JP2003218256A - Package for accommodating electronic component - Google Patents
Package for accommodating electronic componentInfo
- Publication number
- JP2003218256A JP2003218256A JP2002011155A JP2002011155A JP2003218256A JP 2003218256 A JP2003218256 A JP 2003218256A JP 2002011155 A JP2002011155 A JP 2002011155A JP 2002011155 A JP2002011155 A JP 2002011155A JP 2003218256 A JP2003218256 A JP 2003218256A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- recess
- package
- striped
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体素子や弾性
表面波素子等の電子部品を収容する電子部品収納用パッ
ケージに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components such as semiconductor devices and surface acoustic wave devices.
【０００２】[0002]
【従来技術】従来、半導体素子や表面弾性波素子等の電
子部品を収容するための電子部品収納用パッケージは、
酸化アルミニウム質焼結体等の電気絶縁材料から成り、
その上面の略中央部に電子部品を収容するための凹部及
び該凹部周辺から外表面にかけて導出されたタングステ
ン、モリブデン、マンガン等の高融点金属粉末から成る
メタライズ配線層を有する絶縁基体と、蓋体とから構成
されており、絶縁基体の凹部底面に電子部品をエポキシ
樹脂等の接着用の樹脂を介して接着固定するとともに電
子部品の各電極をボンディングワイヤを介して電気的に
接続し、最後に絶縁基体上面に蓋体をガラス、樹脂等の
封止部材により接合させ、内部に電子部品を気密封止す
ることによって最終製品としての電子装置となる。2. Description of the Related Art Conventionally, electronic component storage packages for storing electronic components such as semiconductor devices and surface acoustic wave devices have been
Made of an electrically insulating material such as an aluminum oxide sintered body,
An insulating substrate having a recess for accommodating an electronic component substantially in the center of its upper surface and a metallized wiring layer made of a refractory metal powder of tungsten, molybdenum, manganese, etc. drawn from the periphery of the recess to the outer surface, and a lid. The electronic component is adhered and fixed to the bottom surface of the concave portion of the insulating substrate through an adhesive resin such as epoxy resin, and each electrode of the electronic component is electrically connected through a bonding wire. The lid is joined to the upper surface of the insulating base by a sealing member such as glass or resin, and the electronic components are hermetically sealed inside, so that an electronic device as a final product is obtained.
【０００３】なお、電子部品の凹部底面への接着は、例
えば、まず凹部底面に未硬化のエポキシ樹脂等の接着用
の樹脂を塗布し、次に凹部底面上に電子部品を位置決め
載置するとともに電子部品に適当な荷重を印加し、電子
部品の下面と凹部底面との間に樹脂を濡れ広がらせて充
填し、最後にこの未硬化の樹脂を加熱硬化することによ
り行われる。In order to bond the electronic component to the bottom surface of the recess, for example, an adhesive resin such as an uncured epoxy resin is first applied to the bottom surface of the recess, and then the electronic component is positioned and placed on the bottom surface of the recess. This is performed by applying an appropriate load to the electronic component, allowing the resin to wet and spread between the lower surface of the electronic component and the bottom surface of the recess, and finally heat-curing the uncured resin.
【０００４】この場合、例えば、図３に示すように、配
線導体２２が形成された凹部２１ａを取り囲む絶縁基体
２１の上面に位置決め用のマーク２３を形成しておき、
このマーク２３を基準として電子部品が凹部２１ａ底面
に位置決め、接着される。In this case, for example, as shown in FIG. 3, a positioning mark 23 is formed on the upper surface of the insulating substrate 21 surrounding the recess 21a in which the wiring conductor 22 is formed.
The electronic component is positioned and adhered to the bottom surface of the recess 21a with the mark 23 as a reference.
