JP2017228730A - Wiring board, electronic apparatus, and electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board, an electronic apparatus, and an electronic module excellent in long-term reliability.SOLUTION: A wiring board 1 comprises: an insulating substrate 11 rectangular in a plan view that has, on a principal surface, a concave part 12 in which an electronic component 2 is mounted; a frame-like metal layer 13 that is provided on a lateral wall of the concave part 12; and a through conductor group 14G that includes a plurality of through conductors 14 arranged to be covered by the metal layer 13 in a plan perspective view. The metal layer 13 and the through conductor group 14G are separated; the metal layer 13 and the through conductor group 14G do not have another through conductor therebetween in a thickness direction of the insulating substrate 11; the through conductor group 14G is provided along the lateral wall of the concave part 12 in a plan perspective view.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a wiring board, an electronic device, and an electronic module.

  Conventionally, a wiring board and an electronic device in which an electronic component is mounted on a main surface of an insulating substrate made of ceramics are known (for example, see Patent Document 1).

  In such a wiring substrate, the insulating substrate has a recess for storing and mounting electronic components on the upper surface, and has a frame-shaped metal layer around the recess.

JP 2015-039133

  However, in recent years, electronic devices have been improved in function and size. As a result, the width of the sidewalls around the recesses is small, and the sidewalls of the recesses sandwiched between the corners of the sidewalls of the recesses are likely to be deformed. The upper surface of the side wall of the substrate warps in a concave shape in the thickness direction along the outer edge of the insulating substrate, and when the lid or frame is joined to the frame-shaped metal layer, the airtightness in the recess may be reduced. Concerned.

  According to one aspect of the present invention, a wiring board has a concave portion for mounting an electronic component on a main surface, a rectangular insulating substrate in a plan view, and a frame-shaped metal layer provided on a side wall of the concave portion. And a through conductor group including a plurality of through conductors arranged so as to be covered with the metal layer in a plan view, the metal layer and the through conductor group are separated from each other, and the insulating substrate There is no other through conductor between the metal layer and the through conductor group in the thickness direction, and the through conductor group is provided along the side wall of the recess in a plan view.

  According to one aspect of the present invention, an electronic device includes the wiring board configured as described above and an electronic component mounted in the recess.

  According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device configured as described above connected to the external electrode via solder on the connection pad.

In a wiring board according to one aspect of the present invention, a rectangular insulating substrate having a recess for mounting an electronic component on a main surface thereof, a frame-shaped metal layer provided on a side wall of the recess, and a plane see-through A through conductor group including a plurality of through conductors arranged so as to be covered with the metal layer, the metal layer and the through conductor group are separated from each other, and the metal layer and the through conductor in the thickness direction of the insulating substrate There are no other through conductors between the groups, and the through conductor groups are provided along the side walls of the recesses in a plan view. With the above configuration, the through conductor disposed inside the insulating substrate holds the side wall of the recess, so that the upper surface of the side wall of the recess becomes the outer edge of the insulating substrate, for example, due to stress during lamination or cutting in the manufacturing process. It is possible to suppress the concave shape in the thickness direction along the frame, to improve the bonding between the frame-shaped metal layer and the lid or the frame, and to improve the airtightness in the recess. it can.

  In the electronic device according to one aspect of the present invention, by including the wiring board having the above-described configuration and the electronic component mounted in the recess, an electronic device having excellent airtightness and excellent long-term reliability can be obtained.

  The electronic module according to one aspect of the present invention has excellent long-term reliability by including a module substrate having a connection pad and the electronic device having the above-described configuration connected to the external electrode via solder on the connection pad. Can be.

(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). It is an internal top view which shows the through conductor of the wiring board in FIG. (A) is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.1 (a), (b) is a longitudinal cross-sectional view in the BB line. FIG. 4 is an enlarged cross-sectional view of a main part in part C of the electronic device shown in FIG. 3. (A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). (A) is an internal top view which shows the penetration conductor of the wiring board in FIG. 5, (b) is a principal part expanded sectional view in the D section of (a). It is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.5 (a). (A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). It is an internal top view which shows the through conductor of the wiring board in FIG. (A) is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.8 (a), (b) is a longitudinal cross-sectional view in the BB line.

