JP2002110703A - Package for electronic component housing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of electronic components unable to be adhered firmly and fixed in accompanying of miniaturization of the electronic components. SOLUTION: In a package for electronic component housing comprising an insulation base substance 1 having a recess part 1a for housing the electronic components 3 and a cover body 2, adhering and fixing the electronic components 3 via a resin 5 on the bottom face of the recess part 1a of the insulation base substance 1 and sealing the recess part 1a by the cover body 2, a stripe-like projection part 6 is provided on the bottom face of the recess part 1a of the insulation base substance 1, and the height of the projection part 6 is gradually reduced, from the center of the bottom face of the recess part 1a toward the outer peripheral part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for housing electronic components such as semiconductor devices and surface acoustic wave devices.

[0002]

2. Description of the Related Art Conventionally, electronic component storage packages for storing electronic components such as semiconductor elements and surface acoustic wave elements have been developed.
It is made of an electrical insulating material such as an aluminum oxide sintered body,
An insulating base having a concave portion for accommodating an electronic component at a substantially central portion of an upper surface thereof, a metallized wiring layer made of a refractory metal powder of tungsten, molybdenum, manganese or the like led out from the periphery of the concave portion to the outer surface; The electronic component is bonded and fixed to the bottom of the concave portion of the insulating base via a bonding resin such as an epoxy resin, and each electrode of the electronic component is electrically connected via a bonding wire. The lid is joined to the upper surface of the insulating base with a sealing member such as glass or resin, and the electronic components are hermetically sealed inside to provide an electronic device as a final product.

For bonding the electronic component to the bottom surface of the concave portion, for example, first, an uncured epoxy resin or the like is applied to the bottom surface of the concave portion, and then the electronic component is positioned and mounted on the bottom surface of the concave portion. At the same time, an appropriate load is applied to the electronic component, the resin is wet-spread between the lower surface of the electronic component and the bottom surface of the concave portion to fill the resin, and finally, the uncured resin is heated and cured.

In recent years, electronic components which have been reduced in size to several mm square or less are frequently used. In this case, since the bonding area between the electronic component and the bottom surface of the concave portion is small and the adhesive strength tends to decrease, the bottom surface of the concave portion is often used. A stripe-shaped projection is provided on the electronic component, and the electronic component is placed over the stripe-shaped projection to secure a certain space between the lower surface of the electronic component and the bottom surface of the concave portion. There is a growing use of a structure in which the resin is filled with a resin to secure the volume of the resin and prevent the adhesive strength of the electronic component from being reduced.

[0005]

However, in this conventional electronic component housing package, the upper surface of the striped projection is substantially flat, and the gap between the lower surface of the electronic component and the upper surface of the striped projection is provided. Since there is almost no gap, the resin hardly enters between the electronic component and the upper surface of the stripe-shaped protrusion, and the amount of resin is insufficient, and the adhesion strength at the contact portion between the electronic component and the protrusion is extremely low. As a result, there has been a problem that the bonding strength of the electronic component to the bottom surface of the concave portion cannot be sufficiently increased.

The present invention has been made in view of the above-mentioned problems in the prior art, and has as its object to reduce the number of electronic components to several meters.
An object of the present invention is to provide an electronic component housing package that can firmly adhere and fix an electronic component to the bottom surface of a concave portion via a resin even if the electronic component is a small one having a size of m square or less.

[0007]

A package for storing an electronic component according to the present invention comprises an insulating substrate having a concave portion for accommodating the electronic component and a lid, and the electronic component is provided on the bottom surface of the concave portion of the insulating substrate via a resin. A package for electronic component storage, wherein the recess is sealed with the lid, and a stripe-shaped projection is provided on the bottom surface of the recess of the insulating base, and the height of the projection is reduced. It is characterized in that it gradually decreases from the center of the bottom surface to the outer peripheral portion.

Further, in the electronic component housing package of the present invention, the maximum height difference of the stripe-shaped projections is 5 μm to 15 μm.
It is characterized by being.

According to the electronic component housing package of the present invention, the stripe-shaped projection is provided on the bottom surface of the concave portion of the insulating base, and the height of the projected portion gradually decreases from the center of the bottom surface of the concave portion toward the outer peripheral portion. Therefore, a gap can be formed between the lower surface of the electronic component and the upper surface of the protruding portion so as to gradually increase from the center of the electronic component toward the outer peripheral portion, and the resin can enter the gap well. Therefore, a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion to secure the adhesive strength, and as a result, the electronic component is firmly bonded and fixed to the bottom surface of the concave portion. It becomes possible.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 show an embodiment of an electronic component storage package according to the present invention, wherein 1 is an insulating base made of an electrically insulating material, and 2 is a lid. The insulating base 1 and the lid 2 constitute a container 4 for housing an electronic component 3 such as a semiconductor element or a surface acoustic wave element.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and the like. An appropriate organic binder, a solvent, and the like are added to and mixed with raw material powders such as silicon oxide, magnesium oxide, and calcium oxide to form a slurry, and the slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like to form a ceramic. Obtain a green sheet, and then, after performing appropriate punching processing on the ceramic green sheet and laminating a plurality of these,
It is manufactured by firing at a high temperature of about 1600 ° C.

The insulating base 1 is provided with a rectangular recess 1a for accommodating the electronic component 3 in the center of the upper surface thereof, and a stripe-like projection 6 is formed on the bottom of the recess 1a. The electronic component 3 is placed so as to straddle the stripe-shaped protrusion 6, and the recess 1 is interposed via a resin 5 such as an epoxy resin.
a Adhesively fixed to the bottom surface.

The bonding and fixing of the electronic component 3 to the bottom surface of the concave portion 1a is performed by first applying a bonding resin such as an uncured thermosetting epoxy resin to the bottom surface of the concave portion 1a where the stripe-shaped projections 6 are formed. Then, the electronic component 3 is positioned and mounted so as to straddle the stripe-shaped protrusions 6, and an appropriate load is applied to the electronic component 3, and a resin for bonding is applied to the lower surface of the electronic component 3 and the upper surface of the recess 1 a. This is performed by spreading the resin between the layers and then curing the bonding resin with heat or the like.

The striped projections 6 act as spacers for securing a certain space between the electronic component 3 and the bottom of the recess 1a. By filling the space with the resin 5, the electronic component 3 is filled. 3 to improve the adhesive strength to the insulating substrate 1a.

In the electronic component housing package of the present invention, the stripe-shaped projections 6 are provided on the bottom surface of the recess 1a, and the height of each projection 6 is gradually reduced from the center of the bottom surface of the recess 1a toward the outer periphery. It is important to keep it.

In this case, the height of the stripe-shaped protrusion 6 is adjusted to the height of the recess 1.
a The lower surface of the electronic component 3 and the protrusion 6 are formed by gradually lowering from the center of the bottom surface toward the outer peripheral portion.
Between the upper surface of the electronic component 3 and the upper surface of the electronic component 3.
Adhesive resin for adhering the electronic component 3 to the bottom surface of the recess 1a can be satisfactorily penetrated, and a certain amount of the resin 5 can be interposed between the electronic component 3 and the protrusion 6 to secure the adhesive strength. As a result, the electronic component 3 can be firmly bonded and fixed to the bottom surface of the concave portion 1a.

The striped projections 6 are made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like. A metal paste obtained by adding a suitable organic solvent and a solvent to the high melting point metal powder is mixed. A conventionally well-known thick film method such as a screen printing method is adopted, and the height of the ceramic green sheet serving as the bottom surface of the concave portion 1a of the insulating substrate 1 is gradually reduced in advance from the center of the bottom surface of the concave portion 1a toward the outer peripheral portion. The concave portion 1a of the insulating substrate 1
It is formed on the bottom surface. In order to make the height of the metal paste that becomes the protrusion gradually lower from the center to the outer periphery, for example, using a plurality of patterns of screen printing, the metal paste is printed and applied a plurality of times from the center to the outer periphery. A method such as a method or a method of pressing an outer peripheral portion of a metal paste printed and applied in a predetermined stripe pattern can be used.

If the maximum height difference of the stripe-shaped projections 6 is less than 5 μm, a sufficient gap cannot be formed between the lower surface of the electronic component 3 and the upper surface of the projection 6. When the strength exceeds 15 μm, the gap between the electronic component 3 and the projection 6 becomes too large, and the electronic component 3 is inclined obliquely in one direction on the projection 6 and is easily adhered. The adhesive strength tends to deteriorate, and it becomes difficult to accurately connect a bonding wire described later to the electrode of the electronic component 3. Therefore, the stripe-shaped protrusion 6
It is preferable that the maximum height difference is set in a range of 5 μm to 15 μm.

Further, it is preferable that the stripe-shaped projections 6 are formed so that the maximum height thereof is about 25 μm to 35 μm, and a sufficient space is provided between the bottom surface of the recess 1 a and the electronic component 3. Can be secured, and the occurrence of defects such as chipping and peeling in the striped projections 6 can be effectively prevented.

When the striped projections 6 are made of a high melting point metal powder such as tungsten, molybdenum, and manganese,
If a plating layer of nickel, gold, or the like is applied to the surface to a thickness of about 1 to 20 μm, the oxidation corrosion can be effectively prevented, and the electronic component can be more easily and reliably bonded. Accordingly, it is preferable that a plating layer of nickel, gold, or the like is applied to the surface of the stripe-shaped protrusion 6 to a thickness of 1 to 20 μm.

