JP2007123444A - Package for housing optical element, optical device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing an optical element applicable to the manufacture of an optical device more superior in the light reception accuracy, and to provide the optical device manufactured by using the package for housing the optical element, and to provide its manufacturing method. <P>SOLUTION: The package X for housing an optical element comprises an insulating substrate 10, including a mounting part 11a for mounting an optical element D comprising a light emitter (or a light-receiving part) Da; and a cover 30 comprising a transparent light transmitter 31 and a through-hole 32 that are opened to face the mounting part 11a at its one end, and opened to an external space at the other end for specifying a housing space S for housing the optical element D, together with the insulating substrate 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical element storage package for storing an optical element including a light emitting portion such as a light emitting diode and a semiconductor laser element, and a light receiving portion such as a photodiode and a phototransistor, and an optical device using the optical element storage package And a manufacturing method thereof.

  An optical element storage package for storing an optical element including a light receiving portion such as a photodiode includes an insulating base having a mounting portion for mounting the optical element on the bottom surface of the concave portion, and an outside from the inside of the concave portion of the insulating base. In some cases, a wiring conductor extending between and a lid body including a translucent portion having translucency at the center is provided. The optical element usually has a light receiving portion located at the center of the upper surface and an electrode located at the outer peripheral portion, and is mounted on the mounting portion and electrically connected to the wiring conductor via a bonding wire.

  The optical device using the optical element storage package having such a configuration has the optical element mounted on the insulating base mounting portion, and after the electrical connection between the electrode of the optical element and the wiring conductor is achieved, It is manufactured by bonding a lid through a bonding material so as to close the concave portion on the upper surface. In the optical device thus manufactured, external light reaching the optical element through the lid is received by the light receiving unit, and the external light is converted into an electrical signal. The electrical signal generated by this conversion is propagated to various devices arranged outside the optical device via the wiring conductor.

A method for manufacturing an optical device using the above-described conventional optical element storage package will be described below. First, after mounting the optical element on the mounting portion of the insulating base, the electrode of the optical element and the wiring conductor of the insulating base are connected by a bonding wire. Next, a visual inspection of the interior is performed (internal inspection process), and fine foreign substances adhering to the upper surface (particularly the light receiving portion) of the optical element are confirmed and removed. Next, a lid is attached to the upper surface of the insulating base so as to cover the mounting portion, and the optical element is hermetically sealed. This hermetic sealing is performed by applying a bonding material (for example, an uncured resin adhesive) to the outer peripheral portion of the upper surface of the insulating base, mounting a lid from above, and curing the bonding material.
JP 2005-159277 A

  However, in the above-described manufacturing method, during the handling from the inside inspection process until the lid is attached and the work inside the lid sealing device, the outside air and fine foreign matters existing around the mounting portion are exposed to the upper surface of the optical element. May adhere to the surface. If such foreign matter adheres, external light may not be properly received by the light receiving unit, so that the optical device manufactured by the above-described manufacturing method can ensure sufficient light receiving accuracy. There were cases where it was not possible. In particular, in recent years, an optical element including a light receiving portion such as a photodiode is formed with a very fine light receiving portion due to demands for finer images and higher detection accuracy as a sensor. In some cases, even if a minute foreign matter is slightly attached to the light receiving portion, sufficient light receiving accuracy cannot be ensured in the optical device.

  The present invention has been conceived under such circumstances, and is an optical element storage package that is applied to manufacture an optical device with higher light receiving accuracy, and the optical element storage An object of the present invention is to provide an optical device manufactured using a package and a method for manufacturing the same.

  An optical element storage package according to a first aspect of the present invention includes an insulating substrate having a mounting part for mounting an optical element including a light emitting part and / or a light receiving part, and a translucent part having translucency. And a lid body that has a through-hole that opens so that one end faces the mounting portion and the other end opens to the external space, and that defines a storage space for storing the optical element together with the insulating base; It is characterized by providing. Here, the light emitting part and / or the light receiving part is a description of the meaning including the light emitting part and the light receiving part and the light emitting part or the light receiving part, and the same applies to the following.

  In the optical element storage package according to the first aspect of the present invention, the light transmitting portion faces the light emitting portion and / or the light receiving portion of the optical element mounted on the mounting portion of the insulating base. It is preferable that it is formed in the site to be. Here, the light emitting unit and / or the light receiving unit is a description that includes the light emitting unit, the light receiving unit, and the light emitting unit or the light receiving unit, and the same applies to the following.

  In the optical element storage package according to the first aspect of the present invention, the through hole faces the light emitting part and / or the light receiving part of the optical element mounted on the mounting part of the insulating base. It is preferably formed at a site other than the site.

  An optical device according to a second aspect of the present invention seals an optical element storage package according to the first aspect of the present invention, an optical element mounted on the mounting portion of the insulating base, and the through hole. And a sealing material.

  The manufacturing method of the optical device according to the third aspect of the present invention includes the light mounted on the mounting portion of the insulating substrate having the mounting portion for mounting the optical element including the light emitting portion and / or the light receiving portion. A first removal step of removing foreign matter present on the surface of the light emitting part and / or the light receiving part of the element; a translucent part having translucency; and one end opened to face the mounting part and the other end An attaching step of attaching a lid body, which has a through-hole opened in an external space, and defining a storage space for storing the optical element together with the insulating base to the insulating base, and an optical element that has undergone the mounting step A second removing step of removing foreign matter present on the surface of the light emitting portion and / or the light receiving portion with a removing tool inserted through the through hole, and a sealing step of sealing the through hole with a sealing material It is characterized by including these.

  The method for manufacturing an optical device according to the third aspect of the present invention depends on the degree of the presence of foreign matter on the surface of the light emitting portion and / or the light receiving portion of the optical element after the attaching step and before the second removing step. It is preferable to further include a sorting step for performing sorting.

  The optical element storage package according to the first aspect of the present invention has a through hole having one end opened so as to face the mounting portion and the other end opened to the outside, and stores the optical element together with the insulating base. And a lid that defines a storage space for the purpose. Therefore, in this optical element storage package, even after the lid is attached to the insulating base with a bonding material so as to store the optical element mounted on the mounting portion of the insulating base, the removal tool is inserted through the through hole of the lid. (For example, one having a sticky part containing a mixture of vinyl resin or methyl isobutyl ketone (MIBK) at the tip of a plastic rod-like member) is present on the surface of the light emitting part or light receiving part of the optical element. It is possible to remove foreign matter. Therefore, in this optical element storage package, even if the outer surface of the optical element or fine foreign matter existing around the mounting part adheres to the surface of the optical element during handling until the lid is attached or during the lid sealing operation. In addition, since fine foreign matters and the like can be appropriately removed after the lid is mounted, more excellent light emission accuracy and light reception accuracy can be obtained. Here, the light emission accuracy is an index representing the degree of refinement that can appropriately transmit an optical signal from the light emitting unit to the outside, for example, and the light receiving accuracy is an appropriate value of the optical signal from the outside at the light receiving unit, for example. This is an index representing the degree of refinement that can be received.

  In this optical element storage package, it is preferable that the translucent part is formed at a part facing the light emitting part and / or the light receiving part of the optical element mounted on the mounting part of the insulating base. In such a configuration, when light is emitted from the light emitting part of the optical element (light emission) and light is received at the light receiving part of the optical element, the characteristics of the light emitting part and the light receiving part of the optical element that are the most important are the characteristics. The translucent part is formed including the opposing part. Therefore, the optical element storage package of this configuration is suitable for further improving the light emission accuracy, light reception accuracy, and reliability of the optical element.

