JPS5833861A - Lead frame for semiconductor - Google Patents

Abstract

PURPOSE:To align the positions of a chip and leads by inserting the right and left external leads of a lead pattern between the external leads of adjacent lead patterns and inclining the lead patterns with respect to the profile line of the lead frame, thereby saving the material. CONSTITUTION:A plurality of lead patterns, each of which has a plurality of leads 2 and a profile unit 3 at a semiconductor element placing part 2 as a center, are continuously formed at a lead frame. The right and left external leads 5 of the lead patterns are inserted between the external leads 5' of the adjacent lead patterns. Further, the lead patterns are inclined at the prescribed angle theta with respect to the profile line 6 of the lead frame. As a result, the element placing parts 1, 1' of the respective lead patterns are disposed on linear lines parallel to the profile line 6 of the lead frame.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead 7 array for semiconductor integrated circuit devices (IC, LSI) having a plurality of repeating patterns.

Conventionally, the length of a semiconductor lead frame having the above structure was required to be an integral multiple or more of the length of the part to be made into an m-product.

11pl&- of the 1111th slave power lead frame is shown. In the figure, 1 is an element (chip) mounting part, 2 is a lead extending over this part, 3 is an outer part (7 frames), and 4 is a boundary part. Such a lead frame is made of a single metal flat II
L is punched out continuously or a part of the frame pattern is formed, but the punching margin is large near the outer end of the lead (external lead), and there is a lot of wasted material.

Therefore, conventionally, there has been no attempt to shift the lead frame patterns so that the leads of adjacent lead frames are stacked above and below each other, thereby reducing the gap between the leads and saving on materials.

For example, as shown in No. 5 chips (IIP
There are convenient structures, such as pellet bonding and dow wire bonding, in which the positions of the chip and lead frame are adjusted by changing the pattern of adjacent leads so that the positions of the conductive elements (conductor elements) are the same. However, according to the above-mentioned improvement 11, in the case of the one shown in FIG. 2, the patterns of adjacent wires 7 and 5 are different, and the positions of the chips are also different, which complicates the assembly process.

There are problems with the quality and maintenance of the IR equipment due to the wavy shape of the mold m<resin package. In addition, regarding the third cabinet, the most stormy lead pattern cannot be obtained from the w diameter on the lead frame setting needle, and the quality cannot be maintained because the 2@glued pattern is warm compared to the same product lIK. The disadvantage of the cape is that it is difficult to do so.

The present invention was made to eliminate the drawbacks of the above-mentioned conventional technology, and its purpose was to save materials for lead frames, and to make it possible for assembly workers in the United States to be applied as is.
Lead 7-ray 5-t- that produces uniform and reliable finished products
To provide &.

An embodiment of the present invention is shown in the fourth panel. In the lead frame shown in this embodiment, the left and right external leads 5 of the lead patterns corresponding to adjacent elements are inserted between the external leads 5 of the adjacent lead patterns, and at the same time, each lead pattern is connected to the outer part of the lead frame. They are formed so as to be inclined by a predetermined angle (#) with respect to the line 6, so that the element loading S1.1 of the lead pattern corresponding to each element is on a straight line parallel to the outline of the lead frame. It is set to be placed. In the lead pattern, the external leads that have entered each other should have their tips connected to the base of the other lead as shown in No. 51!11. It may be separated from the position shown in .

According to the present invention described in the embodiments above, the longitudinal dimension of the lead frame can be shortened while using exactly the same side patterns, and the purpose of the above-mentioned generation can be achieved for the following reasons. It can be achieved.

■All lead frames have the same shape, and the finished product is virtually unchanged from conventional products.

■The length direction of the lead is 1. For example, with a general-purpose IC type of 14.16 Piml, the grip will be 2s shorter, but the lead length can be kept to 1/2m compared to the conventional type. It's easy.

■Since the chip and leads are aligned, it is easy to use an automatic assembly machine.

etc.

When putting the lead frame on the automatic assembly line according to the present invention, it is necessary to take into consideration the bonding head 8 and recognition head 8 as shown in section **.
If combined with the nod 1 of the -7 frame in the direction of
Automation can be done using exactly the same way of thinking that has been used for single motion recognition◆. or.

If the recognition device allows the chip 10 to tilt tt-, it is also possible to perform wmt* ending while the chip 10 is tilted as shown in FIG. or,
Lead 7 Ray 5 flag (element loading part) like the 8th garden
You can remove the tip #5 and add a tip #10, or if the bladder size is sufficiently large for the tip #10, the #9 tip can be added.
As shown in the figure, it may be possible to perform bullet bonding on only the chip without attaching any tilt.

Furthermore, as shown in Figure K1110, the same purpose can be achieved by adding only the outer lead 5 at an angle tt while leaving the 7 ladder l of the lead frame and the inner lead in the conventional pattern.

Brief description of wJwi g1ml~ Figure 3 is a plan view showing a conventional lead 7-lame pattern. FIG. 4 shows an example of the lead 7 frame pattern according to the present invention.
FIG. 3 is a partially enlarged plan view in which a part of the figure is modified. FIG. 6 shows a configuration 1 in which a conductor element is assembled to a lead frame according to the present invention.
IN- A plan view for explanation, No. 7 wJ is an enlarged plan view of the same. 8 to 10 are partial plan views showing other embodiments of lead frame patterns according to the present invention.

l...Element placement part (flag), 2.-lead, 3.
-7 frame, 4... border, g... external lead, 6...
... Outer line, 7 - Center line, 8... Bonding head.

9... Frame feeder, lo... Medium conductor element (chip).

Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] 1. In a semiconductor lead frame in which a plurality of lead patterns having a plurality of leads and an outer part at the center of the semiconductor element mounting part are successively formed on a long conductor flat plate, in the lead pattern corresponding to one element. The external lead portions of the plurality of leads are formed in parallel on the left and right at predetermined intervals, and the left and right leads of the lead patterns corresponding to adjacent elements enter into the gap between the leads of the adjacent lead patterns, and at the same time, the leads of each lead pattern 41 that at least the external lead portions are tilted at a predetermined angle WL relative to the outer contour of the lead frame, so that the element mounting portion of the lead pattern corresponding to each element is arranged parallel to the outer contour of the lead frame. Lead frame for semiconductors.