JPH0281721U

JPH0281721U -

Info

Publication number: JPH0281721U
Application number: JP16146288U
Authority: JP
Priority date: 1988-12-12
Filing date: 1988-12-12
Publication date: 1990-06-25

Description

[Brief explanation of drawings]

第１図は本考案のダイとそのリードフレーム部
を載せた半製品の部分平面図、第２図は、第１図
の状態におけるパンチの動作を説明するための第
２図Ａ―Ａ線に沿う断面図、第３図は、第１図の
ダイおよび半製品ならびに第２図のパンチを示す
斜視図、第４図は従来のダイと半製品の部分平面
図、第５図は、第４図の状態と従来のパンチを示
す斜視図である。１，３……パンチ、１ａ……テーパー面、２，
４……ダイ、２ａ……テーパー部、５……半製品
の封止樹脂、６……リードフレーム、７……タイ
バー、８……樹脂バリ。 Fig. 1 is a partial plan view of a semi-finished product on which the die of the present invention and its lead frame are mounted, and Fig. 2 is taken along line A-A in Fig. 2 to explain the operation of the punch in the state shown in Fig. 1. 3 is a perspective view showing the die and semi-finished product shown in FIG. 1 and the punch shown in FIG. 2, FIG. 4 is a partial plan view of the conventional die and semi-finished product, and FIG. FIG. 2 is a perspective view showing the state shown in the figure and a conventional punch. 1, 3...Punch, 1a...Tapered surface, 2,
4...Die, 2a...Tapered portion, 5...Semi-finished sealing resin, 6...Lead frame, 7...Tie bar, 8...Resin burr.

Claims

[Scope of utility model registration request]

In a punch die used to cut tie bars of a lead frame in a semi-finished product after the resin encapsulation process during the manufacturing of a resin-encapsulated semiconductor device, the die is inserted into the boundary between the tie bar and the resin burr of the semi-finished product. The punch has a taper that provides relief necessary for peeling off the resin burr, and the punch rotates downward using the root of the sealing resin body of the resin burr as a fulcrum when the punch descends. A punch die characterized by having a tapered part for removing burrs.