JPH0451487Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead frame, and particularly to the structure of a single in-line type (SIP type) lead frame.

[Prior art and its problems]

Lead frames are broadly divided into single-line types in which the leads are arranged in one row on one side of the die pad, and dual-in-line types (DIP) in which the leads are arranged in two rows.

Among these, the SIP type lead frame has, for example, nine inner leads 2 arranged so as to surround three sides of a die pad 1 for mounting an element, as shown in FIG. A semiconductor element (chip) 3 is placed on the die pad 1, and the bonding pads B1 to B9 of the semiconductor element 3 and the tips of the inner leads 2 are connected by bonding wires 4, respectively, and a resin package (not shown) is attached. The method used is to mold it with

By the way, normally, if the arrangement of bonding pads on a semiconductor chip matches the arrangement order of each inner lead as shown in FIG. 2a, there is no problem as shown in FIG. 4. However, as shown in Figure 2b, if the bonding pad arrangement is shifted one by one from the inner lead arrangement,
In order to avoid changing the pin number, the tip of the inner lead must pass over the semiconductor element and be connected to the bonding pad B9 located at the farthest position, as shown in FIG. For this reason,
The bonding wire must be made longer.
Therefore, there was a problem that there was a high risk of short-circuiting with pad-touching or other wires, resulting in a decrease in reliability.

This invention was made in view of the above-mentioned circumstances,
It is an object of the present invention to provide a lead frame capable of forming a highly reliable semiconductor device without changing the pin number even when the arrangement of bonding pads of a chip is different.

[Means for solving problems]

Therefore, in the present invention, the tips of the inner leads are arranged around at least one side of the die pad on which the semiconductor element is mounted, and the outer leads extending from the inner leads are arranged in a line. The single inner line type lead frame is provided with a sub-lead having a wide portion, or a pad, extending along the one side of the die pad near the side.

[Effect]

With the above configuration, even if the bonding location is far away, once one end of the inner lead and one end of the sub lead are bonded, and then the other end of the sub lead is bonded to the bonding pad of the semiconductor element. Since the bonding wire can be connected without increasing its length, reliability does not deteriorate due to a short circuit of the bonding wire.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a lead frame according to an embodiment of the present invention.

This lead frame consists of a rectangular die pad 13 supported by support bars 12a and 12b extending from frames 11a and 11b, respectively.
, first to ninth inner leads I1 to I9 arranged so that their tips are located near three sides of the die pad, and first to ninth inner leads extending from these first to ninth inner leads, respectively. outer leads U1 to U9 and the diver 14 that supports them.
and a sub-lead 15 extending along one side opposite to the arrangement direction of the outer leads U1 to U9 of the die pad.

Here, V is a groove for stress relaxation.

When mounting a semiconductor element 16' in which the bonding pads B1 to B9 are arranged one by one as shown in FIG. Connections are made.

That is, the first inner lead I1 and the first bonding pad B1, the second inner lead I1 and the second bonding pad B2, and so on are connected by the bonding wire W, and the ninth inner lead I9 is connected in this order. and sub lead 15
Connect one end with bonding wire W, and
The other end of the sub-lead 15 and the ninth bonding pad B9 are connected by a bonding wire W.

Then, after molding so that a resin package (not shown) comes up to the package line PL, the frame body, diver, etc. are cut out, and the outer lead is molded to complete the process. In semiconductor devices formed in this way, although the distance between the bonding pad and the inner lead may be long, the use of sub-leads makes the bonding wire extremely short and prevents it from intersecting the die pad. Therefore, there is no risk of short circuit and the reliability is high.

Note that the shape of the sub-lead is not limited to the embodiment and can be modified as appropriate.

Furthermore, as shown in FIG. 2a, when mounting a semiconductor element 16 in which bonding pads B1 to B9 are lined up in order, this sub-lead may be left unused without any problem. There isn't.

[Effect of idea]

As explained above, according to the present invention, in a single-line lead frame, the sub-leads extending along one side where the inner lead tips of the die pad do not approach are arranged, so that the semiconductor elements to be mounted are Even when the bonding pad arrangement is different from the inner lead arrangement and the bonding wires must cross each other on the die pad, connecting the inner lead and bonding pad via the sub-lead will prevent a short circuit. High reliability of the semiconductor device can be maintained without any damage.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a lead frame according to an embodiment of the present invention, FIGS. 2a and 2b are diagrams showing the arrangement of bonding pads on a semiconductor element, and FIG.
The figure shows a mounting state of a semiconductor element using the lead frame of Fig. 1, and Fig. 4 shows an example of mounting a semiconductor element using a conventional single-line lead frame (the bonding pad is FIG. 5 is a diagram showing an example of mounting a semiconductor element using the same lead frame (the bonding pads do not match the arrangement of the inner leads). 1...Die pad, 2...Inner lead, 3
...Semiconductor element, 4...Bonding wire, B
1 to B9...bonding pads (on the element),
11a, 11b...frame body, 12a, 12b...support bar, 13...die pad, W...bonding wire, I1-I9...inner lead,
U1 to U9...Outer lead, 14...Tie bar, 15...Sub lead, PL...Package line, 16, 16'...Semiconductor element.

Claims (1)

[Claims for Utility Model Registration] The tips of the inner leads are arranged around at least one side of the die pad on which the semiconductor element is mounted, and the outer leads extending from the inner leads are arranged in a line. What is claimed is: 1. A single inner line type lead frame comprising: a sub-lead provided with a wide portion near the one side of the die pad and extending along the side;