【０００５】また、近時、電子部品は数ｍｍ角以下の小
型化されたものが多用され、この場合、電子部品と凹部
底面との接着面積が狭く接着強度が低下しやすいことか
ら、凹部底面に縞状の突起部を設け、この縞状の突起部
上に跨らせて電子部品を載置することにより電子部品の
下面と凹部底面との間に一定のスペースを確保し、この
スペース内に樹脂を充填することにより樹脂のボリュー
ムを確保し、電子部品の接着強度が低下することを防止
するようにした構造が多用されつつある。In recent years, electronic components that are smaller than a few mm square are often used. In this case, the adhesive area between the electronic component and the bottom surface of the recess is small and the adhesive strength is likely to decrease. A striped protrusion is provided on the electronic component, and an electronic component is placed on the striped protrusion so that a certain space is secured between the lower surface of the electronic component and the bottom surface of the recess. A structure is often used in which the volume of the resin is secured by filling the resin into the resin to prevent the adhesive strength of the electronic component from being lowered.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、この従
来の電子部品収納用パッケージにおいては、縞状の突起
部の上面がほぼ平坦で、電子部品の下面と縞状の突起部
の上面との間にほとんど隙間がないことから、電子部品
と縞状の突起部の上面との間には樹脂がほとんど入り込
まず樹脂の量が不足し、この電子部品と突起部との接す
る部分における接着強度が極めて低いものとなり、その
結果、電子部品の凹部底面に対する接着強度を十分に強
くすることができなくなってしまうという問題があっ
た。However, in this conventional package for storing electronic components, the upper surface of the striped protrusion is substantially flat, and the space between the lower surface of the electronic component and the upper surface of the striped protrusion is large. Since there is almost no gap, the resin hardly enters between the electronic component and the upper surface of the striped protrusion, the amount of resin is insufficient, and the adhesive strength at the portion where the electronic component and the protrusion contact is extremely low. As a result, there has been a problem that the adhesive strength to the bottom surface of the recess of the electronic component cannot be sufficiently increased.
【０００７】また、電子部品収納用パッケージの小型化
に伴い、凹部底面に電子部品を接着固定するとき等に使
用する位置決め用マークを設けるスペースの確保が難し
く、認識の容易な位置決め用マークを形成できなくなっ
てきているという問題があった。Further, with the miniaturization of the electronic component storage package, it is difficult to secure a space for providing a positioning mark used for adhering and fixing an electronic component to the bottom surface of the recess, and a positioning mark which can be easily recognized is formed. There was a problem that it was becoming impossible.
【０００８】本発明は上記従来技術における問題点に鑑
みてなされたものであり、その目的は、電子部品が数ｍ
ｍ角以下の小型のものであったとしても、電子部品を凹
部底面に樹脂を介して強固に接着固定することが可能で
あり、かつ電子部品を凹部底面に接着固定するときの位
置決めが容易、確実な電子部品収納用パッケージを提供
することにある。The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide an electronic component of several meters.
Even if the size is smaller than m-square, the electronic component can be firmly adhered and fixed to the bottom surface of the recess via the resin, and the positioning when the electronic component is adhered and fixed to the bottom surface of the recess is easy, It is to provide a reliable package for storing electronic components.
【０００９】[0009]
【課題を解決するための手段】本発明の電子部品収納用
パッケージは、電子部品を収容するための凹部を有する
絶縁基体と蓋体とから成り、絶縁基体の凹部底部に電子
部品を樹脂を介して接着固定するとともに凹部を前記蓋
体で封止するようになした電子部品収納用パッケージで
あって、前記絶縁基体の凹部底面に縞状の突起部を設け
るとともに該突起部の高さが凹部底面の中心から外周部
に向かって漸次低くなっており、かつ前記縞状の突起部
の一部に切り欠き部または窪み部が形成されていること
を特徴とするものである。An electronic component storing package according to the present invention comprises an insulating base having a recess for accommodating an electronic component and a lid, and the electronic component is provided on the bottom of the recess of the insulating base with a resin interposed therebetween. A package for storing electronic parts, wherein the recess is sealed with the lid, and a striped protrusion is provided on the bottom of the recess of the insulating base, and the height of the protrusion is recessed. It is characterized in that it gradually lowers from the center of the bottom surface toward the outer peripheral portion, and that a cutout portion or a recess portion is formed in a part of the striped projection portion.
【００１０】また本発明の電子部品収納用パッケージ
は、前記縞状突起部の最大高低差が５μｍ乃至１５μｍ
であることを特徴とするものである。Further, in the electronic component storing package of the present invention, the maximum height difference of the striped protrusions is 5 μm to 15 μm.
It is characterized by being.
【００１１】本発明の電子部品収納用パッケージによれ
ば、絶縁基体の凹部底面に縞状の突起部を設けるととも
に該突起部の高さが凹部底面の中心から外周部に向かっ
て漸次低くなっていることから、電子部品の下面と突起
部の上面との間に、電子部品の中心から外周部に向かっ
て漸次広くなるような隙間を形成させることができ、こ
の隙間内に樹脂を良好に入り込ませることができるた
め、電子部品の下面と突起部の上面との間に一定量の樹
脂を介在させて接着強度を確保することができ、その結
果、電子部品を凹部底面に強固に接着固定することが可
能となる。According to the electronic component storing package of the present invention, the striped projection is provided on the bottom surface of the recess of the insulating substrate, and the height of the projection is gradually lowered from the center of the bottom surface of the recess toward the outer peripheral portion. Therefore, it is possible to form a gap between the lower surface of the electronic component and the upper surface of the protrusion that gradually widens from the center of the electronic component toward the outer peripheral portion, and the resin can be satisfactorily inserted into the gap. Since a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion, the adhesive strength can be secured, and as a result, the electronic component can be firmly bonded and fixed to the bottom surface of the recess. It becomes possible.
