JPH053266A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent deformation of outer lead terminals during packaging work or the like by providing a flat type resin package with reinforcements to prevent deformation of the lead terminals in a semiconductor device which projects strip-shaped lead terminals out of the resin package. CONSTITUTION:A resin package 2 of a semiconductor device 1 is provided with reinforcements 6 to prevent deformation of outer lead terminals 3. The reinforcements 6 consist of a plurality of projections each provided comblike to two long sides of the resin package 2, each of which corresponds to one of the outer lead terminals 3. The reinforcements 6 are discrete: they are formed upon transfer resin molding after a semiconductor chip is bonded. The reinforcement 6 serves as a base supporting the flat area on the root side of the outer lead terminal. This design makes it hard to deform the outer lead terminals 3 even when outer force acts on them during packaging work, for example.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a strip-shaped external lead terminal is projected to the outside of a resin package, and more particularly to a semiconductor device improved to prevent deformation of the external lead terminal.

[0002]

2. Description of the Related Art FIG. 6 shows a conventional semiconductor device.
In the figure, 1 is a semiconductor device, 2 is a flat type resin package having a substantially rectangular shape in plan view, 3 is a plurality of external lead terminals laterally projected from two long sides of the resin package 2,
4 is a mounting substrate on which a printed wiring (not shown) is formed, 5
Is solder for joining the external lead terminal 3 and the mounting substrate 4.

Although not shown, a semiconductor chip is die-bonded to a lead frame, wire-bonded, and then molded with a resin material, and then the resin package 2
The external lead terminal 3 protruding further outward is bent into a so-called gull wing shape as shown in the drawing.

Such a semiconductor device is mounted on the mounting substrate 4 via solder 5 as shown in FIG.

[0005]

By the way, in the prior art,
For example, when an external force is applied to the external lead terminal 3 of the semiconductor device 1 during mounting work, the external lead terminal 3 may be deformed from the root. If there is such a deformation,
The semiconductor device 1 cannot be mounted, and when the automatic mounting device is used, the above-mentioned semiconductor device is excluded as a defective product, resulting in poor yield.

The present invention was devised in view of the above circumstances, and an object thereof is to prevent deformation of the external lead terminals.

[0007]

In order to achieve the above object, the present invention has the following structure in a semiconductor device in which a strip-shaped lead terminal is projected outside a resin package.

The semiconductor device of the present invention is characterized in that the resin package is provided with a reinforcing portion for preventing deformation of the external lead terminals.

The aforementioned reinforcing portion is provided corresponding to each external lead terminal, or at least corresponding to a combination of two or more adjacent external lead terminals. In addition, the reinforcement part consists of a base that projects laterally from the side of the resin package and receives the root of the external lead terminal from below, and the external lead terminal is embedded in this reinforcement part excluding its surface portion. May be

[0010]

Since the reinforcing portion reinforces the external lead terminal, even if an external force is applied to the external lead terminal of the semiconductor device during mounting work, the external lead terminal is less likely to be deformed.
Since the deformation of the external lead terminals can be almost eliminated in this manner, the semiconductor device can be mounted on the mounting substrate with almost no problem. Further, even in the automatic mounting apparatus, the semiconductor device is less likely to be treated as a defective product due to lead deformation.

[0011]

Embodiments of the present invention will now be described in detail with reference to the drawings.

1 and 2 show a first embodiment of the present invention. In the figure, 1 is a semiconductor device, 2 is a flat type resin package having a substantially rectangular shape in plan view, 3 is a plurality of external lead terminals laterally projected from two long sides of the resin package 2, and 4 is a print not shown. The mounting substrate 5 on which the wiring is formed is solder for joining the external lead terminal 3 and the mounting substrate 4, and these are the same as those shown in the drawing of the conventional example.

The structure of this embodiment different from the conventional example is as follows.
That is, the resin package 2 is provided with the reinforcing portion 6 for preventing the deformation of the external lead terminals 3.

The reinforcing portion 6 is composed of a plurality of convex portions provided in a comb tooth shape on the two long sides of the resin package 2, and each one corresponds to one external lead terminal 3 respectively. The reinforcements 6 are not adjacent to each other. Since the reinforcing portion 6 serves as a base for receiving the flat portion on the base side of the external lead terminal 3 from below, even if external force is applied to the external lead terminal 3 of the semiconductor device 1 during mounting work, for example, external force The lead terminal 3 is less likely to be deformed.

FIG. 3 shows a second embodiment of the present invention.
In this embodiment, the reinforcing portion 6a is a flange-shaped member having a length extending over substantially the entire two long sides of the resin package 2, and the external lead terminals 3 on one side of the resin package 2 are the same.
It is a stand that receives the flat part of the base of the from below.

The present invention is not limited to the ones described in the first and second embodiments, and the reinforcing portions 6 and 6a may have, for example, two, three or more adjacent external lead terminals 3 at the same time. It can be like a pedestal.
Further, as shown in FIGS. 4 and 5, the reinforcing portions 6 and 6a may be formed by embedding the external lead terminal 3 except the surface portion thereof. Further, the reinforcing portions 6 and 6a may be formed so as to surround the external lead terminal 3 except the tip portion.

By the way, in each of the above-mentioned embodiments, the reinforcing portions 6 and 6a are formed at the time of transfer resin molding after the semiconductor chip is bonded to the lead frame. Therefore, the shapes of the reinforcing portions 6 and 6a can be arbitrarily set according to the cavity shape of the molding die.

[0018]

As described above, according to the present invention, since the external lead terminals are protected by the reinforcing portion, even if external force is applied to the external lead terminals of the semiconductor device during mounting work, for example, the external lead terminals are protected. The terminals are less likely to be deformed. Therefore, in the semiconductor device according to the present invention, the defective product occurrence rate due to lead deformation is reduced, so that mounting defects on the mounting board are less likely to occur, and are also less likely to be treated as defective products in the automatic mounting device. Become.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a front view showing a mounted state of the semiconductor device of FIG.

FIG. 3 is a perspective view of a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a partial perspective view showing a modified example of the first embodiment.

FIG. 5 is a partial perspective view showing a modified example of the second embodiment.

FIG. 6 is a perspective view of a conventional semiconductor device.

FIG. 7 is a front view showing a mounted state of a conventional semiconductor device.

[Explanation of symbols]

1 semiconductor device 2 resin package 3 external lead terminal 6 reinforcement

Claims (4)

[Claims] 1. A semiconductor device in which a strip-shaped lead terminal is projected to the outside of a resin package, wherein the resin package is provided with a reinforcing portion for preventing deformation of the external lead terminal. Semiconductor device. 2. The semiconductor device according to claim 1, wherein the reinforcing portion is provided corresponding to each of the external lead terminals. 3. The semiconductor device according to claim 1, wherein the reinforcing portion is provided corresponding to at least a combination of two or more adjacent external lead terminals. 4. The semiconductor device according to claim 1, wherein the reinforcing portion is formed as a base projecting laterally from the side of the resin package and receiving the root of the external lead terminal from below. A semiconductor device, wherein a lead terminal is embedded except the surface portion thereof.