JP2005278093A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of preventing intrusion of noise to an extracted image converted from light into an electric signal by an imaging element by making the light passing through a lens incident onto a light receiving face of the imaging element with high accuracy in the case of photographing an object. <P>SOLUTION: The imaging apparatus is provided with: an insulation board 2 in the middle of which a through-hole 2a is formed; wire conductors 5 formed to a lower side of the insulation board 2; the imaging element 3 that is fitted to around the through-hole 2a at the lower side of the insulation board 2 by opposing its light receiving section 3a to the through-hole 2a and electrodes 7 of which are electrically connected to the wire conductors 5; and a window member 4 fitted to around the opening of the through-hole 2a at the upper side of the insulation board 2 in a way of covering the opening, and a light shield layer 8 is formed to the upper side of the insulation board 2 and includes a shield non-forming part or a groove 8a over the entire circumference of the opening of the through-hole 2a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imaging apparatus applied to an optical sensor or the like using an imaging element such as a CCD type or a CMOS type.

  2. Description of the Related Art Conventionally, ceramics are known as an image pickup apparatus for housing an image pickup device such as a CCD type or a CMOS type. In recent years, electronic devices with an emphasis on portability are required to be reduced in size and thickness in the market. Therefore, in order to sufficiently meet these demands, for example, a cross-sectional shape as shown in FIG. 12, an imaging device 11 mainly composed of an imaging element 13 and a sealing material 14 has been proposed.

  The wiring board 12 is made of ceramics or resin, and is formed as a thin flat plate, and a wiring area 15 is formed on the lower surface thereof. The wiring board 12 has an opening 12 a through which light passes, and a frame-like base 18 is provided on the lower surface of the wiring board 12. The base 18 is joined in a direction substantially orthogonal to the lower surface of the wiring board 12, and a terminal 19 for external connection is formed at the lower end of the base 18. The wiring board 12 is supported and fixed on the external circuit board by the base 18.

  In addition, the imaging element 13 is disposed on the lower surface of the wiring board 12 so that the light receiving portion 13a faces the opening 12a. The image pickup device 13 is a chip in which a CCD type and CMOS type light receiving portion 13a is formed at the center of the upper surface of a silicon substrate, and an electrode pad is formed on the outer peripheral portion of the upper surface of the image pickup device 13.

  A protruding electrode (conductor bump) 17 made of gold or the like is formed on the electrode pad. The protruding electrode 17 is flip-chip bonded to the wiring area 15, and a dam 17 a that is a sealing resin layer made of a resin that reinforces the bonding and seals is applied and formed around the bonding portion. The protruding electrode 17 is connected to the wiring area 15 and led out to the terminal 19 through a wiring conductor (not shown) formed inside the wiring board 12 and the base 18.

  Further, a transparent sealing material 14 made of glass or the like is adhered to the upper surface of the wiring board 12 with a resin adhesive or the like so as to close the opening 12a (see, for example, Patent Document 1 below).

  In such a ceramic imaging device 11, the wiring board 12 and the base 18 are manufactured by a ceramic green sheet (hereinafter also referred to as “green sheet”) lamination method. Specifically, a green sheet for the wiring board 12 made of ceramics and a green sheet for the base 18 made of ceramics are prepared, and wiring conductors from the wiring area 15 of the wiring board 12 to the terminals 19 are provided on these green sheets. A through hole for deriving light and an opening 12a through which light passes are vertically punched on the upper and lower surfaces of the green sheet.

  Next, tungsten (W) or molybdenum (for wiring conductors 15 formed on the wiring area 15 of the wiring board 12, the terminals 19 of the base 18, and the wiring conductors formed inside the wiring board 12 and the base 18 and led out to the terminals 19 are used. A metal paste made of a refractory metal powder such as Mo) is applied by a conventionally known screen printing method or the like. And the green sheet for wiring boards 12 and the green sheet for base 18 are piled up and down and joined, and these are baked at high temperature to form a sintered body.

  Thereafter, a plated metal layer made of a metal such as nickel (Ni) or gold (Au) is deposited on the exposed surfaces of the wiring area 15 and the terminal 19 from which the wiring conductor is led out by an electroless plating method or an electrolytic plating method. Yes.