【００１２】また本発明の電子部品収納用パッケージに
よれば、凹部底面に形成した縞状の突起部の一部に切り
欠き部または窪み部を形成し、この切り欠き部または窪
み部が位置決め用のマークとして作用することから、電
子部品を凹部底面に接着固定するときの位置決めを容
易、確実なものとすることができる。Further, according to the electronic component storing package of the present invention, a notch or a recess is formed in a part of the striped protrusion formed on the bottom surface of the recess, and the notch or the recess is used for positioning. Since it acts as a mark, it is possible to easily and reliably position the electronic component when it is adhesively fixed to the bottom surface of the recess.
【００１３】[0013]
【発明の実施の形態】次に本発明を添付図面に基づき詳
細に説明する。図１および図２は本発明の電子部品収納
用パッケージの一実施例を示し、１は電気絶縁材料から
成る絶縁基体、２は蓋体である。この絶縁基体１と蓋体
２とで半導体素子や表面弾性波素子等の電子部品３を収
容するための容器４が構成される。DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of a package for storing electronic parts of the present invention, in which 1 is an insulating base made of an electrically insulating material and 2 is a lid. The insulating base body 1 and the lid body 2 constitute a container 4 for housing an electronic component 3 such as a semiconductor element or a surface acoustic wave element.
【００１４】前記絶縁基体１は酸化アルミニウム質焼結
体、ムライト質焼結体、窒化アルミニウム質焼結体等の
電気絶縁材料から成り、例えば、酸化アルミニウム質焼
結体から成る場合、酸化アルミニウム、酸化珪素、酸化
マグネシウム、酸化カルシウム等の原料粉末に適当な有
機バインダー、溶剤等を添加混合して泥漿物を作るとと
もに該泥漿物をドクターブレード法やカレンダーロール
法等によりシート状に成形してセラミックグリーンシー
トを得、しかる後、前記セラミックグリーンシートに適
当な打ち抜き加工を施すとともにこれを複数枚積層し、
約１６００℃の高温で焼成することによって製作され
る。The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body. For example, in the case of an aluminum oxide sintered body, aluminum oxide, Ceramics are prepared by adding a suitable organic binder, solvent, etc. to raw material powders of silicon oxide, magnesium oxide, calcium oxide, etc. to form a sludge, and molding the sludge into a sheet by the doctor blade method or calender roll method. Obtain a green sheet, after that, perform appropriate punching processing on the ceramic green sheet and stack a plurality of this,
It is manufactured by firing at a high temperature of about 1600 ° C.
【００１５】前記絶縁基体１はその上面中央部に電子部
品３を収容するための四角形状の凹部１ａが設けてある
とともに該凹部１ａの底面には縞状の突起部６が形成さ
れており、電子部品３がこの縞状の突起部６に跨るよう
にして載置されエポキシ樹脂等の樹脂５を介して凹部１
ａ底面に接着固定される。The insulating base 1 is provided with a rectangular recess 1a for accommodating the electronic component 3 in the center of the upper surface thereof, and a striped projection 6 is formed on the bottom of the recess 1a. The electronic component 3 is placed so as to straddle the stripe-shaped protrusion 6 and the recess 1 is provided via a resin 5 such as an epoxy resin.
It is adhesively fixed to the bottom surface of a.
【００１６】前記電子部品３の凹部１ａ底面への接着固
定は、まず縞状の突起部６が形成されている凹部１ａ底
面に未硬化の熱硬化性エポキシ樹脂等の接着用の樹脂を
塗布し、次に電子部品３を縞状の突起部６上に跨らせて
位置決め載置するとともに電子部品３に適当な荷重を印
加し、接着用の樹脂を電子部品３の下面と凹部１ａ上面
との間に濡れ広がらせ、その後、熱等で接着用の樹脂を
硬化させることにより行なわれる。In order to bond and fix the electronic component 3 to the bottom surface of the recess 1a, first, an adhesive resin such as an uncured thermosetting epoxy resin is applied to the bottom surface of the recess 1a in which the striped protrusion 6 is formed. Next, the electronic component 3 is positioned and placed so as to straddle the striped protrusions 6 and an appropriate load is applied to the electronic component 3, and the adhesive resin is applied to the lower surface of the electronic component 3 and the upper surface of the recess 1a. It is spread by wetting between the two, and then the resin for adhesion is cured by heat or the like.
【００１７】なお前記縞状の突起部６は、電子部品３と
凹部１ａ底面との間に一定のスペースを確保するための
スペーサーとして作用し、このスペース内に樹脂５を充
填させることにより電子部品３の絶縁基体１に対する接
着強度を向上させるようになっている。The striped protrusion 6 acts as a spacer for ensuring a certain space between the electronic component 3 and the bottom surface of the recess 1a, and the resin 5 is filled in this space to fill the electronic component. The adhesive strength of No. 3 to the insulating substrate 1 is improved.
【００１８】本発明の電子部品収納用パッケージにおい
ては、凹部１ａの底面に縞状の突起部６を設けるととも
に、各突起部６の高さを凹部１ａ底面の中心から外周部
に向かって漸次低くしておくことが重要である。In the package for storing electronic parts of the present invention, the striped projections 6 are provided on the bottom surface of the recess 1a, and the height of each projection 6 is gradually lowered from the center of the bottom surface of the recess 1a toward the outer peripheral portion. It is important to keep it.
【００１９】この場合、縞状の突起部６の高さを凹部１
ａ底面の中心から外周部に向かって漸次低くなるように
形成しておくことにより、電子部品３の下面と突起部６
の上面との間に、電子部品３の外縁に向かって漸次広く
なるような隙間を形成させることができ、この隙間に、
電子部品３を凹部１ａ底面に接着するための接着用の樹
脂５を良好に入り込ませ、電子部品３と突起部６との間
に一定量の樹脂５を介在させて接着強度を確保すること
ができ、その結果、電子部品３を凹部１ａ底面に強固に
接着固定することが可能となる。In this case, the height of the striped protrusion 6 is set to the recess 1
a The lower surface of the electronic component 3 and the protruding portion 6 are formed by gradually lowering from the center of the bottom surface toward the outer peripheral portion.
It is possible to form a gap that gradually widens toward the outer edge of the electronic component 3 between the upper surface of the
Adhesive resin 5 for adhering the electronic component 3 to the bottom surface of the recessed portion 1a can be satisfactorily entered, and a certain amount of the resin 5 can be interposed between the electronic component 3 and the protrusion 6 to secure the adhesive strength. As a result, the electronic component 3 can be firmly adhered and fixed to the bottom surface of the recess 1a.
【００２０】前記縞状の突起部６は、例えば、タングス
テン、モリブデン、マンガン等の高融点金属粉末から成
り、該高融点金属粉末に適当な有機溶剤、溶媒を添加混
合して得た金属ペーストを従来周知のスクリーン印刷法
等の厚膜手法を採用し、絶縁基体１の凹部１ａ底面とな
るセラミックグリーンシートに、予め、その高さが凹部
１ａ底面の中心から外周部に向かって漸次低くなるよう
に印刷塗布しておくことによって絶縁基体１の凹部１ａ
底面に被着形成される。なお、突起部６となる金属ペー
ストの高さを、中心から外周に向かって漸次低くなるよ
うにするには、例えば、複数パターンのスクリーン製版
を用い、金属ペーストを中心から外周にかけて複数回印
刷塗布する方法や、縞状の所定パターンに印刷塗布した
金属ペーストの外周部を加圧する方法等の方法を用いる
ことができる。The striped protrusions 6 are made of, for example, a high melting point metal powder such as tungsten, molybdenum, or manganese, and a metal paste obtained by adding and mixing an appropriate organic solvent or solvent to the high melting point metal powder. A well-known thick film method such as a screen printing method is adopted, and the height of the ceramic green sheet serving as the bottom surface of the recess 1a of the insulating substrate 1 is gradually lowered from the center of the bottom surface of the recess 1a to the outer peripheral portion in advance. By printing and coating on the concave portion 1a of the insulating substrate 1
It is deposited on the bottom surface. In addition, in order to gradually lower the height of the metal paste to be the protrusions 6 from the center to the outer periphery, for example, screen printing with a plurality of patterns is used, and the metal paste is applied by printing multiple times from the center to the outer periphery. And a method of pressurizing the outer peripheral portion of the metal paste printed and applied in a striped predetermined pattern can be used.
【００２１】また本発明の電子部品収納用パッケージに
おいては、前記縞状の突起部６の一部に切り欠き部Ａま
たは窪み部Ｂを形成しておくことが重要である。Further, in the electronic component storing package of the present invention, it is important to form the notch A or the recess B in a part of the striped protrusion 6.
【００２２】この切り欠き部Ａまたは窪み部Ｂは、凹部
１ａ底面に電子部品３を接着するときの位置決め用マー
クとして作用し、切り欠き部Ａまたは窪み部Ｂは、隣接
する突起部６表面との間に大きなコントラストを生じる
ため、電子部品３を接着固定するときの位置決めを容
易、確実とすることができる。The notch A or the dent B acts as a positioning mark when the electronic component 3 is adhered to the bottom surface of the recess 1a, and the notch A or the dent B is formed on the surface of the adjacent protrusion 6. Since a large contrast is generated between the two, it is possible to easily and reliably position the electronic component 3 when it is adhesively fixed.
【００２３】前記切り欠き部Ａまたは窪み部Ｂは、例え
ば、絶縁基体１の凹部１ａ底面となるセラミックグリー
ンシートに突起部６となる金属ペーストをスクリーン印
刷法等により所定パターンに印刷塗布した後、この印刷
塗布した金属ペーストの一部を機械的な切削や加圧等の
方法で切り欠いたり窪ませたりする方法によって形成さ
れる。The cutout portion A or the recess portion B is formed, for example, by applying a metal paste serving as the protrusion 6 to a ceramic green sheet serving as the bottom surface of the concave portion 1a of the insulating substrate 1 in a predetermined pattern by screen printing or the like. It is formed by a method in which a part of this printed and applied metal paste is cut or recessed by a method such as mechanical cutting or pressing.
【００２４】なお、前記切り欠き部Ａまたは窪み部Ｂ
は、その長さが０．２ｍｍ未満では、画像認識装置等に
よる認識が難しくなる傾向があり、１ｍｍを超えると、
電子部品３を突起部６上に跨らせて接着するときの安定
性が低下する傾向がある。従って、前記切り欠き部Ａま
たは窪み部Ｂは、その長さを０．２ｍｍ〜１ｍｍの範囲
としておくことが好ましい。The cutout A or the recess B
If the length is less than 0.2 mm, it tends to be difficult for the image recognition device to recognize, and if it exceeds 1 mm,
There is a tendency that the stability when the electronic component 3 is spread over the protrusion 6 and adhered thereto is lowered. Therefore, it is preferable that the cutout portion A or the recess portion B has a length in the range of 0.2 mm to 1 mm.
【００２５】また、前記縞状の突起部６は、最大高低差
が５μｍ未満では電子部品３の下面と突起部６の上面と
の間に十分な隙間を形成することができず電子部品３の
接着強度が低下する傾向にあり、１５μｍを超えると、
電子部品３と突起部６との隙間が大きくなり過ぎ電子部
品３が突起部６上で一方向に斜めに傾いて接着され易く
電子部品３の接着強度が劣化する傾向にあり、また後述
するボンディングワイヤを正確に電子部品３の電極に接
続させることが困難となる。従って、前記縞状の突起部
６は、その最大高低差を５μｍ乃至１５μｍの範囲とし
ておくことが好ましい。If the maximum height difference of the striped projections 6 is less than 5 μm, a sufficient gap cannot be formed between the lower surface of the electronic component 3 and the upper surface of the projections 6, so that the electronic component 3 cannot be formed. The adhesive strength tends to decrease, and if it exceeds 15 μm,
The gap between the electronic component 3 and the protrusion 6 becomes too large, and the electronic component 3 tends to be obliquely attached to the protrusion 6 in one direction, and the adhesive strength of the electronic component 3 tends to deteriorate, and the bonding described later is also performed. It becomes difficult to accurately connect the wire to the electrode of the electronic component 3. Therefore, it is preferable that the maximum height difference of the striped protrusions 6 is in the range of 5 μm to 15 μm.
【００２６】更に前記縞状の突起部６は、その最大高さ
が約２５μｍ〜３５μｍの高さとなるように形成してお
くと凹部１ａ底面と電子部品３との間に十分なスペース
を確保することができるとともに、縞状の突起部６にカ
ケ、剥離等の不具合が生じることを効果的に防止するこ
とができる。従って、前記縞状の突起部６は、その最大
高さが約２５μｍ〜３５μｍの高さとなるように形成し
ておくことが好ましい。Further, if the striped protrusions 6 are formed so that the maximum height thereof is about 25 μm to 35 μm, a sufficient space is secured between the bottom surface of the recess 1a and the electronic component 3. In addition, it is possible to effectively prevent defects such as chipping and peeling of the striped protrusions 6. Therefore, it is preferable that the striped protrusions 6 are formed so that the maximum height thereof is about 25 μm to 35 μm.