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
As shown in FIGS. 1 to 4, the electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 mounted in a recess 12 of the wiring board 1. As shown in FIG. 4, the electronic device is connected to the module substrate 5 constituting the electronic module using solder 6, for example.

  The wiring substrate 1 in the present embodiment has a concave insulating portion 12 for mounting the electronic component 2 on the main surface, a rectangular insulating substrate 11 in plan view, and a frame-shaped metal layer 13 provided on the side wall of the concave portion 12. And a through conductor group 14G including a plurality of through conductors 14 arranged so as to be covered with the metal layer 13 in a plan view. The metal layer 13 and the through conductor group 14G are separated from each other, and there is no other through conductor between the metal layer 13 and the through conductor group 14G in the thickness direction of the insulating substrate 11. 14G is provided along the side wall of the recess 12. The insulating substrate 11 has a wiring conductor 15 on the surface and inside. 1-4, the upward direction means the positive direction of the virtual z-axis. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the wiring board 1 or the like is actually used.

Further, in the example shown in FIGS. 1 and 2, a region where the metal layer 13 or the through conductor 14 overlap is shown by a dotted line in a plan view. In FIG. 1, a region where the through conductors 14 overlap with each other in a plan view is indicated by a dotted line, and in FIG. 2, a region where the metal layer 13 overlaps in a plan view is indicated by a dotted line.

  The insulating substrate 11 has one main surface (upper surface in FIGS. 1 to 4), the other main surface (lower surface in FIGS. 1 to 4), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers 11a, and has an opening in the main surface and a recess 12 for mounting the electronic component 2. The insulating substrate 11 has a rectangular plate shape when seen from a plan view, that is, from a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2. On the mounting portion on the bottom surface of the recess 12, the electronic component 2 is solder bump, gold bump or conductive resin (anisotropic conductive resin, etc.) It is bonded and fixed via a connecting member 3 such as resin.

For the insulating substrate 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body is used. it can. If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, an appropriate punching process is performed on the ceramic green sheet, and a plurality of ceramic green sheets are laminated to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.), whereby the insulating substrate 11 is formed. Produced.

The recess 12 is provided on one main surface of the insulating substrate 11 in the example shown in FIGS. The recess 12 is for mounting the electronic component 2 on the bottom surface. A metal layer 14 for electrical connection with the electronic component 2 is led out from the bottom surface of the recess 12. The concave portion 12 has a rectangular shape with a circular arc shape in a plan view, and is provided in the central portion of the insulating substrate 11. In the example shown in FIGS. 1 to 3, the insulating substrate 11 is formed of four insulating layers 11a, and the recess 12 is provided in the first to third insulating layers 11a on the one main surface side. .

  The recesses 12 are formed by forming through holes to be the recesses 12 in the respective ceramic green sheets by laser processing or punching with a mold in some of the ceramic green sheets for the insulating substrate 11, for example. It can be formed by laminating on another ceramic green sheet in which no through hole is formed.

  On the surface and inside of the insulating substrate 11, a metal layer 13, a through conductor 14, and a wiring conductor 15 are provided. The metal layer 13 is provided in a frame shape on the side wall of the recess 12 of the insulating substrate 11. The frame-shaped metal layer 13 is for bonding, for example, a metal lid or a metal frame to the upper surface of the wiring board 1. The wiring conductor 15 is provided on the surface and inside of the insulating substrate 11. The wiring conductor 15 is for electrically connecting the electronic component 2 and the module substrate 5. The through conductors 14 are provided inside the insulating substrate 11 and are disposed so as to be covered with the metal layer 13 in a plan view.

In the example shown in FIG. 3, the through conductor 14 is provided between the bottom surface of the recess 12 and the upper surface of the side wall of the recess 12 in the longitudinal sectional view, that is, in the side wall of the recess 12. It is provided in the second insulating layer 11a from the side. An insulating layer 11a is provided between the metal layer 13 and the through conductor 14, the metal layer 13 and the through conductor 14 are separated from each other, and other metal No through conductor is provided. The thickness of the insulating layer 11a between the metal layer 13 and the through conductor 14 is preferably smaller than the thickness of the insulating layer 11a on which the through conductor 14 is provided, and is 0.5 mm or less.

