JP2003243551A - Package for accommodating electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that an electronic component cannot be firmly bonded and fixed to a package due to the miniaturization of the electronic component, and a bonding wire cannot be reliably connected to an electrode. <P>SOLUTION: The package for accommodating an electronic component comprises an insulating substrate 1 having a recess 1a for accommodating the electronic component 3 and a lid body 2. In the package, the electronic component 3 is bonded and fixed onto the bottom surface of the recess 1a of the insulating substrate 1 via a resin 5, and the recess 1a is sealed by the lid body 2. A plurality of stripe-like projections 6 are further formed on the bottom surface of the recess 1a of the insulating substrate 1 and the height of the projection 6 becomes lower gradually from the center of the bottom surface of the recess 1a toward an outer-periphery section. In the plurality of projections 6, the height of a stripe-like projection formed at an outermost section is lower than that of any other projection. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components such as semiconductor devices and surface acoustic wave devices.

[0002]

2. Description of the Related Art Conventionally, electronic component storage packages for storing electronic components such as semiconductor devices and surface acoustic wave devices have been
Made of an electrically insulating material such as an aluminum oxide sintered body,
An insulating substrate having a recess for accommodating an electronic component substantially in the center of its upper surface and a metallized wiring layer made of a refractory metal powder of tungsten, molybdenum, manganese, etc. drawn from the periphery of the recess to the outer surface, and a lid. The electronic component is adhered and fixed to the bottom surface of the concave portion of the insulating substrate through an adhesive resin such as epoxy resin, and each electrode of the electronic component is electrically connected through a bonding wire. The lid is joined to the upper surface of the insulating base by a sealing member such as glass or resin, and the electronic components are hermetically sealed inside, so that an electronic device as a final product is obtained.

In order to bond the electronic component to the bottom surface of the recess, for example, an adhesive resin such as an uncured epoxy resin is first applied to the bottom surface of the recess, and then the electronic component is positioned and placed on the bottom surface of the recess. This is performed by applying an appropriate load to the electronic component, allowing the resin to wet and spread between the lower surface of the electronic component and the bottom surface of the recess, and finally heat-curing the uncured resin.

In recent years, electronic components that are smaller than a few mm square are often used. In this case, the adhesive area between the electronic component and the bottom surface of the recess is small, and the adhesive strength is likely to decrease. A striped protrusion is provided on the electronic component, and an electronic component is placed on the striped protrusion so that a certain space is secured between the lower surface of the electronic component and the bottom surface of the recess. A structure is often used in which the volume of the resin is secured by filling the resin into the resin to prevent the adhesive strength of the electronic component from being lowered.

[0005]

However, in this conventional package for storing electronic components, the upper surface of the striped protrusion is substantially flat, and the space between the lower surface of the electronic component and the upper surface of the striped protrusion is large. Since there is almost no gap, the resin hardly enters between the electronic component and the upper surface of the striped protrusion, the amount of resin is insufficient, and the adhesive strength at the portion where the electronic component and the protrusion contact is extremely low. As a result, there has been a problem that the adhesive strength to the bottom surface of the recess of the electronic component cannot be sufficiently increased.

Further, since the heights of the protrusions are almost the same, when the electronic component is placed and adhered while straddling the upper surface of the protrusion, the electronic component and the protrusion are at the outer edge of the electronic component. A part of the adhesive resin that protrudes as if it is pushed out from the narrow gap between the and There was also a problem that could not be connected.

The present invention has been made in view of the above problems in the prior art, and its object is to provide an electronic component of several meters.
Even if the size is smaller than m-square, electronic parts can be firmly bonded and fixed to the bottom surface of the recess via resin, and bonding wires can be reliably connected to the electrodes of the electronic parts. To provide a package for storing various electronic components.

[0008]

An electronic component storing package according to the present invention comprises an insulating base having a recess for accommodating an electronic component and a lid, and the electronic component is provided on the bottom of the recess of the insulating base with a resin interposed therebetween. A package for storing electronic parts, wherein the recess is sealed with the lid, and a plurality of striped projections are provided on the bottom surface of the recess of the insulating base, and the height of the projections is provided. Is gradually lower from the center of the bottom surface of the concave portion toward the outer peripheral portion, and the height of the outermost one of the striped projections is lower than the height of the other ones. Is.

Further, in the electronic component storing package of the present invention, the maximum height difference of the striped protrusions is 5 μm to 15 μm.
It is characterized by being.