【００２７】また更に前記縞状の突起部６は、タングス
テン、モリブデン、マンガン等の高融点金属粉末から成
る場合、その表面にニッケル、金等のめっき層を１〜２
０μｍ程度の厚みに被着させておくと、その酸化腐蝕を
効果的に防止し、電子部品３をより一層容易かつ確実に
接着することができる。従って、前記縞状の突起部６
は、その表面にニッケル、金等のめっき層を１〜２０μ
ｍの厚みに被着させておくことが好ましい。Further, when the striped protrusion 6 is made of a refractory metal powder such as tungsten, molybdenum or manganese, a plating layer of nickel, gold or the like is formed on the surface of the protrusion.
If it is adhered to a thickness of about 0 μm, its oxidation and corrosion can be effectively prevented, and the electronic component 3 can be more easily and surely adhered. Therefore, the striped protrusion 6
Has a plated layer of nickel, gold, etc.
It is preferable that the coating is applied to a thickness of m.
【００２８】更にまた前記縞状の突起部６は、各突起部
６の左右上端の角部を円弧状に面取りした形状としてお
くと電子部品３の下面と突起部６との間に接着用の樹脂
５をより一層良好に入り込ませることができる。従っ
て、前記縞状の突起部６は、各突起部６の左右上端の角
部を円弧状に面取りした形状としておくことが好まし
い。Further, if the striped protrusions 6 are formed by chamfering the corners of the left and right upper ends of each protrusion 6 in an arc shape, they are used for bonding between the lower surface of the electronic component 3 and the protrusions 6. It is possible to allow the resin 5 to enter even more favorably. Therefore, it is preferable that the striped protrusions 6 have a shape in which the corners of the upper and left upper ends of each protrusion 6 are chamfered in an arc shape.
【００２９】前記縞状の突起部６は、またその縦断面形
の幅が突起部６の底部から上面に向かって漸次狭くなる
ようにして形成しておくと、電子部品３と凹部１ａとの
間に形成されるスペースをより一層大きくして充填され
る樹脂５の量をより大きく確保することができるととも
に、樹脂量が小さくなる領域である突起部６と電子部品
３との接触面をより小さくすることができ、電子部品３
を凹部１ａ底面により一層強固に接着固定することがで
きる。従って、前記縞状の突起部６は、その縦断面形の
幅が突起部６の底部から上面に向かって漸次狭くなるよ
うにして形成しておくことが好ましい。If the stripe-shaped protrusion 6 is formed such that the width of the vertical cross-section thereof becomes gradually narrower from the bottom of the protrusion 6 toward the upper surface thereof, the electronic component 3 and the recess 1a are separated from each other. It is possible to secure a larger amount of the resin 5 to be filled by further increasing the space formed between them, and to further improve the contact surface between the protrusion 6 and the electronic component 3 which is a region where the amount of resin decreases. Electronic components that can be made smaller 3
Can be more firmly adhered and fixed to the bottom surface of the recess 1a. Therefore, it is preferable that the striped protrusion 6 is formed such that the width of the vertical cross-section thereof becomes gradually narrower from the bottom to the top of the protrusion 6.
【００３０】また一方、前記絶縁基体１はその凹部１ａ
周辺から容器４の外部にかけてメタライズ配線層７が被
着形成されており、該メタライズ配線層７の凹部１ａ周
辺部は電子部品３の各電極がボンディングワイヤ８を介
し電気的に接続され、また容器４の外部に導出された部
位は錫−鉛半田等の低融点ロウ材を介して外部電気回路
と接続される。On the other hand, the insulating substrate 1 has a recess 1a.
A metallized wiring layer 7 is adhered and formed from the periphery to the outside of the container 4, and each electrode of the electronic component 3 is electrically connected to the periphery of the recess 1a of the metallized wiring layer 7 through a bonding wire 8. 4 is connected to an external electric circuit through a low melting point brazing material such as tin-lead solder.
【００３１】前記メタライズ配線層７はタングステン、
モリブデン、マンガン等の高融点金属粉末から成り、該
高融点金属粉末に適当な有機溶剤、溶媒を添加混合して
得た金属ペーストを従来周知のスクリーン印刷法等の厚
膜手法を採用し、絶縁基体１となるセラミックグリーン
シートに予め印刷塗布しておくことによって絶縁基体１
の凹部１ａ周辺から容器４の外部にかけて被着形成され
る。The metallized wiring layer 7 is made of tungsten,
A metal paste made of high-melting point metal powder such as molybdenum and manganese, which is obtained by adding and mixing an appropriate organic solvent and solvent to the high-melting point metal powder, adopts a thick film technique such as a well-known screen printing method to insulate Insulating substrate 1 is obtained by printing and applying it to the ceramic green sheet that becomes substrate 1 in advance.
