JPH02146847U - - Google Patents
Info
- Publication number
- JPH02146847U JPH02146847U JP5495289U JP5495289U JPH02146847U JP H02146847 U JPH02146847 U JP H02146847U JP 5495289 U JP5495289 U JP 5495289U JP 5495289 U JP5495289 U JP 5495289U JP H02146847 U JPH02146847 U JP H02146847U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- attached
- lead
- area
- connects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図乃至第４図は本考案実施例のリードフレ
ームの製造工程図、第５図は本考案実施例のリー
ドフレームの要部斜視図を示す図、第６図ａ乃至
第６図ｄは本考案のリードフレームの他の製造工
程図、第７図は通常のワイヤレスボンデイング方
式の一例を示す説明図である。
１……インナーリード、２……タイバー、３…
…アウターリード、１１ａ……バンプ、１１……
肉薄のパターン、２０……チツプ、３０……連結
片、Ｔ１，Ｔ２……絶縁性テープ。
1 to 4 are manufacturing process diagrams of a lead frame according to an embodiment of the present invention, FIG. 5 is a perspective view of main parts of a lead frame according to an embodiment of the present invention, and FIGS. 6a to 6d are FIG. 7, which is another manufacturing process diagram of the lead frame of the present invention, is an explanatory diagram showing an example of a normal wireless bonding method. 1...Inner lead, 2...Tie bar, 3...
...Outer lead, 11a...Bump, 11...
Thin pattern, 20... Chip, 30... Connecting piece, T1, T2... Insulating tape.
Claims (1)
る複数のインナーリードを有するリードフレーム
のにおいて、 前リードフレームのパツケージエリア内におけ
る第１の面のボンデイングエリアを除く領域の少
なくとも一部に貼着され隣接リード間を連結固定
する第１の絶縁性物質と、 前記インナーリードの第２の面に貼着され、隣
接リード間を連結固定する第２の絶縁性物質とを
含むことを特徴とするリードフレーム。 (2) 前記第１および第２の絶縁性物質は、相互
に重なり合わないように貼着されていることを特
徴とする請求項(1)記載のリードフレーム。[Scope of Claim for Utility Model Registration] (1) In a lead frame having a plurality of inner leads extending radially from the vicinity of the semiconductor element mounting portion, an area other than the bonding area on the first surface within the package area of the front lead frame. a first insulating material that is attached to at least a portion of the inner lead and connects and fixes adjacent leads; and a second insulating material that is attached to a second surface of the inner lead and connects and fixes adjacent leads. A lead frame comprising: (2) The lead frame according to claim (1), wherein the first and second insulating materials are attached so as not to overlap each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5495289U JPH0720925Y2 (en) | 1989-05-12 | 1989-05-12 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5495289U JPH0720925Y2 (en) | 1989-05-12 | 1989-05-12 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02146847U true JPH02146847U (en) | 1990-12-13 |
| JPH0720925Y2 JPH0720925Y2 (en) | 1995-05-15 |
Family
ID=31577473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5495289U Expired - Lifetime JPH0720925Y2 (en) | 1989-05-12 | 1989-05-12 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720925Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008545278A (en) * | 2005-06-30 | 2008-12-11 | サンディスク コーポレイション | Die package with asymmetric leadframe connection |
-
1989
- 1989-05-12 JP JP5495289U patent/JPH0720925Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008545278A (en) * | 2005-06-30 | 2008-12-11 | サンディスク コーポレイション | Die package with asymmetric leadframe connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720925Y2 (en) | 1995-05-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |