JPH03126058U - - Google Patents
Info
- Publication number
- JPH03126058U JPH03126058U JP3515390U JP3515390U JPH03126058U JP H03126058 U JPH03126058 U JP H03126058U JP 3515390 U JP3515390 U JP 3515390U JP 3515390 U JP3515390 U JP 3515390U JP H03126058 U JPH03126058 U JP H03126058U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- leads
- lead
- outer leads
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Description
第１図ａおよび第１図ｂは本考案実施例のリー
ドフレームを示す図、第２図ａ乃至第２図ｃは本
考案実施例のリードフレームの製造工程を示す説
明図、第３図は従来例のリードフレームを用いた
半導体装置である。
１……半導体素子搭載部分、２ａ……第１のイ
ンナーリード、２ｂ……第２のインナーリード、
４ａ，４ｂ……アウターリード、５……リードフ
レーム本体部、６……ポリイミドフイルム、７…
…タイバー、８……上インナーリード部、１０…
…枠体、２０……絶縁フイルム、２１……リード
フレーム。
FIGS. 1a and 1b are diagrams showing a lead frame according to an embodiment of the present invention, FIGS. 2a to 2c are explanatory diagrams showing the manufacturing process of a lead frame according to an embodiment of the present invention, and FIG. This is a semiconductor device using a conventional lead frame. 1... Semiconductor element mounting portion, 2a... First inner lead, 2b... Second inner lead,
4a, 4b...outer lead, 5...lead frame main body, 6...polyimide film, 7...
...Tie bar, 8...Top inner lead part, 10...
... Frame body, 20 ... Insulating film, 21 ... Lead frame.
Claims (1)
体的に形成され、半導体素子搭載部分から放射状
に延びる複数の第１のインナーリードとを有する
リードフレーム本体部と、 前記各アウターリードのうち第１のインナーリ
ードが延設されていないものの先端に一端を接合
され、前記各第１のインナーリードの上にそのボ
ンデイングエリアを避けて絶縁性フイルムを介し
て配設され、半導体素子搭載部分近傍まで伸長す
る第２のインナーリードとを具備したことを特徴
とするリードフレーム。[Claims for Utility Model Registration] A plurality of outer leads and a plurality of first inner leads that are integrally formed by extending into a part of the outer leads and extend radially from the semiconductor element mounting portion. a lead frame main body having a lead frame main body, and one end of which is bonded to the tip of the first inner lead of each of the outer leads that is not extended, and an insulating conductor is placed on each of the first inner leads, avoiding the bonding area thereof. 1. A lead frame comprising a second inner lead that is disposed through a film and extends to the vicinity of a semiconductor element mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3515390U JP2509435Y2 (en) | 1990-03-30 | 1990-03-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3515390U JP2509435Y2 (en) | 1990-03-30 | 1990-03-30 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126058U true JPH03126058U (en) | 1991-12-19 |
| JP2509435Y2 JP2509435Y2 (en) | 1996-09-04 |
Family
ID=31540263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3515390U Expired - Lifetime JP2509435Y2 (en) | 1990-03-30 | 1990-03-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509435Y2 (en) |
-
1990
- 1990-03-30 JP JP3515390U patent/JP2509435Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509435Y2 (en) | 1996-09-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |