JP6382615B2 - Wiring board, electronic device, and mounting structure of electronic device - Google Patents

Wiring board, electronic device, and mounting structure of electronic device Download PDF

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JP6382615B2
JP6382615B2 JP2014148898A JP2014148898A JP6382615B2 JP 6382615 B2 JP6382615 B2 JP 6382615B2 JP 2014148898 A JP2014148898 A JP 2014148898A JP 2014148898 A JP2014148898 A JP 2014148898A JP 6382615 B2 JP6382615 B2 JP 6382615B2
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notch
wiring board
mounting electrode
main surface
groove
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JP2016025239A (en
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廣森　雅孝
雅孝 廣森
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Kyocera Corp
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Description

本発明は、側面に溝部を有する絶縁基板と、溝部の内側面に設けられた実装電極とを有する配線基板、電子装置および電子装置の実装構造に関するものである。   The present invention relates to a wiring board, an electronic device, and a mounting structure for an electronic device, each having an insulating substrate having a groove on a side surface and a mounting electrode provided on an inner surface of the groove.

ＩＣ、ＬＳＩ等の半導体集積回路素子、ＬＤ（半導体レーザーダイオード）、ＬＥＤ（発光ダイオード）、ＰＤ（フォトダイオード）、イメージセンサ等の光半導体素子およびその他の種々の電子部品を搭載する配線基板として、次のようなものが多用されている。すなわち、ガラスセラミック質焼結体等からなる四角板状等の絶縁基板と、絶縁基板の主面または側面等に銅または銀等の金属材料を用いて設けられた、電子部品と外部電気回路とを電気的に接続するための実装電極等を含む配線導体とを有するものが多用されている。   As a circuit board for mounting semiconductor integrated circuit elements such as IC and LSI, optical semiconductor elements such as LD (semiconductor laser diode), LED (light emitting diode), PD (photodiode), image sensor and other various electronic components, The following are frequently used. That is, an insulating substrate such as a square plate made of a glass ceramic sintered body, etc., and an electronic component and an external electric circuit provided on the main surface or side surface of the insulating substrate using a metal material such as copper or silver, And a wiring conductor including a mounting electrode or the like for electrically connecting the two.

例えば、このような絶縁基板は複数の絶縁層が積層されてなり、直方体状や直方体状の形状である。この絶縁基板の主面等に設けられた搭載部に電子部品が搭載される。搭載された電子部品は、搭載部から実装電極にかけて設けられた配線導体等の一部に接続され、配線導体を介して実装電極と電気的に接続される。また、実装電極と外部電気回路とがはんだ等によって接続されれば、実装電極を介して電子部品と外部電気回路とが互いに電気的に接続される。   For example, such an insulating substrate is formed by stacking a plurality of insulating layers and has a rectangular parallelepiped shape or a rectangular parallelepiped shape. An electronic component is mounted on a mounting portion provided on the main surface or the like of the insulating substrate. The mounted electronic component is connected to a part of a wiring conductor or the like provided from the mounting portion to the mounting electrode, and is electrically connected to the mounting electrode through the wiring conductor. Further, when the mounting electrode and the external electric circuit are connected by solder or the like, the electronic component and the external electric circuit are electrically connected to each other through the mounting electrode.

特開2001−77407号公報Japanese Patent Laid-Open No. 2001-77407 特開2003−8066号公報JP 2003-8066 Gazette 特開2000−323601号公報JP 2000-323601 A

近年、電子部品の小型化に伴い、配線基板の小型化、高密度化が進んでおり、実装電極が小さくなってきている。さらに、絶縁基板の側面に実装電極を設け、絶縁基板の側面を外部電気回路が設けられた外部電気回路基板の主面に対向するように実装する、いわゆる側面実装が用いられる傾向がある。絶縁基板の側面の実装電極と外部電気回路とが互いに対向し合い、はんだ等を介して互いに接続される。この側面実装の場合には、比較的狭い側面に実装電極が配置されるため、実装電極の小型化の影響がさらに顕著になる。そのため、実装電極と外部電気回路との接続の強度および信頼性の向上がさらに重要な課題になる。   In recent years, along with miniaturization of electronic components, miniaturization and high density of wiring boards have progressed, and mounting electrodes have become smaller. Furthermore, there is a tendency to use so-called side surface mounting in which mounting electrodes are provided on the side surface of the insulating substrate and the side surface of the insulating substrate is mounted so as to face the main surface of the external electric circuit substrate provided with the external electric circuit. The mounting electrode on the side surface of the insulating substrate and the external electric circuit face each other and are connected to each other through solder or the like. In the case of this side mounting, since the mounting electrode is disposed on a relatively narrow side surface, the influence of downsizing of the mounting electrode becomes more remarkable. Therefore, the improvement of the strength and reliability of the connection between the mounting electrode and the external electric circuit becomes a further important issue.

側面実装は、例えば、電子装置の外部電気回路基板における占有面積をより小さくしたり、光半導体素子の入出射面（機能面）と外部電気回路基板の主面を垂直に配置すること等のために行われる。この場合、絶縁基板の側面に溝部が設けられ、この溝部内に実装電極が配置される。この実装電極が外部電気回路に対向して接続される。この場合、絶縁基板の側面が外部電気回路基板の主面に対向するように実装されている。   Side mounting is, for example, to reduce the area occupied by the external electric circuit board of the electronic device or to arrange the light incident / exit surface (functional surface) of the optical semiconductor element and the main surface of the external electric circuit board vertically. To be done. In this case, a groove is provided on the side surface of the insulating substrate, and the mounting electrode is disposed in the groove. The mounting electrode is connected to face the external electric circuit. In this case, the insulating substrate is mounted such that the side surface faces the main surface of the external electric circuit substrate.

本発明の一つの態様による配線基板は、複数の絶縁層が積層されてなり、第１主面、該第１主面と反対側の第２主面および側面を有する絶縁基板と、該絶縁基板の前記側面に前記複数の絶縁層の積層方向に延びるように、前記絶縁層の２層以上にわたって形成された溝部と、該溝部の内側面に設けられた実装電極とを備えており、前記複数の絶縁層のうち少なくとも前記第１主面を含む絶縁層が、前記第１主面を含む絶縁層を貫通し、前記第１主面側から見たときに、前記溝部より幅および奥行きが大きく、前記溝部の全体を含む第１切欠き部を有しており、前記溝部の前記内側面から前記第１切欠き部の内面にかけて前記実装電極が延在していることを特徴とする。
A wiring board according to one aspect of the present invention includes a plurality of insulating layers stacked, an insulating substrate having a first main surface, a second main surface opposite to the first main surface, and a side surface, and the insulating substrate A groove portion formed over two or more layers of the insulating layer so as to extend in the stacking direction of the plurality of insulating layers, and mounting electrodes provided on an inner surface of the groove portion. The insulating layer including at least the first main surface among the insulating layers penetrates the insulating layer including the first main surface, and has a width and depth larger than the groove when viewed from the first main surface side. The mounting electrode includes a first notch including the entire groove , and the mounting electrode extends from the inner surface of the groove to the inner surface of the first notch.

本発明の一つの態様による電子装置は、上記構成の配線基板と、該配線基板の前記絶縁基板に搭載された電子部品とを備えており、該電子部品と前記実装電極とが互いに電気的に接続されていることを特徴とする。   An electronic device according to an aspect of the present invention includes a wiring board having the above-described configuration and an electronic component mounted on the insulating substrate of the wiring board, and the electronic component and the mounting electrode are electrically connected to each other. It is connected.

本発明の一つの態様による電子装置の実装構造は、上記構成の電子装置の前記実装電極と外部電気回路とを互いに電気的に接続している接合部材とを備えており、該接合部材は、前記溝部の前記内側面に設けられた前記実装電極上から前記第１切欠き部および前記第２切欠き部の少なくとも一方の内面に設けられた前記実装電極上に跨って位置しており、前記接合部材の一部が前記実装電極の一部から前記外部電気回路にかけてフィレットを形成していることを特徴とする。
A mounting structure of an electronic device according to an aspect of the present invention includes a bonding member that electrically connects the mounting electrode and an external electric circuit of the electronic device having the above-described configuration, and the bonding member includes: It is located over the mounting electrode provided on the inner surface of at least one of the first notch and the second notch from the mounting electrode provided on the inner surface of the groove , A part of the joining member forms a fillet from a part of the mounting electrode to the external electric circuit.

本発明の一つの態様による配線基板によれば、上記構成を有していることから、実装電極の表面積を従来のものよりも大きくすることができる。そのため、実装電極と、実装電極と外部電気回路とを電気的に接続するはんだ等の接合部材との接合面積を従来よりも広くすることができる。したがって、配線基板と外部電気回路との接続強度を向上させることが容易な配線基板を提供することができる。   According to the wiring board according to one aspect of the present invention, the surface area of the mounting electrode can be made larger than that of the conventional one because of the above configuration. Therefore, the bonding area between the mounting electrode and a bonding member such as solder for electrically connecting the mounting electrode and the external electric circuit can be made wider than before. Therefore, it is possible to provide a wiring board that can easily improve the connection strength between the wiring board and the external electric circuit.

本発明の一つの態様による電子装置によれば、上記構成の配線基板と、絶縁基板に搭載された電子部品とを有し、電子部品と実装電極とが互いに電気的に接続されていることから、外部電気回路との接続強度の高い電子装置を提供することができる。   According to an electronic device according to an aspect of the present invention, the electronic device includes the wiring board configured as described above and an electronic component mounted on an insulating substrate, and the electronic component and the mounting electrode are electrically connected to each other. An electronic device having high connection strength with an external electric circuit can be provided.

本発明の一つの態様による電子装置の実装構造によれば、上記構成の電子装置と、電子装置の実装電極と外部電気回路とを互いに電気的に接続している接合部材とを有していることから、接合部材を介した外部電気回路との接続強度の高い電子装置の実装構造を提供することができる。   According to a mounting structure of an electronic device according to an aspect of the present invention, the electronic device includes the electronic device having the above-described configuration, and a bonding member that electrically connects the mounting electrode of the electronic device and an external electric circuit. Therefore, it is possible to provide a mounting structure for an electronic device having high connection strength with an external electric circuit via a bonding member.

（ａ）は本発明の実施形態の配線基板を第２主面側から見た平面図であり、（ｂ）は（ａ）の斜視図である。(A) is the top view which looked at the wiring board of embodiment of this invention from the 2nd main surface side, (b) is the perspective view of (a). （ａ）は本発明の実施形態の配線基板を第１主面側から見た平面図であり、（ｂ）は（ａ）の斜視図である。(A) is the top view which looked at the wiring board of embodiment of this invention from the 1st main surface side, (b) is the perspective view of (a). （ａ）は本発明の実施形態の電子装置および電子装置の実装構造の要部を示す断面図であり、（ｂ）は（ａ）の変形例を示す断面図である。(A) is sectional drawing which shows the principal part of the electronic device of the embodiment of this invention, and the mounting structure of an electronic device, (b) is sectional drawing which shows the modification of (a). （ａ）は本発明の他の実施形態の配線基板を第２主面側から見た平面図であり、（ｂ）はその配線基板を第１主面側から見た平面図であり、（ｃ）は（ｂ）の斜視図である。(A) is the top view which looked at the wiring board of other embodiment of this invention from the 2nd main surface side, (b) is the top view which looked at the wiring board from the 1st main surface side, c) is a perspective view of (b). 本発明のさらに他の実施形態の電子装置および電子装置の実装構造の要部を示す断面図である。It is sectional drawing which shows the principal part of the mounting structure of the electronic device and electronic device of further another embodiment of this invention. （ａ）は図５の要部を第２主面側から見た平面図であり、（ｂ）は図５の変形例における要部の断面図である。(A) is the top view which looked at the principal part of FIG. 5 from the 2nd main surface side, (b) is sectional drawing of the principal part in the modification of FIG.

本発明の実施形態の配線基板等について図面を参照して説明する。図１および図２に、本発明の実施形態の配線基板を示す。   A wiring board and the like according to an embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a wiring board according to an embodiment of the present invention.

図１（ａ）は実施形態の配線基板を第２主面側から見た平面図であり、図１（ｂ）はそ
の配線基板を同じく第２主面側から見た斜視図である。図２（ａ）は実施形態の配線基板を第１主面側から見た平面図であり、図２（ｂ）はその配線基板を第２主面側から見た斜視図である。 FIG. 1A is a plan view of the embodiment of the wiring board as viewed from the second main surface side, and FIG. 1B is a perspective view of the wiring board as viewed from the second main surface side. 2A is a plan view of the wiring board of the embodiment as viewed from the first main surface side, and FIG. 2B is a perspective view of the wiring board as viewed from the second main surface side.

図１および図２に示す配線基板10は、長方形板状の絶縁基板１と、絶縁基板１に設けられた外部接続用の実装電極２とによって基本的に形成されている。例えば図３に示すように、この配線基板10に電子部品21が搭載されて電子装置20が形成される。この電子装置20が、例えば外部電気回路31を含む外部電気回路基板（以下、単に外部基板ともいう）30に実装される。なお、図３は、本発明の実施形態の電子装置20およびその実装構造を示す断面図である。図３において図１および図２と同様の部位には同様の符号を付している。また、図１および図２は断面図ではないが、識別しやすくするため一部にハッチングを施している。   A wiring board 10 shown in FIGS. 1 and 2 is basically formed by a rectangular plate-like insulating substrate 1 and an external connection mounting electrode 2 provided on the insulating substrate 1. For example, as shown in FIG. 3, an electronic component 21 is mounted on the wiring board 10 to form an electronic device 20. The electronic device 20 is mounted on, for example, an external electric circuit board (hereinafter also simply referred to as an external board) 30 including an external electric circuit 31. FIG. 3 is a cross-sectional view showing the electronic device 20 and its mounting structure according to the embodiment of the present invention. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals. 1 and 2 are not cross-sectional views, but are partially hatched for easy identification.

絶縁基板１は、例えば長方形層状の複数の絶縁層１ａが積層されて形成されている。この絶縁基板１は、電子部品が収容される凹部３を有する上面（第２主面）と、上面と反対側の下面（第１主面）と、四つの側面とを有する長方形板状（直方体状）である。上面の凹部３内に電子部品が収容され、凹部３が蓋体等の封止材（後述）で塞がれて電子部品が凹部３内に封止される。この場合、凹部３の底面が電子部品の搭載部（符号なし）であり、この搭載部に電子部品が接着剤、ろう材またはガラス、もしくはこれらの複合材料等によって接合され、固定される。   The insulating substrate 1 is formed by laminating a plurality of rectangular insulating layers 1a, for example. The insulating substrate 1 is a rectangular plate (cuboid) having an upper surface (second main surface) having a recess 3 in which an electronic component is accommodated, a lower surface (first main surface) opposite to the upper surface, and four side surfaces. State). An electronic component is accommodated in the concave portion 3 on the upper surface, and the concave portion 3 is closed with a sealing material (described later) such as a lid, and the electronic component is sealed in the concave portion 3. In this case, the bottom surface of the recess 3 is an electronic component mounting portion (no symbol), and the electronic component is bonded and fixed to the mounting portion with an adhesive, brazing material, glass, or a composite material thereof.

搭載部に搭載される電子部品21は、例えば絶縁基板１の内部に設けられた配線導体等の接続用の導体（図示せず）を介して実装電極２と電気的に接続される。接続用の導体は、例えば複数の絶縁層１ａの層間に回路パターン状に設けられた部分、および絶縁層１ａを厚み方向に貫通する部分を含んでいる。   The electronic component 21 mounted on the mounting portion is electrically connected to the mounting electrode 2 via a connection conductor (not shown) such as a wiring conductor provided inside the insulating substrate 1, for example. The connecting conductor includes, for example, a portion provided in a circuit pattern between a plurality of insulating layers 1a and a portion penetrating the insulating layer 1a in the thickness direction.

絶縁基板１の側面は、外部電気回路に対向して接続される実装電極２が配置される部位である。すなわち、絶縁基板１の側面が外部基板30に対向するようにして電子装置20が外部基板30に実装されている。この電子装置20の実装構造では、実装電極２と外部電気回路31とがはんだ等の接合部材４によって互いに接合され、互いに電気的および機械的に接続される。   The side surface of the insulating substrate 1 is a part where the mounting electrode 2 connected to face the external electric circuit is disposed. That is, the electronic device 20 is mounted on the external substrate 30 such that the side surface of the insulating substrate 1 faces the external substrate 30. In the mounting structure of the electronic device 20, the mounting electrode 2 and the external electric circuit 31 are bonded to each other by a bonding member 4 such as solder, and are electrically and mechanically connected to each other.

