JP2005243969A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus that allows light to precisely enter the light reception of an imaging element and accurately converts the incident light to an electric signal by the imaging element. <P>SOLUTION: The imaging apparatus 1 comprises an insulating substrate 2 made of ceramics in which a through hole 2a is formed; an electrode pad formed around the through hole 2a on the main surface at the lower side of the insulating substrate 2; a plurality of projections 8 that are provided at the outer periphery side of the electrode pad on the lower main surface of the insulating substrate 2 and at the outer periphery of the opening edge of the through hole 2a at least by 0.05 mm; a rectangular solid imaging element 3 in which a light reception section 3a is opposingly mounted to the through hole 2a on the lower surface of the projections 8, and an electrode 7 is electrically connected to the electrode pad; and a window member 4 that is mounted to the periphery of the through hole 2a on the upper main surface of the insulating substrate 2 while covering the through hole 2a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an imaging apparatus applied to an optical sensor or the like using an imaging element such as a CCD type or a CMOS type.

  2. Description of the Related Art Conventionally, ceramic devices are known as image pickup devices for housing CCD or CMOS image pickup devices. In recent years, electronic devices with an emphasis on portability are required to be reduced in size and thickness in the market. For this reason, in order to fully meet these requirements, for example, a cross-sectional shape as shown in FIG. 22, an imaging device 21 mainly composed of an imaging element 23 and a sealing material 24 has been proposed.

  The wiring board 22 is made of ceramics or resin and is formed as a thin flat plate, and a wiring area 27 is formed on the lower main surface thereof. In the wiring board 22, an opening 22 a through which light passes is formed, and a frame-like base 28 is provided on the lower main surface of the wiring board 22. The base 28 is joined in a direction substantially orthogonal to the lower main surface of the wiring board 22, and a terminal 29 for external connection is formed at the lower end of the base 28. The base board 28 supports and fixes the wiring board 22 on the external circuit board.

  In addition, the imaging element 23 is disposed on the lower main surface of the wiring board 22 so that the light receiving portion 23a faces the opening 22a. The image pickup device 23 is a chip in which a CCD type and CMOS type light receiving portion 23a is formed at the center of the upper surface of a silicon substrate, and an electrode pad is formed on the outer peripheral portion of the upper surface of the image pickup device 23.

  A protruding electrode (conductor bump) 27 made of gold or the like is formed on the electrode pad. The protruding electrode 27 is connected to the wiring area 25 and led out to the terminal 29 from the wiring area 25 through a wiring conductor (not shown) formed inside the wiring board 22 and the base 28. Further, a transparent sealing material 24 made of glass or the like is bonded to the upper main surface of the wiring board 22 with a resin adhesive or the like so as to close the opening 22a (see, for example, Patent Document 1 below).

  In such a ceramic imaging device 21, the wiring board 22 and the base 28 are manufactured by a ceramic green sheet (hereinafter also referred to as green sheet) lamination method. Specifically, a green sheet for the wiring board 22 made of ceramics and a green sheet for the base 28 made of ceramics are prepared, and wiring conductors from the wiring area 25 of the wiring board 22 to the terminals 29 are provided on these green sheets. A through hole for deriving light and an opening 22a for allowing light to pass through are vertically punched on the upper and lower surfaces of the green sheet.

  Next, tungsten (W) or molybdenum (for wiring conductors 25 formed on the wiring area 22 of the wiring board 22, the terminals 29 of the base 28, and the wiring conductors formed inside the wiring board 22 and the base 28 and led out to the terminals 29. A metal paste made of a refractory metal powder such as Mo) is applied by a conventionally known screen printing method or the like. And the green sheet for wiring boards 22 and the green sheet for base 28 are piled up and down and joined, and these are baked at high temperature to form a sintered body.

  Thereafter, a plated metal layer made of a metal such as nickel (Ni) or gold (Au) is deposited on the exposed surfaces of the wiring area 25 and the terminal 29 from which the wiring conductor is led out by an electroless plating method or an electrolytic plating method. Yes.