  In this optical element storage package, it is preferable that the through hole is formed in a portion other than the portion facing the light emitting portion and / or the light receiving portion of the optical element mounted on the mounting portion of the insulating base. In such a configuration, when light is emitted from the light emitting part of the optical element (light emission) and light is received at the light receiving part of the optical element, the characteristics of the light emitting part and the light receiving part of the optical element that are the most important are the characteristics. It is possible to effectively prevent the light emitted or received from being distorted or irregularly reflected due to the presence of the through hole in the facing portion. Therefore, the optical element storage package of this configuration is suitable for further improving the light emission accuracy, light reception accuracy, and reliability of the optical element.

  An optical device according to a second aspect of the present invention seals an optical element storage package according to the first aspect of the present invention, an optical element mounted on the mounting portion of the insulating base, and the through hole. And a sealing material. Therefore, in the present optical device, as described above, the fine foreign matter and the like can be removed after mounting the lid, and the through hole of the lid can be sealed with the sealing material. Therefore, this optical device is superior in light emission accuracy, light reception accuracy, and the like.

  The method for manufacturing an optical device according to the third aspect of the present invention removes foreign matter present on the surface of the light emitting portion and / or the light receiving portion of the optical element that has undergone the attachment process by a removal tool inserted through the through hole. A second removal step. Therefore, in this method, an optical device can be manufactured after inserting a removal tool through the through-hole of the lid to remove foreign substances present on the surface of the light emitting part and the light receiving part of the optical element. Therefore, in this method, even if fine foreign matter or the like existing around the outside air or the mounting portion adheres to the surface of the optical element by the time when the mounting process is completed, the fine foreign matter or the like is appropriately removed in the second removal step. Since it can be removed, it is possible to manufacture an optical device with better light emission accuracy and light reception accuracy.

  Preferably, the manufacturing method further includes a selection step of performing selection based on the degree of the presence of foreign matter on the surface of the light emitting portion and / or the light receiving portion of the optical element after the attachment step and before the second removal step. According to such a method, what needs to go through the second removal step after sorting out those that need to go through the second removal step (the presence of foreign matter is above the standard) and those that don't. Only the second removal step can be selectively performed. Therefore, this method is suitable for improving productivity.

  FIG. 1 is a cross-sectional view showing an optical device Y in which an optical element D is accommodated in an optical element accommodation package X according to an embodiment of the present invention. FIG. 2 is a plan view showing the optical device Y shown in FIG.

  The optical element storage package X has an insulating base 10, a wiring conductor 20, and a lid 30 for storing the optical element D therein. The optical element D is a light emitting element having a function of emitting light or a light receiving element having a function of receiving light (function of sensing light). In the present embodiment, the light emitting unit (or from the outside) for emitting light toward the outside. Light receiving portion) Da for receiving the light, and electrodes Db for power supply and signals on the upper surface. Examples of the light emitting element include a light emitting diode (LED) and a semiconductor laser (LD). Examples of the semiconductor chip having the light emitting element include an LED chip and an LD chip. Examples of the light receiving element include a photodiode (PD) and a phototransistor. Semiconductor chips having the light receiving element include a line sensor, an image sensor, a charge coupled device (CCD), an EPROM (Erasable and Programmable Read Only Memory). ) And the like. The storage space S for storing the optical element D is mainly defined by the insulating base 10 and the lid 30.

  The insulating base 10 has a recess 11 and has, for example, a substantially square shape or a substantially rectangular shape in plan view. Examples of the material constituting the insulating substrate 10 include ceramics, resins, and composite materials of ceramics and resins. Here, ceramics means an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body (aluminum nitride ceramic), a silicon carbide sintered body (silicon carbide ceramic), and a silicon nitride sintered body (nitriding). Silicon ceramics), glassy sintered bodies (glass ceramics), mullite sintered bodies, etc., and resins are thermosetting or ultraviolet curing types such as epoxy resins, polyimide resins, acrylic resins, phenolic resins, polyester resins, etc. Resin.

  Here, an example of a method for manufacturing the insulating substrate 10 in the case where an alumina sintered body is employed as the material constituting the insulating substrate 10 will be described. First, raw material powders such as aluminum oxide (alumina) and silicon dioxide (silica) are formed into a sheet shape together with an organic solvent and a binder to produce a plurality of ceramic green sheets. Next, a part of the produced ceramic green sheet is punched into a rectangular plate having a predetermined size that can accommodate the optical element D. Next, the punched ceramic green sheets are laminated to a predetermined dimension that can accommodate the optical element D, and the ceramic green sheets that are not punched are laminated to a predetermined dimension, and the respective laminates are stacked and then fired. Firing is performed at a temperature (for example, 1300 to 1600 ° C.). As described above, the insulating base 10 is manufactured. The method for manufacturing the insulating substrate 10 is not limited to the above-described method by simultaneous firing, and a frame shape is formed by using a bonding material (for example, brazing material, glass, resin) on the outer peripheral portion of the upper surface of the plate-like insulator. A method of joining the insulators may be adopted.

  The recess 11 has a bottom surface 11a and a bottom surface 11b, and is a part for housing the optical element D. The bottom surface 11a is a mounting surface of the optical element D and is, for example, a flat surface. The bottom surface 11b is a part where a wiring pad portion 21 which is one end portion of a wiring conductor 20 described later is located.

  The wiring conductor 20 has a wiring pad portion 21 and a terminal electrode portion 22 and is a member for obtaining electrical continuity inside and outside the optical element storage package X. Moreover, as a form of the wiring conductor 20, metallized layer shape, plating layer shape, vapor deposition layer shape, metal foil layer shape, etc. are mentioned. The wiring pad portion 21 is exposed at the bottom surface 11b and is a portion that is electrically connected to the electrode Db of the optical element D via a bonding wire 40 described later. The terminal electrode portion 22 is exposed on the lower surface of the insulating base 10 and is a portion that is electrically connected to an external electric circuit (not shown) via a conductive connecting material (for example, solder). The wiring pad part 21 and the terminal electrode part 22 are formed in a relatively larger area than the part between them. According to such a configuration, electrical connection can be more reliably and easily performed. Examples of the material constituting the wiring conductor 20 include metal materials such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, and gold. The member for obtaining electrical continuity inside and outside the electronic component storage package X is not limited to the wiring conductor 20, and for example, a metal lead terminal (lead frame) or the like may be adopted.

  Here, an example of a method of forming the wiring conductor 20 when tungsten is adopted as a material constituting the wiring conductor 20 and the wiring conductor 20 is formed in a metallized layer will be described. First, a tungsten paste is kneaded with an organic solvent, a binder, etc., and a metal paste is produced. Next, the produced metal paste is printed on the ceramic green sheet constituting the insulating substrate 10 by a predetermined printing method (for example, screen printing method). At this time, if a through hole is provided in the ceramic green sheet, printing is performed so that the metal paste is also filled in the through hole. The wiring conductor 20 is formed as described above. A plating layer (for example, gold plating or tin plating) may be further formed on the exposed surface of the wiring conductor 20.

  The lid body 30 is configured in a shape and dimensions capable of closing the concave portion 11 of the insulating base 10. For example, if the concave portion 11 has a quadrangular shape in plan view, the outer diameter dimension is larger than the planar view area of the concave portion 11. It is constructed in the shape of a slightly larger square plate. Further, the lid body 30 according to the present embodiment has a main body portion 31 and a through hole 32, and defines a storage space S for storing the optical element D together with the insulating base 10.

  The main body part 31 is a part having translucency, and includes a part facing the light emitting part (or light receiving part) Da of the optical element D mounted on the bottom surface 11 a of the insulating substrate 10. Examples of the material constituting the main body 31 include translucent materials such as glass, quartz glass, crystal, sapphire, and transparent resin.

  The through-hole 32 removes foreign matter or the like existing in the light emitting part (or light receiving part) Da of the optical element D mounted on the bottom surface 11a of the insulating base 10 even after the lid 30 is attached to the insulating base 10. It is a part for enabling, and is formed so that one end is opened to face the bottom surface (mounting surface) 11a of the insulating base 10 and the other end is opened to the external space (space outside the accommodation space S). . The through-hole 32 in the present embodiment extends in the thickness direction (arrow AB direction) of the lid 30 and is symmetric with respect to the facing portion other than the facing portion of the light emitting portion (or light receiving portion) Da. Four positions are provided, but the shape, formation position, and number of formation positions may be set as appropriate within a range that enables the above-described purpose. In addition, the through-hole 32 can be formed with respect to the predetermined position of the cover body 30 by cutting with a drill etc. or laser processing, for example.

  In the present embodiment, the shape of the through hole 32 is a columnar shape. With such a shape, the through hole 32 can be easily filled with the sealing material by a dispensing method. Moreover, the hole diameter (diameter in planar view) of the through-hole 32 is 1-5 mm, for example. When the hole diameter is less than 1 mm, the hole diameter of the through hole 32 is too small, and therefore it may be difficult to fill the sealing material into the through hole 32. When the hole diameter exceeds 5 mm, the hole diameter of the through hole 32 is small. Since it is too large, even if the viscosity of the sealing material to be filled is adjusted, the sealing material may sag in the recess 11.

  The optical element storage package X includes a through-hole 32 extending in the thickness direction (arrow AB direction), and a lid 30 that defines the storage space S for storing the optical element D together with the insulating base 10. Yes. Therefore, in the optical element storage package X, even after the lid 30 is attached to the insulating base 10 with a bonding material so that the optical element D mounted on the mounting portion 11b of the insulating base 10 is stored, the penetration of the lid 30 is achieved. Light removal of the optical element D by inserting a removal tool (for example, one having a sticking portion containing a mixture of vinyl resin, methyl isobutyl ketone (MIBK), etc. at the tip of a plastic rod-like member) through the hole 32 Foreign matter present on the surface of the portion (or light receiving portion) Da can be removed. Therefore, in the optical element storage package X, the outside air and fine foreign matters existing around the mounting portion adhere to the surface of the optical element D during the handling until the lid 30 is attached and the lid sealing operation. However, since fine foreign matters and the like can be appropriately removed after the lid 30 is mounted, more excellent light emission accuracy and light reception accuracy can be obtained.

  The optical element storage package X is formed in a portion where the main body portion 31 faces the light emitting portion (or light receiving portion) Da of the optical element D mounted on the bottom surface (mounting surface) 11b of the insulating base 10. This part is the most important part from the viewpoint of light emission (or light reception) from the light emitting part (or light receiving part) Da of the optical element D. Therefore, the optical element storage package X is suitable for further improving the light emission accuracy, light reception accuracy, and reliability of the optical element D.

  In the optical element storage package X, the through hole 32 is formed in a portion other than the portion facing the light emitting portion (or the light receiving portion) Da of the photoelement D mounted on the bottom surface (mounting surface) 11b of the insulating substrate 10. Yes. Therefore, the optical element storage package X emits light (receives light) from the light emitting part (or light receiving part) Da of the optical element D, and the light emitting part (or light receiving part) of the optical element D, which is the most important in terms of its characteristics. ) Due to the presence of the through-hole 32 at the site facing Da, it is possible to effectively prevent the light emitted or received from being distorted or irregularly reflected. Therefore, the optical element storage package X is suitable for further improving the light emission accuracy, light reception accuracy, and reliability of the optical element D.

  As shown in FIG. 1, the optical device Y includes an optical element storage package X, an optical element D, a bonding wire 40, an adhesive 50, a bonding material 60, and a sealing material 70.

The bonding wire 40 is a member for electrically connecting the electrode Db of the optical element D and the wiring pad portion 21 of the wiring conductor 20, and one end thereof is electrically connected to the electrode Db of the optical element D. The other end is electrically connected to the wiring pad portion 21 of the wiring conductor 20. Examples of the material constituting the bonding wire 40 include metals such as gold and aluminum. The length of the bonding wire 40 is set to 0.3 mm to 3.0 mm, for example. If the length of the bonding wire 40 is less than 0.3 mm, it may be difficult to form a sufficient loop with the bonding wire 40, so that the electrical connection between the electrode Db of the optical element D and the wiring pad portion 21 is difficult. There are cases where it cannot be achieved sufficiently. Also, if the length of the bonding wire 40 exceeds 3.0 mm, the loop due to the bonding wire 40 may become unnecessarily large, causing unnecessary inductance to occur and the high-frequency signal transmission characteristics to deteriorate. There is. In addition, it replaces with the bonding wire 40 in this embodiment, and may employ | adopt strip | belt-shaped connection wires, such as what is called a bonding ribbon, a metal bump, etc. The adhesive agent 50 has the bottom face 11b of the insulating base | substrate 10, and the bottom face of the optical element D. For bonding, for example, resin adhesive such as epoxy resin, polyimide resin, acrylic resin, silicone resin, polyether amide resin, Au-Sn, Sn-Ag-Cu, Sn-Cu , Sn-Pb and other solder materials, glass and the like.

  The bonding material 60 is for bonding the insulating substrate 10 and the lid body 30. For example, a resin adhesive (acrylic resin, epoxy resin, phenol resin, cresol resin, polyimide resin, silicon resin) is used. , Polyetheramide resins, etc.) and glass. Note that the bonding material 60 may include a dark color (black, brown, dark brown, dark green, dark blue, etc.) pigment or dye. According to such a configuration, it is possible to suppress extraneous external light from entering the recess 11 through the bonding material 60. Further, the bonding material 60 may include a filler made of an inorganic material such as glass or ceramics. According to such a configuration, it is possible to improve the strength of the bonding material 60 itself, improve the strength during moisture absorption reflow in the bonded state, and improve the reliability of the bonded portion by thermal expansion / contraction. Further, the bonding material 60 is set so as not to protrude from between the insulating base 10 and the lid 30 into and out of the optical element storage package X. According to such a configuration, it is possible to prevent the bonding material 60 from creeping up on the outer peripheral surface (side surface) of the lid body 30 and spreading to the upper surface central portion and the lower surface central portion of the lid body 30. Generation | occurrence | production of the fall of the light transmission performance etc. resulting from being covered with the bonding | jointing material 60 can be prevented appropriately.

  The sealing material 70 is for sealing the through hole 32, and is an acrylic resin, methacrylic resin, epoxy resin, phenol resin, cresol resin, polyimide resin, silicon resin, polyether amide. Resin materials such as resin, glass materials such as borosilicate glass, ceramic materials such as aluminum oxide sintered body, metal materials such as iron-nickel-cobalt alloy, and the like.

  The optical device Y according to this embodiment includes an optical element storage package X and a sealing material 70. Therefore, in the optical device Y, the fine foreign matter and the like are removed after the lid 30 is attached to the insulating base 10, and the through hole 32 of the lid 30 can be sealed with the sealing material 70. Therefore, the optical device Y is more excellent in light emission accuracy and light reception accuracy.

  Below, the manufacturing method of the optical apparatus Y is demonstrated.

  First, the optical element D is bonded (mounted) to the predetermined mounting region on the bottom surface 11 b of the insulating base 10 using the adhesive 50. Specifically, an adhesive 50 made of an uncured resin is applied to a predetermined mounting region on the bottom surface 11b of the insulating base 10, and a transfer device (for example, pickup and pickup by vacuum suction is performed while being aligned by an image recognition device. After having placed the optical element D on the adhesive 50 by (having a place function), the uncured resin is cured by heat or ultraviolet rays.

  Next, the electrode Db of the optical element D and the wiring pad portion 21 of the wiring conductor 20 are electrically connected using the bonding wire 40. Specifically, one end of the bonding wire 40 is bonded to the electrode Db by ultrasonic bonding, thermocompression bonding, or a combination thereof, and the other end of the bonding wire 40 is bonded by ultrasonic bonding, thermocompression bonding, or a combination thereof. Is bonded to the wiring pad portion 21.

  Next, the foreign matter existing on the surface of the light emitting part (or light receiving part) Da of the optical element D is removed (first removal step). Specifically, the foreign matter is removed by the removing tool while visually confirming the position of the foreign matter. Examples of the removing tool include a stick-like main body (for example, made of plastic) having a sticking material or a vacuum suction mechanism at least temporarily for attaching, adsorbing or holding a foreign substance. Examples of the adhesive material include a mixture of vinyl resin and methyl isobutyl ketone (MIBK). Moreover, as a vacuum suction mechanism, what equips the front-end | tip of a main-body part with a silicon | silicone perforated tube, etc. are mentioned, for example.

  Next, the lid 30 is attached to the insulating base 10 using the bonding material 60 (attachment process). Specifically, an uncured resin material is applied to a predetermined position (for example, the outer periphery) on the lower surface of the lid 30 as an uncured resin material (for example, an epoxy resin) as the bonding material 60, and then the applied resin material is applied. Is positioned and mounted on the upper surface of the insulating substrate 10 so as to surround the bottom surface (mounting surface) 11a of the insulating substrate 10, and the uncured resin material is cured by energy such as heat or light (ultraviolet light), thereby A lid 30 is attached to the body.

  Next, the foreign matter existing on the surface of the light emitting part (or light receiving part) Da of the optical element D is removed by a removing tool inserted through the through hole 32 of the lid 30 (second removing step). Specifically, the foreign matter is removed by the removal tool while confirming the position of the foreign matter using a binocular microscope. As a removal tool, the thing similar to what is used in a 1st removal process is mentioned.

  Next, the through hole 32 of the lid 30 is sealed with the sealing material 70 (sealing step). Specifically, an uncured resin material (for example, acrylic resin or silicone resin) is filled with a predetermined filling means, and the uncured resin material is cured by energy such as heat or light (ultraviolet light), thereby penetrating. The hole 32 is sealed. Examples of the filling means include screen printing, dispensing, and manual work.

  In the present manufacturing method, the second removal is performed by removing the foreign matter existing on the surface of the light emitting part (or light receiving part) Da of the optical element D that has undergone the attachment process with a removing tool inserted through the through hole 32 of the lid 30. It includes a process. Therefore, in this manufacturing method, after removing a foreign substance existing on the surface of the light emitting part (or light receiving part) Da of the optical element D by inserting a removal tool through the through hole 32 of the lid 30, the optical device Y Can be manufactured. Therefore, in the present manufacturing method, even if fine foreign matter or the like existing around the outside air or the bottom surface (mounting surface) 11a adheres to the surface of the optical element D by the time when the mounting process is completed, Since fine foreign matters and the like can be appropriately removed, it is possible to manufacture the optical device Y that is more excellent in light emission accuracy and light reception accuracy.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  The lid 30 of the optical element storage package X does not have to be formed of a translucent material in all parts of the main body 31. For example, as shown in FIG. Only a necessary and sufficient part (translucent part 80) may be made of a translucent material. Examples of the translucent material constituting the translucent portion 80 include the same materials as the translucent material constituting the main body portion 31. According to such a structure, the mechanical strength of the lid body 30 can be increased by configuring the portion other than the light transmitting portion 80 in the lid body 30 with a ceramic material or a metal material, or between the insulating base 10 and the lid body 30. The mounting strength can be increased.

  The lid 30 of the optical element storage package X may have an optical film for blocking ultraviolet rays on at least one of the upper and lower surfaces thereof. According to such a configuration, it is possible to selectively perform light emission (or light reception) of light having a necessary wavelength according to the characteristics of the optical element D, for example.

  The lid 30 of the optical element storage package X may have a configuration having a light-blocking resin film for blocking light on the outer periphery thereof. According to such a configuration, it is possible to prevent extra light from entering the recess 11 and light from being irregularly reflected in the recess 11. Therefore, the optical element storage package X of this configuration can suppress the light emitted from the light emitting portion Da from being partially deteriorated or the extra light from being received by the light receiving portion Da. It is suitable for improving accuracy and light receiving accuracy.

  The sealing of the through hole 32 in the optical device Y is not limited to the sealing material 70 alone. For example, as illustrated in FIG. 4, the sealing body 81 and the sealing material 70 according to the shape of the through hole 32. You may make it carry out by the combination. As a material constituting the sealing body 81, the same material as the sealing material 70 can be used.

  The shape of the through hole 32 in the optical device Y is not limited to a cylindrical shape, and may be, for example, a conical shape or a truncated cone shape. Such a configuration is preferable from the viewpoint of easy filling of the sealing material 70 and ease of insertion of the removal tool.

  In the manufacturing method of the optical device Y, a sorting step is performed after the mounting step and before the second removal step, for sorting according to the degree of the presence of foreign matter on the surface of the light emitting part (or light receiving part) Da of the optical element D. Further, it may be included. According to such a method, what needs to go through the second removal step after sorting out those that need to go through the second removal step (the presence of foreign matter is above the standard) and those that don't. However, since the second removal step can be selectively performed, it is preferable for improving productivity.

It is sectional drawing showing the optical apparatus formed by accommodating an optical element in the optical element storage package which concerns on embodiment of this invention. It is a figure showing the optical apparatus shown in FIG. 1, (a) is a top view, (b) is the top view which abbreviate | omitted the cover body. It is sectional drawing showing the 1st modification of the optical element storage package which concerns on embodiment of this invention. It is sectional drawing showing the 2nd modification of the optical element storage package which concerns on embodiment of this invention.

Explanation of symbols

X Optical element storage package Y Optical device D Optical element Da Light emitting part (or light receiving part)
Db electrode S storage space 10 insulating base 11 recess 11a bottom surface (mounting surface)
11b Bottom surface 20 Wiring conductor 30 Lid 31 Body portion 32 Through hole 40 Bonding wire 50 Adhesive 60 Bonding material 70 Sealing material

Claims (6)

An insulating substrate having a mounting portion for mounting an optical element comprising a light emitting portion and / or a light receiving portion;
A translucent part having translucency, and a storage for storing the optical element together with the insulating base, having a through hole having one end opened to face the mounting part and the other end opened to the external space An optical element storage package comprising: a lid that defines a space. 2. The optical element housing according to claim 1, wherein the translucent part is formed at a portion facing the light emitting part and / or the light receiving part of the optical element mounted on the mounting part of the insulating base. For package. The said through-hole is formed in site | parts other than the site | part facing the said light emission part and / or the said light-receiving part of the said optical element mounted in the said mounting part of the said insulation base | substrate. Optical element storage package. An optical element storage package according to any one of claims 1 to 3, an optical element mounted on the mounting portion of the insulating base, and a sealing material for sealing the through hole. An optical device. Foreign matter present on the surface of the light emitting portion and / or the light receiving portion of the optical element mounted on the mounting portion of the insulating substrate having the mounting portion for mounting the optical element including the light emitting portion and / or the light receiving portion. A first removal step to be removed;
A translucent part having translucency, and a storage for storing the optical element together with the insulating base, having a through hole having one end opened to face the mounting part and the other end opened to the external space An attachment step of attaching a lid defining the space to the insulating base with a bonding material;
A second removal step of removing foreign matter present on the surface of the light emitting portion and / or the light receiving portion of the optical element that has undergone the attachment step with a removal tool inserted through the through hole;
And a sealing step of sealing the through hole with a sealing material. 6. The light according to claim 5, further comprising a sorting step of performing sorting based on a degree of presence of foreign matters on a light emitting portion and / or a light receiving portion of the optical element after the attaching step and before the second removing step. Device manufacturing method.

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