The upper end portion of the through conductor 14 is embedded in the insulating layer 11a between the metal layer 13 and the through conductor 14 in the longitudinal sectional view as in the example shown in FIG. The thickness is preferably 10% or less of the thickness of the insulating layer 11a between the metal layer 13 and the through conductor 14. If it is embedded in a thickness of 10% or more, distortion or the like is likely to occur on the side wall of the recess 12 or the surface of the metal layer 13.

  The plurality of through conductors 14 constitute a through conductor group 14G by providing the plurality of through conductors 14 along the side wall of the recess 12. An insulating layer 11a is provided between the metal layer 13 and the plurality of through conductors 14 constituting the through conductor group 14G, thereby separating the metal layer 13 and the through conductor group 14G.

  Such a through conductor 14 has a thickness equal to or greater than the thickness of the ceramic green sheet, that is, the end protrudes from the surface of the ceramic green sheet, and the through hole for the through conductor 14 is filled with metallized paste. When the sheet is laminated with another ceramic green sheet, the end portion of the metallized paste may be embedded in the other ceramic green sheet side. Further, in the thickness direction, a metallized paste that is less likely to shrink than the ceramic green sheet during firing may be filled in the through hole for the through conductor 14.

  The distance between the through conductor 14 and the inner wall of the recess 12 or the distance between the through conductor 14 and the outer wall of the recess 12 is preferably larger than the diameter of the through conductor 14.

  The metal layer 13, the through conductor 14, and the wiring conductor 15 are metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing an appropriate organic binder and solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired at the same time as the ceramic green sheet for the insulating substrate 11 to be deposited on a predetermined position of the insulating substrate 11. The metal layer 13 and the wiring conductor 15 are formed by, for example, printing and applying a metallized paste for the metal layer 13 or the wiring conductor 15 on a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method. It is formed by firing together with a green sheet. The through conductor 14 is formed, for example, by forming a through hole for the through conductor 14 in a ceramic green sheet for the insulating substrate 11 by a die or punching process by punching or laser processing, and the through conductor is formed in the through hole. It is formed by filling the metallized paste for 14 with the above printing means and firing together with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

  A metal plating layer is applied to the surfaces of the metal layer 13 and the wiring conductor 15 exposed from the insulating substrate 11 by electroplating or electroless plating. The metal plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, gold, or silver and connectivity with the connection member 3, for example, a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold having a thickness of about 0.1 to 3 μm. A plating layer is sequentially deposited. As a result, the metal layer 13 and the wiring conductor 15 can be effectively prevented from corroding, and the metal layer 13 and the lid, or the metal lid or metal frame, and the wiring conductor 15 and the bonding are bonded. The bonding between the connection member 3 such as a wire and the bonding between the wiring conductor 15 and the connection pad 51 for connection formed on the module substrate 5 can be strengthened.

  The metal plating layer is not limited to nickel plating layer / gold plating layer, and may be other metal plating layers including nickel plating layer / palladium plating layer / gold plating layer.

  An electronic device can be manufactured by mounting the electronic component 2 on the mounting portion on the bottom surface of the recess 12 of the wiring board 1. The electronic component 2 mounted on the wiring board 1 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the mounting portion by a bonding member such as a low melting point brazing material or a conductive resin, and then connected to a bonding wire or the like. The electrode of the semiconductor element and the wiring conductor 15 are electrically connected via the member 3 to be mounted on the wiring board wiring board 1. As a result, the electronic component 2 is electrically connected to the wiring conductor 15. For example, when the electronic component 2 is a flip chip type semiconductor element, the semiconductor element is a semiconductor via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). The electrode of the element and the wiring conductor 15 are mounted on the wiring board 1 by being electrically and mechanically connected. In addition, a plurality of electronic components 2 may be mounted on the wiring board 1, or small electronic components such as a resistance element or a capacitor element may be mounted as necessary. Moreover, the electronic component 2 is sealed with a lid made of resin, glass, ceramics, metal, or the like, using a sealing material 4 made of resin, glass, or the like, as necessary.