絶縁基板１は、その側面に、複数の絶縁層１ａの積層方向に延びる溝部５を有している。溝部５は、第１主面側から見て、角部が円弧状に成形された長方形状である。また、長方形板状の絶縁基板１の角部分に（二つの側面を跨るように）溝部が形成されていても構わない。この溝部５の内側面に沿って、層状に実装電極２が配置されている。溝部５の内側面に実装電極２が配置されていることにより、溝部５内に接合部材４を収容するためのスペースが確保されている。なお、溝部５の形状は、長方形状等の四角形状、円弧状または楕円弧状等の他の形状であってもよい。   The insulating substrate 1 has a groove 5 on its side surface that extends in the stacking direction of the plurality of insulating layers 1a. The groove part 5 has a rectangular shape in which the corner part is formed in an arc shape when viewed from the first main surface side. Further, a groove portion may be formed at a corner portion of the rectangular plate-like insulating substrate 1 (so as to straddle two side surfaces). The mounting electrodes 2 are arranged in layers along the inner surface of the groove 5. By disposing the mounting electrode 2 on the inner surface of the groove 5, a space for accommodating the bonding member 4 in the groove 5 is secured. The shape of the groove 5 may be other shapes such as a quadrangular shape such as a rectangular shape, an arc shape or an elliptical arc shape.

また、複数の絶縁層１ａのうち第１主面を含む絶縁層１ａが第１切欠き部６を有している。第１切欠き部６は、その内側に溝部５を含んでいる。実装電極２は、溝部５の内側面から第１切欠き部６の内面にかけて延在している。そのため、実装電極２の表面積を、仮に溝部５の内側面のみに設けられているような場合（従来の技術）に比べて大きくすることができる。これにより、実装電極２と、実装電極２と外部電気回路31とを電気的に接続するはんだ等の接合部材４との接合面積をより広くすることができる。したがって、外部電気回路31との接続強度を向上させることが容易な配線基板10を提供することができる。また、外部電気回路31との接続強度の向上が容易な電子装置20を提供することができる。   Further, the insulating layer 1 a including the first main surface among the plurality of insulating layers 1 a has the first notch portion 6. The 1st notch part 6 contains the groove part 5 in the inner side. The mounting electrode 2 extends from the inner surface of the groove 5 to the inner surface of the first notch 6. Therefore, the surface area of the mounting electrode 2 can be increased as compared with the case where the mounting electrode 2 is provided only on the inner surface of the groove portion 5 (conventional technology). Thereby, the bonding area between the mounting electrode 2 and the bonding member 4 such as solder for electrically connecting the mounting electrode 2 and the external electric circuit 31 can be increased. Therefore, it is possible to provide the wiring board 10 that can easily improve the connection strength with the external electric circuit 31. Further, it is possible to provide the electronic device 20 in which the connection strength with the external electric circuit 31 can be easily improved.

本実施形態では、第１主面側から見たときに第１切欠き部６が溝部５よりも絶縁基板１
の中央部側により大きく入り込んでいる。すなわち、第１切欠き部６の奥行き（絶縁基板１の側面側の端部と、それとは反対側の端部との間の距離）が、溝部５の奥行きよりも大きい。そのため、実装電極２の面積をより大きくして、接続信頼性をさらに向上させる上で有利である。 In the present embodiment, when viewed from the first main surface side, the first notch 6 is more insulated than the groove 5 than the insulating substrate 1.
It is deeper in the middle part of. In other words, the depth of the first notch 6 (the distance between the end on the side surface side of the insulating substrate 1 and the end on the opposite side) is larger than the depth of the groove 5. Therefore, it is advantageous to further increase the connection reliability by increasing the area of the mounting electrode 2.

なお、配線基板10に搭載される電子部品としては、ＩＣ、ＬＳＩ等の半導体集積回路素子、ＬＤ（半導体レーザーダイオード）、ＬＥＤ（発光ダイオード）、ＰＤ（フォトダイオード）、イメージセンサ等の光半導体素子およびその他の種々の電子部品が挙げられる。これらの電子部品は、半導体基板の主面に微細な電子機械システムが形成された微小電子機械システム（いわゆるＭＥＭＳ素子）が含まれていてもよい。また、容量素子、抵抗器またはインダクタ素子等の受動部品が含まれてもよく、複数（同じものが複数個、または複数種）の電子部品が搭載されてもよい。   The electronic components mounted on the wiring board 10 include semiconductor integrated circuit elements such as IC and LSI, optical semiconductor elements such as LD (semiconductor laser diode), LED (light emitting diode), PD (photodiode), and image sensor. And various other electronic components. These electronic components may include a micro electro mechanical system (so-called MEMS element) in which a micro electro mechanical system is formed on the main surface of a semiconductor substrate. In addition, passive components such as a capacitive element, a resistor, or an inductor element may be included, and a plurality of electronic components (the same one may be plural or plural types) may be mounted.

絶縁基板１を形成している複数の絶縁層１ａは、例えばガラスセラミック質焼結体、酸化アルミニウム質焼結体、ムライト質焼結体またはチッ化アルミニウム質焼結体等の絶縁材料によって、形成されている。絶縁基板１は、このような複数の絶縁層１ａが積層されて形成されている。絶縁基板１は、ガラスセラミック質焼結体からなる複数の絶縁層１ａが積層されてなるものである場合には、次のようにして製作することができる。まず、セラミックフィラー粉末を用意する。セラミックフィラー粉末としては、酸化アルミニウム、酸化クロム、酸化銅、酸化ジルコニウム、スピネルおよびクォーツ等が挙げられる。また、ガラス粉末を用意する。ガラス粉末は、例えば、ＳｉＯ２−Ｂ２Ｏ３−Ａｌ２Ｏ３−ＭｇＯ−ＣａＯ−ＢａＯ−ＳｒＯ系等のガラスが挙げられる。これらのセラミックフィラー粉末およびガラス粉末を含む原料粉末に適当な有機バインダおよび有機溶剤を添加混合してスラリーを作製する。次に、このスラリーをドクターブレード法やリップコーター法等のシート成形技術を採用してシート状に成形することによって複数枚のセラミックグリーンシートを作製する。その後、セラミックグリーンシートを切断加工および打ち抜き加工等から選択した加工方法によって適当な形状とするとともにこれを複数枚積層し、最後にこの積層したセラミックグリーンシートを還元雰囲気中において約900〜1000℃の温度
で焼成することによって絶縁基板１を製作することができる。 The plurality of insulating layers 1a forming the insulating substrate 1 are formed of an insulating material such as a glass ceramic sintered body, an aluminum oxide sintered body, a mullite sintered body, or an aluminum nitride sintered body. Has been. The insulating substrate 1 is formed by laminating a plurality of such insulating layers 1a. When the insulating substrate 1 is formed by laminating a plurality of insulating layers 1a made of a glass ceramic sintered body, the insulating substrate 1 can be manufactured as follows. First, ceramic filler powder is prepared. Examples of the ceramic filler powder include aluminum oxide, chromium oxide, copper oxide, zirconium oxide, spinel and quartz. Moreover, a glass powder is prepared. Examples of the glass powder include SiO 2 —B 2 O 3 —Al 2 O 3 —MgO—CaO—BaO—SrO-based glass. An appropriate organic binder and organic solvent are added to and mixed with the raw material powder containing these ceramic filler powder and glass powder to prepare a slurry. Next, a plurality of ceramic green sheets are produced by forming this slurry into a sheet by employing a sheet forming technique such as a doctor blade method or a lip coater method. Thereafter, the ceramic green sheet is made into an appropriate shape by a processing method selected from cutting and punching and the like, and a plurality of them are laminated. Finally, the laminated ceramic green sheets are heated to about 900 to 1000 ° C. in a reducing atmosphere. The insulating substrate 1 can be manufactured by baking at a temperature.

