JP2006278756A - Package for piezoelectric vibrator storage and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for piezoelectric vibrator storage that can connect an electrode of a piezoelectric vibrator to a conductor bump electrically and mechanically excellently with good position precision, even when the package to the piezoelectric vibrator storage is made small-sized, and to provide a piezoelectric device with high reliability which uses the package for piezoelectric vibrator storage. <P>SOLUTION: The package for piezoelectric vibrator storage is equipped with a base body 101 having a recess 102 where a piezoelectric vibrator 103 is stored on its top surface, a conductor layer 105 formed on the bottom surface of the recess 102, the conductor bump 106 which is formed on the conductor layer 105 and to which the piezoelectric vibrator 103 is joined through a conductive adhesive 109, and a gold plating layer 107 covering surfaces of the conductor layers 105 and conductor bump 106. The gold plating layer 107 has its surface made rougher where the gold plating layer 107 is covered with the conductor layer 105 than where the gold plating layer 107 is covered with the conductor bump 106. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibrator housing package and a piezoelectric device for housing a piezoelectric vibrator such as a crystal vibrator or a ceramic vibrator.

  Conventionally, a piezoelectric vibrator housing package for housing a piezoelectric vibrator such as a quartz crystal vibrator is an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a ceramic such as glass ceramic. A base made of a material and having a recess for housing the piezoelectric vibrator at the center of the upper surface, a frame-shaped sealing metallization layer formed on the upper surface of the base so as to surround the recess, and a bottom surface of the recess The conductor layer formed and the conductor bump formed on the conductor layer are provided. Normally, external connection terminals are formed on the outer surface such as the outer surface and the lower surface of the base, and the wiring conductor is led out from the conductor bumps to the external connection terminals. Usually, a gold plating layer is deposited on the surface of the conductor layer, the conductor bump, and the wiring conductor to prevent oxidation corrosion, reduce contact resistance, and the like.

  The piezoelectric vibrator is housed in the recess of the piezoelectric vibrator housing package, and the electrodes of the piezoelectric vibrator are electrically and mechanically connected to the conductor layer and the conductor bump via a conductive adhesive, etc. The lid is attached to the sealing metallization layer around the concave portion on the upper surface of the base member via a brazing material or the like to close the concave portion, whereby the piezoelectric vibrator is hermetically sealed in the concave portion to form a piezoelectric device. . Then, the piezoelectric vibrator is connected to the external electric circuit by connecting the external connection terminal to the external electric circuit. For example, when the piezoelectric vibrator is a quartz crystal vibrator, a time and frequency reference signal is output from the piezoelectric device to an external electric circuit.

  The conductor bumps are formed on the upper surface of the conductor layer by providing a space between the piezoelectric vibrator and the recess so that a sufficient pool of conductive adhesive is formed, and the connection reliability of the piezoelectric vibrator. This is to ensure Another object of the present invention is to secure a space between the piezoelectric vibrator and the bottom surface of the concave portion of the base body to generate vibration of the piezoelectric vibrator more reliably.

  An example of such a conventional piezoelectric vibrator housing package is shown in FIG. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view at B-B ′.

  As shown in FIGS. 3A and 3B, such a piezoelectric vibrator housing package includes a base body 201 having a concave portion 202 for housing the piezoelectric vibrator 203 on the upper main surface, and a concave portion 202. The conductive layer 205 formed on the bottom surface of the conductive layer 205 and the conductive bump 206 formed on the conductive layer 205 are attached to the upper surface of the conductive bump 206. .

  The piezoelectric vibrator 203 is accommodated in the concave portion 202 of the base 201, and an electrode (not shown) formed at the end of the piezoelectric vibrator 203 is connected to the conductive layer 205 and the conductive bump 206 with the conductive adhesive 209. By attaching a lid 210 made of metal, ceramics or the like via a brazing material such as a low melting point metal around the recess 202 on the upper surface of the base body 201. A piezoelectric device in which a piezoelectric vibrator 203 is hermetically sealed inside a container composed of a base 201 and a lid 210 is obtained.