  For example, as shown in FIG. 4, the external electrode 13 of the electronic device of the present embodiment is connected to the connection pad 51 of the module substrate 5 via the solder 6 to form an electronic module. In the electronic device, for example, as shown in FIG. 4, the external electrode 13 disposed on the upper surface side of the wiring substrate 1 is connected to the connection pad 51 of the module substrate 5. When an optical element such as a light emitting element is used as the electronic component 2, the module substrate 5 is provided with an opening 52 for transmitting light, as shown in FIG. Such an opening 52 is formed larger than the electronic component 2 in plan view.

  The wiring board 1 of the present embodiment has a recess 12 for mounting the electronic component 2 on the main surface, a rectangular insulating substrate 11 in plan view, and a frame-shaped metal layer 13 provided on the side wall of the recess 12. A through conductor group 14G including a plurality of through conductors 14 disposed so as to be covered with the metal layer 13 in a plan view, the metal layer 13 and the through conductor group 14G are separated from each other, and the insulating substrate 11 In the thickness direction, there is no other through conductor between the metal layer 13 and the through conductor group 14G, and the through conductor group 14G is provided along the side wall of the recess 12 in a plan view. With the above configuration, the through conductor 14 disposed inside the insulating substrate 11 holds the side wall of the recess 12 so that the upper surface of the side wall of the recess 12 is insulated due to, for example, stress during lamination or cutting in the manufacturing process. It is possible to suppress a concave shape in the thickness direction along the outer edge of the substrate 11, improve the bonding between the frame-shaped metal layer 13 and the lid or frame, and improve the airtightness in the concave portion 12. It can be good.

  Further, in the planar perspective view, the through conductor group 14G has a plurality of through conductors 14 arranged in a band shape. With this arrangement, the through conductors 14 disposed inside the insulating substrate 11 along the side walls of the recesses 12 are better held, so that the upper surface of the side walls of the recesses 12 is the outer edge of the insulating substrate 11. It can suppress that it becomes concave shape in the thickness direction along.

  Note that the phrase “the plurality of through conductors 14 are arranged in a strip shape” indicates that five or more through conductors 14 are arranged along the side wall of the recess 12 in a plan view. In the example shown in FIGS. 1 and 2, one through conductor group 14 </ b> G includes 11 through conductors 14, and the wiring board 1 is provided with through conductor groups 14 </ b> G along the four side walls of the recess 12. The four through conductor groups 14G are formed.

  Further, when the plurality of through conductors 14 are arranged at equal intervals in one through conductor group 14G, for example, stress at the time of stacking or cutting in the manufacturing process, etc. The through conductor groups 14G arranged at intervals are easily dispersed evenly, and the through conductors 14 arranged inside the insulating substrate 11 along the side walls of the recesses 12 can better hold the side walls of the recesses 12. It is possible and preferable.

  In the wiring board 1, a plurality of through conductors 14 are continuously arranged along the side wall at equal intervals on each of the four side walls, that is, a through conductor group 14G is provided on each of the four side walls. Preferably it is.

  Further, the through conductor group 14 </ b> G is provided away from the corner of the side wall of the recess 12 in a plan view. With this arrangement, the insulating substrate is formed along the side wall of the recess 12 that tends to be concave in the thickness direction, which is sandwiched between corners of the side wall of the recess due to stress during lamination or cutting in the manufacturing process, for example. By holding the through conductors 14 arranged inside 11, it is possible to effectively suppress the upper surface of the side wall of the recess 12 from being recessed in the thickness direction along the outer edge of the insulating substrate 11.

  Note that the penetrating conductor group 14G is provided apart from the corners of the side walls of the recess 12 means that the through-extension diagonal line of the insulating substrate 11 that passes through the opposite corners of the recess 12 or the virtual extension diagonal line. Beyond that, the through conductor 14 is not provided. Further, as in the example shown in FIG. 2, if the shortest distance between adjacent through conductor groups 14G across the virtual extension diagonal line is larger than the interval between the through conductors 14 in one through conductor group 14G, for example, electrons Even if the heat of the electronic component 2 is transmitted to the wiring board 1 during operation of the apparatus, stress due to the difference in thermal expansion between the insulating substrate 11 and the through conductor 14 is formed at the corner of the side wall of the recess 12 where stress is easily applied during handling. Is less likely to occur, and it is possible to suppress the occurrence of cracks and the like at the corners of the side walls of the recesses 12, which is preferable. The through conductors 14 disposed at the end of the through conductor group 14G are preferably separated from the outer edges of the orthogonal outer walls of the through conductor group 14G by two or more diameters of the through conductor 14.