It is adhered and formed from around the concave portion 1a to the outside of the container 4.
【００３２】更に前記絶縁基体１上面には蓋体２が封止
部材９を介して接合され、これによって絶縁基体１の凹
部１ａはその内部が蓋体２によって気密に封止される。Further, the lid 2 is joined to the upper surface of the insulating base 1 through the sealing member 9, whereby the inside of the recess 1a of the insulating base 1 is hermetically sealed by the lid 2.
【００３３】前記蓋体２は、鉄−ニッケル−コバルト合
金、酸化アルミニウム質焼結体、ムライト質焼結体、窒
化アルミニウム質焼結体等から成り、例えば酸化アルミ
ニウム質焼結体から成る場合、酸化アルミニウム、酸化
マグネシウム、酸化カルシウム等の原料粉末を従来周知
のプレス成形法を採用することによって成形するととも
にこれを約１５００℃の温度で焼成することによって形
成される。The lid 2 is made of an iron-nickel-cobalt alloy, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body or the like. For example, when it is made of an aluminum oxide sintered body, It is formed by molding a raw material powder of aluminum oxide, magnesium oxide, calcium oxide or the like by adopting a conventionally known press molding method and firing the powder at a temperature of about 1500 ° C.
【００３４】かくしてこの電子部品収納用パッケージに
よれば、絶縁基体１の凹部１ａ底面に電子部品３を樹脂
５を介して接着し、次に前記電子部品３の各電極をメタ
ライズ配線層７にボンディングワイヤ８を介して電気的
に接続させ、最後に絶縁基体１の上面に蓋体２をガラ
ス、樹脂等から成る封止部材９を介して接合させ、絶縁
基体１と蓋体２とから成る容器４内部に電子部品３を気
密に収容することによって最終製品としての電子装置と
なる。Thus, according to this electronic component storing package, the electronic component 3 is adhered to the bottom surface of the recess 1a of the insulating substrate 1 through the resin 5, and then each electrode of the electronic component 3 is bonded to the metallized wiring layer 7. A container formed by the insulating base 1 and the lid 2 is electrically connected via a wire 8 and finally the lid 2 is joined to the upper surface of the insulating base 1 via a sealing member 9 made of glass, resin or the like. An electronic device as a final product is obtained by hermetically accommodating the electronic component 3 inside 4.
【００３５】なお、本発明は上記実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲での種々の
変更・改良を加えることは何ら差し支えない。例えば、
上記実施例においては絶縁基体を酸化アルミニウム質焼
結体等を用いた場合について説明したが、絶縁基体とし
てプラスチック等の樹脂材料製や有機材料と無機材料と
の複合材料製のものを用いてもよい。The present invention is not limited to the above embodiments, and various modifications and improvements can be added without departing from the gist of the present invention. For example,
In the above embodiments, the case where the insulating substrate is an aluminum oxide sintered body or the like has been described, but an insulating substrate made of a resin material such as plastic or a composite material of an organic material and an inorganic material may be used. Good.
【００３６】[0036]
【発明の効果】本発明の電子部品収納用パッケージによ
れば、絶縁基体の凹部底面に縞状の突起部を設けるとと
もに該突起部の高さが凹部底面の中心から外周部に向か
って漸次低くなっていることから、電子部品の下面と突
起部の上面との間に、電子部品の中心から外周部に向か
って漸次広くなるような隙間を形成させることができ、
この隙間内に樹脂を良好に入り込ませることができるた
め、電子部品の下面と突起部の上面との間に一定量の樹
脂を介在させて接着強度を確保することができ、その結
果、電子部品を凹部底面に強固に接着固定することが可
能となる。According to the electronic component storage package of the present invention, a striped projection is provided on the bottom surface of the recess of the insulating substrate, and the height of the projection is gradually lowered from the center of the bottom surface of the recess toward the outer peripheral portion. Therefore, it is possible to form a gap between the lower surface of the electronic component and the upper surface of the protruding portion that gradually widens from the center of the electronic component toward the outer peripheral portion,
Since the resin can be favorably allowed to enter the gap, a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion to secure the adhesive strength, and as a result, the electronic component can be secured. Can be firmly adhered and fixed to the bottom surface of the recess.
