JPS63200339U - - Google Patents
Info
- Publication number
- JPS63200339U JPS63200339U JP9258587U JP9258587U JPS63200339U JP S63200339 U JPS63200339 U JP S63200339U JP 9258587 U JP9258587 U JP 9258587U JP 9258587 U JP9258587 U JP 9258587U JP S63200339 U JPS63200339 U JP S63200339U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- raised
- utility
- semiconductor device
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 2
Landscapes
- Die Bonding (AREA)
Description
第１図乃至第３図はそれぞれ本考案の実施例を
示す斜視図である。
１１，２１，３１……Ａｕ―Ｓｉマウントロウ
材、１２……凸部、２２，３２……Ａｕマウント
ロウ材。
1 to 3 are perspective views showing embodiments of the present invention, respectively. 11, 21, 31... Au--Si mount brazing material, 12... Convex portion, 22, 32... Au mount brazing material.
Claims (1)
マウントロウ材を介して構成される半導体装置に
於いて、マウントロウ材に於ける中央部の一部を
高くするか又は、ストライプ状に高くする事を特
徴とする半導体装置用のマウントロウ材。 (2) 中央部とベース部の金属を異にする事を特
徴とする実用新案登録請求の範囲第(1)項記載の
半導体装置用のマウントロウー材。[Claims for Utility Model Registration] (1) In a semiconductor device in which an IC element is mounted on a lead frame or a package through a soldering material, a part of the central part of the mounting soldering material is raised or , a mounting wax material for semiconductor devices that is characterized by being raised in a striped manner. (2) The mounting row material for a semiconductor device according to claim (1) of the utility model registration, characterized in that the central part and the base part are made of different metals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9258587U JPS63200339U (en) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9258587U JPS63200339U (en) | 1987-06-15 | 1987-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200339U true JPS63200339U (en) | 1988-12-23 |
Family
ID=30954416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9258587U Pending JPS63200339U (en) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200339U (en) |
-
1987
- 1987-06-15 JP JP9258587U patent/JPS63200339U/ja active Pending