  In this case, the positioning of the electrode of the piezoelectric vibrator 203 and the conductor bump 206 is performed by recognizing the outer peripheral edge of the conductor layer 205 with an image recognition device and forming it at a predetermined position with reference to the outer peripheral edge of the conductor layer. The position of the conductor bump 206 that will be present is calculated, and the piezoelectric vibrator 203 is moved so that the central portion of the electrode of the piezoelectric vibrator 203 is positioned on the conductor bump 206.

  Note that the conductor layer 205 and the conductor bump 206 are normally formed on the bottom surface of the recess 202 with the conductor layer 205 having a size and position corresponding to the dimensions of the piezoelectric vibrator 203 and the like.

  In recent years, in accordance with market demands, such piezoelectric devices have been downsized in the piezoelectric vibrator housing package, and in order to cope with this, the concave portion 202 for housing the piezoelectric vibrator 203 is made smaller. When the piezoelectric vibrator housing package is downsized in this way, the size of the conductor layer 205 and the conductor bump 206 for connecting the piezoelectric vibrator 203 is reduced accordingly.

Further, in a small piezoelectric vibrator housing package in which the length of one side is 3 mm or less, the frame on which the outer peripheral portion of the piezoelectric vibrator 203 and the sealing metallized layer 204 of the base body 201 are formed in a top view. The distance from the inner peripheral part of the part has become very narrow.
Japanese Utility Model Publication No. 1993-46115 JP 2003-243554 A

  However, with the recent miniaturization of the piezoelectric device, the conductor layer 205 and the conductor bump 206 are formed to be small, so that the recognition accuracy of the position of the conductor bump 206 by the image recognition device or the like deteriorates. Had a point.

  That is, as the conductor layer 205 becomes smaller, it becomes difficult to recognize the position of the outer peripheral edge by the image recognition device, and accordingly, it becomes difficult to calculate the position of the conductor bump easily and accurately.

  As a result, it is extremely difficult to specify the position of the conductor bump 206, and the electrode of the piezoelectric vibrator 203 is accurately positioned on the conductor bump 206 when the piezoelectric vibrator 203 is mounted inside the piezoelectric vibrator housing package. When the piezoelectric vibrator 203 is poorly connected, or when the piezoelectric vibrator 203 is displaced and mounted, the conductive adhesive 209 flows out between adjacent conductor layers and is electrically short-circuited. This causes a problem that a mounting failure such as the above occurs.

  In addition, since the gold plating layer 207 is deposited on the surface of the conductor layer 205 and the conductor bump 206, the surface has few irregularities and is inactive, and the mechanical connection strength of the conductive adhesive is low. There was a problem that it was easy to become. In particular, when the area of the connection portion becomes narrow, it has become extremely difficult to mechanically and firmly connect the conductive layer 205 and the conductive bump 206 to the conductive adhesive 209.

  The present invention has been devised in view of such a problem, and the object thereof is to provide an accurate electrical position of the electrodes of the piezoelectric vibrator to the conductor bump even when the piezoelectric vibrator housing package is downsized. It is an object of the present invention to provide a piezoelectric vibrator housing package that can be mechanically connected and a highly reliable piezoelectric device using the piezoelectric vibrator housing package.

  The package for housing a piezoelectric vibrator of the present invention includes a base having a recess in which a piezoelectric vibrator is accommodated on the upper surface, a conductor layer formed on the bottom surface of the recess, and a conductive adhesive formed on the conductor layer. A conductor bump to which the piezoelectric vibrator is joined via a conductor, and a gold plating layer deposited on the surface of the conductor layer and the conductor bump. The gold plating layer is deposited on the conductor bump. The surface of the portion deposited on the conductor layer is rougher than the surface of the portion that is formed.

  In the piezoelectric vibrator housing package of the present invention, preferably, the conductor layer is a metallized layer formed by firing conductor powder, and an inorganic powder coarser than the conductor powder is added. To do.

  In the piezoelectric vibrator housing package of the present invention, preferably, the base is made of a ceramic material, and the inorganic powder added to the conductor layer is the ceramic material.

A piezoelectric device according to the present invention includes a piezoelectric vibrator housing package described in any one of the above, a piezoelectric vibrator housed in the concave portion and bonded to the conductor bump via a conductive adhesive, And a lid attached to the upper surface of the base body.

  According to the package for housing a piezoelectric vibrator of the present invention, a base having a recess that accommodates the piezoelectric vibrator on the top surface, a conductor layer formed on the bottom surface of the recess, and a conductive adhesive formed on the conductor layer A conductor bump to which the piezoelectric vibrator is bonded via the conductor layer, and a gold plating layer deposited on the surface of the conductor layer and the conductor bump. Since the surface of the portion deposited on the conductor layer is rougher than the surface, the reflectance of the gold plating layer deposited on the conductor layer and the gold plating layer formed on the conductor bump is reduced. The difference in luminance due to the difference becomes remarkably large, and the conductor bump can be identified as the conductor layer and directly recognized by an image recognition device or the like. Therefore, it is possible to improve the positional accuracy of the connection with respect to the conductor bump of the piezoelectric vibrator.

  In addition, since the surface of the gold plating layer applied to the conductor layer is rougher than the portion of the gold plating layer applied to the conductor bump, the inner surface of the connection portion has fine irregularities. It becomes easy to obtain an anchoring effect and the like due to the conductive adhesive entering into. Therefore, the piezoelectric vibrator can be mechanically firmly connected through the conductive adhesive.

  Therefore, the electrode of the piezoelectric vibrator can be firmly connected to the conductor bump with high positional accuracy and electrically and mechanically.

  According to the package for housing a piezoelectric vibrator of the present invention, preferably, the conductor layer is a metallized layer formed by firing conductor powder, and an inorganic powder coarser than the conductor powder is added. The conductor layer can be formed by a conventional screen printing method according to the size and thickness of the conductor layer, and the surface of the conductor layer can be made rougher than the surface of the conductor bump by the coarse inorganic powder. The gold plating layer can be formed so that the surface of the connection pad is rougher than the gold plating layer deposited on the surface.

  According to the package for accommodating a piezoelectric vibrator of the present invention, preferably, the base is made of a ceramic material, and the inorganic powder added to the conductor layer is the ceramic material. The substrate and the conductor layer can be co-fired at temperature, and the strength of the bond of the conductor layer to the substrate (by bonding between the ceramic material of the substrate and the ceramic material added to the conductor layer) ( The so-called metallization strength can be strengthened.

  In addition, since the inorganic powder added to the conductor layer and the ceramic material constituting the substrate are made of the same material, the shrinkage behavior during firing due to the reaction between the component material of the substrate and the inorganic powder in the conductor layer Change, and discoloration, warpage, and the like due to a reaction during simultaneous firing of the inorganic powder and the substrate can be prevented.

  The piezoelectric device of the present invention includes a piezoelectric vibrator housing package described in any one of the above, a piezoelectric vibrator housed in a recess and bonded to a conductor bump via a conductive adhesive, Since it has a lid attached to the upper surface of the substrate, the electrical and mechanical connection reliability between the piezoelectric vibrator housing package and the piezoelectric vibrator housed therein can be ensured even if it is downsized. A high piezoelectric device capable of accurately operating a piezoelectric vibrator over a long period of time can be provided.

  Next, a piezoelectric vibrator housing package and a piezoelectric device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1A is a plan view showing an example of an embodiment of a package for accommodating a piezoelectric vibrator of the present invention, FIG. 1B is a cross-sectional view taken along the line AA ′, and FIG. It is a principal part enlarged view in the connection part of FIG. In the figure, 101 is a substrate, 102 is a recess, 103 is a piezoelectric vibrator, 104 is a metallization layer for sealing, 105 is a conductor layer, and 106 is a conductor bump.