  FIG. 5 is a cross-sectional view of an optical sensor device formed by modularizing the imaging device 11 of FIG. In the imaging device 11, a frame-like base 18 is provided on the lower surface of the wiring board 12, and a terminal 19 for external connection is provided at the lower end of the base 18. The terminal 19 is connected to the wiring of the external circuit board 26. It is connected to a conductor or the like, and is connected and reinforced by the solder 20. In addition, a lens barrel 21 is bonded and fixed to the outer peripheral portion of the upper surface of the wiring board 12 in the imaging device 11 on the outer peripheral side of the sealing material 14.

  In the above configuration, since the imaging device 11 is mounted on the external circuit board 26, a mounting space 22 is formed between the imaging device 11 and the external circuit board 26. An electronic component 23 such as a semiconductor element such as an IC or LSI or a connector is attached to the upper surface of the external circuit board 26 facing the mounting space 22.

  Light entering the module from the outside passes through the lens 25 through the lens 25 from the window 24 of the lens barrel 21 and passes through the transparent sealing material 14. The light that has passed through the sealing material 14 passes through the opening 12 a formed in the wiring board 12 and enters the light receiving portion 13 a of the image sensor 13. The light received by the light receiving portion 13 a of the image sensor 13 is converted into an electric signal and transmitted to the wiring board 12 through the protruding electrode 17. The electrical signal transmitted to the wiring board 12 passes through the wiring conductors in the wiring board 12 and the base 18 and is output to the outside of the imaging device 11 through the terminal 19 of the base 18.

As described above, when the imaging device 11 is mounted on the external circuit board 26 of the module by providing the base 18 having the terminals 19 formed around the imaging device 13, the imaging device 11 and the external circuit board 26 are connected to each other. A mounting space 22 can be secured in between, and the electronic component 23 can be mounted there by utilizing the mounting space 22. Therefore, it is possible to reduce the size of the module having the imaging device 11 (see, for example, Patent Document 1 below). In addition, when the image pick-up element 13 is a square by planar view, the base 18 may be provided along only the two sides.
JP 2002-299592 A

  However, according to the imaging device 11 of Patent Document 1, since the wiring board 12 is made of ceramics, resin, or the like and is formed as a thin flat plate, light is easily transmitted through the wiring board 12, and from the upper surface of the wiring board 12. After light is incident and refracted inside, the light is emitted from the inner wall surface of the opening 12a and enters the opening 12a. The light is transmitted through the wiring board 12 and emitted from the lower surface, and is formed around the joint portion of the imaging element 13. By passing through the dam 17a and entering the opening 12a, unnecessary light enters the light receiving portion 13a and cannot be received with high precision, and flare, ghost, etc. are converted into an electric signal and taken out. There was a problem that noise was generated.

  Further, a transparent sealing material 14 made of glass or the like is adhered to the upper surface of the wiring board 12 by a resin adhesive or the like so as to close the opening 12a, and this resin adhesive is formed in the opening 12a formed in the wiring board 12. By flowing into the inner wall surface, the resin adhesive easily adheres to the inner wall surface of the opening 12a in a protruding manner, and light incident through the sealing material 14 passes through the opening 12a and passes through the inner wall surface of the opening 12a. There is a problem that irregular reflection is caused by the projection-like resin adhesive deposited on the lens, and a part of the light enters the light receiving portion 13a, so that the light cannot be received accurately and noise is generated in the image.

  Similarly, when the imaging device 11 is a module including a lens, light is transmitted through the wiring board 12 or is irregularly reflected by a protruding resin adhesive attached to the inner wall surface of the opening 12 a of the wiring board 12. As a result, unnecessary light is incident on the light receiving portion 13a and cannot be received accurately, and noise is generated in the image.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and its purpose is to allow light that has passed through the lens to be incident on the light receiving surface of the image sensor with high accuracy without irregular reflection. Accordingly, an object of the present invention is to provide an imaging apparatus capable of preventing noise in an image taken out by being converted into an electrical signal by an imaging element.

  The imaging device according to the present invention includes an insulating substrate having a through hole formed in a central portion thereof, a wiring conductor formed on a lower surface of the insulating substrate, and light reception by the through hole around the through hole on the lower surface of the insulating substrate. An image pickup device in which electrodes are attached to face each other and an electrode is electrically connected to the wiring conductor, and is attached around the opening of the through hole on the upper surface of the insulating substrate so as to cover the opening The insulating substrate has a light blocking layer formed on an upper surface thereof, and the light blocking layer is provided with a non-formed portion or a groove around the opening of the through-hole. It is characterized by.