なお、絶縁基板１は、有機樹脂を含む複合材料等からなるものであってもよい。この場合には、例えば未硬化の有機樹脂材料（熱硬化性樹脂）を金型等によって所定の絶縁基板１の形状に成形して硬化させることによって絶縁基板１を製作することができる。   The insulating substrate 1 may be made of a composite material containing an organic resin. In this case, for example, the insulating substrate 1 can be manufactured by molding and curing an uncured organic resin material (thermosetting resin) into a predetermined shape of the insulating substrate 1 using a mold or the like.

溝部５は、例えば上記のようにガラスセラミック焼結体からなる絶縁層１ａが積層されてなる絶縁基板１を製作する際に、絶縁層１ａとなるセラミックグリーンシートの外周部分の一部を金型等を用いて所定の溝部５の形状に打ち抜いておくことによって形成することができる。この打ち抜きのパターンは、前述したような、第１主面側から見た溝部５の形状であり、例えば角部が円弧状に成形された長方形状である。   For example, when the insulating substrate 1 is formed by laminating the insulating layer 1a made of a glass ceramic sintered body as described above, a part of the outer peripheral portion of the ceramic green sheet that becomes the insulating layer 1a is molded as the groove 5 Etc., and can be formed by punching into the shape of the predetermined groove 5. This punching pattern is the shape of the groove portion 5 as seen from the first main surface side as described above, and is, for example, a rectangular shape in which corner portions are formed in an arc shape.

また、溝部５は、例えば実施形態の配線基板10をとなる複数の領域が配列された母基板（図示せず）に、領域の境界に跨るように貫通孔を設けておくことによって形成することもできる。母基板が分割されたときに、上記の貫通孔が境界を挟んで隣り合う領域（つまり個片の配線基板10の絶縁基板１）のそれぞれの側面の溝部５になる。   The groove 5 is formed, for example, by providing a through-hole so as to straddle the boundary of the region in a mother substrate (not shown) in which a plurality of regions that form the wiring substrate 10 of the embodiment are arranged. You can also. When the mother board is divided, the above-mentioned through holes become the groove portions 5 on the side surfaces of the adjacent regions (that is, the insulating substrate 1 of the piece of wiring board 10) across the boundary.

実装電極２および配線導体等は、例えば、銅、銀、パラジウム、金、白金、タングステン、モリブデンまたはマンガン等の金属材料、またはこれらの金属材料を主成分とする合金材料によって形成されている。また、実装電極２は、これらの金属材料に加えてガラス等の無機材料を含むものであっても構わない。これらの金属材料等は、例えばメタライズ層、めっき層、蒸着層等の形態で絶縁基板１上に設けられている。   The mounting electrode 2 and the wiring conductor are formed of, for example, a metal material such as copper, silver, palladium, gold, platinum, tungsten, molybdenum, or manganese, or an alloy material containing these metal materials as a main component. Further, the mounting electrode 2 may include an inorganic material such as glass in addition to these metal materials. These metal materials and the like are provided on the insulating substrate 1 in the form of, for example, a metallized layer, a plating layer, a vapor deposition layer, or the like.

実装電極２は、例えば銅のメタライズ層からなる場合であれば、銅の粉末を有機溶剤およびバインダとともに混練して作製した金属ペーストを、絶縁基板１となるセラミックグリーンシートに印刷し、同時焼成して形成することができる。この場合、上記セラミックグリーンシートの側面にあらかじめ設けておいた溝部５（溝部５となる打ち抜き部分）の内側面に金属ペーストを印刷し、積層して同時焼成する。金属ペーストの塗布は、例えばスクリーン印刷法等の印刷法によって行なうことができる。また、この銅のメタライズ層の露出表面を、ニッケルおよび金等のめっき層で被覆するようにしてもよい。   If the mounting electrode 2 is made of, for example, a copper metallized layer, a metal paste prepared by kneading copper powder together with an organic solvent and a binder is printed on a ceramic green sheet to be the insulating substrate 1 and fired simultaneously. Can be formed. In this case, a metal paste is printed on the inner side surface of the groove portion 5 (a punched portion to be the groove portion 5) provided in advance on the side surface of the ceramic green sheet, laminated and fired simultaneously. The metal paste can be applied by a printing method such as a screen printing method. The exposed surface of the copper metallization layer may be covered with a plating layer such as nickel and gold.

また、上記のような有機樹脂材料からなる絶縁基板１の溝部５の内側面に、蒸着法、またはめっき法等の手段で銅等の金属材料が被着されて、実装電極２が形成されていてもよい。   Further, the mounting electrode 2 is formed by depositing a metal material such as copper on the inner surface of the groove portion 5 of the insulating substrate 1 made of the organic resin material as described above by means of vapor deposition or plating. May be.

第１切欠き部６も、溝部５と同様の方法で形成することができる。この場合、第１切欠き部６となる打ち抜き部分の内面にも実装電極２となる金属ペーストを印刷し、同時焼成すれば、第１切欠き部６の内面に実装電極２を延在させることができる。なお、第１切欠き部６の奥行きを溝部５の奥行きよりも大きくする場合には、例えば、打ち抜き加工用の金型のサイズを上記奥行きの違いに応じて適宜調整すればよい。   The first notch portion 6 can also be formed in the same manner as the groove portion 5. In this case, if the metal paste that becomes the mounting electrode 2 is printed also on the inner surface of the punched portion that becomes the first notch portion 6 and is fired at the same time, the mounting electrode 2 extends on the inner surface of the first notch portion 6. Can do. In addition, what is necessary is just to adjust the size of the metal mold | die for punching suitably according to the difference of the said depth, when making the depth of the 1st notch part 6 larger than the depth of the groove part 5, for example.

すなわち、第１切欠き部６は、溝部５が第１主面を含む絶縁層１ａまで設けられ、この第１主面を含む絶縁層１ａにおいて他の絶縁層１ａよりも溝部となる打ち抜き範囲が大きくされたものとみなすこともできる。   That is, the first notch portion 6 has the groove portion 5 provided up to the insulating layer 1a including the first main surface, and the insulating layer 1a including the first main surface has a punching range in which the groove portion becomes a groove portion than the other insulating layers 1a. It can also be regarded as enlarged.

なお、第１切欠き部６の大きさは、例えば、第１主面側から見たときに、第１切欠き部６内に溝部５の全体が含まれるような大きさに設定される。この場合には、実装電極２の接合部材４との接合面積をより効果的に大きくすることができる。すなわち、外部電気回路31に対する実装電極２の接合の強度をより確実に高めることができる配線基板10を提供することができる。また、絶縁層１ａを積層する際に位置合わせすることが容易となり、積層によるずれを抑制することができる。このとき、第１主面側から見た溝部５に対する第１切欠き部６の大きさ（面積）の比率は、上記の接合強度の向上、絶縁基板１の機械的強度、隣り合う切欠き部６のそれぞれの実装電極２間の電気絶縁性および配線基板10製作時の作業性等を考慮すれば、約1.5〜３倍程度に設定されていればよい。   In addition, the magnitude | size of the 1st notch part 6 is set to the magnitude | size which the whole groove part 5 is contained in the 1st notch part 6, for example, when it sees from the 1st main surface side. In this case, the bonding area between the mounting electrode 2 and the bonding member 4 can be increased more effectively. That is, it is possible to provide the wiring board 10 that can increase the bonding strength of the mounting electrode 2 to the external electric circuit 31 more reliably. Moreover, it becomes easy to align when laminating | stacking the insulating layer 1a, and the shift | offset | difference by lamination can be suppressed. At this time, the ratio of the size (area) of the first notch portion 6 to the groove portion 5 as viewed from the first main surface side is the improvement in the bonding strength, the mechanical strength of the insulating substrate 1, and the adjacent notch portion. In consideration of the electrical insulation between the respective mounting electrodes 2 of 6 and the workability when the wiring board 10 is manufactured, it is sufficient that the number is set to about 1.5 to 3 times.

なお、実装電極２となる金属ペーストの印刷は、溝部５となる打ち抜き加工を施した複数のセラミックグリーンシートを積層した後に、これらの打ち抜き部分の内面にまとめて行うようにしてもよい。また、溝部５となる打ち抜き加工を施した複数のセラミックグリーンシートに加えて、第１切欠き部６となるセラミックグリーンシートも積層した後に、これらの打ち抜き部分の内面にまとめ上記金属ペーストを印刷するようにしてもよい。   Note that printing of the metal paste to be the mounting electrode 2 may be performed collectively on the inner surface of these punched portions after a plurality of ceramic green sheets that have been punched to become the groove portions 5 are stacked. Further, in addition to the plurality of ceramic green sheets that have been punched to become the groove portions 5, the ceramic green sheets that become the first cutout portions 6 are also laminated, and then the metal paste is printed on the inner surfaces of these punched portions. You may do it.