  The electronic device according to the present embodiment includes the wiring substrate 1 having the above-described configuration and the electronic component 2 mounted in the recess 12 so that the electronic device has excellent airtightness and excellent long-term reliability. it can.

  The electronic module according to the present embodiment includes the module substrate 5 having the connection pads 51, and the electronic device having the above-described configuration connected to the external electrodes 13 via the solder 6 on the connection pads 51. The reliability can be improved.

  The wiring board 1 in this embodiment can be used suitably in a small electronic device, and the airtightness in the recessed part 12 in the wiring board 1 can be improved.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

  The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the through conductor group 14G is provided on the outer edge side of the side wall of the recess 12. Note that, in the electronic device according to the second embodiment, similarly to the electronic device according to the first embodiment, in the example illustrated in FIG. 5, the region where the metal layer 13 overlaps is indicated by a dotted line in a plan view. Yes. Further, in the example shown in FIG. 6, a region where the through conductors 14 overlap is indicated by a dotted line in a plan view.

Similar to the wiring substrate 1 of the first embodiment, the wiring substrate 1 in the second embodiment has a through conductor 14 disposed inside the insulating substrate 11 holding the side wall of the recess 12, for example, a manufacturing process. It is possible to suppress the upper surface of the side wall of the concave portion 12 from being concave in the thickness direction along the outer edge of the insulating substrate 11 due to stress at the time of lamination or cutting in the frame, and the frame-shaped metal layer 13 and the lid The bonding with the body or the frame can be made good, and the airtightness in the recess 12 can be made good.

  The through conductor group 14G is provided on the outer edge side of the side wall of the concave portion 12 that the through conductor 14 is on the outer wall side of the concave portion 12, that is, the center of each through conductor 14 constituting the through conductor group 14G is That is, it is located on the outer wall side of the recess 12 with respect to the center line N of the width W1 of the side wall.

  When the through conductor group 14G is provided on the outer edge side of the side wall of the recess 12, the interval W3 between the through conductor 14 and the outer wall of the recess 12 is set to suppress distortion between the through conductor 14 and the outer wall of the recess 12. The diameter of the through conductor 14 is preferably equal to or greater than (W3 ≧ φ1).

  The through conductor 14 of the wiring board 1 in the second embodiment is formed by forming a through hole for the through conductor 14 provided in the ceramic green sheet for the insulating substrate 11 on the outer edge side of the side wall of the recess 12. can do.

  Further, as in the example shown in FIGS. 5A and 7, the insulating film 16 may be formed so as to cover the outer edge of the surface of the metal layer 13. The insulating film 16, for example, controls the flow of the brazing material or the like on the surface of the metal layer 13 when joining the metal lid body or the metal frame body to the metal layer 13, and the metal layer 13 and the metal layer It is possible to satisfactorily join the lid or the metal frame and to improve the airtightness in the recess 12. The metal conductor 14 may be provided so as to overlap the insulating film 16 in a plan view.

  The insulating film 16 is a ceramic layer substantially equivalent to the insulating substrate 11. For example, if the insulating substrate 11 is made of an aluminum oxide sintered body, the insulating film 16 is made of an aluminum oxide sintered body. When the insulating film 16 is made of an aluminum oxide sintered body, such an insulating film 16 is obtained by adding a ceramic paste obtained by adding and mixing an appropriate organic binder and a solvent to the aluminum oxide powder. The ceramic green sheet for 11 is printed and applied in a predetermined pattern by a screen printing method so as to partially overlap with the metallized paste for the metal layer 13, and fired simultaneously with the ceramic green sheet for the insulating substrate 11, The insulating substrate 11 is deposited on a predetermined position.

