JPH032654U - - Google Patents
Info
- Publication number
- JPH032654U JPH032654U JP6339289U JP6339289U JPH032654U JP H032654 U JPH032654 U JP H032654U JP 6339289 U JP6339289 U JP 6339289U JP 6339289 U JP6339289 U JP 6339289U JP H032654 U JPH032654 U JP H032654U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- end surface
- heat sink
- excluding
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係るリードフレー
ムの斜視図、第２図は同実施例のリードフレーム
を用いて樹脂モールドされた半導体装置の第１図
Ａ−Ｂ−Ｃ−Ｄ線に沿つた断面図、第３図は本考
案の他の実施例に係るリードフレームの斜視図、
第４図は従来のリードフレームの斜視図、第５図
は従来のリードフレームを用いて樹脂モールドさ
れた半導体装置の第４図Ｅ−Ｆ−Ｇ−Ｈ線に沿つ
た断面図である。
１……半導体ペレツト、１１，２１……放熱板
、３，４……リード、１２，２２……吊ピン、１
０，２０……リードフレーム。
Fig. 1 is a perspective view of a lead frame according to an embodiment of the present invention, and Fig. 2 shows a semiconductor device resin-molded using the lead frame of the same embodiment, taken along line A-B-C-D in Fig. 1. 3 is a perspective view of a lead frame according to another embodiment of the present invention,
FIG. 4 is a perspective view of a conventional lead frame, and FIG. 5 is a sectional view taken along the line E-F-G-H in FIG. 4 of a semiconductor device resin-molded using the conventional lead frame. 1... Semiconductor pellet, 11, 21... Heat sink, 3, 4... Lead, 12, 22... Hanging pin, 1
0,20...Lead frame.
Claims (1)
ードが延設される一端面を除いた他端面に吊ピン
を連結してなるリードフレームにおいて、 上記吊ピンを放熱板より軟らかい金属で構成し
たことを特徴とするリードフレーム。[Claims for Utility Model Registration] In a lead frame in which a hanging pin is connected to the other end surface of a heat sink on which a semiconductor pellet is mounted, excluding one end surface on which the leads are extended, A lead frame characterized by being made of soft metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339289U JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339289U JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032654U true JPH032654U (en) | 1991-01-11 |
Family
ID=31593397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6339289U Pending JPH032654U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032654U (en) |
-
1989
- 1989-05-30 JP JP6339289U patent/JPH032654U/ja active Pending