an organic solvent, a binder, etc., and a metal paste is produced. Next, the produced metal paste is printed on the ceramic green sheet constituting the insulating substrate 10 by a predetermined printing method (for example, screen printing method). The wiring conductor 20 is formed as described above. A plating layer (for example, gold plating or tin plating) may be further formed on the exposed surface of the wiring conductor 20.

  The lid 30 defines a storage space A for storing the electronic component D together with the insulating base 10. In the present embodiment, the storage space 10 is hermetically sealed between the storage portion 10 a and the lid body 30 by joining the lid body 30 to the insulating base 10 and closing the storage portion 10 a with the lid body 30. A is formed, and the electronic component D is hermetically sealed in this space.

  The lid body 30 is configured in a shape and dimensions capable of closing the storage portion 10a of the insulating base 10. For example, if the storage space A is a quadrangular shape in plan view, the outer diameter is larger than the planar view area of the storage space A. Is also formed into a slightly larger square plate shape. Examples of the material constituting the lid 30 include metal materials such as Fe—Ni—Co alloys and Fe—Ni alloys, ceramic materials, and translucent materials (such as glass, quartz, sapphire, and transparent resin). Note that when a metal material is employed as the material constituting the lid 30, a plating layer such as Ni or Au may be deposited on the surface thereof.

  Here, an example of a method for producing the lid body 30 when an Fe—Ni—Co alloy is employed as the material constituting the lid body 30 will be described. First, the Fe—Ni—Co alloy plate material is subjected to metal processing such as rolling to obtain a metal plate having a predetermined thickness. Next, the produced metal plate is subjected to mechanical punching, etching, or the like, and cut to a predetermined outer dimension of the lid. Thereafter, the lid body 30 is produced by depositing a plating layer of Ni, Au or the like by a known electrolytic plating method or electroless plating method as necessary. In addition, when the lid 30 is made of glass or transparent resin (acrylic resin, methacrylic resin, epoxy resin, etc.), the original plate such as a glass plate having a predetermined lid thickness is cut as described above. Thus, the lid body 30 can be manufactured.

  The bonding wire 40 is a member for electrically connecting the electrode Da of the electronic component D and the wiring pad 21 of the wiring conductor 20, and one end thereof is electrically connected to the electrode Da of the electronic component D. The other end is electrically connected to the wiring pad 21 of the wiring conductor 20. Examples of the material constituting the bonding wire 40 include metals such as gold and aluminum. The length of the bonding wire 40 is set to, for example, 0.3 mm to 5.0 mm. If the length of the bonding wire 40 is less than 0.3 mm, it may be difficult to form a sufficient loop with the bonding wire 40, so that the electrical connection between the electrode Da of the electronic component D and the wiring pad 21 is sufficient. It may not be possible. In addition, if the length of the bonding wire 40 exceeds 5.0 mm, the loop due to the bonding wire 40 may become unnecessarily large, resulting in unnecessary inductance being generated and the high-frequency signal transmission characteristics being deteriorated. There is. Instead of the bonding wire 40 in the present embodiment, a band-like connection line such as a so-called bonding ribbon, a metal bump, or the like may be employed.

  The adhesive 50 is for adhering the lower surface of the electronic component D to the mounting portion 11 of the insulating substrate 10, and for example, an epoxy resin, a polyimide resin, an acrylic resin, a silicone resin, a polyetheramide resin, or the like. And a solder material such as Au—Sn, Sn—Ag—Cu, Sn—Cu, Sn—Pb.

  The bonding material 60 is for bonding the insulating base 10 and the lid 30 together. Examples of the bonding material 60 include resins such as an epoxy resin, a silicone resin, an acrylic resin, a polyimide resin, a phenol resin, a cresol resin, glass, a brazing material, and the like. The larger the size, the greater the influence on the electronic component D and the like.

  In the electronic component storage package X, the insulating base 10 has a plurality of groove portions 12 at one end extending to the storage space A and the other end extending to the external space at a portion in contact with the bonding material 60. Therefore, in the electronic component storage package X, when the lid 30 is pressed against the insulating substrate 10 to which the bonding material 60 is applied, the bonding material 60 (uncured) applied to the groove 12 and the lid 30 Since the air in the storage space A can be more appropriately discharged to the external space through the gap formed therebetween, the pressure in the storage space A can be within a more appropriate range. Therefore, in the electronic component storage package X, the parallelism between the insulating base 10 and the lid body 30 is reduced due to the inclination of the lid body 30 due to the unreasonably increased pressure in the storage space A. Can be suppressed.

  Further, in the electronic component storage package X, the bonding material 60 is thinned (a phenomenon in which the width of the bonding material becomes narrow) due to an unreasonably high pressure in the storage space A, so that the lid for the insulating base 10 is covered. It can suppress that the joint strength of the body 30 falls or the reliability with respect to moisture absorption falls.

  Furthermore, since the electronic component storage package X does not require a special design (for example, a design having a slit-like non-application portion) with respect to the application pattern of the bonding material 60, the application pattern of the bonding material 60 can be simplified. .

  From the above, the electronic component storage package X has high parallelism between the insulating base 10 and the lid 30 and is excellent in long-term reliability and reliability with respect to moisture absorption.

  In the electronic component storage package X, one groove portion and the other groove portion are positioned so as to be symmetric with respect to the substantially square center of gravity. According to such a configuration, since it is possible to suppress the bias of the release of air from the storage space A to the external space, when performing the discharge of air from the storage space to the external space more efficiently and effectively. Is preferred. Since the electronic component storage package X has a substantially rectangular shape in plan view, it is suitable for efficiently storing, for example, a rectangular (substantially rectangular) optical semiconductor element such as a line sensor or an area sensor as the electronic component D. .

  The electronic device Y is an electronic component having high parallelism between the insulating base 10 and the lid 30 and excellent long-term reliability and reliability against moisture absorption by suppressing the inclination of the lid 30 and the thinning of the bonding material 60. An electronic component D is stored in the storage space A of the storage package X. Therefore, the electronic device Y is excellent in the reliability of hermetic sealing. When an optical semiconductor element is used as the electronic component D, since the parallelism between the insulating base 10 and the lid 30 is high, the electronic device Y should have excellent reliability and characteristics such as image recognition accuracy. Can do.

  Below, the manufacturing method of the electronic device Y is demonstrated.

  First, the electronic component D is bonded (mounted) to the mounting portion 14 on the bottom surface of the storage space A of the insulating base 10 using the adhesive 50. Specifically, an adhesive 50 made of uncured resin is applied to a predetermined position of the mounting portion 11 of the insulating base 10, and a transfer device (for example, pickup and After placing the electronic component D on the adhesive 50 by having a place function), the uncured resin is cured by heat, ultraviolet light, or the like.

  Next, the electrode Da of the electronic component D and the wiring pad portion 21 of the wiring conductor 20 are electrically connected using the bonding wire 40.

  Next, the bonding material 60 is applied to the region on the top surface 10b of the insulating base 10 where the lid 30 is placed. As a method for applying the bonding material 60, for example, an uncured bonding material 60 (paste-like) is injected into a predetermined syringe, and an air pressure is loaded into the syringe, so that the protruding amount from the needle portion at the tip of the syringe. A screen printing method in which a coating mask having a coating pattern shape is prepared, and an uncured bonding material 60 is printed and applied by a squeegee or the like from the upper portion is applied.

  Next, the lid body 30 is placed while being positioned on the upper surface 10b of the insulating substrate 10 to which the bonding material 60 has been applied.

  Next, by curing the bonding material 60, the insulating base 10 and the lid body 30 are bonded to hermetically seal the electronic component D. As described above, the electronic device Y shown in FIG. 1 can be manufactured.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  Although the groove 12 is provided in the insulating base 10 in the present embodiment, it may be provided in a portion that is bonded to the insulating base 10 via the bonding material 60 in the lid 30. Even in such a configuration, the same effects as in the present embodiment can be obtained.