  The wiring board 1 of the second embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment described above.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS. The electronic device according to the third embodiment of the present invention differs from the electronic device according to the above-described embodiment in that the length L1 of the through conductor group 14G is larger than the length L2 of the recess 12. Further, in the electronic device according to the third embodiment, similarly to the electronic device according to the first embodiment, in the example illustrated in FIG. 8, the region where the metal layer 13 overlaps is indicated by a dotted line in a plan view. Yes. Further, in the example shown in FIG. 9, a region where the through conductors 14 overlap is shown by a dotted line in plan perspective. Further, in the example shown in FIGS. 9 and 10, the region where the concave portion 12 overlaps is indicated by a dotted line.

  Similar to the wiring substrate 1 of the first embodiment, the wiring substrate 1 in the third embodiment has a through conductor 14 disposed inside the insulating substrate 11 holding the side wall of the recess 12, for example, in a manufacturing process. It is possible to suppress the upper surface of the side wall of the concave portion 12 from being concave in the thickness direction along the outer edge of the insulating substrate 11 due to stress at the time of lamination or cutting in the frame, and the frame-shaped metal layer 13 and the lid The bonding with the body or the frame can be made good, and the airtightness in the recess 12 can be made good.

  Further, since the length L1 of the through conductor group 14G is larger than the length L2 of the recess 12, the through conductor 14 holds the entire side wall of the recess 12, so that the upper surface of the side wall of the recess 12 is It can suppress more favorably that it becomes concave shape in the thickness direction along an outer edge.

  In the wiring substrate 1 of the third embodiment, the length L1 of the through conductor group 14 is larger than the length L2 of the concave portion 12 in a plan view, as in the example shown in FIG. This indicates that the length L1 of the through conductor group 14G consisting of 14 is larger than the length L2 of the inner wall of the recess 12 having the largest opening (L1> L2). In the wiring board 1 of the third embodiment, the through conductor group 14G is provided away from the corner of the side wall of the recess 12 as in the wiring board 1 of the first embodiment. The wiring board 1 of the third embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment described above.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner when viewed in a plan view. Further, a notch may be provided between the side surface of the insulating substrate 11 and the one main surface, and a so-called castellation conductor in which the wiring conductor 15 is extended to the inner surface of the notch may be provided.

  Moreover, you may combine the wiring board 1 of 1st-3rd embodiment. For example, the insulating film 16 may be provided in the wiring substrate 1 of the first or third embodiment.

  In the above-described embodiment, the example in which the insulating substrate 11 is configured by the four insulating layers 11a is shown. However, the insulating substrate 11 is configured by three or five or more insulating layers 11a. It doesn't matter.

  Further, the wiring board 1 may be manufactured in the form of a multi-piece wiring board.

1 ... Wiring board
11 ... Insulating substrate
12 ... Recess
13 ... Metal layer
14 ... Penetration conductor
14G ... Penetration conductor group
15 ... Wiring conductor
16 ··· Insulating film 2 ··· Electronic component 3 ··· Connection member L1 · Length L2 of through conductor group · Length of recess

Claims (7)

A rectangular insulating substrate in plan view having a recess for mounting electronic components on the main surface;
A frame-shaped metal layer provided on the side wall of the recess;
A through conductor group including a plurality of through conductors arranged so as to be covered with the metal layer in a plan view,
The metal layer and the through conductor group are separated from each other, and there is no other through conductor between the metal layer and the through conductor group in the thickness direction of the insulating substrate. A wiring board characterized in that a group is provided along the side wall of the recess.   2. The wiring board according to claim 1, wherein the plurality of through conductors are arranged in a band shape in the through conductor group in a plan view.   3. The wiring board according to claim 1, wherein the through conductor group is provided apart from a corner portion of the side wall of the concave portion in a plan view.   4. The wiring board according to claim 1, wherein the through conductor group is provided on an outer edge side of a side wall of the recess in a plan view.   5. The wiring board according to claim 1, wherein the length of the through conductor group is larger than the length of the concave portion in a plan view. The wiring board according to any one of claims 1 to 5,
And an electronic component mounted in the recess. A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 6 connected to the connection pad via solder.

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