JPH0292941U - - Google Patents
Info
- Publication number
- JPH0292941U JPH0292941U JP1989001596U JP159689U JPH0292941U JP H0292941 U JPH0292941 U JP H0292941U JP 1989001596 U JP1989001596 U JP 1989001596U JP 159689 U JP159689 U JP 159689U JP H0292941 U JPH0292941 U JP H0292941U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- die island
- clamp
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例を示す平面図、第
１図ｂは第１図ａに示すリードフレームのダイア
イランドのヒートクランプの状態を示す斜視図、
第２図ａはこの種リードフレームの一例を示す平
面図、第２図ｂは第２図ａに示すリードフレーム
のダイアイランドのヒートクランプの状態を示す
斜視図である。
１……ダイアイランド、２……アースリード、
３……インナーリード、４……ヒートクランパー
、５……ヒートブロツク、６……チツプ、７……
ワイヤ、８……クランプリード。なお図中同一符
号は同一または相当する部分を示す。
FIG. 1a is a plan view showing an embodiment of the present invention, FIG. 1b is a perspective view showing the state of the heat clamp of the die island of the lead frame shown in FIG. 1a,
FIG. 2a is a plan view showing an example of this type of lead frame, and FIG. 2b is a perspective view showing a state of heat clamping of the die island of the lead frame shown in FIG. 2a. 1...Dai Island, 2...Earth Lead,
3... Inner lead, 4... Heat clamper, 5... Heat block, 6... Chip, 7...
Wire, 8...clamp lead. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
リードにのみ支持されるリードフレームにおいて
、ダイアイランドのアースリードが連結する辺を
除く相対する辺にそれぞれ放熱フインを兼ねるク
ランプリードを設けたことを特徴とするリードフ
レーム。 In a lead frame in which a die island is supported only by a single ground lead connected to one side, a clamp lead that also serves as a heat dissipation fin is provided on each opposing side other than the side to which the die island is connected to the ground lead. Lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001596U JPH0292941U (en) | 1989-01-12 | 1989-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001596U JPH0292941U (en) | 1989-01-12 | 1989-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292941U true JPH0292941U (en) | 1990-07-24 |
Family
ID=31201618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001596U Pending JPH0292941U (en) | 1989-01-12 | 1989-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292941U (en) |
-
1989
- 1989-01-12 JP JP1989001596U patent/JPH0292941U/ja active Pending