JPS6441149U - - Google Patents
Info
- Publication number
- JPS6441149U JPS6441149U JP13702487U JP13702487U JPS6441149U JP S6441149 U JPS6441149 U JP S6441149U JP 13702487 U JP13702487 U JP 13702487U JP 13702487 U JP13702487 U JP 13702487U JP S6441149 U JPS6441149 U JP S6441149U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- die pad
- line type
- semiconductor element
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案実施例のリードフレームを示
す図、第２図ａおよび第２図ｂは、半導体素子上
のボンデイングパツドの配列状態を示す図、第３
図は、第１図のリードフレームを用いた半導体素
子の実装状態を示す図、第４図は、従来のシング
ルインライン型のリードフレームを用いた半導体
素子の実装例を示す図（ボンデイングパツドがイ
ンナーリードの配列に一致）、第５図は同リード
フレームを用いた半導体素子の実装例を（ボンデ
イングパツドがインナーリードの配列と不一致）
示す図である。
１……ダイパツド、２……インナーリード、３
……半導体素子、４……ボンデイングワイヤ、Ｂ
１〜Ｂ９……（素子上の）ボンデイングパツド、
１１ａ，１１ｂ……枠体、１２ａ，１２ｂ……サ
ポートバー、１３……ダイパツド、Ｗ……ボンデ
イングワイヤ、Ｉ１〜Ｉ９……インナーリード、
Ｕ１〜Ｕ９……アウターリード、１４……タイバ
ー、１５……サブリード、ＰＬ……パツケージラ
イン、１６，１６′……半導体素子。
FIG. 1 is a diagram showing a lead frame according to an embodiment of the present invention, FIGS. 2a and 2b are diagrams showing the arrangement of bonding pads on a semiconductor element, and FIG.
The figure shows a mounting state of a semiconductor element using the lead frame of Fig. 1, and Fig. 4 shows an example of mounting a semiconductor element using a conventional single-in-line type lead frame (the bonding pad is Figure 5 shows an example of mounting a semiconductor device using the same lead frame (bonding pads do not match the inner lead arrangement).
FIG. 1...Die pad, 2...Inner lead, 3
...Semiconductor element, 4...Bonding wire, B
1 to B9...bonding pads (on the element),
11a, 11b...frame body, 12a, 12b...support bar, 13...die pad, W...bonding wire, I1-I9...inner lead,
U1 to U9...Outer lead, 14...Tie bar, 15...Sub lead, PL...Package line, 16, 16'...Semiconductor element.
Claims (1)
１辺を除く他の辺のまわりにインナーリードの先
端がくるように配列されると共に、インナーリー
ドから伸長するアウターリードが１列に配列せし
められてなるシングルインライン型のリードフレ
ームにおいて、 前記ダイパツドの前記１辺の近傍でこの辺に沿
つて伸長するパツドを有してなるサブリードを具
えたことを特徴とするリードフレーム。[Claims for Utility Model Registration] The tips of the inner leads are arranged around at least one side of a die pad on which a semiconductor element is mounted, and the outer leads extending from the inner leads are arranged in a row. What is claimed is: 1. A single in-line type lead frame in which the die pads are arranged in a single in-line type, characterized in that the sub-leads are provided in the vicinity of the one side of the die pad and have pads extending along this side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13702487U JPH0451487Y2 (en) | 1987-09-08 | 1987-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13702487U JPH0451487Y2 (en) | 1987-09-08 | 1987-09-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6441149U true JPS6441149U (en) | 1989-03-13 |
| JPH0451487Y2 JPH0451487Y2 (en) | 1992-12-03 |
Family
ID=31398079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13702487U Expired JPH0451487Y2 (en) | 1987-09-08 | 1987-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451487Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321047A (en) * | 1989-05-30 | 1991-01-29 | Internatl Business Mach Corp <Ibm> | Semiconductor package sealed in capsule |
-
1987
- 1987-09-08 JP JP13702487U patent/JPH0451487Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321047A (en) * | 1989-05-30 | 1991-01-29 | Internatl Business Mach Corp <Ibm> | Semiconductor package sealed in capsule |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451487Y2 (en) | 1992-12-03 |