前述したように、図３（ａ）および（ｂ）は、本発明の実施形態の電子装置20およびその実装構造を示す断面図である。図３（ａ）は、例えば図１および図２に示す配線基板10の凹部３内に電子部品21が収容されてなるものについて、その電子部品21が凹部３の底面に搭載された部分を第１および第２主面に直交する方向に切断した断面を示している。第１切欠き部６の内面の全面に実装電極２が延在し、その実装電極に接合部材４が接合している。また、図３（ｂ）は、図３（ａ）の変形例であり、実装電極２が第１切欠き部６の内面に部分的に延在している例である。   As described above, FIGS. 3A and 3B are cross-sectional views showing the electronic device 20 and the mounting structure thereof according to the embodiment of the present invention. FIG. 3A shows, for example, a case where an electronic component 21 is housed in the recess 3 of the wiring board 10 shown in FIGS. 1 and 2, and a portion where the electronic component 21 is mounted on the bottom surface of the recess 3 is shown in FIG. The cross section cut | disconnected in the direction orthogonal to the 1st and 2nd main surface is shown. The mounting electrode 2 extends over the entire inner surface of the first notch 6, and the bonding member 4 is bonded to the mounting electrode. FIG. 3B is a modification of FIG. 3A, in which the mounting electrode 2 partially extends on the inner surface of the first notch portion 6.

実装電極２と外部電気回路31とを電気的に接続している接合部材４として用いられるはんだは、例えばスズ−銀、スズ−銀−銅、スズ−銀−ビスマスおよびスズ−鉛等の組成のものが挙げられる。また、接合部材４は、はんだに限らず、導電性接着剤または異方導電
性接着剤でも構わない。 The solder used as the joining member 4 that electrically connects the mounting electrode 2 and the external electric circuit 31 has a composition such as tin-silver, tin-silver-copper, tin-silver-bismuth, and tin-lead. Things. The joining member 4 is not limited to solder, and may be a conductive adhesive or an anisotropic conductive adhesive.

図３に示された例においては、例えば電子部品21が上記の光半導体素子であり、絶縁基板１の第２主面にフェルール22の端面が突き当てられて接合されている。このフェルール22の中央部を貫通して光ファイバ等の光導波路23が配置されている。光導波路23は、光半導体素子である電子部品21に対して光信号を送受するためのものである。外部から電子部品21に送信された光信号が光電変換により電気信号に変換され、実装電極２を含む導電路によって外部電気回路31に電気信号が送信される。あるいは、外部電気回路31から実装電極２を含む導電路によって電子部品21に送信された電気信号が光電変換により光信号に変換され、光導波路によって外部に光信号が送信される。光信号は、外部を撮影した画像情報等であってもよく、他の電子装置（図示せず）で処理された電気信号が外部の光電変換装置（図示せず）で光信号に変換されたものであってもよい。例えば電子装置間（実施形態の電子装置20と他の電子装置との間）の信号の送受が光信号によって行なわれる場合には、電気信号で行われる場合に比べてノイズの影響の低減等の効果が得られる。   In the example shown in FIG. 3, for example, the electronic component 21 is the above-described optical semiconductor element, and the end surface of the ferrule 22 is abutted against and joined to the second main surface of the insulating substrate 1. An optical waveguide 23 such as an optical fiber is disposed through the center of the ferrule 22. The optical waveguide 23 is for transmitting and receiving optical signals to and from the electronic component 21 that is an optical semiconductor element. An optical signal transmitted from the outside to the electronic component 21 is converted into an electrical signal by photoelectric conversion, and the electrical signal is transmitted to the external electrical circuit 31 through the conductive path including the mounting electrode 2. Alternatively, the electrical signal transmitted from the external electrical circuit 31 to the electronic component 21 through the conductive path including the mounting electrode 2 is converted into an optical signal by photoelectric conversion, and the optical signal is transmitted to the outside through the optical waveguide. The optical signal may be image information obtained by photographing the outside, and an electrical signal processed by another electronic device (not shown) is converted into an optical signal by an external photoelectric conversion device (not shown). It may be a thing. For example, when signal transmission / reception between electronic devices (between the electronic device 20 of the embodiment and another electronic device) is performed by an optical signal, the influence of noise is reduced as compared with the case where the signal is transmitted by an electrical signal. An effect is obtained.

この電子装置20の実装構造において、接合部材４は、溝部５の内側面に設けられた実装電極２上から第１切欠き部６の内面に設けられた実装電極２上に跨って位置している。すなわち、溝部５内から第１切欠き部６内にかけて連続して接合部材４が実装電極２に接合されている。この接合部材４の一部が、実装電極２の一部から外部電気回路31にかけてフィレットを形成している。このように、比較的広い面積で接合部材４と実装電極とが互いに接合され、またフィレットが形成されていることから、電子装置20と外部基板31との接続の強度および信頼性の高い実装構造が実現されている。   In the mounting structure of the electronic device 20, the joining member 4 is located across the mounting electrode 2 provided on the inner surface of the first notch 6 from the mounting electrode 2 provided on the inner surface of the groove 5. Yes. That is, the joining member 4 is joined to the mounting electrode 2 continuously from the inside of the groove 5 to the inside of the first notch 6. A part of the joining member 4 forms a fillet from a part of the mounting electrode 2 to the external electric circuit 31. As described above, since the bonding member 4 and the mounting electrode are bonded to each other over a relatively large area and a fillet is formed, the mounting structure having high strength and reliability of the connection between the electronic device 20 and the external substrate 31. Is realized.

接合部材４がフィレットを形成するためには、電子装置20の実装構造を外部基板30の主面に対向するように見たときに、外部電気回路31の少なくとも一部が実装電極２よりも外側に位置している必要がある。すなわち、このような位置関係になるように電子装置20が外部電気回路31に対して位置決めされて実装されている必要がある。   In order for the bonding member 4 to form a fillet, when the mounting structure of the electronic device 20 is viewed so as to face the main surface of the external substrate 30, at least a part of the external electric circuit 31 is outside the mounting electrode 2. Need to be located in. That is, the electronic device 20 needs to be positioned and mounted with respect to the external electric circuit 31 so as to have such a positional relationship.

第１切欠き部６の内面への実装電極２の延在は、実装電極２の接合部材４との接合面積をより大きくする上では、例えば図３（ａ）の例のように第１切欠き部６の内面の全面にわたるものであることが好ましい。すなわち、実装電極２が第１切欠き部６の内面により広い範囲で延在しているほど、実装電極２と接合部材４との接合面積を大きくして、電子装置20の外部基板30に対する接続の強度および信頼性の高い実装構造とする上で有利である。   The extension of the mounting electrode 2 to the inner surface of the first notch 6 is, for example, the first cutting as shown in FIG. 3A in order to increase the bonding area of the mounting electrode 2 with the bonding member 4. It is preferable to cover the entire inner surface of the notch 6. That is, as the mounting electrode 2 extends in a wider range from the inner surface of the first cutout portion 6, the bonding area between the mounting electrode 2 and the bonding member 4 is increased, and the connection of the electronic device 20 to the external substrate 30 is performed. This is advantageous in achieving a mounting structure with high strength and reliability.

ただし、この場合には、実装電極２と接合部材４との接合面積がより大きくなる。言い換えれば接合部材４の広がる範囲がより広くなる。そのため、この広い範囲に接合部材４がある程度の厚さで広がることができる程度に接合部材４の量（体積）を確保する必要がある。つまり、フィレットの確実な形成に際してより多くの接合材４が必要になる。   However, in this case, the bonding area between the mounting electrode 2 and the bonding member 4 becomes larger. In other words, the range in which the joining member 4 spreads becomes wider. Therefore, it is necessary to secure the amount (volume) of the joining member 4 to such an extent that the joining member 4 can spread with a certain thickness in this wide range. That is, more bonding material 4 is required for the reliable formation of the fillet.