  FIG. 9 is a cross-sectional view of an optical sensor device obtained by modularizing the imaging device 21 of FIG. In the imaging device 21, a frame-like base 28 is provided on the lower main surface of the wiring board 22, and a terminal 29 for external connection is provided at the lower end of the base 28. The terminal 29 is connected to an external circuit board. The wiring conductor 36 is connected to the wiring conductor 36 and the like, and is connected and reinforced by the solder 30. In addition, a lens barrel 31 is bonded and fixed on the upper main surface of the wiring board 22 in the imaging device 21 on the outer peripheral side of the sealing material 24.

  In the above configuration, since the imaging device 21 is mounted on the external circuit board 36, a mounting space 32 is formed between the imaging device 21 and the external circuit board 36. On the upper surface of the external circuit board 36 facing the mounting space 32, an electronic component 33 such as a semiconductor element such as an IC or LSI or a connector is attached.

  Then, light incident on the module from the outside passes through the lens 35 from the window 34 of the lens barrel 31 and passes through the transparent sealing material 34. The light that has passed through the sealing material 34 passes through the opening 22 a formed in the wiring board 22 and enters the light receiving portion 23 a of the image sensor 23. The light received by the light receiving unit 23 a of the image sensor 23 is converted into an electric signal and transmitted to the wiring board 22 through the protruding electrode 27. The electrical signal transmitted to the wiring board 22 passes through the wiring conductors inside the wiring board 22 and the base 28 and is output to the outside of the imaging device 21 via the terminal 29 of the base 28.

As described above, when the imaging device 21 is mounted on the external circuit board 36 of the module by providing the base 28 having the terminals 29 formed around the imaging device 23, the imaging device 21 and the external circuit board 36 are The mounting space 32 can be secured in between, and the electronic component 33 can be mounted there by utilizing the mounting space 32. Therefore, it is possible to reduce the size of the module having the imaging device 21 (see, for example, Patent Document 1 below). In addition, when the image pick-up element 23 is a rectangle by planar view, the base 28 may be provided along only the two sides.
JP 2002-299592 A

  However, according to the conventional imaging device 21, since the wiring board 22 is formed of ceramics, the influence of warpage or deformation is likely to occur near the opening of the wiring board 22, and the imaging element 23 is connected to the wiring board. 22 has a problem that it is difficult to join the wire 22 with high accuracy. Therefore, when the subject is photographed, the light passing through the lens 35 does not accurately enter the light receiving portion 23a of the image sensor 23, and the incident light cannot be accurately converted into an electrical signal by the image sensor 23 and extracted. Had.

  If the wiring board 22 becomes very thin as the image pickup device 21 is downsized, the edge of the opening 22a is likely to be deformed, and the edge of the opening 22a is on the lower side. If the image sensor 23 is deformed so as to be convex toward the main surface side, the edge of the opening 22a contacts the image sensor 23 when the image sensor 23 is attached to the wiring board 22, and the image sensor 23 is cracked. It had the problem that.

  Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to make light incident accurately on the light receiving portion of the image sensor, and to accurately convert the incident light into an electrical signal by the image sensor. It is to provide an imaging device that can be taken out.

  An image pickup apparatus according to the present invention includes an insulating substrate made of ceramics with a through hole formed therein, an electrode pad formed around the through hole on the lower main surface of the insulating substrate, and the lower main surface of the insulating substrate. A plurality of protrusions provided on the outer peripheral side of the through hole from the opening edge of the through hole on the outer peripheral side of the electrode pad, and a lower surface of the protrusion abutting the light receiving portion against the through hole And a rectangular parallelepiped imaging element having an electrode electrically connected to the electrode pad, and a window member attached around the through hole on the upper main surface of the insulating substrate so as to cover the through hole. It is characterized by that.

  In the imaging apparatus according to the aspect of the invention, it is preferable that the plurality of projections include two first projections having a step between a side surface and an upper surface on the imaging element side, and the remaining second projections. Both sides of the corner of the upper surface of the element are in contact with the steps of the two first protrusions, respectively.

  In the imaging apparatus according to the aspect of the invention, it is preferable that the second protrusion is formed at a corner portion opposite to the corner portion where the two first protrusions are formed.

  In the imaging device according to the aspect of the invention, it is preferable that the insulating substrate is formed with two side portions opposed to the lower main surface and side wall portions for supporting and fixing the insulating substrate on the upper surface of the external circuit substrate. The second protrusion is formed along a side on which the side wall portion is not formed.

  An imaging device according to the present invention includes an insulating substrate made of ceramics with a through hole formed therein, an electrode pad formed around a through hole in the lower main surface of the insulating substrate, and an electrode pad on the lower main surface of the insulating substrate A plurality of protrusions provided on the outer peripheral side of the outer peripheral side of the through hole more than 0.05 mm from the opening edge of the through hole, and the lower surface of the protrusion are brought into contact with the light receiving portion facing the through hole and the electrode is electrically connected to the electrode pad. A rectangular parallelepiped imaging device and a window member attached around the through hole in the upper main surface of the insulating substrate so as to cover the through hole. As a result, the image sensor is in a state of being separated from the edge of the opening. Even if the edge of the opening is deformed so as to protrude toward the lower main surface of the insulating substrate, the edge of the opening is imaged. Image sensor and insulating substrate that can reduce contact with element The stress applied to the junction of the thermal expansion coefficient difference can be dispersed by a plurality of projections, it is possible to effectively reduce a imaging element cracking. In addition, the image sensor can be easily attached in parallel to the insulating substrate, and the image sensor can be attached to the insulating substrate with high accuracy.

  In the image pickup apparatus of the present invention, preferably, the plurality of protrusions includes two first protrusions having a step between the side surface on the image pickup element side and the upper surface, and the remaining second protrusion, and the upper surface of the image pickup element. Since both sides of the corners of the two abuts against the steps of the two first protrusions, the plurality of protrusions attach the image sensor in parallel to the insulating substrate and Thus, the image sensor can be aligned, and the image sensor can be attached to the insulating substrate with extremely high accuracy.

  In the imaging apparatus of the present invention, preferably, the second protrusion is formed at a corner portion opposite to the corner portion where the two first protrusions are formed. Since it mounts on two or more protrusions, it becomes easy to attach an image pick-up element flatly.

  In the image pickup apparatus of the present invention, preferably, the insulating substrate is formed with side wall portions for supporting and fixing the insulating substrate on the upper surface of the external circuit substrate on two opposite sides of the lower main surface. Since the second protrusion is formed along the side on which the side wall portion is not formed, it is possible to suppress the occurrence of a large deformation due to the influence when the side wall portion is joined to the insulating substrate, and the deformation. This makes it difficult for the influence of the above and others to be transmitted to the second protrusion, and the parallelism between the imaging element and the insulating substrate can be maintained well.

  The imaging apparatus of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an image pickup apparatus of the present invention. FIG. 2 is a bottom view of an insulating substrate in the image pickup apparatus of FIG. Reference numeral 3 denotes an image pickup element, 4 denotes a window member, and 5 denotes a wiring conductor, and the image pickup apparatus 1 is mainly composed of these elements.

  The insulating substrate 2 of the present invention is made of a ceramic such as an aluminum oxide sintered body (alumina ceramics) or an aluminum nitride sintered body, and is molded as a thin flat plate, and a metal powder such as W or Mo is formed on the surface and inside thereof. A wiring conductor 5 made of metallization and having a function of transmitting an electrical signal of the image sensor 3 is formed. A through hole 2a that allows light to pass through is formed at the center, and a light receiving light is formed below the through hole 2a. An image pickup device 3 is attached in which the portion 3a is opposed to the through hole 2a and an electrode 7 (for example, formed of a protruding electrode such as a conductor bump) is electrically connected to the wiring conductor 5. A window member 4 for protecting the light receiving portion 3a of the image sensor 3 is attached to the upper side of the insulating substrate 2 with a resin adhesive or the like.