  In the imaging device according to the aspect of the invention, it is preferable that the light blocking layer has a portion along the outer peripheral side edge of the non-formed part or groove rather than a part along the inner peripheral side edge of the non-formed part or groove. It is characterized by being thick.

  In the imaging device of the present invention, since the light blocking layer is formed on the upper surface of the insulating substrate, the light blocking layer effectively prevents light from being transmitted through the insulating substrate even if the insulating substrate is thinly formed. Will be able to. Therefore, light is incident from the upper surface of the insulating substrate, refracted inside, and then exits from the inner wall surface of the through hole and enters the through hole, or passes through the insulating substrate and exits from the lower surface, and then joins the image sensor. It is possible to effectively prevent the light from entering the through hole through the dam formed around the dam, and the light can be accurately incident on the light receiving portion and converted into an electric signal. It is possible to effectively prevent noise from being generated in the extracted image.

  Further, since the light blocking layer is provided with a non-formed part or groove around the entire periphery of the opening of the through hole, the non-formed part or groove is a pool of resin adhesive for bonding the window member. The window member can be firmly bonded to the insulating substrate, and the resin adhesive can flow into the inside of the opening, thereby effectively attaching the resin adhesive to the inner wall surface of the through hole in a protruding manner. The light that has passed through the window member and entered the through-hole is irregularly reflected by the protruding resin adhesive attached to the inner wall surface, and part of the light may enter the light-receiving unit. Therefore, it is possible to effectively prevent noise from being generated in an image that has been converted into an electrical signal and taken out.

  Further, even when the imaging device is a module including a lens, the light passing through the lens is favorably converted into an electric signal without being irregularly reflected, so that noise can be effectively prevented.

  In the imaging device of the present invention, preferably, the light blocking layer has a thicker portion along the outer peripheral edge of the non-formed portion or groove than a portion along the inner peripheral edge of the non-formed portion or groove. The window member can be covered with the non-light-blocking portion of the window member or the edge of the groove on the outer peripheral side, and the light entering from the side surface of the window member can be effectively prevented to prevent unnecessary light from entering the light receiving portion. Incidence can be more effectively prevented.

  In addition, it is possible to more effectively prevent light from being transmitted through the insulating substrate by the thicker light blocking layer, and it is possible to effectively prevent noise from being generated in the image. Furthermore, it becomes possible to increase the amount of the resin adhesive pool when the window member is bonded to the insulating substrate, and the window member can be bonded more firmly.

  The imaging apparatus of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an imaging apparatus according to the present invention. In FIG. 1, 2 is an insulating substrate, 2a is a through hole, 3 is an image sensor, 4 is a window member, and 5 is a wiring conductor. There are these, and the imaging apparatus 1 is mainly configured.

  The insulating substrate 2 of the present invention is made of a ceramic such as an aluminum oxide sintered body (alumina ceramics) or an aluminum nitride sintered body, and is molded as a thin flat plate, and a metal powder such as W or Mo is formed on the surface and inside thereof. A wiring conductor 5 made of metallization and having a function of transmitting an electrical signal of the image sensor 3 is formed. A through hole 2a that allows light to pass through is formed at the center, and a light receiving light is formed below the through hole 2a. An image pickup device 3 is attached in which the portion 3a is opposed to the through hole 2a and an electrode 7 (for example, formed of a protruding electrode such as a conductor bump) is electrically connected to the wiring conductor 5. A window member 4 for protecting the light receiving portion 3a of the image sensor 3 is attached to the upper side of the insulating substrate 2 with a resin adhesive 4a or the like.

  When the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to form a slurry. Is formed into a sheet by a conventionally known doctor blade method, calendar roll method, or the like to obtain a green sheet (ceramic raw sheet). Next, a through hole for forming the wiring conductor 5 and a through hole 2a for allowing light to pass through are formed in the green sheet by punching, and a metal paste to be the wiring conductor 5 is printed and applied in a predetermined pattern. Thereafter, these green sheets are laminated and cut to obtain a green sheet molded body for the insulating substrate 2, and finally the molded body is sintered at a high temperature (about 1600 ° C.).

