JPH01115247U - - Google Patents

Info

Publication number
JPH01115247U
JPH01115247U JP1988009121U JP912188U JPH01115247U JP H01115247 U JPH01115247 U JP H01115247U JP 1988009121 U JP1988009121 U JP 1988009121U JP 912188 U JP912188 U JP 912188U JP H01115247 U JPH01115247 U JP H01115247U
Authority
JP
Japan
Prior art keywords
chip
die pad
heat dissipation
semiconductor device
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988009121U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988009121U priority Critical patent/JPH01115247U/ja
Publication of JPH01115247U publication Critical patent/JPH01115247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はそれぞれ本考案の実施例の構
成図である。各図において、 １：ＩＣチツプ、２：ダイパツド、３：外部リ
ード、７：空孔、８：放熱フイン。 FIGS. 1 and 2 are block diagrams of embodiments of the present invention, respectively. In each figure, 1: IC chip, 2: die pad, 3: external lead, 7: hole, 8: heat dissipation fin.

Claims (1)

【実用新案登録請求の範囲】 (1) ダイパツド上にＩＣチツプをマウントし、
ＩＣチツプと外部リードとの間を接続して成る半
導体装置において、ダイパツドのＩＣマウント領
域にパツドを貫通してその裏面側に開放する放熱
用空孔を設けたことを特徴とする半導体装置。 (2) ダイパツド上にＩＣチツプをマウントし、
ＩＣチツプと外部リードとの間を接続して成る半
導体装置において、ダイパツドの裏面側に放熱フ
インを設けたことを特徴とする半導体装置。[Scope of claim for utility model registration] (1) Mounting an IC chip on a die pad,
1. A semiconductor device comprising an IC chip and an external lead connected to each other, characterized in that a heat dissipation hole is provided in an IC mount area of a die pad, penetrating the pad and opening to the back side thereof. (2) Mount the IC chip on the die pad,
1. A semiconductor device comprising an IC chip and an external lead connected to each other, characterized in that a heat dissipation fin is provided on the back side of a die pad.
JP1988009121U 1988-01-27 1988-01-27 Pending JPH01115247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988009121U JPH01115247U (en) 1988-01-27 1988-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988009121U JPH01115247U (en) 1988-01-27 1988-01-27

Publications (1)

Publication Number Publication Date
JPH01115247U true JPH01115247U (en) 1989-08-03

Family

ID=31215593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988009121U Pending JPH01115247U (en) 1988-01-27 1988-01-27

Country Status (1)

Country Link
JP (1) JPH01115247U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011522403A (en) * 2008-05-30 2011-07-28 アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフト Method for incorporating at least one electronic component into a printed circuit board and printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011522403A (en) * 2008-05-30 2011-07-28 アーテー・ウント・エス・オーストリア・テヒノロギー・ウント・ジュステームテッヒニク・アクチェンゲゼルシャフト Method for incorporating at least one electronic component into a printed circuit board and printed circuit board

Similar Documents

Publication Publication Date Title
JPH01115247U (en)
JPH0397952U (en)
JPH01176946U (en)
JPS6336052U (en)
JPH0176054U (en)
JPS6117737U (en) semiconductor equipment
JPH0361386U (en)
JPS5999447U (en) Package for semiconductors
JPS6094834U (en) semiconductor equipment
JPS6439649U (en)
JPS63174460U (en)
JPS59107157U (en) GaAs semiconductor device
JPS59103441U (en) semiconductor integrated circuit
JPH02122448U (en)
JPS60141142U (en) Heat dissipation fins for semiconductor devices
JPS5889946U (en) semiconductor equipment
JPH0247062U (en)
JPH032654U (en)
JPH0316346U (en)
JPH0451153U (en)
JPS6351451U (en)
JPS60137435U (en) semiconductor equipment
JPH01171045U (en)
JPH044767U (en)
JPS58168147U (en) semiconductor equipment