  When the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. Is formed into a sheet by a conventionally known doctor blade method, calendar roll method, or the like to obtain a green sheet (ceramic raw sheet). Next, a through hole for forming the wiring conductor 5 and a through hole for forming the through hole 2a are formed in the green sheet by punching, and a metal paste that becomes the wiring conductor 5 is printed and applied in a predetermined pattern. Thereafter, these green sheets are laminated and cut to obtain a green sheet molded body for the insulating substrate 2, and finally the molded body is sintered at a high temperature (about 1600 ° C.).

  The wiring conductor 5 deposited on the insulating substrate 2 functions as a conductive path for transmitting the electric signal of the image sensor 3 to the terminal 6 for external connection, and a part of the wiring conductor 5 is below the insulating substrate 2. It is formed around the through hole 2 a on the side main surface and is formed as an electrode pad connected to the electrode 7 of the image sensor 3. In addition, the wiring conductor 5 is formed by applying a metal paste obtained by adding and mixing an appropriate organic solvent and solvent to a refractory metal powder such as W or Mo on a green sheet to be the insulating substrate 2 by a screen printing method in advance. By being printed and coated on the insulating substrate 2, it is deposited on a predetermined position of the insulating substrate 2.

  In addition, when a metal having excellent corrosion resistance such as nickel or gold is deposited on the exposed surface of the wiring conductor 5 to a thickness of about 1 to 20 μm, the wiring conductor 5 can be effectively prevented from being oxidized and corroded, The connection between the wiring conductor 5 and the electrode 7 of the imaging device 3 can be made strong. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 5 by an electrolytic plating method or an electroless plating method. preferable.

  Further, below the through hole 2a at the center of the insulating substrate 2, an image pickup device 3 in which a CCD type and CMOS type light receiving part 3a is formed on a silicon substrate is disposed. An electrode 7 such as gold is formed on the outer periphery of the image sensor 3, and the electrode 7 is connected to the wiring conductor 5. The image sensor 3 is connected to the external electric circuit via the wiring conductor 5. Is electrically connected.

  A transparent window member 4 made of glass, sapphire or the like is disposed and bonded around the through hole 2a on the upper main surface of the insulating substrate 2, and the window member 4 is insulated by a resin adhesive such as epoxy resin. 2 is bonded to the periphery of the through hole 2a to protect the light receiving portion 3a of the image sensor 3 such as a CCD type or a CMOS type.

  The imaging element 3 is flip-chip bonded to the wiring conductor 5 whose electrode 7 is plated with nickel, gold, or the like of the insulating substrate 2 by, for example, an ultrasonic bonding method. The flip chip bonding by the ultrasonic bonding method is a bonding method in which bonding is performed by applying ultrasonic vibration of about 0.5 seconds to the bonding portion while pressurizing the bonding portion at room temperature. A dam (not shown), which is a sealing resin layer made of a resin that reinforces the joint and seals it, is applied and formed around the joint of the image sensor 3. This dam is obtained by increasing the viscosity of the epoxy resin, and the thixo ratio, which is an index of the strength of maintaining the shape of the resin, should be as large as 1.7 or more.

  And the some protrusion 8 provided in the outer peripheral side 0.05 mm or more from the opening edge of the through-hole 2a in the outer peripheral side rather than the electrode pad of the lower main surface of the insulated substrate 2 is formed, and the image pick-up element 3 is the following. The light receiving portion 3a is brought into contact with the lower surface of the protrusion 8 so as to face the through hole 2a. Accordingly, the imaging element 3 is separated from the edge of the opening by the plurality of protrusions 8, and thus the imaging element 3 and the imaging element 3 are protruded to the lower main surface side of the insulating substrate 2. Stress applied to these joints due to a difference in thermal expansion coefficient with the insulating substrate 2 can be dispersed by the plurality of protrusions 8, and cracking of the image sensor 3 can be effectively reduced. Moreover, it becomes easy to attach the image sensor 3 in parallel to the insulating substrate 2, and the image sensor 3 can be attached to the insulating substrate 2 with high accuracy.