  The main body 101, the recess 102, the conductor layer 105, and the conductor bump 106 constitute the piezoelectric vibrator housing package of the present invention.

  The substrate 101 is formed by laminating an insulating layer made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, and has a side length of about 2 to 20 mm, for example. And a square shape with a thickness of about 0.4 to 2 mm. A quadrangular recess 102 for mounting the piezoelectric vibrator 103 is provided at the center of the upper surface. In the example of FIG. 1, the bottom surface of the recess 102 is the mounting portion for the piezoelectric vibrator 103.

  If the base 101 is made of, for example, an aluminum oxide sintered body, a plurality of green sheets obtained by forming a raw material powder such as aluminum oxide into a sheet shape are prepared, and some of the green sheets are prepared. An opening for forming the recess 102 by punching is provided, and these green sheets are sequentially laminated and fired.

  Further, the piezoelectric vibrator 103 is, for example, a crystal vibrator or a ceramic vibrator constituting a piezoelectric oscillator. In this example, the piezoelectric vibrator 103 (quartz crystal vibrator) having an electrode at a rectangular end is formed into the concave portion 102. The example accommodated in is shown. A conductor layer 105 is formed on the bottom surface of the recess 102. Conductive bumps 106 are formed on the conductive layer 105.

  The conductor layer 105 and the conductor bump are formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum. If the conductor layer 105 is made of, for example, tungsten, a metal paste formed by adding an organic solvent, a binder, or the like to tungsten powder is printed in a predetermined pattern on the bottom surface of the concave portion 102 of the green sheet serving as the insulating substrate 101. Is formed. In addition, the conductor bump 106 formed on the upper surface of the conductor layer 105 of the recess 102 is formed by applying a tungsten metal paste to be the conductor bump 106 onto the upper surface of the conductor layer 105 formed in this manner in a bump shape ( It is formed by raising and printing in a convex shape.

  In addition, the conductive adhesive 109 is formed by adding and mixing particles such as silver, gold, copper, aluminum, and nickel as a conductive filler to a resin material such as an epoxy resin. For example, an uncured conductive adhesive obtained by adding silver particles to an uncured epoxy resin is interposed between the electrode of the piezoelectric vibrator 103 and the conductor layer 105 and the conductor bump 106 so that the epoxy resin is heated. By curing with ultraviolet rays or the like, the electrode of the piezoelectric vibrator 103 is bonded to the conductor layer 105 and the conductor bump 106.

  A gold plating layer 107 is deposited on the surface of the conductor layer 105 and the conductor bump 106 so that the connection electric resistance of the conductive adhesive 109 to the conductor layer 105 and the conductor bump 106 is lowered, and oxidation corrosion is caused. It is prevented.

  The gold plating layer 107 is formed by, for example, immersing the conductor layer 105 and the conductor bumps in an electrolytic plating bath of cyan type (gold cyanide as a supply source of gold and adding an electric salt, a pH adjuster, etc.) It is formed by an electroplating method in which a plating layer is deposited at a current density and time.

  The gold plating layer 107 is formed so that the surface of the portion attached to the conductor layer 105 is rougher than the surface of the portion attached to the conductor bump 106.

  By adopting such a structure, the difference in luminance due to the difference in reflectance between the gold plating layer 107 deposited on the conductor layer 105 and the gold plating layer 107 formed on the conductor bump 106 is significantly increased. The conductor bump 106 can be discriminated from the conductor layer 105 and directly recognized by an image recognition device or the like.

  Accordingly, even when the outer periphery of the conductor bump 106 is formed so as to be located inside the outer periphery of the conductor layer 105 over the entire periphery when the base 101 is viewed in plan view, the electrodes of the piezoelectric vibrator 103 are connected. The conductor bump 106 (high portion) can be identified accurately and easily. As a result, the positioning of the electrode with respect to the conductor bump 106 of the piezoelectric vibrator 103 becomes accurate and easy.

  In addition, since the gold plating layer 107 in a portion attached to the conductor layer 105 is formed to have a rougher surface than the gold plating layer 107 in a portion attached to the conductor bump 106, the outer periphery of the connection portion is formed. It becomes easy to obtain an anchor effect or the like due to the conductive adhesive 109 entering the fine irregularities. That is, the piezoelectric vibrator 103 and the conductor layer 106 can be firmly bonded via the conductive adhesive 109. Therefore, the electrical and mechanical connection of the piezoelectric vibrator 103 to the piezoelectric vibrator housing package can be improved.

  For example, by confirming the position of the outer periphery of the conductor bump 106 formed on the conductor layer 105 with the electrode of the piezoelectric vibrator 103 by an image recognition device or the like, the upper surface portion of the conductor bump 106 that is the highest portion of the connection portion The conductive adhesive 109 is supplied from a dispenser (not shown) to this portion, and the piezoelectric vibrator 103 is mounted on this portion so that the electrode of the piezoelectric vibrator 103 is connected by a mounter. The electrode of the piezoelectric vibrator 103 is bonded to the electrode, the conductor bump 106, and the conductor layer 105 through the conductive adhesive 109.

  At this time, the piezoelectric vibrator 103 mounted by the mounter presses the supplied conductive adhesive 109 so that the conductor has a surface rougher than the surface of the gold plating layer 107 attached to the conductor bump 106. The layer 105 also spreads and hardens on the gold plating layer 107 side.

  In addition, since the surface of the gold plating layer 107 applied to the conductor bump 106 is formed to be rough, the flow of the conductive adhesive 109 can be suppressed to some extent, and the connection with the piezoelectric vibrator 103 can be suppressed. Electrical short-circuiting (short-circuiting) between adjacent conductor layers 105 can also be prevented.

  The surface roughness (arithmetic surface roughness Ra) of the gold plating layer of the conductor bump 106 made only of a metal material conductor such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, or the like was, for example, a cyan bath. When formed by electrolytic plating, the thickness is about 1 to 3 μm. Thereby, the adhesion strength between the gold plating layer 107 and the conductor bump 106 can be maintained, and problems such as swelling and peeling of the gold plating layer are prevented.

  On the other hand, the conductor layer 105 to which the inorganic powder 111 that is coarser than the conductor powder included in the metal material conductor is added has a surface roughness that is greater than that of the conductor bump 106, and the conductor layer 105 after the gold plating layer 107 is deposited. The surface roughness (arithmetic surface roughness Ra) is about 3 to 10 μm, and the surface of the gold plating layer 107 clearly attached to the conductor layer 105 is more surface than the gold plating layer 107 attached to the conductor bump 106. Is formed coarsely. As a result, the surface of the gold plating layer 107 of the conductor layer 105 is formed to be rough, so that the light reflection direction is diffused to become a low reflectance region, and a difference in luminance between the conductor layer 105 and the conductor bump 106 occurs. Thus, the recognizability by the image recognition apparatus of the automatic mounting apparatus when mounting the piezoelectric vibrator 103 can be improved.

  In order to roughen the surface of the portion of the gold plating layer 107 that is attached to the conductor layer 105 and the surface of the portion that is attached to the conductor bump 106, for example, the conductor layer 105 that is the base of the gold plating layer 107 is used. The surface roughness of the conductive layer 105 is made larger than the surface roughness of the conductor bump 106, or a rough gold plating layer is deposited on the surface of the conductive layer 105, and then the conductive layer 105 is masked with a resin or the like. Further, a method such as depositing a smooth gold plating layer on the surface of the conductor bump 106 can be used. As the surface roughness of the gold plating layer 107, for example, a method such as increasing the current density can be used when plating is performed by an electrolytic plating method.

