KR101032725B1 - Camera module and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a camera module and a method of manufacturing the same, comprising a image sensor for converting an incident optical image into an electrical signal, comprising: a window through which the optical image passes through the image sensor on an uppermost substrate Forming an upper surface of the image sensor; stacking and pressing a plurality of substrates on the lower surface of the uppermost substrate to form an embedded printed circuit board having an embedded area accommodating the image sensor; Forming a first through hole penetrating the embedded printed circuit board and a second through hole penetrating between the uppermost substrate and the image sensor; forming a circuit pattern on a surface of the embedded printed circuit board Include.

Camera Module, Embedded, EPCB, Image Sensor, Through Hole

Description

Camera module and manufacturing method thereof

The present invention relates to a camera module mounted on a portable terminal and the like and a method of manufacturing the same.

Recently, the demand for small camera modules is increasing for various multimedia fields such as notebook personal computers, camera phones, PDAs, smart phones, toys, and image input devices such as surveillance cameras and video terminals of video take recorders. .

Mobile phones, in particular, have a huge impact on design, which demands smaller camera modules.

The camera module is manufactured using an image sensor chip of a CCD or CMOS, and collects an object through a lens on the image sensor chip, converts an optical signal into an electrical signal, and displays the object on a display medium such as an LCD display device. Pass the video so that.

In general, the height portion of the camera module is the sum of the lens height (TTL, Through The Lens), the image sensor height, and the thickness of the printed circuit board. The higher the TTL of the lens, the better the resolution of the camera. Therefore, in order to reduce the size and performance of the camera module, the TTL of the lens should be sufficiently secured at a certain camera module height.

However, in the conventional camera module, since an image sensor is attached to a printed circuit board (PCB), it is difficult to realize miniaturization and high performance of the camera module.

The present invention provides a camera module capable of miniaturization and high performance and a manufacturing method thereof.

According to an aspect of the present invention, a plurality of uppermost substrates are arranged in a lower portion of an upper surface of the substrate to have an image sensor arranged at a lower portion of the lens unit to receive an optical image of an object and converting the optical image into an electrical signal, and a built-in area for receiving the image sensor. A substrate formed by stacking substrates, and a window through which the optical image passes through the image sensor is formed on the uppermost substrate, and an upper surface of the uppermost substrate and an upper surface of the image sensor are electrically connected by a first through hole. A camera module including a printed circuit board is provided.

According to another feature of the invention, there is provided a camera module manufacturing method comprising an image sensor for converting an incident optical image into an electrical signal. The method comprises the steps of forming a window for passing the optical image to the image sensor on a top substrate, laminating the top substrate on an upper surface of the image sensor, stacking and pressing a plurality of substrates on a bottom surface of the top substrate; Forming an embedded printed circuit board having an embedded area accommodating the image sensor, forming a first through hole penetrating the embedded printed circuit board and a second through hole penetrating between the uppermost substrate and the image sensor The method may include forming a circuit pattern on a surface of the embedded printed circuit board.

In an embodiment of the present invention, by accommodating the image sensor on the printed circuit board, the total thickness of the camera module may be reduced by the thickness allocated to the image sensor. The margin of the lens height (TTL, Through The Lens) of the lens unit increases by the thickness allocated to the image sensor, thereby realizing miniaturization and high performance of the camera module.

 In addition, by electrically connecting the image sensor and the printed circuit board using a through hole, a separate manufacturing process such as die bonding and wire bonding is not performed. You can.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Now, a camera module and a method for manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Sometimes.

1 is a schematic configuration diagram of a camera module according to an exemplary embodiment of the present invention, FIG. 2 is an enlarged view of a printed circuit board, and FIG. 3 is a plan view of an uppermost substrate according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the camera module includes a lens barrel 10, a holder 20, an IR filter 30, an image sensor 40, and a printed circuit board 50.

The lens barrel 10 is a means for fixing and protecting a plurality of lenses (not shown). The lens barrel 10 includes a plurality of lenses that can enter an optical image of a subject inside the lens barrel 10.

The holder 20 faces the inner circumferential surface of the outer circumferential surface of the lens barrel 10 and is also a case for protecting the IR filter 30 and the image sensor 40.

The IR filter 30 is an infrared filter arranged under the lens barrel 10 and blocks infrared rays included in the optical image incident from the lens.

The image sensor 40 converts the optical image blocked by the IR filter 30 into an electrical signal and is received in the embedded area 51 of the printed circuit board 50.

As shown in FIG. 2, the printed circuit board 50 is a substrate formed by stacking a plurality of substrates B1 to Bn on an outer layer board A, and accommodates an image sensor 40. An embedded region 51 accommodating the image sensor 40 is formed by an embedded printed circuit board (EPCB) formed by stacking a plurality of substrates B1 to Bn.

As shown in FIG. 3, the uppermost substrate A is provided with a window 52 through which an optical image incident through the lens can pass through the image sensor 40.

The printed circuit board 50 of the present invention is a substrate formed by applying pressure while a plurality of substrates (B1 to Bn in FIG. 2) are stacked on the uppermost substrate A. The uppermost substrate A and the plurality of substrates B1 are formed. Bn) is an embedded printed circuit board formed by stacking.

Various circuit patterns may be formed on the surface of the printed circuit board 50 according to an applied device, and elements 70 such as driver ICs may be mounted on one side of the upper surface of the uppermost substrate A of the printed circuit board 50. Can be. The device 70 may be any one of an active device and a passive device.

