JPS63110047U - - Google Patents
Info
- Publication number
- JPS63110047U JPS63110047U JP157287U JP157287U JPS63110047U JP S63110047 U JPS63110047 U JP S63110047U JP 157287 U JP157287 U JP 157287U JP 157287 U JP157287 U JP 157287U JP S63110047 U JPS63110047 U JP S63110047U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- sealed
- semiconductor device
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のリードフレームの
平面図、第２図ａ，ｂはインナーリード上の段差
部の形成方法を示した斜視図、第３図は樹脂封止
後の段差部のリード軸方向の断面図、第４図は板
厚がすべて均一な従来のリードフレームの平面図
である。
１……タブ、２……インナーリード、２ａ，２
ｂ……突出部、３……吊りリード、４……段差部
、５……タイバー、６……フレーム、７……ガイ
ドホール、８……封止樹脂、９……すき間。
Fig. 1 is a plan view of a lead frame according to an embodiment of the present invention, Figs. 2a and b are perspective views showing a method for forming a stepped portion on an inner lead, and Fig. 3 is a stepped portion after resin sealing. FIG. 4 is a cross-sectional view in the lead axial direction, and FIG. 4 is a plan view of a conventional lead frame in which all plate thicknesses are uniform. 1...Tab, 2...Inner lead, 2a, 2
b...Protrusion, 3...Hanging lead, 4...Step, 5...Tie bar, 6...Frame, 7...Guide hole, 8...Sealing resin, 9...Gap.
Claims (1)
ームにおいて、前記樹脂内に封止されるインナー
リードおよび吊りリードの一部にリング状の段差
が形成されていることを特徴とする半導体装置用
リードフレーム。 A lead frame for use in a resin-sealed semiconductor device, characterized in that a ring-shaped step is formed in a part of the inner lead and the suspension lead sealed in the resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP157287U JPS63110047U (en) | 1987-01-08 | 1987-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP157287U JPS63110047U (en) | 1987-01-08 | 1987-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63110047U true JPS63110047U (en) | 1988-07-15 |
Family
ID=30779607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP157287U Pending JPS63110047U (en) | 1987-01-08 | 1987-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63110047U (en) |
-
1987
- 1987-01-08 JP JP157287U patent/JPS63110047U/ja active Pending