The electronic component storage package of the present invention is characterized in that the height difference between the outermost one of the striped projections and the other is 5 μm to 25 μm. It is a thing.

According to the electronic component storing package of the present invention, the striped projection is provided on the bottom surface of the recess of the insulating substrate, and the height of the projection is gradually lowered from the center of the bottom surface of the recess toward the outer peripheral portion. Therefore, it is possible to form a gap between the lower surface of the electronic component and the upper surface of the protrusion that gradually widens from the center of the electronic component toward the outer peripheral portion, and the resin can be satisfactorily inserted into the gap. Since a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion, the adhesive strength can be secured, and as a result, the electronic component can be firmly bonded and fixed to the bottom surface of the recess. It becomes possible.

Further, according to the electronic component storing package of the present invention, the height of the outermost one of the plurality of striped projections is made lower than the height of the other projections. When the electronic components are placed on top of each other and adhered with the resin for adhesion, an appropriate distance is secured between the electronic components and the protrusions at the outer edge of the electronic components, and the appropriate amount of resin for adhesion is retained. Therefore, it is possible to effectively prevent the adhesive resin from creeping up from the side surface to the upper surface of the electronic component. As a result, the electrodes of the electronic component can be prevented from being covered with the resin, and the bonding wires can be reliably connected to the electrodes.

[0013]

DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings. FIGS. 1 and 3 show an embodiment of a package for storing electronic parts of the present invention, in which 1 is an insulating base made of an electrically insulating material and 2 is a lid. The insulating base body 1 and the lid body 2 constitute a container 4 for housing an electronic component 3 such as a semiconductor element or a surface acoustic wave element.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body. For example, in the case of an aluminum oxide sintered body, aluminum oxide, Ceramics are prepared by adding a suitable organic binder, solvent, etc. to raw material powders of silicon oxide, magnesium oxide, calcium oxide, etc. to form a sludge, and molding the sludge into a sheet by the doctor blade method or calender roll method. Obtain a green sheet, after that, perform appropriate punching processing on the ceramic green sheet and stack a plurality of this,
It is manufactured by firing at a high temperature of about 1600 ° C.

The insulating base 1 is provided with a rectangular recess 1a for accommodating the electronic component 3 in the center of the upper surface thereof, and a striped projection 6 is formed on the bottom of the recess 1a. The electronic component 3 is placed so as to straddle the stripe-shaped protrusion 6 and the recess 1 is provided via a resin 5 such as an epoxy resin.
It is adhesively fixed to the bottom surface of a.

In order to bond and fix the electronic component 3 to the bottom surface of the recess 1a, first, an adhesive resin such as an uncured thermosetting epoxy resin is applied to the bottom surface of the recess 1a in which the striped protrusion 6 is formed. Next, the electronic component 3 is positioned and placed so as to straddle the striped protrusions 6 and an appropriate load is applied to the electronic component 3, and the adhesive resin is applied to the lower surface of the electronic component 3 and the upper surface of the recess 1a. It is spread by wetting between the two, and then the resin for adhesion is cured by heat or the like.

The striped protrusion 6 acts as a spacer for ensuring a certain space between the electronic component 3 and the bottom surface of the recess 1a, and the resin 5 is filled in this space to fill the electronic component. The adhesive strength of No. 3 to the insulating substrate 1 is improved.

In the package for storing electronic parts of the present invention, the striped projections 6 are provided on the bottom surface of the recess 1a, and the height of each projection 6 is gradually lowered from the center of the bottom surface of the recess 1a toward the outer peripheral portion. It is important to keep it.

In this case, the height of the striped protrusion 6 is set to the recess 1
a The lower surface of the electronic component 3 and the protruding portion 6 are formed by gradually lowering from the center of the bottom surface toward the outer peripheral portion.
It is possible to form a gap that gradually widens toward the outer edge of the electronic component 3 between the upper surface of the
Adhesive resin 5 for adhering the electronic component 3 to the bottom surface of the recessed portion 1a can be satisfactorily entered, and a certain amount of the resin 5 can be interposed between the electronic component 3 and the protrusion 6 to secure the adhesive strength. As a result, the electronic component 3 can be firmly adhered and fixed to the bottom surface of the recess 1a.

Further, in the electronic component storing package of the present invention, as shown in FIG. 3, the outermost one 6a of the plurality of striped projections 6 is made lower than the other ones. It is important to keep

If the height of the outermost one 6a of the protrusions 6 is set lower than the height of the other ones, the electronic component 3 is placed on the protrusions 6 and the resin for adhesion is used. When bonded, an appropriate amount of resin for bonding can be retained at the outer edge of the electronic component 3 by securing an appropriate space between the electronic component 3 and the protrusion 6a. It is possible to effectively suppress the creeping up from the side surface to the upper surface. As a result, it is possible to prevent the electrode of the electronic component 3 from being covered with the resin 5, and the connection of the bonding wire, which will be described later, is not hindered by the resin 5 and can be reliably connected.

The striped protrusions 6 are made of refractory metal powder such as tungsten, molybdenum and manganese, and a metal paste obtained by adding and mixing a suitable organic solvent and a solvent to the refractory metal powder. A well-known thick film method such as a screen printing method is adopted, and the height of the ceramic green sheet serving as the bottom surface of the recess 1a of the insulating substrate 1 is gradually lowered from the center of the bottom surface of the recess 1a to the outer peripheral portion in advance. By printing and coating on the concave portion 1a of the insulating substrate 1
It is deposited on the bottom surface. In addition, in order to gradually lower the height of the metal paste to be the protrusions 6 from the center to the outer periphery, for example, screen printing with a plurality of patterns is used, and the metal paste is applied by printing multiple times from the center to the outer periphery. And a method of pressurizing the outer peripheral portion of the metal paste printed and applied in a striped predetermined pattern can be used.

Of the plurality of striped protrusions 6,
In order to make the height of the outermost one 6a lower than the height of the other ones, for example, first, after the metal paste is printed and applied on the ceramic green sheet so that a plurality of striped protrusions 6 are all formed. It is also possible to use a method in which the metal paste is printed and applied again using a plate-making method in which only the protrusions other than the outermost portion are printed.

If the maximum height difference of the striped projection 6 is less than 5 μm, a sufficient gap cannot be formed between the lower surface of the electronic component 3 and the upper surface of the projection 6, and the electronic component is bonded. The strength tends to decrease. When it exceeds 15 μm, the gap between the electronic component 3 and the protrusion 6 becomes too large, and the electronic component 3 is inclined on the protrusion 6 in one direction and is easily adhered. The adhesive strength tends to deteriorate, and it becomes difficult to accurately connect the bonding wire described below to the electrode of the electronic component 3. Therefore, the striped protrusion 6
It is preferable that the maximum height difference is within the range of 5 μm to 15 μm.

If the difference between the height of the outermost part 6a and the height of the other parts of the plurality of striped protrusions 6 is less than 5 μm, the resin for adhesion can be effectively prevented from creeping up. If it exceeds 25 μm, the risk of the electronic component 3 being inclined and bonded tends to increase. Therefore, it is preferable that the difference between the height of the outermost portion 6a of the striped protrusions 6 and the height of the other portions is in the range of 5 μm to 25 μm.

Further, it is preferable that the striped protrusion 6 is formed so that the maximum height thereof is approximately 25 μm to 35 μm, and a sufficient space is provided between the bottom surface of the recess 1 a and the electronic component 3. In addition, it is possible to effectively prevent the occurrence of defects such as chipping and peeling on the striped protrusions 6.

When the striped protrusions 6 are made of a refractory metal powder such as tungsten, molybdenum or manganese,
If a plating layer of nickel, gold or the like is deposited on the surface to a thickness of about 1 to 20 μm, the oxidative corrosion can be effectively prevented and the electronic component 3 can be more easily and surely bonded. . Therefore, it is preferable to deposit a plating layer of nickel, gold or the like on the surface of the striped protrusion 6 to a thickness of 1 to 20 μm.

The striped protrusions 6 are preferably formed by chamfering the corners at the upper left and right ends of each of the protrusions 6 in an arc shape, and are bonded between the lower surface of the electronic component 3 and the protrusions 6. It is possible to allow the resin 5 for use to enter into the resin even more satisfactorily.

If the stripe-shaped protrusion 6 is formed such that the width of the vertical cross-section thereof becomes gradually narrower from the bottom of the protrusion 6 toward the upper surface thereof, the gap between the electronic component 3 and the concave portion 1a is reduced. It is possible to secure a larger amount of resin 5 to be filled by further increasing the space formed in
It is possible to further reduce the contact surface between the electronic component 3 and the protrusion 6 which is a region where the amount of resin is small, and the electronic component 3 can be more firmly adhered and fixed to the bottom surface of the concave portion 1a. Therefore, it is preferable that the striped protrusion 6 is formed such that the width of the vertical cross-section thereof becomes gradually narrower from the bottom to the top of the protrusion 6.

A metallized wiring layer 7 is formed on the insulating substrate 1 from the periphery of the recess 1a to the outside of the container 4, and the electrodes of the electronic component 3 are bonded to the periphery of the recess 1a of the metallized wiring layer 7. The portion electrically connected through the wire 8 and led out to the outside of the container 4 is connected to an external electric circuit through a low melting point brazing material such as tin-lead solder.

The metallized wiring layer 7 is made of tungsten,
A metal paste made of high-melting point metal powder such as molybdenum and manganese, which is obtained by adding and mixing an appropriate organic solvent and solvent to the high-melting point metal powder, adopts a thick film technique such as a well-known screen printing method to insulate Insulating substrate 1 is obtained by printing and applying it to the ceramic green sheet that becomes substrate 1 in advance.
It is adhered and formed from around the concave portion 1a to the outside of the container 4.

Further, the lid 2 is joined to the upper surface of the insulating base 1 through the sealing member 9, whereby the inside of the recess 1a of the insulating base 1 is hermetically sealed by the lid 2.

The lid 2 is made of an iron-nickel-cobalt alloy, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body or the like. For example, when it is made of an aluminum oxide sintered body, It is formed by molding a raw material powder of aluminum oxide, magnesium oxide, calcium oxide or the like by adopting a conventionally known press molding method and firing the powder at a temperature of about 1500 ° C.

Thus, according to this electronic component storing package, the electronic component 3 is adhered to the bottom surface of the recess 1a of the insulating substrate 1 through the resin 5, and then each electrode of the electronic component 3 is bonded to the metallized wiring layer 7. A container formed by the insulating base 1 and the lid 2 is electrically connected via a wire 8 and finally the lid 2 is joined to the upper surface of the insulating base 1 via a sealing member 9 made of glass, resin or the like. An electronic device as a final product is obtained by hermetically accommodating the electronic component 3 inside 4.

The present invention is not limited to the above embodiments, and various modifications and improvements can be added without departing from the gist of the present invention. For example,
In the above embodiments, the case where the insulating substrate is an aluminum oxide sintered body or the like has been described, but an insulating substrate made of a resin material such as plastic or a composite material of an organic material and an inorganic material may be used. Good.

[0036]

According to the electronic component storage package of the present invention, a striped projection is provided on the bottom surface of the recess of the insulating substrate, and the height of the projection is gradually lowered from the center of the bottom surface of the recess toward the outer peripheral portion. Therefore, it is possible to form a gap between the lower surface of the electronic component and the upper surface of the protruding portion that gradually widens from the center of the electronic component toward the outer peripheral portion,
Since the resin can be favorably allowed to enter the gap, a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion to secure the adhesive strength, and as a result, the electronic component can be secured. Can be firmly adhered and fixed to the bottom surface of the recess.

Further, according to the electronic component storing package of the present invention, the height of the outermost one of the plurality of striped projections is made lower than the height of the other projections. When the electronic components are placed on top of each other and adhered with the resin for adhesion, an appropriate distance is secured between the electronic components and the protrusions at the outer edge of the electronic components, and the appropriate amount of resin for adhesion is retained. Therefore, it is possible to effectively prevent the adhesive resin from creeping up from the side surface to the upper surface of the electronic component. As a result, the electrodes of the electronic component can be prevented from being covered with the resin, and the bonding wires can be reliably connected to the electrodes.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is a sectional view taken along line RR ′ of FIG.

[Explanation of symbols]

1 ... Insulating substrate 1a ... Recess 2 ... Lid 3 ... Electronic components 4 ... Container 5 ... Resin 6 ... Striped protrusion 6a .... Outermost one of striped protrusions 7: Metallized wiring layer 8: Bonding wire 9 ... Sealing member

Claims (3)

[Claims] 1. An insulating base having a recess for accommodating an electronic component, and a lid. An electronic component is adhesively fixed to the bottom of the recess of the insulating base via a resin, and the recess is sealed by the lid. A package for storing electronic parts configured as described above, wherein a plurality of striped projections are provided on the bottom surface of the recess of the insulating base, and the height of the projections gradually decreases from the center of the bottom surface of the recess toward the outer peripheral portion. In addition, the height of the outermost one of the striped protrusions is lower than the height of the other ones. 2. The package for storing electronic components according to claim 1, wherein the maximum height difference between the striped protrusions is 5 μm to 15 μm. 3. The height difference between the outermost one of the striped protrusions and the other is 5 μm to 25 μm.
The package for storing electronic components according to claim 1, wherein the package is m.