JPH0373463U - - Google Patents
Info
- Publication number
- JPH0373463U JPH0373463U JP13551489U JP13551489U JPH0373463U JP H0373463 U JPH0373463 U JP H0373463U JP 13551489 U JP13551489 U JP 13551489U JP 13551489 U JP13551489 U JP 13551489U JP H0373463 U JPH0373463 U JP H0373463U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor element
- tie bar
- leads
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案リードフレームの一つの実施例
を示す平面図、第２図は従来例を示す平面図、第
３図は考案が解決しようとする問題点を説明する
平面図である。
符号の説明、１……リード、１ａ……インナー
リード、２……タイバー、７……モールド用金型
、７ｇ……ゲート。
FIG. 1 is a plan view showing one embodiment of the lead frame of the present invention, FIG. 2 is a plan view showing a conventional example, and FIG. 3 is a plan view illustrating the problem to be solved by the invention. Explanation of symbols: 1...Lead, 1a...Inner lead, 2...Tie bar, 7...Molding die, 7g...Gate.
Claims (1)
に樹脂封止される各リードを少なくともタイバー
により一体化したリードフレームにおいて、 樹脂封止の際にモールド用金型のゲートと近い
ところに位置するリードの上記タイバーの内側の
部分を他のリードのそれよりも太くした ことを特徴とするリードフレーム。[Claim for Utility Model Registration] In a lead frame in which each lead connected to each electrode of a semiconductor element and sealed with resin together with the semiconductor element is integrated with at least a tie bar, the lead frame is connected to the gate of a molding die during resin sealing. A lead frame characterized in that the inner part of the tie bar of the leads located close to each other is made thicker than that of other leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135514U JP2503561Y2 (en) | 1989-11-21 | 1989-11-21 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135514U JP2503561Y2 (en) | 1989-11-21 | 1989-11-21 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0373463U true JPH0373463U (en) | 1991-07-24 |
| JP2503561Y2 JP2503561Y2 (en) | 1996-07-03 |
Family
ID=31682781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135514U Expired - Fee Related JP2503561Y2 (en) | 1989-11-21 | 1989-11-21 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503561Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113070U (en) * | 1978-01-27 | 1979-08-08 | ||
| JPH01243566A (en) * | 1988-03-25 | 1989-09-28 | Hitachi Ltd | Lead frame |
-
1989
- 1989-11-21 JP JP1989135514U patent/JP2503561Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113070U (en) * | 1978-01-27 | 1979-08-08 | ||
| JPH01243566A (en) * | 1988-03-25 | 1989-09-28 | Hitachi Ltd | Lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2503561Y2 (en) | 1996-07-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |