JPH03124656U - - Google Patents
Info
- Publication number
- JPH03124656U JPH03124656U JP3219790U JP3219790U JPH03124656U JP H03124656 U JPH03124656 U JP H03124656U JP 3219790 U JP3219790 U JP 3219790U JP 3219790 U JP3219790 U JP 3219790U JP H03124656 U JPH03124656 U JP H03124656U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealing
- lead frame
- pattern
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１実施例の製造途中の樹脂
封止直後の部分平面図、第２図は樹脂封止後の完
成品の部分斜視図、第３図は本考案の第２実施例
の部分斜視図である。
１……リードフレームの半導体素子搭載部、２
……インナーリード、３……アウターリード、４
……タイバー、５……タブリード、６……位置決
めパターン（十字形）、７……半導体素子、８…
…封止樹脂体（領域）、９……位置決めパターン
（円環状）。
Fig. 1 is a partial plan view of the first embodiment of the present invention immediately after resin sealing during manufacturing, Fig. 2 is a partial perspective view of the finished product after resin sealing, and Fig. 3 is a second embodiment of the present invention. FIG. 3 is a partial perspective view of an example. 1...Semiconductor element mounting part of lead frame, 2
...Inner lead, 3...Outer lead, 4
... Tie bar, 5 ... Tab lead, 6 ... Positioning pattern (cross shape), 7 ... Semiconductor element, 8 ...
... Sealing resin body (area), 9... Positioning pattern (circular).
Claims (1)
してなる半導体装置において、前記リードフレー
ムはこの半導体装置実装時の位置決めに用いられ
るパターンを有し、かつこのパターンは封止後の
封止樹脂体の外部に露呈されていることを特徴と
する半導体装置。 In a semiconductor device formed by resin-sealing after attaching leads using a lead frame, the lead frame has a pattern used for positioning during mounting of the semiconductor device, and this pattern is used for positioning the encapsulating resin body after sealing. A semiconductor device characterized by being exposed to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3219790U JPH03124656U (en) | 1990-03-28 | 1990-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3219790U JPH03124656U (en) | 1990-03-28 | 1990-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124656U true JPH03124656U (en) | 1991-12-17 |
Family
ID=31535123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3219790U Pending JPH03124656U (en) | 1990-03-28 | 1990-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124656U (en) |
-
1990
- 1990-03-28 JP JP3219790U patent/JPH03124656U/ja active Pending