  Such a protrusion 8 is made of a metallized layer made of tungsten, molybdenum, copper, silver or the like, or an insulating layer made of a material substantially the same as that of the insulating substrate 2, and when the protrusion 8 is made of a metallized layer, tungsten or molybdenum. A metallized paste obtained by adding and mixing a suitable organic binder, solvent, plasticizer, dispersant, etc. to metal powder composed of copper, silver, etc. is applied to a ceramic green sheet for the insulating substrate 2 by a conventionally known screen printing method. This pattern is printed and applied and fired together with the green ceramic molded body for the insulating substrate 2 to form a predetermined pattern on the lower main surface of the insulating substrate 2. Further, when the protrusion 8 is made of a metallized layer, for example, in order to effectively prevent the protrusion 8 from being oxidatively corroded, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold layer having a thickness of about 0.1 to 3 μm are used. A plating layer is preferably applied.

  Further, if the protrusion 8 is formed at a portion of less than 0.05 mm from the opening edge of the through hole 2a, the protrusion 8 is easily affected by the deformation of the opening edge of the through hole 2a, and the image sensor 3 is insulated. It becomes difficult to attach in parallel to the substrate 2. Further, the opening edge of the through hole 2a is more easily deformed due to the influence of the protrusion 8 when the insulating substrate 2 is formed. Further, when the protrusion 8 is formed, if it is applied to the inner peripheral surface of the through hole 2a due to printing misalignment or the like, the light incident from the upper opening of the through hole 2a may be blocked. For this reason, the protrusion 8 is formed on the outer peripheral side by 0.05 mm or more from the opening edge of the through hole 2a.

  The plurality of protrusions 8 are preferably formed at positions that do not overlap with the wiring conductor 5 in plan view, whereby the plurality of protrusions 8 are formed at the same height on the lower main surface of the insulating substrate 2. Thus, the image pickup device 3 can be satisfactorily attached to the insulating substrate 2.

  Further, as shown in the cross-sectional view of the image pickup apparatus 1 in FIG. 3 and the bottom view of the insulating substrate 2 in the image pickup apparatus 1 in FIG. The two first protrusions 8a and the remaining second protrusions 8b are provided on both sides of the bottom surface of the image pickup device 3 and are in contact with the steps of the two first protrusions 8a. Is good. As a result, the imaging element 3 can be attached in parallel to the insulating substrate 2 by the plurality of protrusions 8, and the imaging element 3 can be aligned at the level difference between the two first protrusions 8 a. Can be attached to the insulating substrate 2 with high accuracy. Accordingly, it is possible to make light incident on the light receiving portion 3a of the image pickup device 3 with high accuracy, and to convert the incident light into an electrical signal accurately by the image pickup device 3 and take it out.

  The second protrusion 8b is preferably formed at a corner portion opposite to the corner portion where the two first protrusions 8a are formed. Thereby, since the image pick-up element 3 is mounted on the three protrusions 8 including a corner | angular part, it becomes easy to attach the image pick-up element 3 flatly.

  Such a second protrusion 8b may be formed so as to be in contact with the apex of the corner of the image sensor 3 facing the corner of the image sensor 3 on which the two first protrusions 8a are formed. You may form in the at least one side part of the both sides of the corner | angular part of the image pick-up element 3 facing the corner of the image pick-up element 3 in which the two 1st protrusions 8a were formed.

  5 is a cross-sectional view of the imaging device 1, FIG. 6 is a bottom view of the insulating substrate 2 in the imaging device 1 of FIG. 5, and FIG. 7 is a cross-sectional view of an optical sensor device configured using the imaging device 1 of FIG. As shown, the insulating substrate 2 may be formed with side wall portions 2b for supporting and fixing the insulating substrate 2 on the upper surface of the external circuit substrate 16, respectively, on two opposing sides of the lower main surface.

  Preferably, the insulating substrate 2 is formed with side wall portions 2b for supporting and fixing the insulating substrate 2 on the upper surface of the external circuit substrate 16 on the two opposing sides of the lower main surface, respectively, and the second protrusions. 8b is good to be formed along the edge | side of the side in which the side wall part 2b is not formed. As a result, it is possible to suppress the occurrence of large deformation due to the effect of joining the side wall 2b to the insulating substrate 2, and it is difficult for the influence of the deformation or the like to be transmitted to the second protrusion 8b. The parallelism with 2 can be maintained well.