  Although the groove part 12 is provided in a total of four places in this embodiment, the number of formation places is not restricted to this, 1-3 places may be sufficient and 5 places or more may be sufficient. Moreover, although the groove part 12 is formed in the intermediate part of each side by planar view in this embodiment, a formation position is not restricted to this, For example, as shown in FIG. Good.

  The shape of the groove 12 in plan view is not limited to a linear shape, and may be a spindle shape, for example. Such a shape is suitable from the viewpoint of air escape and productivity. Moreover, the longitudinal cross-sectional shape of the groove part 12 is not restricted to a rectangular shape, A partial circular shape (for example, semicircle shape), a partial ellipse shape, polygonal shapes other than rectangular shape etc. may be sufficient. In particular, when the lid 30 is finally joined, a shape having no corners such as a partial circular shape or a partial elliptical shape is suitable for spreading the bonding material 60 to every corner of the groove 12.

  The lid 30 has a substantially flat plate shape in the present embodiment, but is not limited to such a shape. Specifically, for example, when the substantially flat insulating base 10 is employed, a concave portion having a desired shape may be provided in the lid body 30 in order to appropriately form the storage space A for storing the electronic component D. Good.

  The lid body 30 may be configured to have a part including a translucent member in a part thereof. Moreover, the site | part which contains translucency may have the optical film which bears the function which suppresses permeation | transmission of an ultraviolet-ray on the surface. Furthermore, a paint having a function of preventing irregular reflection of light in the storage space A may be applied to a surface other than the portion including translucency and defining the storage space A. According to such a configuration, when, for example, an optical semiconductor element is employed as the electronic component D, it is possible to more appropriately transfer light inside and outside the storage space A. Examples of the translucent member include glass, quartz, sapphire, and transparent resin. Examples of the optical film include AR coat and IR filter. Examples of the paint include acrylic black paint and epoxy black paint. And acrylic paint in which PTFE fine powder is dispersed.

  The bonding material 60 may include a dark color (black, brown, dark brown, dark green, dark blue, etc.) pigment or dye. According to such a configuration, it is possible to suppress extraneous external light from entering the recess 11 through the bonding material 60. Further, the bonding material 60 may include a filler made of an inorganic material such as glass or ceramics. According to such a configuration, in addition to being able to increase the mechanical strength of the bonding material 60 itself, the mechanical strength is improved at the time of moisture absorption reflow in the bonded state, and the reliability of the bonded portion is improved due to thermal expansion and contraction. be able to.

It is sectional drawing showing the electronic device which accommodated the electronic component in the electronic component storage package which concerns on embodiment of this invention. It is a disassembled perspective view showing the electronic device shown in FIG. It is a top view showing the electronic device shown in FIG. It is a top view showing the electronic component storage package which concerns on embodiment of this invention. It is a top view showing the modification of the electronic component storage package which concerns on embodiment of this invention.

Explanation of symbols

X Electronic component storage package Y Electronic device A Storage space D Electronic component 10 Insulating substrate 11 Mounting portion 12 Groove portion 20 Wiring conductor 30 Lid body 40 Bonding wire 50 Adhesive 60 Bonding material

Claims (3)

An insulating base having a mounting portion for mounting an electronic component, a lid that defines a storage space for storing the electronic component together with the insulating base, and a joint for joining the insulating base and the lid With materials,
The insulating base and / or the lid has one or a plurality of grooves at one end that extends to the storage space and the other end that extends to the external space at a portion that contacts the bonding material. Storage package. The storage space is substantially rectangular in plan view,
2. The electronic component according to claim 1, wherein among the plurality of grooves, one groove and the other groove are positioned so as to be symmetric with respect to a center of gravity of the substantially square shape. Storage package. An electronic device comprising the electronic component storage package according to claim 1 and an electronic component mounted on the mounting portion.

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