これに対して、例えば図３（ｂ）の例のように、第１切欠き部６の内面の全面ではなく一部のみに実装電極２が延在していれば、実装電極２に接合される接合部材４の量が比較的少なくても、フィレットが容易に形成され得る。なお、図３（ｂ）の例では、フィレットの上部が第１切欠き部６の内面のうち底面（第１主面側の開口と反対側の面）に位置するようにに実装電極２が延在している。この場合には、外部電気回路31を図３（ａ）の例よりも実装電極２よりも内側に位置させてもフィレットを形成することができるため、電子装置20の外部基板30における占有面積をより小さくすることができる。   In contrast, for example, as in the example of FIG. 3B, if the mounting electrode 2 extends only in part rather than the entire inner surface of the first notch 6, it is joined to the mounting electrode 2. Even if the amount of the joining member 4 is relatively small, the fillet can be easily formed. In the example of FIG. 3B, the mounting electrode 2 is positioned so that the upper portion of the fillet is located on the bottom surface (the surface opposite to the opening on the first main surface side) of the inner surface of the first notch portion 6. It is extended. In this case, since the fillet can be formed even if the external electric circuit 31 is positioned inside the mounting electrode 2 with respect to the example of FIG. 3A, the occupied area of the electronic device 20 on the external substrate 30 is reduced. It can be made smaller.

なお、第１切欠き部６の内面の一部のみに実装電極２が延在する場合には、その延在部分は溝部５の内側面の実装電極から連続したものとする。これにより、溝部５の内側面か
ら第１切欠き部６の内面（底面）にかけて連続して、フィレットを有する接合部材４が配置された実装構造とすることができる。 When the mounting electrode 2 extends only to a part of the inner surface of the first notch portion 6, the extending portion is assumed to be continuous from the mounting electrode on the inner surface of the groove portion 5. Thereby, it can be set as the mounting structure by which the joining member 4 which has a fillet is arrange | positioned continuously from the inner surface of the groove part 5 to the inner surface (bottom surface) of the 1st notch part 6. FIG.

図４に本発明の他の実施形態の配線基板を示す。図４（ａ）は本発明の他の実施形態の配線基板10Ａを第２主面側から見た平面図であり、図４（ｂ）はその配線基板10Ａを第１主面側から見た平面図であり、図４（ｃ）は図４（ｂ）の斜視図である。図４において図１および図２と同様の部位には同様の符号を付している。以下の説明において前述した実施形態の配線基板10等と同様の点については説明を省略する。なお、図４においても識別を容易とするために実装電極２等にハッチングを施している。   FIG. 4 shows a wiring board according to another embodiment of the present invention. 4A is a plan view of a wiring board 10A according to another embodiment of the present invention viewed from the second main surface side, and FIG. 4B is a plan view of the wiring board 10A viewed from the first main surface side. It is a top view and FIG.4 (c) is a perspective view of FIG.4 (b). 4, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the following description, description of the same points as those of the wiring substrate 10 and the like of the above-described embodiment will be omitted. In FIG. 4, the mounting electrodes 2 and the like are hatched for easy identification.

図４の例において、絶縁基板１およびこれを形成している複数の絶縁層１ａはそれぞれ正方形板状である。絶縁基板１は、凹部３を含む上面（第２主面）と、その反対側の下面（第１主面）と四つの側面とを有している。この絶縁基板１の上面の凹部３内に電子部品（図３では図示せず）が収容されて電子装置（図３では図示せず）が形成される。この電子装置について、下面が外部基板の外部電気回路（図３では図示せず）に対向して実装される点が上記実施形態の配線基板10および電子装置20と異なる。   In the example of FIG. 4, the insulating substrate 1 and the plurality of insulating layers 1a forming the insulating substrate 1 each have a square plate shape. The insulating substrate 1 has an upper surface (second main surface) including the recess 3, a lower surface (first main surface) on the opposite side, and four side surfaces. An electronic component (not shown in FIG. 3) is accommodated in the recess 3 on the upper surface of the insulating substrate 1 to form an electronic device (not shown in FIG. 3). This electronic device is different from the wiring substrate 10 and the electronic device 20 of the above embodiment in that the lower surface is mounted facing an external electric circuit (not shown in FIG. 3) of the external substrate.

この他の実施形態の配線基板10Ａを含む電子装置の実装構造においても、実装電極２が外部電気回路とはんだ等の接合部材（図３では図示せず）を介して接合され、電気的および機械的に接続される。この実装構造においても、接合部材は、溝部５の内側面に設けられた実装電極２上から第１切欠き部６の内面に設けられた実装電極２上に跨っている。また、接合部材の一部が実装電極２の一部から外部電気回路にかけてフィレットを形成する。これにより、搭載された電子部品と外部電気回路との接続の信頼性が高い実装構造が実現され得る。   Also in the mounting structure of the electronic device including the wiring board 10A of the other embodiment, the mounting electrode 2 is bonded to an external electric circuit via a bonding member (not shown in FIG. 3) such as solder, and the electric and mechanical Connected. Also in this mounting structure, the joining member straddles the mounting electrode 2 provided on the inner surface of the first notch 6 from the mounting electrode 2 provided on the inner surface of the groove 5. Further, a part of the joining member forms a fillet from a part of the mounting electrode 2 to the external electric circuit. Thereby, a mounting structure with high reliability of connection between the mounted electronic component and the external electric circuit can be realized.

図４の例では、第１主面の角部のみに第１切欠き部６が設けられている。第１主面が外部基板に対向して実装される場合には、絶縁基板１の角部において絶縁基板１と外部基板との間の熱応力が最も大きくなりやすい。第１主面の角部に第１切欠き部６が設けられていれば、この配線基板10Ａを含む電子装置の実装構造について、その熱応力が比較的大きい部分で絶縁基板１（実装電極２）と外部基板（外部電気回路）との接続の強度が向上されたものとすることができる。したがって、例えば第１切欠き部６をできるだけ少なく抑えながら、外部基板に対する接続強度の高い実装構造とすることができる。第１切欠き部６の数をできるだけ少なく抑えることは、例えば絶縁基板１の機械的強度および配線基板の生産性等に対してより有利である。   In the example of FIG. 4, the first notch 6 is provided only at the corner of the first main surface. When the first main surface is mounted facing the external substrate, the thermal stress between the insulating substrate 1 and the external substrate tends to be the largest at the corners of the insulating substrate 1. If the first notch 6 is provided at the corner of the first main surface, the insulating substrate 1 (mounting electrode 2) is mounted at the portion where the thermal stress is relatively large in the mounting structure of the electronic device including the wiring substrate 10A. ) And an external substrate (external electrical circuit). Therefore, for example, a mounting structure with high connection strength to the external substrate can be obtained while suppressing the first notch portion 6 as small as possible. Suppressing the number of the first cutout portions 6 as much as possible is more advantageous for the mechanical strength of the insulating substrate 1 and the productivity of the wiring substrate, for example.

なお、図４の例では、絶縁基板の上面に凹部３を囲む枠状の金属層（符号なし）が設けられている。この金属層は、例えば凹部３をふさぐ蓋体（図示せず）をろう材等で接合する際の下地金属層となる。この金属層は、例えば実装電極２と同様の金属材料を用い、同様の方法で形成することができる。   In the example of FIG. 4, a frame-shaped metal layer (no symbol) surrounding the recess 3 is provided on the upper surface of the insulating substrate. This metal layer becomes, for example, a base metal layer when a lid (not shown) that covers the recess 3 is joined with a brazing material or the like. This metal layer can be formed by the same method using, for example, the same metal material as that of the mounting electrode 2.

図５は、本発明のさらに他の実施形態の配線基板10Ｂ、およびその配線基板10Ｂを含む電子装置20ならびに電子装置20の実装構造の要部を示す断面図である。また、図６（ａ）は図５の要部を第２主面側から見た平面図であり、図６（ｂ）は図５の変形例における要部の断面図である。図６において図１〜図５と同様の部位には同様に符号を付している。図６（ａ）は断面図ではないが、識別しやすくするために実装電極２にハッチングを施している。図６（ａ）では見やすくするために接合部材４等を省略している。この例においても、前述した各実施形態と同様の点については説明を省略する。   FIG. 5 is a cross-sectional view showing a wiring board 10B according to still another embodiment of the present invention, an electronic device 20 including the wiring board 10B, and a main part of a mounting structure of the electronic device 20. FIG. 6A is a plan view of the main part of FIG. 5 viewed from the second main surface side, and FIG. 6B is a cross-sectional view of the main part in the modification of FIG. In FIG. 6, the same parts as those in FIGS. 1 to 5 are denoted by the same reference numerals. Although FIG. 6A is not a cross-sectional view, the mounting electrode 2 is hatched for easy identification. In FIG. 6A, the joining member 4 and the like are omitted for easy viewing. Also in this example, description of the same points as those of the above-described embodiments is omitted.

図５の例においては、例えば四角板状の絶縁基板１の第１主面および第２主面の両方に凹部３が設けられ、それぞれの底面が電子部品の搭載部になっている。それぞれの搭載部
に搭載された電子部品21が、絶縁基板１の側面に設けられた実装電極２と配線導体等（図示せず）を介して電気的に接続されている。また、この例においては、例えば図６（ａ）に示されているように、複数の絶縁層１ａのうち少なくとも第２主面を含む絶縁層１ａが第２切欠き部７を有している。第２切欠き部７は、その内側に溝部５を含んでいる。溝部５は第１主面および第２主面からそれぞれ絶縁基板１の側面の途中まで設けられている。これらの点が、上記実施形態の配線基板10等に対して異なる。 In the example of FIG. 5, for example, the concave portions 3 are provided on both the first main surface and the second main surface of the rectangular plate-like insulating substrate 1, and the respective bottom surfaces serve as mounting portions for electronic components. The electronic component 21 mounted on each mounting portion is electrically connected to the mounting electrode 2 provided on the side surface of the insulating substrate 1 via a wiring conductor or the like (not shown). In this example, for example, as shown in FIG. 6A, the insulating layer 1 a including at least the second main surface among the plurality of insulating layers 1 a has the second notch portion 7. . The 2nd notch part 7 contains the groove part 5 inside. The groove 5 is provided from the first main surface and the second main surface to the middle of the side surface of the insulating substrate 1. These points are different from the wiring board 10 and the like of the above embodiment.

この例の配線基板10Ｂおよび電子装置20Ｂにおいて、溝部５の内側面から第２切欠き部７の内面にかけて実装電極２が延在している。なお、この例において第２切欠き部７の内面に延在している実装電極２は、第２主面の凹部３内に収容された電子部品21である。第１切欠き部６および第２切欠き部７のそれぞれに延在した実装電極２は、それぞれ互いに電気的に独立して、外部電気回路31と接合部材４を介して電気的に接続される。   In the wiring board 10B and the electronic device 20B in this example, the mounting electrode 2 extends from the inner surface of the groove 5 to the inner surface of the second notch portion 7. In this example, the mounting electrode 2 extending on the inner surface of the second notch 7 is an electronic component 21 accommodated in the recess 3 of the second main surface. The mounting electrodes 2 extending in the first cutout portion 6 and the second cutout portion 7 are electrically connected to each other via the external electric circuit 31 and the joining member 4 independently of each other. .

この配線基板10Ｂおよびそれを用いた電子装置20Ｂについても、溝部５の内側面の実装電極２から第１および第２切欠き部６、７の内面に設けられた実装電極にかけて、フィレットを含む接合部材４が接合されている。そのため、電子装置20と外部基板30との接続の強度および信頼性の高い実装構造が実現され得る。   The wiring board 10B and the electronic device 20B using the wiring board 10B are also joined including a fillet from the mounting electrode 2 on the inner surface of the groove 5 to the mounting electrodes provided on the inner surfaces of the first and second cutouts 6 and 7. The member 4 is joined. Therefore, a mounting structure with high strength and reliability of connection between the electronic device 20 and the external substrate 30 can be realized.

なお、図６（ａ）の例では、第２切欠き部７が溝部５よりも絶縁基板１の中央部側により大きく入り込んでいる。すなわち、第２切欠き部７の奥行きが溝部５の奥行きよりも大きい。そのため、第２切欠き部７について、より信頼性の高い実装構造に対して有効なものになっている。   In the example of FIG. 6A, the second notch portion 7 enters more into the central portion side of the insulating substrate 1 than the groove portion 5. That is, the depth of the second notch 7 is greater than the depth of the groove 5. Therefore, the second cutout portion 7 is effective for a more reliable mounting structure.

なお、上記各例の配線基板10、10Ａおよび10Ｂにおいて、絶縁基板の第１主面側または第２主面側から見て、溝部５、第１切欠き部６および第２切欠き部７のそれぞれの外周のうち少なくとも一部が円弧部を含んでいる場合には次のような効果を得ることができる。すなわち、この場合には、実装電極２の接合部材４が接合される端部（上記各外周の位置に相当）に熱応力等の応力が集中したとしても、その応力を円弧部で分散して緩和することができる。したがって、外部電気回路31に対する接続信頼性がより高い実装構造、その実装構造を可能にする電子装置20（20Ｂ）および配線基板10（10Ａ、10Ｂ）の提供に対して有利である。なお、円弧部の一例は、図２（ａ）の第１切欠き部６の先端部分の形状として示されている。   In the wiring boards 10, 10A, and 10B of the above examples, the groove portion 5, the first notch portion 6, and the second notch portion 7 are viewed from the first main surface side or the second main surface side of the insulating substrate. The following effects can be obtained when at least a part of each outer periphery includes an arc portion. That is, in this case, even if stress such as thermal stress is concentrated at the end portion (corresponding to the position of each outer periphery) to which the joining member 4 of the mounting electrode 2 is joined, the stress is dispersed at the arc portion. Can be relaxed. Therefore, it is advantageous for providing a mounting structure with higher connection reliability to the external electric circuit 31, and an electronic device 20 (20B) and a wiring board 10 (10A, 10B) that enable the mounting structure. An example of the arc portion is shown as the shape of the tip portion of the first notch portion 6 in FIG.

また、第２切欠き部７の大きさは、例えば前述した第１切欠き部６の場合と同様に、第２主面側から見たときに、第２切欠き部７内に溝部５の全体が含まれるような大きさに設定される。この場合にも、実装電極２の接合部材４との接合面積をより効果的に大きくすることが容易であり、外部電気回路31に対する実装電極２の接合の強度をより確実に高めることができる。第２主面側から見た溝部５に対する第２切欠き部７の大きさ（面積）の比率についても、上記の接合強度の向上および前述した種々の条件（絶縁基板１の機械的強度）等を考慮して、約1.5〜３倍程度に設定される。   Further, the size of the second cutout portion 7 is, for example, similar to the case of the first cutout portion 6 described above, when the groove portion 5 is formed in the second cutout portion 7 when viewed from the second main surface side. The size is set to include the whole. Also in this case, it is easy to increase the bonding area between the mounting electrode 2 and the bonding member 4 more effectively, and the bonding strength of the mounting electrode 2 to the external electric circuit 31 can be increased more reliably. Regarding the ratio of the size (area) of the second notch portion 7 to the groove portion 5 as viewed from the second main surface side, the above-described improvement of the bonding strength and the various conditions described above (the mechanical strength of the insulating substrate 1), etc. Is set to about 1.5 to 3 times.

また、上記各実施形態の配線基板10等について、例えば図６（ｂ）に示すように、積層方向における断面視において、第１切欠き部６および第２切欠き部７の少なくとも一方の内面のうち、絶縁層の厚み方向に延びている側面が傾斜した面であってもよい。図６（ｂ）の例では第２切欠き部７の側面が傾斜した面になっているが、第１切欠き部６の側面のみが傾斜していてもよく、第１および第２切欠き部６、７の両方の側面が傾斜していてもよい。この傾斜の方向は、第１切欠き部６または第２切欠き部７の第１主面または第２主面における開口に向かって外方向に傾斜する方向である。言い換えれば、第１および第２切欠き部６、７は、絶縁基板１の側面と反対側の端部において外側に開いた形状であってもよい。   Further, for example, as shown in FIG. 6B, the wiring substrate 10 and the like of each of the above-described embodiments has an inner surface of at least one of the first notch portion 6 and the second notch portion 7 in a sectional view in the stacking direction. Of these, the inclined side surface may extend in the thickness direction of the insulating layer. In the example of FIG. 6B, the side surface of the second notch portion 7 is an inclined surface, but only the side surface of the first notch portion 6 may be inclined, and the first and second notches Both side surfaces of the parts 6 and 7 may be inclined. The direction of the inclination is a direction inclined outward toward the opening in the first main surface or the second main surface of the first notch 6 or the second notch 7. In other words, the first and second cutouts 6 and 7 may have a shape opened outward at the end opposite to the side surface of the insulating substrate 1.

