JP4601331B2 - Imaging device and imaging module - Google Patents

Description

  The present invention relates to an imaging apparatus and an imaging module that are applied to an optical sensor or the like using an imaging element such as a CCD type or a CMOS type.

  2. Description of the Related Art Conventionally, ceramic devices are known as image pickup devices for housing CCD or CMOS image pickup devices. In recent years, electronic devices with an emphasis on portability are required to be reduced in size and thickness in the market. For this reason, in order to fully meet these requirements, for example, a cross-sectional shape as shown in FIG. 12, an imaging device 11 mainly composed of an imaging element 13 and a sealing material 14 has been proposed.

  The wiring board 12 is made of ceramics or resin, and is formed as a thin flat plate, and a wiring area 15 is formed on the lower surface thereof. The wiring board 12 has an opening 12 a through which light passes, and a frame-like base 18 is provided on the lower surface of the wiring board 12. The base 18 is joined in a direction substantially orthogonal to the lower surface of the wiring board 12, and a terminal 19 for external connection is formed at the lower end of the base 18. The wiring board 12 is supported and fixed on the external circuit board by the base 18.

  In addition, the imaging element 13 is disposed on the lower surface of the wiring board 12 so that the light receiving portion 13a faces the opening 12a. The image pickup device 13 is a chip in which a CCD type and CMOS type light receiving portion 13a is formed at the center of the upper surface of a silicon substrate, and an electrode pad is formed on the outer peripheral portion of the upper surface of the image pickup device 13.

  A protruding electrode (conductor bump) 17 made of gold or the like is formed on the electrode pad. The protruding electrode 17 is flip-chip bonded to the wiring area 15, and a dam 17 a that is a sealing resin layer made of a resin that reinforces the bonding and seals is applied and formed around the bonding portion. The protruding electrode 17 is connected to the wiring area 15 and led out to the terminal 19 through a wiring conductor (not shown) formed inside the wiring board 12 and the base 18.

  Further, a transparent sealing material 14 made of glass or the like is adhered to the upper surface of the wiring board 12 with a resin adhesive or the like so as to close the opening 12a (see, for example, Patent Document 1 below).

  In such a ceramic imaging device 11, the wiring board 12 and the base 18 are manufactured by a ceramic green sheet (hereinafter also referred to as a green sheet) lamination method. Specifically, a green sheet for the wiring board 12 made of ceramics and a green sheet for the base 18 made of ceramics are prepared, and wiring conductors from the wiring area 15 of the wiring board 12 to the terminals 19 are provided on these green sheets. A through hole for deriving light and an opening 12a through which light passes are vertically punched on the upper and lower surfaces of the green sheet.

  Next, tungsten (W) or molybdenum (for wiring conductors 15 formed on the wiring area 15 of the wiring board 12, the terminals 19 of the base 18, and the wiring conductors formed inside the wiring board 12 and the base 18 and led out to the terminals 19 are used. A metal paste made of a refractory metal powder such as Mo) is applied by a conventionally known screen printing method or the like. And the green sheet for wiring boards 12 and the green sheet for base 18 are piled up and down and joined, and these are baked at high temperature to form a sintered body.

  Thereafter, a plated metal layer made of a metal such as nickel (Ni) or gold (Au) is deposited on the exposed surfaces of the wiring area 15 and the terminal 19 from which the wiring conductor is led out by an electroless plating method or an electrolytic plating method. Yes.

  FIG. 7 is a cross-sectional view of an optical sensor device obtained by modularizing the imaging device 11 of FIG. In the imaging device 11, a frame-shaped base 18 is provided on the lower surface of the wiring board 12, and a terminal 19 for external connection is provided at the lower end of the base 18, and the terminal 19 is wired to the external circuit board 16. It is connected to a conductor or the like, and is connected and reinforced with solder. In addition, the lens barrel 20 is bonded and fixed to an outer peripheral portion of the upper surface of the wiring board 12 in the imaging device 11 on the outer peripheral side of the sealing material 14.