  The wiring conductor 5 deposited on the insulating substrate 2 functions as a conductive path for transmitting the electric signal of the image sensor 3 to the terminal 6 for external connection, and is suitable for refractory metal powder such as W or Mo. A metal paste obtained by adding and mixing an organic solvent and a solvent is preliminarily printed and applied in a predetermined pattern on a green sheet to be the insulating substrate 2 by a screen printing method. The

  In addition, when a metal having excellent corrosion resistance such as nickel or gold is deposited on the exposed surface of the wiring conductor 5 to a thickness of about 1 to 20 μm, the wiring conductor 5 can be effectively prevented from being oxidized and corroded, The connection between the wiring conductor 5 and the electrode 7 of the imaging device 3 can be made strong. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 5 by an electrolytic plating method or an electroless plating method. preferable.

  A transparent window member 4 made of glass, sapphire, or the like is disposed and bonded on the upper surface of the insulating substrate 2 by a resin adhesive 4a such as an epoxy resin to protect the light receiving portion 3a of the image sensor 3 such as a CCD type or a CMOS type. doing.

  In the present invention, the insulating substrate 2 has the light blocking layer 8 formed on the upper surface, and the light blocking layer 8 has a non-formed portion or groove 8a around the entire periphery of the opening of the through hole 2a. . And that is important. Thereby, even if the insulating substrate 2 is thinly formed, the light blocking layer 8 can effectively prevent light from being transmitted through the insulating substrate 2. Therefore, light enters from the upper surface of the insulating substrate 2 and is refracted inside and then exits from the inner wall surface of the through hole 2a and enters the through hole 2a, or passes through the insulating substrate 2 and exits from the lower surface. It is possible to effectively prevent the dam 7a formed around the joint portion of the element 3 from passing through and entering the through hole 2a, so that light can be incident on the light receiving portion 3a with high accuracy. Thus, it is possible to effectively prevent noise from being generated in an image that has been converted into an electrical signal and taken out.

  Further, since the light blocking layer 8 is provided with non-formed portions or grooves 8a around the entire periphery of the opening of the through hole 2a, the non-formed portions or grooves 8a are used for bonding the window member 4 to each other. A pool of the resin adhesive 4a can be formed, and the window member 4 can be firmly bonded to the insulating substrate 2, and the resin adhesive 4a flows into the inside of the opening so that the resin adhesive 4a is applied to the inner wall surface of the through hole 2a. Can be effectively prevented from adhering to the projection, and the light that has passed through the window member 4 and entered the through-hole 2a is diffusely reflected by the projection-like resin adhesive 4a that adheres to the inner wall surface. Since a part of the light can be accurately incident on the light receiving unit 3a without entering the light receiving unit 3a, it is possible to effectively prevent the generation of noise in the image that is converted into an electric signal and taken out. it can.

  The light blocking layer 8 has a light transmittance of 10% or less for light in the visible light region. Such materials include ceramics such as aluminum oxide sintered bodies, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramic sintered bodies, epoxy resins, acrylic resins, polycarbonates, phenol resins, silicone resins. In order to obtain a desired light transmittance, such as resin such as Al, Cu, Ni, Ag, stainless steel, brass (Cu-Zu alloy), Fe-Ni-Co alloy, Cu-W alloy, etc. are used. In addition, these materials may contain pigments, pigments, organic fillers, inorganic fillers, metal fillers, or a metal layer may be formed on the surface.

  Further, an adhesive layer for bonding to the insulating substrate 2 may be provided. If the light transmittance with respect to light in the visible light region including the adhesive layer is 10% or less, the light blocking layer 8 is provided. Function as. Examples of such an adhesive layer include a bonding material made of a resin adhesive such as epoxy, a brazing material such as Ag brazing, Pb—Sn solder, and Pb free solder.

  Further, a non-formation part (a part in which the insulating substrate 2 is exposed by forming a frame-like hole so as to penetrate the upper and lower surfaces in a part of the light blocking layer 8) provided in the light blocking layer 8 or a groove ( If the surface of the light blocking layer 8 is formed with a frame-like recess) 8a is a ceramic, it is formed by punching a ceramic raw sheet with a die, and if it is a resin or metal, it is a punching die or molding. It is formed by a mold.

  The non-formed part or the groove 8a is formed so as to surround the opening of the through hole 2a, and is preferably formed around the entire opening of the through hole 2a. Thereby, it can prevent more effectively that the resin adhesive 4a flows into the inside of opening.

  Further, the non-formed part or groove 8a is preferably 0.3 to 0.8 times the width of the joint surface between the window member 4 and the insulating substrate 2. Accordingly, it is possible to more effectively prevent the resin adhesive 4a from flowing into the inside of the opening, and it is possible to increase the pool of the resin adhesive 4a and further increase the bonding strength between the window member 4 and the insulating substrate 2.