  The gold plating layer 107 may be attached to the surface of the conductor layer 105 or the conductor bump 106 via a base plating layer (not shown) such as a nickel plating layer or a copper plating layer. For example, when a nickel plating layer (not shown) having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the conductor layer 105 and the conductor bump 106, It is more effective for preventing oxidative corrosion of the conductor layer 105 and the conductor bump 106, reducing the contact electric resistance to the conductive adhesive 109, and improving the strength of the adhesion of the gold plating layer 107 to the conductor layer 105 and the conductor bump 106. is there.

  In the piezoelectric vibrator housing package of the present invention, the conductor layer 105 is a metallized layer formed by firing conductor powder, and it is preferable that an inorganic powder 111 coarser than the conductor powder is added.

  In this case, the conductor layer 105 can be formed by a conventional screen printing method according to the size and thickness of the conductor layer 105, and the surface of the conductor layer 105 can be made rougher than the surface of the conductor bump 106 by the coarse inorganic powder 111. Therefore, the gold plating layer 107 can be easily formed so that the surface of the connection pad becomes rougher than the gold plating layer 107 deposited on the surface of the conductor bump 106.

  Accordingly, it becomes easier to obtain an anchor effect or the like due to the conductive adhesive 109 entering the fine irregularities on the outer periphery of the conductor layer 105 of the connecting portion, so that the gap between the piezoelectric vibrator 103 and the conductor layer 105 can be easily obtained. It can be firmly bonded through the conductive adhesive 109. Therefore, the electrical and mechanical connection of the piezoelectric vibrator 103 to the piezoelectric vibrator housing package can be further effectively improved.

  Here, as described above, the conductor powder forming the conductor layer 105 is a metal material (powder) such as tungsten, molybdenum, copper, or silver. In order to manufacture a conductive paste for forming the conductor layer 105. In addition, a binder and an organic solvent are added to these metal powders, a metal paste is produced using a well-known dispersing means such as three-roll mixing or a ball mill, and the inorganic powder is coarser than the dispersed conductor powder. It can be manufactured by further adding the powder 111 to this metal paste and subjecting it to a dispersion treatment.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the base 101 is made of a ceramic material, and the inorganic powder 111 added to the conductor layer 105 is made of the ceramic material.

  With this configuration, the base 101 and the conductor layer 105 can be simultaneously fired at the firing temperature of the conventional ceramic material, and these ceramic materials (added to the ceramic material and the conductor layer 105 of the base 101) The strength of bonding of the conductor layer 101 to the base 101 (so-called metallization strength) can be strengthened by bonding after firing with the ceramic material.

  Further, since the inorganic powder 111 added to the conductor layer 105 and the ceramic material constituting the base 101 are made of the same material, the reaction between the constituent material of the base 101 and the inorganic powder 111 in the conductor layer 105. It is possible to prevent the change in shrinkage behavior at the time of firing, and to prevent discoloration, warpage, and the like due to the reaction during the simultaneous firing of the inorganic powder 111 and the substrate 101.

  Here, if the ceramic material to be the base 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic, the same as the base 101 is used. A metallized paste for the conductor layer 105 can be manufactured by adding an inorganic powder 111 to be a ceramic material to the metallized paste to be the conductor layer 105. At this time, it is desirable to use a powder manufactured by a pulverization process different from the ceramic material used as the base 101 so that the inorganic powder 111 is coarser than the conductor powder in the metallized paste.

  Usually, the ceramic material used as the substrate 101 is pulverized by a pulverizing means such as a ball mill or a jet mill so as to obtain a particle size so that the sinterability at the time of firing is good. Since the inorganic powder 111 needs to have a larger particle size than the ceramic material used as the substrate 101, it is separately manufactured as a relatively coarse pulverized product by a short pulverizing means. The particle size of the conductor powder for metallized paste such as tungsten, molybdenum, copper, and silver is usually about 0.2 to 2 μm, whereas the particle size of the inorganic powder 111 is about 3 to 10 μm. By adding it to the metallized paste, the surface of the gold plating layer 107 to be deposited on the surface of the conductor layer 105 that is the connection portion can be structured to be in fine irregularities on the outer periphery of the conductor layer 105. This makes it easier to obtain an anchor effect or the like due to the conductive adhesive 109 entering.

  The piezoelectric device of the present invention includes a piezoelectric vibrator housing package described in any of the above, and a piezoelectric vibrator 103 housed in the recess 102 and joined to the conductor bump 106 via the conductive adhesive 109. And the lid 110 attached to the upper surface of the base 101, the electrical and mechanical characteristics of the piezoelectric vibrator housing package and the piezoelectric vibrator 103 housed therein even if the package is downsized. It is possible to provide a piezoelectric device that can accurately operate the piezoelectric vibrator 103 over a long period of time with high connection reliability.

  The piezoelectric vibrator 103 is housed in the recess 102 of the piezoelectric vibrator housing package, and the electrodes of the piezoelectric vibrator 103 are connected to the upper surface of the conductor bump 106 and the conductor layer 105 via the conductive adhesive 109. Next, the lid 110 is attached via a brazing material such as silver solder so as to cover the recess 102 on the metallization layer 104 for sealing around the recess 102 on the upper surface of the base 101. As a result, the piezoelectric vibrator 103 is hermetically sealed inside the container formed by the concave portion 102 of the base 101 and the lid 110, and is formed as a piezoelectric device.

  In this piezoelectric device, the electrode of the hermetically sealed piezoelectric vibrator 103 is connected to the wiring conductor and the external connection by connecting the external connection terminal led out to the outer surface of the lower surface of the base 101 of the wiring conductor to the external electric circuit. It is electrically connected to an external electric circuit through a terminal.

  The present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the gist of the present invention. For example, in this example, the conductor layer 105 and the conductor bump 106 are formed so that the connection portion is in contact with the inner surface of the bottom corner of the recess 102, but the recess 102 has a shape in accordance with the shape of the piezoelectric vibrator of the piezoelectric device. You may form so that it may space apart from the inner surface of a bottom face.

  Further, in the piezoelectric device shown in the example of the embodiment of the present invention, it is formed by laminating two insulating layers, but it may be formed by laminating other number of insulating layers. Needless to say.

(A) is a top view which shows an example of embodiment of the package for piezoelectric vibrator accommodation of this invention, (b) is sectional drawing in the A-A 'line of the package for piezoelectric vibrator accommodation of (a). It is a principal part enlarged view which shows an example of embodiment of the package for piezoelectric vibrator accommodation of this invention. (A) is a top view which shows an example of embodiment of the conventional piezoelectric vibrator storage package, (b) is sectional drawing in the B-B 'line of the piezoelectric vibrator storage package of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Base | substrate 102 ... Recessed part 103 ... Piezoelectric vibrator 104 ... Metallization layer for sealing 105 ... Conductor layer 106 ... Conductor bump 107: Gold plating layer 109: Conductive adhesive 110: Lid 111: Inorganic powder

Claims (4)

A base having a recess for accommodating a piezoelectric vibrator on the upper surface, a conductor layer formed on the bottom surface of the recess, and formed on the conductor layer, and the piezoelectric vibrator is bonded via a conductive adhesive A conductor bump; and a gold plating layer deposited on the surface of the conductor layer and the conductor bump. The gold plating layer is formed on the conductor layer from the surface of the portion deposited on the conductor bump. A package for housing a piezoelectric vibrator, characterized in that the surface of the part to be deposited is rough. 2. The package for accommodating a piezoelectric vibrator according to claim 1, wherein the conductor layer is a metallized layer formed by firing conductor powder, and an inorganic powder coarser than the conductor powder is added. 3. The package for accommodating a piezoelectric vibrator according to claim 2, wherein the base is made of a ceramic material, and the inorganic powder added to the conductor layer is the ceramic material. The piezoelectric vibrator housing package according to any one of claims 1 to 3, the piezoelectric vibrator housed in the concave portion and bonded to the conductor bump via a conductive adhesive, A piezoelectric device comprising: a lid attached to an upper surface of a base.

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