Light entering the module from the outside passes through the lens 22 from the window 21 of the lens barrel 20 and passes through the transparent sealing material 14. The light that has passed through the sealing material 14 passes through the opening 12 a formed in the wiring board 12 and enters the light receiving portion 13 a of the image sensor 13. The light received by the light receiving portion 13 a of the image sensor 13 is converted into an electric signal and transmitted to the wiring board 12 through the protruding electrode 17. The electrical signal transmitted to the wiring board 12 passes through the wiring conductors inside the wiring board 12 and the base 18 and is output to the outside of the imaging device 11 via the terminal 19 of the base 18. (For example, refer to Patent Document 1 below). In addition, when the image pick-up element 13 is a rectangle by planar view, the base 18 may be provided along only the two sides.
JP 2002-299592 A

  However, in the imaging device 11 of Patent Document 1, the thickness of the wiring board 12 is likely to vary for each imaging device 11, and the imaging element 13 is disposed on the lower surface of the wiring board 12 having such a large thickness variation. Since the lens barrel 20 with the lens 22 attached is bonded and fixed to the outer peripheral portion of the upper surface, the distance between the lens 22 and the light receiving portion 13a of the image sensor 13 is made constant due to the thickness variation of the wiring board 12. It is very difficult to do so, and there is a problem that the focusing performance is deteriorated and the light transmitted through the lens 22 cannot be accurately incident on the light receiving unit 13a.

  Further, if the thickness of the wiring board 12 is reduced in order to reduce the variation in the thickness of the wiring board 12, the mechanical strength of the wiring board 12 is weakened, and the wiring board 12 is cracked in the process of mounting or transporting the image pickup device 13. There was a problem that chipping occurred.

  Therefore, the present invention has been completed in view of the above-described conventional problems, and the object of the present invention is to increase the focusing performance between the lens and the light receiving portion of the image sensor when photographing a subject. It is an object of the present invention to provide an imaging device and an imaging module in which light transmitted through the light source is accurately converted into an electrical signal by an imaging device and can be extracted as a clear image.

An image pickup apparatus according to the present invention has a lower substrate having a first through hole that opens to an upper surface and a lower surface, and a second through hole that opens to an upper surface and a lower surface, and is disposed on the upper surface of the lower substrate. An upper substrate is provided, and a recess for accommodating the image sensor is formed by an inner surface of the first through hole and a lower surface of the upper substrate, and the second through hole opens at the bottom of the recess. In the state where the insulating substrate, the wiring conductor led out from the periphery of the opening of the second through hole on the bottom surface of the concave portion to the lower surface of the insulating substrate, and the light receiving portion face the second through hole, the concave portion An image pickup device in which an electrode is electrically connected to the wiring conductor around the second through hole on the bottom surface of the base plate, and a window attached to the top surface of the insulating substrate so as to cover the opening of the second through hole and comprising a member, the side of the insulating substrate In, wherein the lower substrate protrudes more laterally than the upper substrate, the flange portion for fixing the lens fixing member is formed.

  In the imaging apparatus of the present invention, it is preferable that the upper surface of the flange portion and the bottom surface of the concave portion are on the same plane.

  In the image pickup apparatus of the present invention, it is preferable that the insulating substrate is chamfered at a corner between its upper surface and side surfaces.

  The imaging module of the present invention has a cylindrical shape in which the lower end is joined to the upper surface of the collar portion, the through hole is formed in the center portion of the upper end surface, and the lower end is opened. A lens fixing member and a lens attached to the lens fixing member so as to close the opening of the through hole are provided.

According to the imaging apparatus of the present invention, the lower substrate having the first through-hole opening on the upper surface and the lower surface, and the second through-hole opening on the upper surface and the lower surface, and disposed on the upper surface of the lower substrate. A recess for accommodating the image pickup element is formed by the inner side surface of the first through-hole and the lower surface of the upper substrate, and the second through-hole opens to the bottom surface of the recess ; a wiring conductor which is led to the lower surface of the insulating substrate from the periphery of the opening of the second through hole of the bottom surface of the recess, in a state where the light receiving portion to the second through-holes are opposed, the second through hole of the bottom surface of the recess an imaging element electrode is electrically connected to the wiring conductor around the, and comprises a secured to a window member covering the opening of the second through-hole in the upper surface of the insulating substrate, the side surface of the insulating substrate In, the lower substrate protrudes to the side than the upper substrate Adhesive since the flange portion for fixing the lens fixing member is formed, when the imaging module lens fixing member having a lens in the imaging device bonded to the lens fixing member to the upper surface of the flange portion By fixing, the positional accuracy in the height direction between the lens fixed to the lens fixing member and the imaging element can be extremely increased without reducing the thickness of the insulating substrate.

  That is, the positional accuracy between the lens fixing member and the image sensor is between the plane on which the upper surface of the collar portion to which the lens fixing member is bonded and fixed is located and the plane on which the bottom surface of the recess to which the image sensor is attached is located. Even if the entire thickness of the insulating substrate varies depending on the thickness variation, in the configuration of the present invention, the thickness between the plane on which the upper surface of the flange is located and the plane on which the bottom surface of the recess is located. Or the thickness can be made very thin to make the variation very small, and the positional accuracy in the height direction between the top surface of the flange and the bottom surface of the recess can be greatly improved. As a result, the variation in the focal length between the lens attached to the lens fixing member and the light receiving portion of the image sensor is reduced, and the light transmitted through the lens can be accurately incident on the light receiving portion, and the insulating substrate The mechanical strength of can be maintained.

  In the imaging device of the present invention, preferably, the upper surface of the collar and the bottom surface of the recess are on the same plane. Therefore, when the imaging device is an imaging module having a lens, the upper surface of the collar and the bottom of the recess. Therefore, the focusing performance between the lens and the light receiving portion of the image sensor can be improved.

  In the image pickup apparatus of the present invention, preferably, since the corner between the upper surface and the side surface of the insulating substrate is chamfered, the lens fixing member is bonded and fixed, the image pickup device is mounted, and conveyed from the outside. Because it can effectively prevent the corners between the top and side surfaces of the insulating substrate from being cracked or chipped by the external force, the light transmitted through the lens is prevented from being blocked by the broken or chipped pieces. be able to.

  The imaging module of the present invention has a cylindrical shape in which the lower end is joined to the upper surface of the collar portion, the through hole is formed in the center of the upper end surface, and the lower end is opened, with the imaging device of the present invention. Since the lens fixing member and the lens attached to the lens fixing member so as to close the opening of the through hole are provided, the mechanical strength is increased and the light is accurately transmitted to the light receiving portion of the image sensor. A well-incident image is formed, and an image signal is accurately converted into an electric signal, so that a clear image can be taken out.

This onset Ming imaging apparatus will be described in detail below. Figure 1 is a cross-sectional view showing an example of an embodiment for the onset light of the imaging device, reference numeral 2 denotes an insulating substrate, 2a through hole, an imaging device 3, 4 is the window member, 5 a wiring conductor The imaging device 1 is mainly configured by these.

  The insulating substrate 2 of the present invention is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, and is molded as a thin flat plate, and a metal powder such as W or Mo is formed on the surface and inside thereof. A wiring conductor 5 made of metallization and having a function of transmitting an electrical signal of the image sensor 3 is formed. A through hole 2a that allows light to pass through is formed at the center, and a light receiving light is formed below the through hole 2a. A concave portion 2b is formed in which the imaging element 3 is accommodated in which the portion 3a is opposed to the through hole 2a and the electrode is electrically connected to the wiring conductor 5 via the electrical connection means 7 such as a conductor bump. A window member 4 for protecting the light receiving portion 3a of the image sensor 3 is attached to the upper side of the insulating substrate 2 with a resin adhesive or the like.

  When the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to form a slurry. Is formed into a sheet by a conventionally known doctor blade method, calendar roll method, or the like to obtain a green sheet (ceramic raw sheet). Next, a through hole for forming the wiring conductor 5 in the green sheet, a through hole 2a for allowing light to pass through, a recess 2b for accommodating the image pickup device 3, and an outer peripheral side surface of the insulating substrate 2 above the flange 2c, A part to be formed is formed by punching, and a metal paste to be the wiring conductor 5 is printed and applied in a predetermined pattern. Thereafter, these green sheets are laminated and cut to obtain a green sheet molded body for the insulating substrate 2, and finally the molded body is sintered at a high temperature (about 1600 ° C.).

  The wiring conductor 5 deposited on the insulating substrate 2 functions as a conductive path for transmitting the electric signal of the image pickup device 3 to the wiring conductor of the external circuit board 6, and is suitable for refractory metal powders such as W and Mo. A metal paste obtained by adding and mixing an organic solvent and a solvent is preliminarily printed and applied in a predetermined pattern to the green sheet to be the insulating substrate 2 by a screen printing method, and is simultaneously fired with the green sheet to be the insulating substrate 2 As a result, the insulating substrate 2 is deposited on a predetermined position.

  In addition, when a metal having excellent corrosion resistance such as nickel or gold is deposited on the exposed surface of the wiring conductor 5 to a thickness of about 1 to 20 μm, the wiring conductor 5 can be effectively prevented from being oxidized and corroded, The bonding between the wiring conductor 5 and the electrode 7 of the imaging device 3 and the bonding between the wiring conductor of the external circuit board 6 can be made strong. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 5 by an electrolytic plating method or an electroless plating method. preferable.

  A recess 2b for accommodating the image pickup device 3 is formed on the lower surface of the insulating substrate 2, and a through hole 2a is formed between the upper surface and the bottom surface of the recess 2b. The through hole 2a receives light. The imaging element 3 is accommodated so that the electrode 7 is electrically connected to the wiring conductor 5 around the through hole 2a on the bottom surface of the recess 2b with the portion 3a facing each other.

  Note that the image pickup device 3 is flip-chip bonded to the wiring conductor 5 whose electrode 7 is plated with nickel, gold or the like of the insulating substrate 2 by, for example, an ultrasonic bonding method. The flip chip bonding by the ultrasonic bonding method is a bonding method in which bonding is performed by applying ultrasonic vibration of about 0.5 seconds to the bonding portion while pressurizing the bonding portion at room temperature. A dam 7a, which is a sealing resin layer made of a resin that reinforces and seals the joint, is applied and formed around the joint of the image sensor 3. The dam 7a is obtained by increasing the viscosity of a resin such as an epoxy resin, and the thixo ratio, which is an index of the strength of maintaining the shape of the resin, is preferably as large as 1.7 or more.

  The image pickup device 3 has a CCD-type and CMOS-type light receiving portion 3a formed on a silicon substrate. An electrode such as gold is formed on the outer peripheral portion of the image pickup device 3, and the electrode is an electric such as a conductor bump. The image pickup device 3 is connected to the wiring conductor of the external circuit board 6 through the wiring conductor 5.

  Note that the image pickup device 3 is bonded to the bottom surface of the recess 2b with a bonding member such as an epoxy resin or solder, and the electrode of the image pickup device 3 is electrically connected to the wiring conductor 5 via a bonding wire or the like. Good.

  In the present invention, the insulating substrate 2 has a flange portion 2c formed at the lower end portion of the side surface thereof. And that is important. As described above, since the insulating substrate 2 has the flange portion 2c formed at the lower end portion of the side surface thereof, when the imaging module 10 of the present invention having the lens 9 in the imaging device 1 of FIG. By fixing the fixing member 8 to the upper surface of the flange portion 2c, the thickness between the upper surface of the flange portion 2c and the bottom surface of the concave portion 2b to which the image sensor 3 is attached can be reduced without reducing the thickness of the insulating substrate 2. Since the thickness variation can be reduced by reducing the thickness, the variation in the focal length between the lens 9 attached to the lens fixing member 8 and the light receiving portion 3a of the image sensor 3 is reduced, and the lens 9 is transmitted. The incident light can be accurately incident on the light receiving portion 3a, and the mechanical strength of the insulating substrate 2 can be maintained.

  When the insulating substrate 2 is manufactured by the green sheet laminating method, the lower portion of the insulating substrate 2 having the flange portion 2c and the upper portion of the insulating substrate 2 serving as the bottom surface of the recess 2b are laminated with a green sheet interposed therebetween. The insulating substrate 2 of the invention can be formed. Then, by thinning the green sheet sandwiched between the upper part and the lower part of the insulating substrate 2, the thickness variation of the green sheet sandwiched therebetween is reduced. Therefore, variations in the height position of the upper surface of the flange portion 2c provided in the lower portion of the insulating substrate 2 and the height position of the bottom surface of the recess portion 2b in the upper portion of the insulating substrate 2 are reduced, and the upper surface and the recess portion of the flange portion 2c are reduced. The positional accuracy in the height direction of the bottom surface of 2b becomes extremely high.

  Preferably, the lower portion of the insulating substrate 2 having the flange portion 2c and the upper portion of the insulating substrate 2 serving as the bottom surface of the concave portion 2b are directly laminated without interposing a green sheet therebetween. As a result, the upper surface of the flange portion 2c and the bottom surface of the recess portion 2b are on the same plane, and the height of the upper surface of the flange portion 2c and the bottom surface of the recess portion 2b is the same. Accordingly, the positional accuracy of the lens fixing member 8 bonded and fixed to the upper surface of the flange portion 2c and the imaging element 3 attached to the bottom surface of the concave portion 2b can be made extremely good.

  In addition, when the image pickup element 3 is square in plan view, the flange 2c is provided over the entire periphery at the lower ends of the four side surfaces of the insulating substrate 2 as shown in the plan view of the insulating substrate 2 in FIG. In addition, the adhesive strength of the lens fixing member 8 can be increased, and intrusion of floating substances from the outside of the imaging module 10 can be prevented.

  Further, as shown in the plan view of the insulating substrate 2 in FIG. 3, the flange portion 2 c may be provided along only two sides of the insulating substrate 2. In this case, the imaging module 10 can be reduced in size.

Moreover, it is preferable that the width | variety which protrudes from the side surface of the insulated substrate 2 is 0.5-2.0 mm. In the case of less than 0.5 mm, the range in which the lens fixing member 8 is bonded and fixed to the upper surface of the flange portion 2c becomes narrow, and the adhesive strength decreases. On the other hand, it is exceeded and the imaging apparatus 1 is likely to increase the size of the 2.0 mm.

  A transparent window member 4 made of glass, sapphire, or the like is disposed and bonded to the upper surface of the insulating substrate 2 with a resin adhesive such as an epoxy resin to protect the light receiving portion 3a of the image sensor 3.

Next, an imaging apparatus of a reference example will be described. FIG. 4 is a cross-sectional view of the imaging apparatus of the reference example (the same parts as those in FIG. 1 are denoted by the same reference numerals). The imaging device 1 ′ includes an insulating substrate 2 having a recess 2b for accommodating the image sensor 3 on the upper surface, a wiring conductor 5 led out from the bottom surface of the recess 2b to the lower surface of the insulating substrate 2, and a recess 2b. And the window member 4 attached to the upper surface of the insulating substrate 2 so as to cover the recess 2b. The insulating substrate 2 has a flange portion 2c formed at the lower end portion of the side surface thereof. Even in such a case, when the imaging device 1 ′ is an imaging module 10 including the lens 9, the thickness of the insulating substrate 2 can be reduced by bonding and fixing the lens fixing member 8 to the upper surface of the flange 2 c. Since the thickness variation between the upper surface of the flange 2c and the bottom surface of the recess 2b to which the image pickup device 3 is attached can be reduced to reduce the thickness variation, the lens attached to the lens fixing member 8 can be reduced. 9 and the light receiving portion 3a of the image pickup device 3 are reduced in variation in focal length so that the light transmitted through the lens 9 can be incident on the light receiving portion 3a with high accuracy and the mechanical strength of the insulating substrate 2 is maintained. be able to.

Since the imaging device 1 ′ of the reference example can also be manufactured by the same material and method as the imaging device 1 of the present invention, detailed description thereof is omitted.

In the onset bright Contact and Reference Example, the imaging device 1, 1 ', it is preferable that the bottom surface of the top surface and the recess 2b of the flange portion 2c are on the same plane. Accordingly, when the imaging device 1 or 1 ′ is an imaging module 10 including the lens 9, there is no variation in thickness between the upper surface of the flange 2c and the bottom surface of the recess 2b. The focusing performance with the three light receiving portions 3a can be made high.

  In addition, it is preferable that the flatness of the upper surface of the collar part 2c and the bottom face of the recessed part 2b is 5-50 micrometers. If the thickness is less than 5 μm, the production process becomes complicated and the production becomes difficult. On the other hand, if it exceeds 50 μm, the focusing performance between the lens 9 and the light receiving portion 3a tends to be lowered.

Further, in this onset bright Contact and Reference Example, the imaging apparatus 1 and 1 ', the insulating substrate 2, it is preferable that a corner portion between its upper surface and the side surface is chamfered. Thereby, it is effective that the corner portion between the upper surface and the side surface of the insulating substrate 2 is cracked or chipped due to external force from the outside in adhesion fixing of the lens fixing member 8, mounting of the image pickup device 3, and conveyance. Therefore, it is possible to prevent light transmitted through the lens 9 from being blocked by the fragments due to the cracks and chips. In addition, in FIGS. 1-4, this chamfered site | part is shown as the chamfering part 2d.

  The corner chamfered portion 2d between the upper surface and the side surface of the insulating substrate 2 is obtained by laminating and cutting the green sheet to be the insulating substrate 2 described above, and then cutting the corner diagonally. The corner portion is formed by a method such as forming the corner portion with a pressing die or chamfering the corner portion while cutting with a cutting blade provided with a pressing die for chamfering.

  Further, the angle θ formed between the side surface of the insulating substrate 2 and the inclined surface of the chamfered portion 2d is preferably 15 to 45 degrees. When the angle θ is less than 15 degrees, the chamfered portion 2d is reduced in plan view, and an external force is applied to reduce the outer dimension from the side of the insulating substrate 2, and the outer dimension of the insulating substrate 2 varies. On the other hand, when the angle exceeds 45 degrees, the chamfered portion 2d becomes large in plan view, and the insulating substrate 2 is easily increased in size, and an external force is applied from the upper surface side of the insulating substrate 2, and the insulating substrate 2 is likely to be deformed or warped. .

  The chamfered portion 2d at the corner between the upper surface and the side surface of the insulating substrate 2 may have an arc shape on the convex side.

Thus, the imaging apparatus 1, 1 'of the present onset bright Contact and Reference Example, the lower end is joined to an upper surface of the flange portion 2c, the lower end a through-hole 2a in the center portion of the upper surface is formed is opened cylinder The present invention as shown in the cross-sectional view of FIG. 5 is provided with a lens fixing member 8 having a shape and a lens 9 attached to the lens fixing member 8 so as to close the opening of the through hole 8a. Imaging module 10. With this configuration, the mechanical strength can be increased, light can be accurately incident on the light receiving portion 3a of the image sensor 3 to form an image, and the image sensor 3 can accurately convert it into an electrical signal to extract a clear image. it can.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention .

The present onset light of the imaging device is a sectional view showing an example of an embodiment. FIG. 2 is a plan view of an insulating substrate in the imaging device of FIG. 1. It is a top view which shows the other example of the insulated substrate in the imaging device of FIG. It is sectional drawing which shows an example of embodiment about the imaging device of a reference example . It is sectional drawing which shows an example of embodiment about the imaging module of this invention. It is sectional drawing of the conventional imaging device. It is sectional drawing of the conventional optical sensor apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1 ': Imaging device 2: Insulating substrate 2a: Through-hole 2b: Concave part 2c: Chamfering part 3: Imaging element 3a: Light-receiving part 4: Window member 5: Wiring conductor 8: Lens fixing member 9: Lens 10: Imaging module

Claims (4)

A lower substrate having a first through-hole opening in the upper surface and the lower surface, and an upper substrate having a second through-hole opening in the upper surface and the lower surface and disposed on the upper surface of the lower substrate, A recess for accommodating the image sensor is formed by an inner surface of one through hole and a lower surface of the upper substrate, and an insulating substrate in which the second through hole opens at the bottom surface of the recess, said second wiring conductor derived on the lower surface of the insulating substrate from the periphery of the opening of the through hole of the bottom, in a state where the light receiving portion is opposed to the second through-hole, and the second bottom surface of the recess An image sensor in which an electrode is electrically connected to the wiring conductor around a through hole; and a window member attached to the upper surface of the insulating substrate so as to cover the opening of the second through hole. in a side of the insulating substrate, the lower Imaging apparatus characterized by plates projecting laterally than the upper substrate, the flange portion for fixing the lens fixing member is formed. Claim 1 Symbol placement of the image pickup apparatus is characterized in that the upper surface of the flange portion and the bottom surface of the recess are coplanar. The insulating substrate, the imaging apparatus according to claim 1 or claim 2, wherein corner portions, characterized in that it is chamfered between its top and sides. The imaging device according to any one of claims 1 to 3 , and a cylindrical shape in which a lower end is joined to an upper surface of the flange portion, a through hole is formed in a central portion of the upper end surface, and a lower end is opened. An imaging module comprising: a lens fixing member that is attached; and a lens attached to the lens fixing member so as to close the opening of the through hole.

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