JPS6489551A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPS6489551A
JPS6489551A JP24833287A JP24833287A JPS6489551A JP S6489551 A JPS6489551 A JP S6489551A JP 24833287 A JP24833287 A JP 24833287A JP 24833287 A JP24833287 A JP 24833287A JP S6489551 A JPS6489551 A JP S6489551A
Authority
JP
Japan
Prior art keywords
punching
inner lead
flat area
area
correction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24833287A
Other languages
Japanese (ja)
Inventor
Yuji Matsubara
Tomoichi Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24833287A priority Critical patent/JPS6489551A/en
Publication of JPS6489551A publication Critical patent/JPS6489551A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To decrease the variation of correction and improve the tip positioning accuracy of inner leads by selecting a punching position in such a manner that at least half the punching area coincides with the flat area of the back of an inner lead. CONSTITUTION:A punched metal lead frame has a flat area 4 at the back of its inner lead 2, and the flat area becomes wider with the width of the inner lead 2. The punching point for positional correction is selected toward the tie bar of the tapered inner lead, so that at least half the punching area can coincide with the flat area 4. This requires less correction if formed portions 5 are different in shape.
JP24833287A 1987-09-30 1987-09-30 Manufacture of lead frame for semiconductor device Pending JPS6489551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24833287A JPS6489551A (en) 1987-09-30 1987-09-30 Manufacture of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24833287A JPS6489551A (en) 1987-09-30 1987-09-30 Manufacture of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6489551A true JPS6489551A (en) 1989-04-04

Family

ID=17176510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24833287A Pending JPS6489551A (en) 1987-09-30 1987-09-30 Manufacture of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6489551A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof

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