JPH0176054U - - Google Patents
Info
- Publication number
- JPH0176054U JPH0176054U JP1987171798U JP17179887U JPH0176054U JP H0176054 U JPH0176054 U JP H0176054U JP 1987171798 U JP1987171798 U JP 1987171798U JP 17179887 U JP17179887 U JP 17179887U JP H0176054 U JPH0176054 U JP H0176054U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- high thermal
- pin
- semiconductor device
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の断面図、第２図は第１図のＩＣチツプマウント
部分の拡大図、第３図は本考案の他の実施例を示
す断面図、第４図は従来の半導体装置の断面図で
ある。
１はＩＣチツプ、２は金属ワイヤ、３はボンデ
イングパツド、４は封止材、５は蓋板、６は従来
の材質のピン、７は熱伝導度の高いピン、８は電
源と接続された熱伝導度の高いピン、９はＧＮＤ
と接続された熱伝導度の高いピン、１０は熱の広
がり方を示す。
FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the invention, FIG. 2 is an enlarged view of the IC chip mount portion of FIG. 1, and FIG. 3 is a sectional view showing another embodiment of the invention. FIG. 4 is a sectional view of a conventional semiconductor device. 1 is an IC chip, 2 is a metal wire, 3 is a bonding pad, 4 is a sealing material, 5 is a cover plate, 6 is a pin made of a conventional material, 7 is a pin with high thermal conductivity, and 8 is connected to a power source. pin with high thermal conductivity, 9 is GND
A pin with high thermal conductivity connected to 10 indicates how heat spreads.
Claims (1)
に放熱用の熱伝導度の高い材質のピンを設けたこ
とを特徴とする半導体装置。 (2) 前記熱伝導度の高いピンをＩＣチツプの電
源又はＧＮＤと接続したことを特徴とする実用新
案登録請求の範囲第１項記載の半導体装置。[Scope of Claim for Utility Model Registration] (1) A semiconductor device characterized in that a pin made of a material with high thermal conductivity for heat radiation is provided under the part where an IC chip is mounted. (2) The semiconductor device according to claim 1, wherein the pin having high thermal conductivity is connected to a power source or GND of an IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171798U JPH0176054U (en) | 1987-11-10 | 1987-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171798U JPH0176054U (en) | 1987-11-10 | 1987-11-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176054U true JPH0176054U (en) | 1989-05-23 |
Family
ID=31463809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171798U Pending JPH0176054U (en) | 1987-11-10 | 1987-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176054U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316247A (en) * | 1989-06-14 | 1991-01-24 | Hitachi Ltd | Package for semiconductor element |
-
1987
- 1987-11-10 JP JP1987171798U patent/JPH0176054U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316247A (en) * | 1989-06-14 | 1991-01-24 | Hitachi Ltd | Package for semiconductor element |
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