JPS5472963A - Lead frame for semiconductor element - Google Patents

Lead frame for semiconductor element

Info

Publication number
JPS5472963A
JPS5472963A JP13996977A JP13996977A JPS5472963A JP S5472963 A JPS5472963 A JP S5472963A JP 13996977 A JP13996977 A JP 13996977A JP 13996977 A JP13996977 A JP 13996977A JP S5472963 A JPS5472963 A JP S5472963A
Authority
JP
Japan
Prior art keywords
link piece
parts
piece parts
lead
link
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13996977A
Other languages
Japanese (ja)
Inventor
Nobuo Otani
Usuke Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13996977A priority Critical patent/JPS5472963A/en
Publication of JPS5472963A publication Critical patent/JPS5472963A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the yield of products by reducing the zigzaging of a center hole at the time of punching a lead frame, by forming at a fixed angle a groove at a linking-piece part between adjacent lead piece parts. CONSTITUTION:Lead piece parts 20 for the formation of a semiconductor element are formed in one with frame main body 10 extending from the part between link piece parts 11 and 12 toward the side of link piece part 11 and along the length direction of link piece parts 11 and 12 at a fixed interval. Into link piece parts 11, groove 14 is pressed at the nearly middle position between lead piece parts 20 prependicularly to the length directin from the outside of link piece part 11 to its inside not reaching all of width-directional parts. Consequently, link piece part 11 is elongated slightly and balance is kept between link piece parts 11 and 12, so that the zigzaging of center hole 15 can be suppressed to a little.
JP13996977A 1977-11-24 1977-11-24 Lead frame for semiconductor element Pending JPS5472963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13996977A JPS5472963A (en) 1977-11-24 1977-11-24 Lead frame for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13996977A JPS5472963A (en) 1977-11-24 1977-11-24 Lead frame for semiconductor element

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP24441584A Division JPS60186048A (en) 1984-11-21 1984-11-21 Forming method of lead frame

Publications (1)

Publication Number Publication Date
JPS5472963A true JPS5472963A (en) 1979-06-11

Family

ID=15257875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13996977A Pending JPS5472963A (en) 1977-11-24 1977-11-24 Lead frame for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5472963A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578739U (en) * 1980-06-16 1982-01-18
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof
JPS60186048A (en) * 1984-11-21 1985-09-21 Hitachi Ltd Forming method of lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313358A (en) * 1976-07-22 1978-02-06 Toshiba Corp Manufacture of lead frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578739U (en) * 1980-06-16 1982-01-18
JPS57210651A (en) * 1981-06-19 1982-12-24 Toshiba Corp Lead frame and manufacture thereof
JPS6252951B2 (en) * 1981-06-19 1987-11-07 Tokyo Shibaura Electric Co
JPS60186048A (en) * 1984-11-21 1985-09-21 Hitachi Ltd Forming method of lead frame

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