As described above, in the present invention, by accommodating the image sensor 40 on the printed circuit board 50, the total thickness of the camera module may be reduced by the thickness allocated to the image sensor 40.

The margin of the lens height (TTL, Through The Lens) of the lens unit increases by the thickness allocated to the image sensor 40, thereby making it possible to realize miniaturization and high performance of the camera module.

4 is a flowchart illustrating a manufacturing method of a camera module according to an exemplary embodiment of the present invention, and FIG. 5 is a diagram illustrating a manufacturing process according to the flowchart of FIG. 4.

As shown in FIGS. 4 and 5A, first, a window 52 through which an optical image is passed through the image sensor 40 is formed on the uppermost substrate A of the printed circuit board 50 (S301). At this time, the upper surface area of the window 52 is smaller than the upper surface area of the image sensor 40.

In order to prevent the image sensor 40 from being corroded by the etching solution, the first resist 81 is coated on the upper surface 41 of the image sensor 40 (S302).

Then, the uppermost substrate A is laminated on the upper surface 41 of the image sensor 40 (S303).

5B, the plurality of substrates B1 to Bn are stacked while forming the embedded region 51 so that the image sensor 40 is accommodated in the printed circuit board 50. The printed circuit board on which the plurality of substrates B1 to Bn are stacked is an embedded printed circuit board (EPCB) having an embedded area 51 (S304).

As shown in FIG. 5C, a through hole 82a is formed to electrically connect the uppermost substrate A and the plurality of substrates B1 to Bn, and the upper surface of the uppermost substrate A and the image sensor. Through-holes 82b for electrically connecting the upper surface of the 40 are formed (S305).

As shown in FIG. 5D, the upper and lower surfaces of the printed circuit board 50 are plated to form a plating layer 83 (S306). In this case, the plating layer may be formed in the through holes 82a and 82b so that the top layer substrate A and the image sensor 40 may be electrically connected to the through holes 82b.

As shown in FIG. 5E, the second resist 84 is laminated at the position where the circuit pattern is to be formed in the plating layer 83 (S307).

As shown in FIG. 5F, the plating layer 83 other than the plating layer 83 on which the second resist 84 is stacked is selectively removed using an etching solution (S308).

Next, as shown in FIG. 5G, a reaction solution reacting with the first resist 81 and the second resist 84 is injected to remove the first resist 81 and the second resist 84 (S309). ).

As described above, in the present invention, by accommodating the image sensor 40 on the printed circuit board 50, the total thickness of the camera module can be reduced by the thickness assigned to the image sensor 40.

In addition, a through hole 82b is formed between the image sensor 40 and the printed circuit board 50 to electrically connect the image sensor 40 and the printed circuit board 50 by the through hole 82b. The electronic device may be electrically connected between the image sensor 40 and the devices attached to the upper surface of the printed circuit board 50 without separate processes such as die bonding and wire bonding. The present invention can improve the process yield by shortening the manufacturing time by not performing die bonding and wire bonding.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

1 is a schematic configuration diagram of a camera module according to an embodiment of the present invention.

2 is an enlarged view of a printed circuit board.

3 is a plan view of an uppermost substrate according to an embodiment of the present invention.

4 is a flowchart illustrating a manufacturing method of a camera module according to an exemplary embodiment of the present invention.

5 is a diagram illustrating a manufacturing process according to the flowchart of FIG. 4.

Claims (10)

An image sensor arranged at a lower portion of the lens unit to receive the optical image of the subject, and converting the optical image into an electrical signal; A substrate is formed by stacking a plurality of substrates on a top substrate to have a built-in area for accommodating the image sensor. The top substrate includes a window through which the optical image passes through the image sensor, and an upper surface of the top substrate and the image. The upper surface of the sensor includes an embedded printed circuit board electrically connected by the first through hole, A circuit pattern is formed on the uppermost substrate of the embedded printed circuit board, and a device is mounted on an upper surface of the uppermost substrate, and the image sensor and the device are electrically connected by the first through hole. delete delete The method of claim 1, The width of the window is smaller than the width of the image sensor. The method of claim 1, And a second through hole formed in the embedded printed circuit board to electrically connect the uppermost substrate and the plurality of substrates. In the camera module manufacturing method comprising an image sensor for converting the incident light image into an electrical signal, (a) forming a window in the uppermost substrate to pass the optical image to the image sensor, (b) depositing the uppermost substrate on the upper surface of the image sensor, (c) stacking and pressing a plurality of substrates on a lower surface of the uppermost substrate to form an embedded printed circuit board having an embedded area accommodating the image sensor; (d) forming a first through hole penetrating the embedded printed circuit board and a second through hole penetrating between the uppermost substrate and the image sensor; and (e) forming a circuit pattern on a surface of the embedded printed circuit board. The method of claim 6, Following step (a), And applying a first resist to the top surface of the image sensor. The method of claim 7, wherein Following step (e), And removing the first resist. The method of claim 6, In step (e), Forming a plating layer by plating upper and lower surfaces of the embedded printed circuit board; Stacking a second resist at a position where the circuit pattern is to be formed in the plating layer; Selectively removing a plating layer other than the plating layer on which the second resist is laminated using an etching solution, and Removing the second resist. The method of claim 6, And the width of the window is smaller than that of the image sensor.

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