It is preferable that the stripe-shaped projections 6 are further formed in such a manner that corners at upper right and left ends of each projection are chamfered in an arc shape, and an adhesive between the lower surface of the electronic component 3 and the projection 6 is formed. Can be more favorably penetrated.

If the stripe-shaped projections 6 are formed so that the width of the vertical cross section gradually narrows from the bottom to the upper surface of the projections 6, the gap between the electronic component 3 and the recess 1a is formed. And the amount of the resin 5 to be filled is further increased by increasing the space formed in
The contact area between the protrusion 6 and the electronic component 3, which is a region where the amount of resin is reduced, can be made smaller, and the electronic component 3 can be more firmly bonded and fixed to the bottom surface of the recess 1a. Therefore, it is preferable that the stripe-shaped projections 6 are formed such that the width of the vertical cross section gradually becomes narrower from the bottom to the upper surface of the projections 6.

The metallized wiring layer 7 is formed on the insulating substrate 1 from the periphery of the concave portion 1a to the outside of the container 4, and each electrode of the electronic component 3 is bonded to the peripheral portion of the metallized wiring layer 7 at the concave portion 1a. The part which is electrically connected through the wire 8 and led out of the container 4 is connected to an external electric circuit through a low melting point brazing material such as tin-lead solder.

The metallized wiring layer 7 is made of tungsten,
A metal paste obtained by adding a suitable organic solvent and a solvent to the high melting point metal powder such as molybdenum, manganese, etc., and adopting a conventionally known thick film method such as a screen printing method. The insulating substrate 1 is printed and coated on a ceramic green sheet serving as the substrate 1 in advance.
From the periphery of the concave portion 1 a to the outside of the container 4.

Further, a lid 2 is joined to the upper surface of the insulating base 1 via a sealing member 9, whereby the inside of the recess 1 a of the insulating base 1 is hermetically sealed by the lid 2.

The lid 2 is made of an iron-nickel-cobalt alloy, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or the like. It is formed by molding a raw material powder such as aluminum oxide, magnesium oxide, calcium oxide or the like by using a conventionally known press molding method, and firing it at a temperature of about 1500 ° C.

Thus, according to this electronic component storage package, the electronic component 3 is bonded to the bottom surface of the concave portion 1a of the insulating base 1 via the resin 5, and then each electrode of the electronic component 3 is bonded to the metallized wiring layer 7. A container made of the insulating base 1 and the lid 2 is electrically connected via wires 8 and finally the lid 2 is joined to the upper surface of the insulating base 1 via a sealing member 9 made of glass, resin or the like. An electronic device as a final product is obtained by hermetically housing the electronic component 3 inside the electronic device 4.

The present invention is not limited to the above embodiment, and various changes and improvements may be made without departing from the spirit of the present invention. For example,
In the above embodiment, the case where the insulating substrate is made of aluminum oxide sintered body or the like is described. However, the insulating substrate may be made of a resin material such as plastic or a composite material of an organic material and an inorganic material. Good.

[0029]

According to the electronic component housing package of the present invention, the stripe-shaped projection is provided on the bottom surface of the concave portion of the insulating base, and the height of the projected portion gradually decreases from the center of the bottom surface of the concave portion toward the outer peripheral portion. Therefore, a gap can be formed between the lower surface of the electronic component and the upper surface of the protruding portion so as to gradually increase from the center of the electronic component toward the outer peripheral portion,
Since the resin can be satisfactorily penetrated into the gap, a certain amount of resin can be interposed between the lower surface of the electronic component and the upper surface of the protrusion to secure the adhesive strength. Can be firmly bonded and fixed to the bottom surface of the concave portion.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a plan view showing one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Depression 2 ... Lid 3 ... Electronic components 4 ... Container 5 ... Resin 6 ... Stripe-shaped protrusion 7 ... ... Metalized wiring layer 8 ... Bonding wire 9 ... Sealing member

Claims (2)

[Claims] An electronic device comprising: an insulating base having a concave portion for accommodating an electronic component; and a lid, wherein the electronic component is bonded and fixed to a bottom surface of the concave portion of the insulating base via a resin, and the concave portion is sealed with the lid. An electronic component housing package as described above, wherein a stripe-shaped protrusion is provided on the bottom surface of the recess of the insulating base, and the height of the protrusion gradually decreases from the center of the bottom surface of the recess toward the outer periphery. A package for storing electronic components, characterized in that: 2. The electronic component storage package according to claim 1, wherein the maximum height difference of the stripe-shaped projections is 5 μm to 15 μm.