  Such a side wall 2b is made of ceramics such as an aluminum oxide sintered body (alumina ceramics) and an aluminum nitride sintered body, which are the same material as that of the insulating substrate 2, and an electric signal of the image pickup device 3 is passed through the wiring conductor 5. It is for taking out outside. For this reason, a wiring layer (not shown) is formed inside or on the surface of the side wall 2b. This wiring layer is an organic material suitable for refractory metal powders such as W and Mo, which are made of the same material as the wiring conductor 5. A metal paste obtained by adding and mixing a solvent and a solvent is preliminarily printed and applied in a predetermined pattern on the green sheet to be the side wall 2b by a screen printing method, thereby being deposited on a predetermined position on the side wall 2b. . One end of the wiring layer is formed so as to be electrically connected to the wiring conductor 5, and the other end is formed on the lower end of the side wall portion 2b by the same method using the same material as the wiring layer. It is derived so as to be connected to the terminal 9.

  The side wall portion 2b also functions as a support for the insulating substrate 2. When the imaging device 1 is mounted with the terminal 9 at the lower end thereof connected to a wiring conductor or the like of the external circuit substrate 16, the imaging device 1 and the outside are mounted. A mounting space 12 is formed between the circuit board 16 and an electronic component 13 such as an IC, LSI, or connector is mounted on the upper surface of the external circuit board 16 corresponding to the mounting space 12 or the lower main surface of the insulating substrate 2. Can do. Therefore, when the imaging device 1 is used as an optical sensor device mounted on the external circuit board 16 or the like, the optical sensor device can be reduced in size.

  The side wall 2b is formed by punching through holes for forming a wiring layer connected to the terminals 9 in a green sheet similar to the insulating substrate 2, and a metal paste that becomes the wiring layers and the terminals 9 is formed. A predetermined pattern is printed and applied. Thereafter, these green sheets are sequentially laminated on the green sheet to be the insulating substrate 2 and cut to obtain a molded body integrated with the green sheet for the insulating substrate 2. Finally, the molded body is heated to a high temperature (about 1600 ° C.).

  The wiring layer of the side wall 2b and the exposed surface of the terminal 9 effectively prevent oxidative corrosion, and the bonding state between the wiring conductor 5 of the insulating substrate 2 and the wiring layer of the side wall 2b, the terminal 9 and the outside In order to improve the bonding state of the circuit board 16 with the wiring conductor, a copper plating layer, nickel plating layer, or gold plating layer having a thickness of about 1 to 20 μm is deposited by electrolytic plating or electroless plating. These plating layers may be applied sequentially.

  When the imaging device 1 is a module including the lens 15, the light receiving unit 3 a and the lens of the imaging device 3 are suppressed because tilting and rattling of the imaging device 3 with respect to the insulating substrate 2 due to large deformation and warping are suppressed. 15 can be adjusted with high accuracy, and light passing through the lens 15 through the window 14 of the lens barrel 11 can be accurately incident on the light receiving portion 3a of the image pickup device 3 and is incident. Light can be accurately converted into an electrical signal by the image pickup device 3 and extracted.

  Thus, in the imaging apparatus 1 of the present invention, the external circuit board 16 is connected to the lower end of the side wall part 2b via the solder 10 or the like, and the lens barrel is provided on the outer peripheral part outside the window member 4 on the upper main surface of the insulating board 2. 11 is bonded and fixed to form an optical sensor device.

  The imaging device of the present invention was evaluated in the following examples.

  First, after punching a ceramic green sheet of alumina ceramics to form a 3 mm square through hole 2a, a metal paste containing W powder was printed to form a wiring conductor 5 and an electrode pad.

  Further, this metal paste is printed, and the protrusion 8 having a thickness of 0.01 mm is variously spaced from the opening edge of the through hole 2a (0.02 mm, 0.04 mm, 0.05 mm, 0.08 mm and 0.10 mm). A plurality were formed at the sites.