  Further, even when the imaging device 1 is a module including a lens, the light that has passed through the lens is favorably converted into an electric signal without being irregularly reflected, so that noise can be effectively prevented.

  Further, below the through hole 2a at the center of the insulating substrate 2, an image pickup device 3 in which a CCD type and CMOS type light receiving part 3a is formed on a silicon substrate is disposed. An electrode 7 such as gold is formed on the outer periphery of the image sensor 3, and the electrode 7 is connected to the wiring conductor 5. The image sensor 3 is connected to the external electric circuit via the wiring conductor 5. Is electrically connected.

FIG. 2 is a cross-sectional view showing another example of the embodiment of the present invention in which a frame-like side wall portion 9 is provided outside the imaging element 3 on the lower surface of the insulating substrate 2. (Same parts as in FIG.
The side wall portion 9 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, and the like, which are the same material as the insulating substrate 2. It is for taking out. Therefore, a wiring layer (not shown) is formed inside or on the surface of the side wall 9, and this wiring layer is an organic solvent suitable for refractory metal powder such as W or Mo, which is the same material as the wiring conductor 5. The metal paste obtained by adding and mixing the solvent is preliminarily printed and applied in a predetermined pattern on the green sheet to be the side wall portion 9 by a screen printing method, so that the metal paste is deposited on the side wall portion 9 at a predetermined position. One end of the wiring layer is formed so as to be electrically connected to the wiring conductor 5, and the other end is formed on the lower end of the side wall portion 9 with the same material as the wiring layer in the same manner. It is derived so as to be connected to the terminal 10.

  The side wall portion 9 also functions as a support for the insulating substrate 2. When the imaging device 1 is mounted with the terminal 10 at the lower end thereof connected to a wiring conductor or the like of the external circuit substrate, the imaging device 1 and the external circuit are mounted. A mounting space is formed between the substrate and an electronic component such as an IC, LSI, or connector on the external circuit board corresponding to the mounting space or the lower surface of the insulating substrate 2. Therefore, when the imaging device 1 is used as an optical sensor device that is mounted on an external circuit board or the like, the optical sensor device can be reduced in size.

  Further, the side wall 9 is formed by punching through holes for forming a wiring layer connected to the terminal 10 in the same green sheet as the insulating substrate 2, and a metal paste that becomes the wiring layer and the terminal 10 is formed. Printing is applied in a predetermined pattern. Thereafter, these green sheets are sequentially laminated on the green sheet to be the insulating substrate 2 and cut to obtain a molded body integrated with the green sheet for the insulating substrate 2. Finally, the molded body is heated to a high temperature (about 1600 ° C.).

  Note that the wiring layer of the side wall 9 and the exposed surface of the terminal 10 effectively prevent oxidative corrosion, and the bonding state between the wiring conductor 5 of the insulating substrate 2 and the wiring layer of the side wall 9 is good. In order to do so, a copper plating layer, a nickel plating layer, and a gold plating layer having a thickness of about 1 to 20 μm are applied by electrolytic plating or electroless plating, or these plating layers are sequentially applied. It is good to be.

  The imaging element 3 is flip-chip bonded to the wiring conductor 5 whose electrode 7 is plated with nickel, gold, or the like of the insulating substrate 2 by, for example, an ultrasonic bonding method. The flip chip bonding by the ultrasonic bonding method is a bonding method in which bonding is performed by applying ultrasonic vibration of about 0.5 seconds to the bonding portion while pressurizing the bonding portion at room temperature. A dam 7a, which is a sealing resin layer made of a resin that reinforces and seals the joint, is applied and formed around the joint of the image sensor 3. The dam 7a is obtained by increasing the viscosity of a resin such as an epoxy resin, and the thixo ratio, which is an index of the strength of maintaining the shape of the resin, is preferably as large as 1.7 or more.

  As described above, the imaging device 1 of the present invention includes the insulating substrate 2 in which the through hole 2a is formed in the central portion, the wiring conductor 5 formed on the lower surface of the insulating substrate 2, and the lower surface of the insulating substrate 2. The image sensor 3 in which the light receiving portion 3a is attached to the through hole 2a around the hole 2a and the electrode 7 is electrically connected to the wiring conductor 5, and the opening of the through hole 2a on the upper surface of the insulating substrate 2 Since the insulating substrate 2 has a light blocking layer 8 formed on the upper surface, the light blocking layer 8 is formed even if the insulating substrate 2 is thinly formed. The layer 8 can effectively prevent light from being transmitted through the insulating substrate 2. Therefore, the light that has passed through the window member 4 and entered the through hole 2a is refracted inside from the upper surface of the insulating substrate 2 and emitted from the inner wall surface of the through hole 2a to enter the through hole 2a. Undesired light such as light transmitted through the insulating substrate 2 and emitted from the lower surface through the dam 7a formed around the joint of the image sensor 3 and incident into the through hole 2a is received by the light receiving unit. The light can be incident on the light receiving unit 3a with high accuracy without being incident on the light 3a, and it is possible to effectively prevent the generation of noise in the image that is converted into an electric signal and taken out.

  Further, since the light blocking layer 8 is provided with non-formed portions or grooves 8a around the entire periphery of the opening of the through hole 2a, the non-formed portions or grooves 8a are used for bonding the window member 4 to each other. A pool of the resin adhesive 4a can be formed, and the window member 4 can be firmly bonded to the insulating substrate 2, and the resin adhesive 4a flows into the inside of the opening so that the resin adhesive 4a is applied to the inner wall surface of the through hole 2a. Can be effectively prevented from adhering to the projection, and the light that has passed through the window member 4 and entered the through-hole 2a is diffusely reflected by the projection-like resin adhesive 4a that adheres to the inner wall surface. Since a part of the light can be accurately incident on the light receiving unit 3a without entering the light receiving unit 3a, it is possible to effectively prevent the generation of noise in the image that is converted into an electric signal and taken out. it can.

  Further, even when the imaging device 1 is a module including a lens, the light that has passed through the lens is favorably converted into an electric signal without being irregularly reflected, so that noise can be effectively prevented.

  Further, in the present invention, as shown in the cross-sectional view of FIG. 3 (the same parts as those in FIG. 1 are denoted by the same reference numerals), the light blocking layer 8 is a part along the outer peripheral edge of the non-formed part or the groove 8a. Is preferably thicker than the non-formed portion or the portion along the inner peripheral edge of the groove 8a. That is, in the light blocking layer 8, it is preferable that the thickness of the part along the outer peripheral side edge of the non-formed part or groove 8a is thicker than the thickness of the part located inside the non-formed part or groove 8a. As a result, it is possible to more effectively prevent light from being transmitted through the insulating substrate 2, and it is possible to effectively prevent noise from being generated in the image. Further, it is possible to increase the amount of the resin adhesive 4a accumulated when the window member 4 is bonded to the insulating substrate 2, and the window member 4 can be bonded more firmly.

  Thus, in the imaging device 1 of the present invention, the external circuit board of the module is connected to the lower end of the side wall portion 9, and the lens barrel is bonded and fixed to the outer peripheral portion outside the window member 4 on the upper surface of the insulating substrate 2. It becomes a device.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, when the image sensor 3 is a quadrangle in plan view, the side wall 9 may be provided along only two sides thereof.

It is sectional drawing which shows an example of embodiment about the imaging device of this invention. It is sectional drawing which shows the other example of embodiment about the imaging device of this invention. It is sectional drawing which shows the other example of embodiment about the imaging device of this invention. It is sectional drawing of the conventional imaging device. It is sectional drawing of the optical sensor apparatus comprised using the imaging device of FIG.

Explanation of symbols

1: Image pickup device 2: Insulating substrate 2a: Through hole 3: Image pickup element 3a: Light receiving portion 4: Window member 4a: Resin adhesive 5: Wiring conductor 6: Terminal 7: Electrode 8: Light blocking layer 8a: Non-formed portion or groove

Claims (2)

An insulating substrate having a through-hole formed in the central portion, a wiring conductor formed on the lower surface of the insulating substrate, and a light-receiving portion disposed around the through-hole on the lower surface of the insulating substrate with the light receiving portion facing the through-hole And an imaging element having an electrode electrically connected to the wiring conductor, and a window member attached around the opening of the through hole on the upper surface of the insulating substrate and covering the opening. The insulating substrate has a light blocking layer formed on an upper surface thereof, and the light blocking layer is provided with a non-formed portion or a groove around the opening of the through hole over the entire circumference. Imaging device. 2. The light blocking layer according to claim 1, wherein a portion along an outer peripheral side edge of the non-formed portion or groove is thicker than a portion along an inner peripheral edge of the non-formed portion or groove. Imaging device.

Images