この場合には、接合部材４の端部が、その厚み方向の断面視で実装電極２に沿って傾斜した形状になるため、配線基板10Ｂと外部基板30の線膨張係数の違い等による熱応力（せん断応力）がフィレット端部へ集中することが緩和される。これは、フィレットの体積が増加したことや、実装電極２と接合部材４の界面が熱応力が大きく発生する方向からずれるためであると考えられる。したがって、この場合にも、外部電気回路31に対する接続信頼性がより高い実装構造、その実装構造を可能にする電子装置20（20Ｂ）および配線基板10（10Ａ、10Ｂ）の提供に対して有利である。   In this case, since the end portion of the joining member 4 has a shape inclined along the mounting electrode 2 in a sectional view in the thickness direction, thermal stress due to a difference in linear expansion coefficient between the wiring board 10B and the external board 30 or the like. Concentration of (shear stress) at the end of the fillet is alleviated. This is considered to be because the volume of the fillet is increased and the interface between the mounting electrode 2 and the bonding member 4 is deviated from the direction in which a large thermal stress is generated. Therefore, in this case as well, it is advantageous for providing a mounting structure with higher connection reliability to the external electric circuit 31, and an electronic device 20 (20B) and a wiring board 10 (10A, 10B) that enable the mounting structure. is there.

１・・・絶縁基板
１ａ・・絶縁層
２・・・実装電極
３・・・凹部
４・・・接合部材
５・・・溝部
６・・・第１切欠き部
７・・・第２切欠き部
10・・・配線基板
20・・・電子装置
21・・・電子部品
22・・・フェルール
23・・・光導波路
30・・・外部電気回路基板
31・・・外部電気回路
DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a .... Insulating layer 2 ... Mounting electrode 3 ... Concave part 4 ... Bonding member 5 ... Groove part 6 ... 1st notch part 7 ... 2nd notch Part
10 ... wiring board
20 ... Electronic device
21 ... Electronic components
22 ... Ferrule
23: Optical waveguide
30 ... External electric circuit board
31 ... External electric circuit

Claims (10)

複数の絶縁層が積層されてなり、第１主面、該第１主面と反対側の第２主面および側面を有する絶縁基板と、
該絶縁基板の前記側面に前記複数の絶縁層の積層方向に延びるように、前記絶縁層の２層以上にわたって形成された溝部と、該溝部の内側面に設けられた実装電極とを備えており、
前記複数の絶縁層のうち少なくとも前記第１主面を含む絶縁層が、前記第１主面を含む絶縁層を貫通し、前記第１主面側から見たときに、前記溝部より幅および奥行きが大きく、前記溝部の全体を含む第１切欠き部を有しており、
前記溝部の前記内側面から前記第１切欠き部の内面にかけて前記実装電極が延在していることを特徴とする配線基板。 A plurality of insulating layers, and an insulating substrate having a first main surface, a second main surface opposite to the first main surface, and a side surface;
A groove formed on two or more layers of the insulating layer so as to extend in the stacking direction of the plurality of insulating layers on the side surface of the insulating substrate; and a mounting electrode provided on an inner surface of the groove. ,
Of the plurality of insulating layers, an insulating layer including at least the first main surface passes through the insulating layer including the first main surface, and is wider and deeper than the groove when viewed from the first main surface side. is large, has a first notch including the whole of the groove,
The wiring board, wherein the mounting electrode extends from the inner surface of the groove portion to an inner surface of the first notch portion. 前記複数の絶縁層のうち少なくとも前記第２主面を含む絶縁層が前記溝部を含む第２切欠き部を有しており、
前記溝部の前記内側面から前記第２切欠き部の内面にかけて前記実装電極が延在していることを特徴とする請求項１に記載の配線基板。 An insulating layer including at least the second main surface of the plurality of insulating layers has a second notch including the groove;
The wiring board according to claim 1, wherein the mounting electrode extends from the inner surface of the groove portion to an inner surface of the second notch portion. 前記絶縁基板の前記第１主面側から見て、前記溝部および前記第１切欠き部のそれぞれの外周のうち少なくとも一部が円弧部を含むことを特徴とする請求項１または請求項２に記載の配線基板。 The at least one part of each outer periphery of the said groove part and the said 1st notch part contains a circular arc part seeing from the said 1st main surface side of the said insulated substrate, The Claim 1 or Claim 2 characterized by the above-mentioned. The wiring board described. 前記絶縁基板の前記第２主面側から見て、前記第２切欠き部の外周が円弧部を含むことを特徴とする請求項２または請求項２を引用する請求項３に記載の配線基板。 When viewed from the second principal surface of the insulating substrate, the wiring board according to claim 3, the outer periphery of the second notch cites claim 2 or claim 2, characterized in that it comprises an arcuate portion . 前記積層方向における断面視において、前記第１切欠き部の前記内面のうち前記絶縁層の厚み方向に延びている側面が、前記第１切欠き部の前記第１主面における開口に向かって外方向に傾斜していることを特徴とする請求項１〜４のいずれかに記載の配線基板。 In a cross-sectional view in the stacking direction, a side surface extending in the thickness direction of the insulating layer among the inner surface of the first notch portion is outward toward the opening in the first main surface of the first notch portion. The wiring board according to claim 1, wherein the wiring board is inclined in a direction. 前記積層方向における断面視において、前記第２切欠き部の前記内面のうち前記絶縁層の厚み方向に延びている側面が、前記第２切欠き部の前記第２主面における開口に向かって外方向に傾斜していることを特徴とする請求項２および請求項１を引用しない請求項３〜５のいずれかに記載の配線基板。 In a cross-sectional view in the stacking direction, a side surface of the inner surface of the second notch that extends in the thickness direction of the insulating layer is outside the opening in the second main surface of the second notch. wiring board according to any one of claims 3-5 which does not quote the claims 2 and 1, characterized in that it is inclined in a direction. 前記第１切欠き部の前記内面の全面にわたって、前記実装電極が延在していることを特徴
とする請求項１〜６のいずれかに記載の配線基板。 The wiring board according to claim 1, wherein the mounting electrode extends over the entire inner surface of the first cutout portion. 前記第２切欠き部の前記内面の全面にわたって、前記実装電極が延在していることを特徴とする請求項２および請求項１を引用しない請求項３〜７のいずれかに記載の配線基板。 Over the entire surface of said inner surface of said second notch, the wiring board according to any one of claims 3-7 which does not quote the claims 2 and 1, wherein the mounting electrode extends . 請求項１〜８のいずれかに記載の配線基板と、該配線基板の前記絶縁基板に搭載された電子部品とを備えており、該電子部品と前記実装電極とが互いに電気的に接続されていることを特徴とする電子装置。 A wiring board according to any one of claims 1 to 8, and an electronic component mounted on the insulating substrate of the wiring board, wherein the electronic component and the mounting electrode are electrically connected to each other. An electronic device characterized by comprising: 請求項９に記載の電子装置と、
該電子装置の前記実装電極と外部電気回路とを互いに電気的に接続している接合部材とを備えており、
該接合部材は、前記溝部の前記内側面に設けられた前記実装電極上から前記第１切欠き部および前記第２切欠き部の少なくとも一方の内面に設けられた前記実装電極上に跨って位置しており、
前記接合部材の一部が前記実装電極の一部から前記外部電気回路にかけてフィレットを形成していることを特徴とする電子装置の実装構造。 An electronic device according to claim 9 ;
A bonding member that electrically connects the mounting electrode and the external electric circuit of the electronic device to each other;
The joining member is positioned over the mounting electrode provided on the inner surface of at least one of the first notch and the second notch from the mounting electrode provided on the inner surface of the groove. And
A mounting structure of an electronic device, wherein a part of the joining member forms a fillet from a part of the mounting electrode to the external electric circuit.
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