【００３７】また本発明の電子部品収納用パッケージに
よれば、凹部底面に形成した縞状の突起部の一部に切り
欠き部または窪み部を形成し、この切り欠き部または窪
み部を位置決め用のマークとして作用することから、電
子部品を凹部底面に接着固定するときの位置決めを容
易、確実なものとすることができる。Further, according to the electronic component storing package of the present invention, a notch or a recess is formed in a part of the striped protrusion formed on the bottom surface of the recess, and the notch or the recess is used for positioning. Since it acts as a mark, it is possible to easily and reliably position the electronic component when it is adhesively fixed to the bottom surface of the recess.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】本発明の一実施例を示す平面図である。FIG. 2 is a plan view showing an embodiment of the present invention.
【図３】従来の電子部品収納用パッケージの一例を示す
平面図である。FIG. 3 is a plan view showing an example of a conventional electronic component storage package.
１・・・・・絶縁基体 １ａ・・・・凹部 ２・・・・・蓋体 ３・・・・・電子部品 ４・・・・・容器 ５・・・・・樹脂 ６・・・・・縞状の突起部 ７・・・・・メタライズ配線層 ８・・・・・ボンディングワイヤ ９・・・・・封止部材 Ａ・・・・・切り欠き部 Ｂ・・・・・窪み部 1 ... Insulating substrate 1a ... Recess 2 ... Lid 3 ... Electronic components 4 ... Container 5 ... Resin 6 ... Striped protrusion 7: Metallized wiring layer 8: Bonding wire 9 ... Sealing member A: Notch B: Dimple
Claims (2)
縁基体と蓋体とから成り、絶縁基体の凹部底部に電子部
品を樹脂を介して接着固定するとともに凹部を前記蓋体
で封止するようになした電子部品収納用パッケージであ
って、 前記絶縁基体の凹部底面に縞状の突起部を設けるととも
に該突起部の高さが凹部底面の中心から外周部に向かっ
て漸次低くなっており、かつ前記縞状の突起部の一部に
切り欠き部または窪み部が形成されていることを特徴と
する電子部品収納用パッケージ。1. An insulating base having a recess for accommodating an electronic component, and a lid. An electronic component is adhesively fixed to the bottom of the recess of the insulating base via a resin, and the recess is sealed by the lid. A package for storing electronic parts configured as described above, wherein a striped projection is provided on the bottom surface of the recess of the insulating base, and the height of the projection is gradually lowered from the center of the bottom surface of the recess toward the outer peripheral portion. A package for storing electronic components, characterized in that a cutout portion or a recess portion is formed in a part of the striped projection portion.
１５μｍであることを特徴とする請求項１に記載の電子
部品収納用パッケージ。2. The package for storing electronic components according to claim 1, wherein the maximum height difference between the striped protrusions is 5 μm to 15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002011155A JP2003218256A (en) | 2002-01-21 | 2002-01-21 | Package for accommodating electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002011155A JP2003218256A (en) | 2002-01-21 | 2002-01-21 | Package for accommodating electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003218256A true JP2003218256A (en) | 2003-07-31 |
Family
ID=27648699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002011155A Pending JP2003218256A (en) | 2002-01-21 | 2002-01-21 | Package for accommodating electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003218256A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009070348A1 (en) * | 2007-11-30 | 2009-06-04 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
| US7629201B2 (en) | 2005-04-01 | 2009-12-08 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package with device wafer and passive component integration |
| US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
-
2002
- 2002-01-21 JP JP2002011155A patent/JP2003218256A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7629201B2 (en) | 2005-04-01 | 2009-12-08 | Skyworks Solutions, Inc. | Method for fabricating a wafer level package with device wafer and passive component integration |
| US7635606B2 (en) | 2006-08-02 | 2009-12-22 | Skyworks Solutions, Inc. | Wafer level package with cavities for active devices |
| WO2009070348A1 (en) * | 2007-11-30 | 2009-06-04 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
| US8324728B2 (en) | 2007-11-30 | 2012-12-04 | Skyworks Solutions, Inc. | Wafer level packaging using flip chip mounting |
| US8809116B2 (en) | 2007-11-30 | 2014-08-19 | Skyworks Solutions, Inc. | Method for wafer level packaging of electronic devices |
| US8900931B2 (en) | 2007-12-26 | 2014-12-02 | Skyworks Solutions, Inc. | In-situ cavity integrated circuit package |
| US9153551B2 (en) | 2007-12-26 | 2015-10-06 | Skyworks Solutions, Inc. | Integrated circuit package including in-situ formed cavity |
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