  And this ceramic green sheet was baked at 1600 degreeC, and the insulated substrate 2 (sample No. 1-5) was formed.

And the deformation state of the opening edge of each through-hole 2a of these five types of insulating substrates 2 and the parallel state of the plurality of protrusions 8 were evaluated. In addition, as a deformation | transformation state of the opening edge of the through-hole 2a, what the difference in height of an opening edge and an electrode pad is 0.01 mm or less was determined as a non-defective product. Further, the parallel state of the plurality of protrusions 8 was determined as a good product when the parallelism of the insulating substrate with respect to the surface formed by the plurality of protrusions 8 was 0.01 mm or less. The results are shown in Table 1.

  According to Table 1, the sample No. 8 in which the protrusion 8 is formed at a site at a distance of 0.05 mm or more from the opening edge of the through hole 2a. 3-No. 5, the deformation state of the opening edge was 0.01 mm or less, and the parallel state of the protrusion 8 was 0.01 mm or less, which was found to be excellent (indicated by a circle in the table).

  In addition, the sample No. 8 in which the protrusion 8 is formed at a portion shorter than the distance of 0.05 mm from the opening edge of the through hole 2a. 1 and no. 2, the deformation of the opening edge exceeded 0.01 mm, and the parallel state of the protrusion 8 exceeded 0.01 mm (indicated by x in the table).

  Therefore, by forming the protrusions 8 at a portion having a distance of 0.05 mm or more from the opening edge of the through hole 2a, the influence of the deformation of the opening edge can be reduced and the deformation of the opening edge can be reduced. It was found that the image pickup device 3 can be attached in parallel to the insulating substrate 2 by contacting the projection 8 so that the light receiving portion 3a faces the through hole 2a.

  Note that the present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the scope of the present invention.

It is sectional drawing which shows an example of embodiment about the imaging device of this invention. It is a bottom view of the insulating substrate in the imaging device of FIG. It is sectional drawing which shows the other example of embodiment about the imaging device of this invention. FIG. 4 is a bottom view of an insulating substrate in the imaging device of FIG. 3. It is sectional drawing which shows the other example of embodiment about the imaging device of this invention. FIG. 6 is a bottom view of an insulating substrate in the imaging device of FIG. 5. It is sectional drawing of the optical sensor apparatus comprised using the imaging device of FIG. It is sectional drawing of the conventional imaging device. It is sectional drawing of the optical sensor apparatus comprised using the imaging device of FIG.

Explanation of symbols

1: Image pickup device 2: Insulating substrate 2a: Through hole 2b: Side wall portion 3: Image pickup element 3a: Light receiving portion 4: Window member 5: Wiring conductor 7: Electrode 8: Protrusion 8a: First protrusion 8b: Second protrusion

Claims (4)

An insulating substrate made of ceramics with a through hole formed thereon, an electrode pad formed around the through hole on the lower main surface of the insulating substrate, and an outer periphery than the electrode pad on the lower main surface of the insulating substrate And a plurality of protrusions provided on the outer peripheral side of 0.05 mm or more from the opening edge of the through hole on the side, and the lower surface of the protrusion is brought into contact with the light receiving portion facing the through hole and the electrode is attached to the electrode pad A rectangular parallelepiped imaging device electrically connected, and a window member attached around the through hole on the upper main surface of the insulating substrate so as to cover the through hole. An imaging device. The plurality of protrusions includes two first protrusions having a step between the side surface and the upper surface on the image sensor side and the remaining second protrusion, and both sides of the corners on the upper surface of the image sensor are The imaging apparatus according to claim 1, wherein the imaging device is in contact with the step of the two first protrusions. The imaging apparatus according to claim 2, wherein the second protrusion is formed at a corner portion opposite to the corner portion where the two first protrusions are formed. In the insulating substrate, side walls for supporting and fixing the insulating substrate on the upper surface of the external circuit board are formed on two opposing sides of the lower main surface, and the second protrusion is formed on the side wall. The imaging apparatus according to claim 1, wherein the imaging device is formed along a side on which the portion is not formed.

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